DE102010036449A1 - Master component, has variant switching arrangements connected with other switching arrangements, and connection elements separated such that variant switching arrangements are separated from latter switching arrangements - Google Patents

Abstract

The component has switching arrangements (M1, M2), and variant switching arrangements (VS1-VSn) comprising connection elements (V1-Vn) e.g. low-resistive resistors, 0-ohm resistors and surface mounting device resistors, which are attached to the variant switching arrangements. The variant switching arrangements are connected with the switching arrangements by the connection elements. The connection elements are separated such that the variant switching arrangements are separated from the switching arrangements. Test pads (PP1-PP2n) are attached to the connection elements. An independent claim is also included for a method for providing an individualized component made of a master component.

Description

The invention relates to the configuration of circuit networks.

From the prior art a variety of modules are known. If these were produced in the past, then it usually required a comparison or at least a metrological characterization, so that assemblies outside a certain tolerance were not used.

In order to inexpensively produce a variety of similar modules or to compensate for component tolerances in assemblies, you can use so-called master modules.

These master assemblies either incorporate different circuits and / or matching networks so that component tolerances can be compensated.

Before such a master module is ready for use, a circuit must be selected by selective selection and / or a matching network must be activated or deactivated.

To enable such selection or activation or deactivation, the master assembly had a switching device, e.g. B. in the form of DIP switches, so that the respective desired property could be activated in the test field.

A disadvantage of this approach is that on the one hand, such switches are relatively expensive and require a lot of space, on the other hand, that the switch position is not sufficiently stable due to aging, fatigue, etc.

It is therefore an object of the invention to provide a master assembly which solves a disadvantage or several drawbacks in an inventive manner.

The object is achieved by a master module having a first circuit arrangement and a variant circuit arrangement. The variant circuit arrangement has an associated connection element and the variant circuit arrangement is connected in the ground state to the first circuit arrangement via the respective associated connection element. The connection element can be separated once, so that the associated variant circuit arrangement (s) is separated from the first circuit arrangement.

In a further embodiment of the invention, two contacting pads are assigned to the connecting element, so that the one-time separation of the connecting element can be brought about by applying an electrical voltage to the associated contacting pads.

In a further development of the invention, the one-time separation of the connecting element by means of a mechanical, electrical or thermal separation can be brought about.

In one embodiment of the invention, the connecting element is a low-resistance resistor.

In a further development of the invention, the connecting element is a 0 ohm resistor.

In a further embodiment of the invention, the connecting element is an SMD resistor.

In a further development of the invention, the connecting element is a resistor of the type 0402 or smaller.

Furthermore, the object is achieved by a method for providing an individualized assembly from a master assembly, wherein the master assembly comprises a first circuit arrangement and a variant circuit arrangement, wherein the variant circuit arrangement has an associated connection element, wherein the variant circuit arrangement connected in the ground state with the first circuit arrangement via the respective associated connection element is solved. This method includes the step of disconnecting the connector so that the associated variant circuitry (s) are permanently disconnected from the first circuitry.

In a development of the invention, the step of separating comprises mechanical, thermal or electrical action on the connecting element.

In yet another embodiment of the invention, the step of disconnecting comprises applying an electrical voltage to associated contacting pads.

The invention will be explained in more detail below with the aid of the figures. In these shows:

1 a schematic master assembly according to the invention and

2 a schematic flowchart of a method according to the invention for providing an individualized assembly of a master assembly.

In 1 a master assembly according to the invention is shown. This has a first circuit arrangement M1; M2 up. Furthermore, the master module has a variant circuit arrangement VS1; VS2; VSn on.

In the present case, a plurality of variant circuit arrangements VS1; VS2; VSn shown. It will be apparent to those skilled in the art that any number of variant circuitry may be provided. In particular, it can be provided that only a single variant circuit arrangement is provided.

The variant circuit arrangement VS1; VS2; VSn is connected to the first circuit M1, M2 via an associated connection element V1; V2; Vn first connected in a ground state. In this respect, a connecting element of a variant circuit arrangement or a selection of variant circuit arrangements, for. In a kind of hierarchical assignment.

Now, by configuration, for. B. in the test field based on measured values or according to specification, it can be determined that one or more of the variant circuits are not needed.

Then the respective connecting element V1; V2; Vn once separated, and thus the associated variant circuit arrangements VS1; VS2; VSn from the first circuit M1; M2 separated.

For example, if the variant circuits have matching networks, it can be determined in the test field which of the existing matching networks best fits as variant circuit arrangements. Is this z. B. VS2, the other variant circuit arrangements VS1, VSn are separated once.

Since the separation without external action, namely the re-creation of the compounds is not possible, the separation is irreversible, so that there is no longer the risk that a switch its switching position, whether by aging or incorrect operation or the like, changes.

In order to facilitate this separation, it can be provided that the connecting element V1; V2; Vn two contacting pads are assigned, so that by applying an electrical voltage to the associated contacting pads PP1, PP2; PP3, PP4; PP (2n-1), PP2nn the one-time separation of the connecting element V1; V2; Vn can be brought about.

In the present case, the contacting elements PP1 and PP2 are assigned to the connecting element V1, the contacting pads PP3 and PP4 to the connecting element V2, and the contacting pads PP (2n-1) and PP2n to the connecting element Vn.

If it is determined that the variant circuit arrangements VS1 and VSn are to be separated, it can be achieved by applying an electrical voltage to the associated contacting pads PP1 and PP2 or PP (2n-1) and PP2n, that the connection via the connection element irreversible is disconnected. For this purpose, a voltage can be applied to the connection to be separated, for example, via the test pads in the test field without affecting or endangering the further circuits M1, M2, V2.

Alternatively, it can also be provided that, instead of an electrically induced one-time separation of the connecting element of the connecting element V1 and Vn, a direct thermal action is also carried out. For example, by a laser beam or the like locally, the connecting element can be heated so that the connection is separated.

In a further alternative, it is also provided that instead of an electrically induced one-time separation of the connecting element of the connecting element V1 and Vn also a direct mechanical action is made. For example, by milling or drilling locally, the connecting element can be processed so that the connection is broken.

In one embodiment of the invention, the connecting element is V1; V2; Vn a low resistance. Such resistors can also be designed as a 0 ohm resistor. Resistors are available in different designs, especially as SMD resistor, z. B. the design 0402 or smaller.

By choosing the design, for example, the necessary voltage / the necessary current can be determined, which is necessary for a one-time separation. For example, in the case of the 0402 design, a short current pulse from a commercially available laboratory voltage source (for example 24 V) is already sufficient to obtain a successful separation. Separation means in this context a high-impedance state, so that the variant circuit is in principle ineffective.

As previously indicated, the approach may be embedded in an inventive method.

In this method of providing an individualized assembly from a master assembly, the master assembly having a first circuitry M1; M2 and a variant circuit arrangement VS1; VS2; VSn, wherein the variant circuit arrangement VS1; VS2; VSn an associated connection element V1; V2; Vn, wherein the variant circuit arrangement VS1; VS2; VSn in the ground state with the first circuit M1; M2 via the respective associated connection element V1; V2; Vn is connected in one step 100 determines which variant circuit arrangements should be separated.

In a further step 200 is the respective connecting element V1; V2; Vn separated so that the associated variant circuit arrangements VS1; VS2; VSn permanently from the first circuit M1; M2 is disconnected.

The step of separating 200 can be a mechanical, thermal or electrical action on the connecting element V1; V2; Vn have.

For example, at an electrical disconnect 200 an electrical voltage is applied to associated contacting pads PP1, PP2; PP3, PP4; PP (2n - 1), PP2n created.

In an optional step 300 the circuit obtained can be checked again. If the result of the check indicates that a particular configuration has not been obtained, the procedure may restart. In this new run, either the same process can be stopped or another variant circuit can be disconnected.

LIST OF REFERENCE NUMBERS

M1

first circuit arrangement

M2

second circuit arrangement

VS1-VS n

Variant circuitry

V1, V2, Vn

connecting element

PP1 PP2n

Prüfpad

Claims (10)

A master assembly comprising • a first circuit arrangement (M1; M2) and • a variant circuit arrangement (VS1; VS2; VSn), wherein the variant circuit arrangement (VS1; VS2; VSn) has an assigned connection element (V1; V2; Vn), wherein the variant circuit arrangement ( VS1; VS2; VSn) in the ground state is connected to the first circuit arrangement (M1; M2) via the respective associated connection element (V1; V2; Vn), characterized in that • the connection element (V1; V2; Vn) can be separated once such that the associated variant circuit arrangements (VS1; VS2; VSn) are disconnected from the first circuit arrangement (M1; M2). Master assembly according to Claim 1, characterized in that two contacting pads are assigned to the connecting element (V1; V2; Vn), so that by applying an electrical voltage to the associated contacting pads (PP1, PP2; PP3, PP4; PP (2n - 1), PP2n) the one-time separation of the connecting element (V1, V2, Vn) can be brought about. Master assembly according to claim 1 or 2, characterized in that by means of a mechanical, electrical or thermal separation, the one-time separation of the connecting element (V1, V2, Vn) can be brought about. Master assembly according to claim 1 to 3, characterized in that the connecting element (V1; V2; Vn) is a low resistance. Master assembly according to one of the preceding claims 1 to 4, characterized in that the connecting element (V1; V2; Vn) is a 0 ohm resistor. Master assembly according to one of the preceding claims 1 to 5, characterized in that the connecting element (V1; V2; Vn) is an SMD resistor. Master assembly according to one of the preceding claims 1 to 6, characterized in that the connecting element (V1; V2; Vn) is a resistor of the type 0402 or less. A method for providing an individualized assembly from a master assembly, the master assembly having • a first circuit arrangement (M1, M2) and • a variant circuit arrangement (VS1, VS2, VSn), wherein the variant circuit arrangement (VS1, VS2, VSn) has an associated connection element ( V1; V2; Vn), wherein the variant circuit arrangement (VS1; VS2; VSn) in the ground state is connected to the first circuit arrangement (M1; M2) via the respective associated connection element (V1; V2; Vn), comprising the step of disconnect ( 200 ) of the connecting element (V1; V2; Vn) so that the associated variant circuit arrangements (VS1; VS2; VSn) are permanently disconnected from the first circuit arrangement (M1; M2). Method according to claim 8, characterized in that the step of separating ( 200 ) has mechanical, thermal or electrical action on the connecting element (V1; V2; Vn). Method according to claim 8 or 9, characterized in that the step of separating ( 200 ) has applied an electrical voltage to associated contacting pads (PP1, PP2, PP3, PP4, PP (2n-1), PP2n).

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