DE102010030525A1 - Electronic control module - Google Patents
Electronic control module Download PDFInfo
- Publication number
- DE102010030525A1 DE102010030525A1 DE201010030525 DE102010030525A DE102010030525A1 DE 102010030525 A1 DE102010030525 A1 DE 102010030525A1 DE 201010030525 DE201010030525 DE 201010030525 DE 102010030525 A DE102010030525 A DE 102010030525A DE 102010030525 A1 DE102010030525 A1 DE 102010030525A1
- Authority
- DE
- Germany
- Prior art keywords
- component
- circuit board
- heat
- control assembly
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Abstract
Elektronische Steuerbaugruppe (1) für ein Kraftfahrzeug, insbesondere eine Getriebesteuerbaugruppe, wobei die Steuerbaugruppe (1) ein zu entwärmendes Bauelement (4) aufweist, welches an einer ersten Seite (3a) einer beidseitig bestückten Leiterplatte (3) angeordnet ist, wobei die Leiterplatte (3) zwischen der ersten (3a) und einer gegenüberliegenden zweiten (3b) Seite eine elektrisch leitfähige Lage (9) aufweist, welche mit dem zu entwärmenden Bauelement (4) in thermisch leitender Verbindung steht, und wobei das zu entwärmende Bauelement (4) ferner mit einem zur ersten Seite (3a) benachbarten Kühlelement (6), insbesondere einem Gehäuseelement (2a) der Steuerbaugruppe (1), in thermisch leitender Verbindung steht.Electronic control assembly (1) for a motor vehicle, in particular a transmission control assembly, the control assembly (1) having a component (4) to be cooled, which is arranged on a first side (3a) of a circuit board (3) populated on both sides, the circuit board ( 3) has an electrically conductive layer (9) between the first (3a) and an opposite second (3b) side, which is in thermally conductive connection with the component (4) to be cooled, and the component (4) to be cooled is in thermally conductive connection with a cooling element (6) adjacent to the first side (3a), in particular a housing element (2a) of the control assembly (1).
Description
Die vorliegende Erfindung betrifft eine elektronische Steuerbaugruppe für ein Kraftfahrzeug gemäß dem Oberbegriff von Anspruch 1.The present invention relates to an electronic control assembly for a motor vehicle according to the preamble of claim 1.
Im Stand der Technik ist z. B. aus der Druckschrift
Bei Steuerungen bzw. Steuerbaugruppen zum Einsatz im Kraftfahrzeug ist regelmäßig ein Augenmerk auf den benötigten Bauraum zu richten, welcher maßgeblich von der Notwendigkeit der Entwärmung der an der Leiterplatte anzuordnenden Komponenten über ein Kühlelement, z. B. das Gehäuse, mitbestimmt wird. In dieser Hinsicht ist die im Stand der Technik vorgeschlagene Lösung verbesserungsfähig.In the case of controllers or control modules for use in motor vehicles, regular attention must be paid to the required installation space, which essentially depends on the necessity of cooling the components to be arranged on the printed circuit board via a cooling element, eg. As the housing is mitbestimmt. In this regard, the solution proposed in the prior art can be improved.
Ausgehend vom eingangs geschilderten Stand der Technik liegt der vorliegenden Erfindung die Aufgabe zugrunde, eine Steuerbaugruppe für ein Kraftfahrzeug vorzuschlagen, welche eine gute Entwärmung eines an einer Leiterplatte angeordneten, zu entwärmenden Bauelements einhergehend mit geringen Bauraumanforderungen ermöglicht.Based on the above-described prior art, the present invention seeks to propose a control assembly for a motor vehicle, which allows a good heat dissipation of a arranged on a circuit board to be Entwärmenden device along with low space requirements.
Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruchs 1 gelöst.This object is achieved by the features of claim 1.
Vorgeschlagen wird erfindungsgemäß eine elektronische Steuerbaugruppe für ein Kraftfahrzeug, insbesondere eine Getriebesteuerbaugruppe, wobei die Steuerbaugruppe ein zu entwärmendes Bauelement aufweist, welches an einer ersten Seite einer beidseitig bestückten Leiterplatte angeordnet ist, wobei die Leiterplatte zwischen der ersten und einer gegenüberliegenden zweiten Seite eine elektrisch leitfähige Lage aufweist, welche mit dem zu entwärmenden Bauelement in thermisch leitender Verbindung steht, und wobei das zu entwärmende Bauelement ferner mit einem zur ersten Seite benachbarten Kühlelement, insbesondere einem Gehäuseelement der Steuerbaugruppe, in thermisch leitender Verbindung steht.According to the invention, an electronic control module for a motor vehicle, in particular a transmission control module, is proposed, wherein the control module has a component to be heat-treated which is arranged on a first side of a printed circuit board fitted on both sides, wherein the circuit board has an electrically conductive layer between the first and an opposite second side which is in thermally conductive connection with the component to be heat-treated, and wherein the component to be heat-treated is also in thermally conductive connection with a cooling element adjacent to the first side, in particular a housing element of the control assembly.
Bei einer erfindungsgemäßen Ausführungsform der Steuerbaugruppe ist das zu entwärmende Bauelement ein Mikroprozessor-Bauelement, insbesondere ein Mikrocontroller-Bauelement.In an embodiment according to the invention of the control module, the component to be devoured is a microprocessor component, in particular a microcontroller component.
Bei einer weiteren erfindungsgemäßen Ausführungsform der Steuerbaugruppe weist das zu entwärmende Bauelement zur thermisch leitenden Verbindung mit der elektrisch leitfähigen Lage einen thermisch leitfähigen Bereich auf, insbesondere in Form eines exposed pads, welcher der ersten Seite der Leiterplatte zugewandt ist.In a further embodiment according to the invention of the control module, the component to be heat-treated has a thermally conductive region for the thermally conductive connection to the electrically conductive layer, in particular in the form of an exposed pad, which faces the first side of the printed circuit board.
Bei noch einer weiteren erfindungsgemäßen Ausführungsform der Steuerbaugruppe ist das zu entwärmende Bauelement mittels eines Bauelementgehäuses mit dem Kühlelement thermisch leitend verbunden.In yet another embodiment according to the invention of the control module, the component to be devoured is thermally conductively connected to the cooling element by means of a component housing.
Gemäß einem Aspekt der erfindungsgemäßen Steuerbaugruppe ist die Leiterplatte an der zweiten Seite mit wenigstens einem weiteren elektronischen Bauelement bestückt, welches das zu entwärmende Bauelement in Richtung von der zweiten zur ersten Seite überlappt.According to one aspect of the control module according to the invention, the printed circuit board on the second side is equipped with at least one further electronic component which overlaps the component to be devoured in the direction from the second to the first side.
Gemäß einem weiteren Aspekt der erfindungsgemäßen Steuerbaugruppe ist die elektrisch leitfähige Lage eine Masselage bzw. eine Ground-Lage.According to a further aspect of the control module according to the invention, the electrically conductive layer is a ground layer or a ground layer.
Gemäß noch einem weiteren Aspekt der erfindungsgemäßen Steuerbaugruppe ist die Leiterplatte eine Multilager-Leiterplatte, insbesondere eine HDI-Leiterplatte.According to yet another aspect of the control assembly according to the invention, the printed circuit board is a multilayer printed circuit board, in particular an HDI printed circuit board.
Vorgeschlagen wird erfindungsgemäß auch eine Steuerbaugruppe, wobei das Leiterplattenmaterial der Leiterplatte FR4 ist.According to the invention, a control module is also proposed, the printed circuit board material being the circuit board FR4.
Weiterhin wird erfindungsgemäß eine Steuerbaugruppe vorgeschlagen, wobei zwischen dem Bauelementgehäuse des zu entwärmenden Bauelements und dem Kühlelement der Steuerbaugruppe eine Wärmeleitschicht angeordnet ist.Furthermore, a control module according to the invention is proposed, wherein a heat-conducting layer is arranged between the component housing of the component to be heat-treated and the cooling element of the control assembly.
Bei einer Ausführungsform der erfindungsgemäßen Steuerbaugruppe ist das zu entwärmende Bauelement mittels eines thermischen Vias mit der elektrisch leitfähigen Lage thermisch leitend verbunden, wobei das Via insbesondere mit dem thermisch leitfähigen Bereich thermisch leitend verbunden ist.In one embodiment of the control module according to the invention, the component to be heat-sealed is thermally conductively connected to the electrically conductive layer by means of a thermal vias, wherein the via is in particular thermally conductively connected to the thermally conductive region.
Bei einer weiteren Ausführungsform der erfindungsgemäßen Steuerbaugruppe steht neben dem zu entwärmenden Bauelement wenigstens ein weiteres elektronisches Bauelement an der zweiten Seite, insbesondere ein Leistungsbauelement, in thermisch leitender Verbindung mit der elektrisch leitfähigen Lage und/oder dem Kühlelement.In a further embodiment of the control module according to the invention, in addition to the component to be cooled, at least one further electronic component on the second side, in particular a power component, is in thermally conductive connection with the electrically conductive layer and / or the cooling element.
Weitere Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden Beschreibung von Ausführungsbeispielen der Erfindung, anhand der Figuren der Zeichnungen, die erfindungswesentliche Einzelheiten zeigen, und aus den Ansprüchen. Die einzelnen Merkmale können je einzeln für sich oder zu mehreren in beliebiger Kombination bei einer Variante der Erfindung verwirklicht sein. Further features and advantages of the invention will become apparent from the following description of embodiments of the invention, with reference to the figures of the drawings, which show details essential to the invention, and from the claims. The individual features can be realized individually for themselves or for several in any combination in a variant of the invention.
Bevorzugte Ausführungsformen der Erfindung werden nachfolgend anhand der beigefügten Zeichnungen näher erläutert. Es zeigen:Preferred embodiments of the invention are explained below with reference to the accompanying drawings. Show it:
In den nachfolgenden Figurenbeschreibungen sind gleiche Elemente bzw. Funktionen mit gleichen Bezugszeichen versehen. Elemente aus dem Stand der Technik sind dabei mit gestrichenen Bezugszeichen versehen, Elemente der Erfindung mit ungestrichenen Bezugszeichen.In the following description of the figures, the same elements or functions are provided with the same reference numerals. Elements of the prior art are provided with primed reference numerals, elements of the invention with uncoated reference numerals.
Die
Die Leiterplatte
An der Leiterplatte
Das zu entwärmende Bauelement
Erfindungsgemäß steht das zu entwärmende Bauelement
Das zu entwärmende Bauelement
Erfindungsgemäß ist das zu entwärmende Bauelement
Erfindungsgemäß weist das Gehäuseunterteil
Neben dem an der ersten Seite
Die Bauelemente
Die Gehäuseelemente
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 1, 11, 1
- Steuerbaugruppecontrol module
- 2, 2'2, 2 '
- Gehäusecasing
- 2a, 2a'2a, 2a '
- GehäuseunterteilHousing bottom
- 2b, 2b'2b, 2b '
- GehäuseoberteilHousing top
- 3, 3'3, 3 '
- Leiterplattecircuit board
- 3a, 3a'3a, 3a '
- erste Seitefirst page
- 3b3b
- zweite Seitesecond page
- 4, 4'4, 4 '
- zu entwärmendes Bauelementto be cooled component
- 4a, 4a'4a, 4a '
- thermisch leitender Bereichthermally conductive area
- 4b, 4b'4b, 4b '
- Chipchip
- 4c4c
- Gehäusecasing
- 5, 5'5, 5 '
- thermische Viasthermal vias
- 6, 6'6, 6 '
- Wärmesenke/KühlelementHeat sink / cooling element
- 7, 7'7, 7 '
- Wärmeleitschichtheat conducting
- 88th
- Komponentencomponents
- 99
- elektrisch leitfähige Lageelectrically conductive layer
- 1010
- Ausnehmungrecess
- 10a10a
- Oberflächesurface
- 1111
- Dichtungpoetry
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- EP 1648744 B1 [0002] EP 1648744 B1 [0002]
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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DE201010030525 DE102010030525A1 (en) | 2010-06-25 | 2010-06-25 | Electronic control module |
PCT/EP2011/057120 WO2011160879A1 (en) | 2010-06-25 | 2011-05-04 | Electronic control assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201010030525 DE102010030525A1 (en) | 2010-06-25 | 2010-06-25 | Electronic control module |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102010030525A1 true DE102010030525A1 (en) | 2011-12-29 |
Family
ID=44280728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201010030525 Withdrawn DE102010030525A1 (en) | 2010-06-25 | 2010-06-25 | Electronic control module |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102010030525A1 (en) |
WO (1) | WO2011160879A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012223287A1 (en) * | 2012-12-14 | 2014-06-18 | Hella Kgaa Hueck & Co. | Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper |
DE102013212398A1 (en) * | 2013-06-27 | 2014-12-31 | Zf Friedrichshafen Ag | Circuit device and method for producing a circuit device for controlling a transmission of a vehicle |
DE202016103798U1 (en) * | 2016-07-14 | 2017-10-19 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | electronics housing |
DE102017110354A1 (en) * | 2017-05-12 | 2018-11-15 | Connaught Electronics Ltd. | Housing for a control unit for a camera of a motor vehicle and with a heat dissipation element, camera, motor vehicle and method |
DE102017128928A1 (en) * | 2017-11-10 | 2019-08-08 | Valeo Thermal Commercial Vehicles Germany GmbH | electronics package |
WO2021197982A1 (en) * | 2020-04-03 | 2021-10-07 | Volkswagen Aktiengesellschaft | Vehicle, a main frame, a module pocket, an electronic module, and a printed circuit board |
EP3933912A1 (en) * | 2020-06-30 | 2022-01-05 | Andreas Stihl AG & Co. KG | Cooling device for an electronic power device |
DE102020212804A1 (en) | 2020-10-09 | 2022-04-14 | Vitesco Technologies Germany Gmbh | Control module for a vehicle with at least one electric motor and a transmission |
DE102020215811A1 (en) | 2020-12-14 | 2022-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | contact arrangement |
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DE4335946A1 (en) * | 1993-10-21 | 1995-04-27 | Bosch Gmbh Robert | Arrangement consisting of a printed circuit board |
DE19600619A1 (en) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Control unit consisting of at least two housing parts |
DE19722357C1 (en) * | 1997-05-28 | 1998-11-19 | Bosch Gmbh Robert | Control unit |
DE19842615A1 (en) * | 1997-09-19 | 1999-04-15 | Mitsubishi Heavy Ind Ltd | Electronic component comprises a boxed printed circuit board module |
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DE102010017815A1 (en) * | 2009-07-16 | 2011-02-03 | Denso Corporation, Kariya-City | Electronic control unit |
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-
2010
- 2010-06-25 DE DE201010030525 patent/DE102010030525A1/en not_active Withdrawn
-
2011
- 2011-05-04 WO PCT/EP2011/057120 patent/WO2011160879A1/en active Application Filing
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JPH0260976A (en) * | 1988-08-29 | 1990-03-01 | Pentel Kk | Ink for optical information recording medium |
DE4335946A1 (en) * | 1993-10-21 | 1995-04-27 | Bosch Gmbh Robert | Arrangement consisting of a printed circuit board |
DE19600619A1 (en) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Control unit consisting of at least two housing parts |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012223287A1 (en) * | 2012-12-14 | 2014-06-18 | Hella Kgaa Hueck & Co. | Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper |
CN105340076B (en) * | 2013-06-27 | 2019-06-14 | Zf腓德烈斯哈芬股份公司 | The method of circuit device and the circuit device for manufacturing control transmission for vehicles |
CN105340076A (en) * | 2013-06-27 | 2016-02-17 | Zf腓德烈斯哈芬股份公司 | Circuit device and method for producing a circuit device for controlling a transmission of a vehicle |
US9472486B2 (en) | 2013-06-27 | 2016-10-18 | Zf Friedrichshafen Ag | Circuit device and method of manufacturing a circuit device for controlling a transmission of a vehicle |
DE102013212398A1 (en) * | 2013-06-27 | 2014-12-31 | Zf Friedrichshafen Ag | Circuit device and method for producing a circuit device for controlling a transmission of a vehicle |
DE202016103798U1 (en) * | 2016-07-14 | 2017-10-19 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | electronics housing |
DE102017110354A1 (en) * | 2017-05-12 | 2018-11-15 | Connaught Electronics Ltd. | Housing for a control unit for a camera of a motor vehicle and with a heat dissipation element, camera, motor vehicle and method |
DE102017128928B4 (en) | 2017-11-10 | 2019-09-12 | Valeo Thermal Commercial Vehicles Germany GmbH | electronics package |
DE102017128928A1 (en) * | 2017-11-10 | 2019-08-08 | Valeo Thermal Commercial Vehicles Germany GmbH | electronics package |
WO2021197982A1 (en) * | 2020-04-03 | 2021-10-07 | Volkswagen Aktiengesellschaft | Vehicle, a main frame, a module pocket, an electronic module, and a printed circuit board |
EP3933912A1 (en) * | 2020-06-30 | 2022-01-05 | Andreas Stihl AG & Co. KG | Cooling device for an electronic power device |
US11632855B2 (en) | 2020-06-30 | 2023-04-18 | Andreas Stihl Ag & Co. Kg | Arrangement for conducting heat away from an electronic component |
DE102020212804A1 (en) | 2020-10-09 | 2022-04-14 | Vitesco Technologies Germany Gmbh | Control module for a vehicle with at least one electric motor and a transmission |
DE102020212804B4 (en) | 2020-10-09 | 2022-10-13 | Vitesco Technologies Germany Gmbh | Control module for a vehicle with at least one electric motor and a transmission |
DE102020215811A1 (en) | 2020-12-14 | 2022-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | contact arrangement |
Also Published As
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WO2011160879A1 (en) | 2011-12-29 |
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