DE102009040834A1 - Diode laser component, has sealing device provided for sealing free space with respect to surrounding, and sealing ring sections accomplishing sealing of partial contributions between optics unit and contact bodies, respectively - Google Patents

Abstract

The component has an edge-emitting laser diode element and an optics unit i.e. mirror, that is provided with a partially transparent transmission element and an optically effective surface. The optically effective surface is spaced at a distance from a radiation emission section by a free space. A sealing device (60) is provided for sealing the free space with respect to surrounding and includes a closed sealing ring (61). Sealing ring sections accomplish sealing of partial contributions between the optics unit and contact bodies, respectively.

Description

The invention relates to a device for protecting an edge-emitting laser diode element, in particular its radiation emission sections, against environmental influences. For this purpose, it is common to house the laser diode element by being housed in a housing usually. From the prior art, for example, the published patent application JP 09 275 244 A , Housing are known which have a housing bottom, on which a frame is fixed, between the inner walls, a housing volume / interior is formed, which is closed by a lid which is fixed on the side facing away from the housing bottom of the frame.

The laser diode element is mounted in the interior directly on the housing bottom or on a heat conducting body, which in turn is mounted in the interior of the housing bottom. An optical element - for example, an optical fiber or a window - which is embedded in an opening of the frame or bridged such, transmits the radiation from the interior of the housing in the outer space of the environment.

Disadvantages of the described arrangement are the multiplicity, the size and the complexity of the components which are used to house the laser diode element.

The object of the invention is to describe a housekeeping for edge-emitting laser diode elements, which does not have these disadvantages.

The object is achieved by a diode laser component according to claim 1. Advantageous embodiments are the subject of the dependent claims.

According to the invention, the diode laser component has at least one edge emitting laser diode element as well as a first contact body and at least one second contact body. The laser diode element has on a first side at least a first electrical contact surface and an opposite side of the first side, at least one second electrical contact surface. Characteristic of edge-emitting laser diode elements is arranged between the planes of the electrical contact surfaces, radiation emission surface - also called front facet - with at least one radiation emission section from which is emitted during operation of the diode laser device radiation in a first half-space, which is limited by the plane of the radiation emission surface. By radiation emission surface is meant the surface from which the majority of the radiation leaving the laser diode element exits the laser diode element. The rear facet opposite the radiation emission surface emits a significantly smaller, but detectable, fraction of the radiation. An emission of radiation into the first half-space does not necessarily mean that the emitted radiation must remain in the first half-space, but that it passes through a first path in the first half-space when leaving the radiation emission area.

The radiation emission direction of radiation emerging from the front facet in this case points from the radiation emission section in a direction away from the laser diode component. The radiation emission section is the region of the radiation emission surface at which the radiation emerges from the waveguide of the laser diode element. For the waveguide, the radiation emission section, or both together, the term "emitter" is also used.

A laser diode element may have only a single emitter and is referred to in this case as a single laser diode. However, it can also have a plurality of emitters, which can be stacked one above the other in the direction perpendicular to the contact surface planes or lined up next to one another in a direction parallel to the contact surface planes. Laser diode elements with a variety of side by side. lined emitters are called laser diode bars.

According to the invention, the first contact body is characterized in that it has a first connection surface which lies opposite the first electrical contact surface and is in contact with the first electrical contact surface in at least one first mechanical contact which is perpendicular to the first contact surface of the laser diode element in the projection extending first electrical contact surface to the first pad. In the same way, according to the invention, the second contact body is characterized in that it has a second connection surface which at least partially opposes the first electrical contact surface and is in contact with the second electrical contact surface in at least one first mechanical contact perpendicular to the projection of the laser diode element the second contact surface extends from the second electrical contact surface to the second connection surface. In this sense, the contact bodies form a mechanical contact for the laser diode element.

The mechanical contacts are preferably of a solid type, wherein a solid contact of the first surface of a first solid (laser diode element) with the second surface of a second solid (first or second contact body) means that the surfaces i directly contact directly lie on one another or in indirect contact by at least one intermediate element - for example, a solid plate and / or a cohesive joint layer - are spaced therefrom between them, wherein planar contacts of the first and second surfaces to opposite surfaces of the intermediate element and optionally between surfaces of several intermediate elements ,

An example of a mechanical contacting is a cohesive connection of one of the electrical contact surfaces with its opposite connection surface, wherein the cohesive connection extends in the projection of the laser diode element perpendicular to the respective electrical contact surface of the respective electrical contact surface to the respective connection surface.

Such a cohesive connection can be formed for example by a joining agent layer, which is arranged between the respective electrical contact surfaces and the contact surfaces opposite the respective electrical contact surfaces of the contact body and each at least partially in perpendicular to the contact surfaces projection of the laser diode element completely from the respective electrical contact surface extends respective pad.

Another example of a mechanical contacting is a first frictional connection of one of the electrical contact surfaces with the opposite connection surface, in which the respective connection surface rests directly or indirectly via at least one intermediate layer under pressure on the respective electrical contact surface. Such a frictional mechanical contacting of a laser diode element is described, for example, in the published patent applications EP 1 341 275 A2 and US 2006 029 117 A1 whose disclosure content is hereby incorporated by reference.

A mechanical contact, in particular a feststofflicher, is equivalent to a in the projection of the laser diode element perpendicular to one of the contact surfaces of the respective electrical contact surface to the opposing pad extending solids-bonded heat flow path through which the absorption of heat in the operation of the diode laser device of the relevant electrical contact surface goes out, is provided by the respective pad.

In this sense, the contact bodies also form a thermal connection for the laser diode element. For this purpose, the mechanical connections between the contact body, preferably both on the part of the laser diode element and on the part of the contact body surface and fill the space between the contact bodies and the laser diode element preferably substantially completely.

Preferably, the contact bodies also each form an electrical connection for the laser diode element. For this purpose, the contact body and optionally present between the contact bodies and the laser diode elements cohesive compounds at least partially electrically conductive, wherein at least one electrically conductive region of the respective contact body is in electrical contact with that electrical contact surface of the laser diode element, which is opposite to the contact body. For example, the contact bodies can be completely metallic, consist of a metal-matrix composite material (for example silver-diamond or copper-graphite) or else have an electrically insulating core body (for example diamond or beryllium-oxide ceramic) with a superficial metal layer. Electrically conductive regions of the contact bodies serve to supply / discharge electrical current to / from the semiconductor component via its contact surfaces. For this purpose, the electrically conductive regions of the contact bodies are in each case connected via an electrical connection surface of the contact bodies, preferably in a materially connected, electrically conductive connection with the electrical contact surfaces. The material bond preferably extends in a direction perpendicular to the respective contacted contact surfaces projection of the laser diode element. Preferably, the material connection is realized surface on the respective contact and pads. It may preferably have a single electrically conductive joining zone, for example that of a metallic solder, or - less preferably - two joining zones, between which an electrically conductive intermediate body is arranged.

The diode laser component according to the invention includes an optical unit which serves to transmit radiation emitted during operation from the laser diode element. For this purpose, the optical unit according to the invention at least one for the radiation at least partially transmissive transmission element and at least one, at least partially arranged in the first half-space and the radiation emission section at least partially opposite, optically active surface which is spaced by a free space of the radiation emission section.

An example of the transmission element is a plane window through which the radiation is emitted in the transmission direction. Another example is a lens, such as a lens Cylindrical lens that collimates the radiation in a direction perpendicular to the contact surface planes - the fast-axis direction -. Another example is an optical fiber into which the radiation is coupled directly or indirectly via an optical means.

The optical unit may consist solely of this transmission element, for example, if this is designed as a window, or have a socket which is materially connected to the transmission element. An example of such a socket is a cylindrical sleeve for guiding the optical fiber.

The optically active surface according to the invention can be formed by a surface section of the transmission element. In this case, it is a transmitting surface, which also represents a refracting surface in non-collimated or oblique incident beams. The optically active surface according to the invention can also be formed by a reflective surface of a separate optically active element of the optical unit, for example a mirror. In addition, the optically effective surface may also have a superficial structure with diffractive or scattering properties.

As is known, the radiation emission section of the radiation emission surface is particularly endangered by environmental influences. Therefore, the clearance immediately adjacent to the radiation emission section and located between the radiation emission section and the optically effective surface must be sealed from the environment. To such a seal contributes to the seal according to the invention, the essential feature of the invention is a sealing ring, of which a first sealing ring portion to the seal makes a first partial contribution between the optical unit and the first contact body, and a second sealing ring portion to the seal a second partial contribution between the optical unit and the second contact body makes.

The preposition "between" is not primarily local, but modal; that is, it does not necessarily imply a sectional arrangement of the gasket between the optical unit and the contact bodies, but it relates to the manner in which the gasket acts. Of course, however, the secondary importance of the preposition may be taken into account, a sealing connection created between two components in the form of a seal locally between the components.

Broadly speaking, the invention provides, for the protection of an edge-emitting laser diode element, which is fastened cohesively between a first contact bodies and a second contact body, this laser diode element with the participation of an optical unit, which is provided for the passage of light emitted by the laser diode element radiation to live, wherein a seal with a closed sealing ring is provided for sealing a clearance between the laser diode element and the optical unit, of which a first sealing ring portion between the optical unit and the first contact body seals and a second sealing ring portion between the optical unit and the second contact body seals.

The solution according to the invention provides a diode laser component which has a structure for its laser diode element. The contact body of the diode laser component form the housing bottom and the housing cover. The housing frame is provided at least in sections by the indispensable optical unit. The seal closes off the space in front of the radiation emission section by leaving its seal ring free of radiation circumscribed by the seal ring for passage of the radiation.

An advantage of the invention is the small number of components that are necessary for the housings of the laser diode component. The components of the diode laser component are preferably limited to the means according to the invention mentioned in claim 1: laser diode element, first contact body, second contact body, optical unit and seal. Thus, the contact body serve not only for mechanical contacting of the laser diode element, which is relevant for the house, but also for thermal and electrical contact.

The small number of components also has an advantageous effect on the production costs of the diode laser component according to the invention and its size. The invention advantageously combines all the functions required for the operation of the laser diode element in a very simple manner and in the smallest possible space: electrical contacting, heat dissipation, radiation transmission and dust-tight or even hermetic closure.

Preferably, the first sealing ring portion contacts the first contact body and / or the optical unit. Preferably, the second sealing ring portion contacts the second contact body and / or the optical unit.

When contacting the first and second contact body, in the event that it is completely electrically conductive or metallic, through the sealing ring this is to avoid a electrical short circuit on the laser diode element at least partially perform electrically insulating. Preferably, the seal is partially or completely formed by an electrically insulating joining agent.

In principle, different sealing ring sections may consist of the same material or of different materials.

With regard to the arrangement of the sealing ring, this is preferably such that the first sealing ring portion is arranged at least in sections between the first contact body and the optical unit and / or the second sealing ring portion is at least partially disposed between the second contact body and the optical unit.

To complete the seal, the seal ring may include a third seal ring portion disposed between a first end of the first seal ring portion and a first end of the second seal ring portion for sealing a third portion, and a fourth seal ring portion disposed between a second end of the first seal ring portion and a second end of the second seal ring portion is arranged and makes a fourth partial amount for sealing.

For example, the third and / or fourth sealing ring section can contact the radiation emission surface of the laser diode element for this purpose. This is not mandatory. Instead, the third and / or fourth sealing ring portion can also contact a layer which is arranged between at least partially opposite and projecting over the laser diode element parallel to the plane of the electrical contact surfaces protrusions of the first and second contact body. In the case of electrically conductive contact body, this layer is preferably electrically insulating or electrically insulated. The layer may be, for example, a ceramic plate or an electrically insulating joining agent, for example a cured epoxy adhesive. The said layer can also be regarded as a sealing segment and thus as part of the seal.

In fact, besides the sealing ring, further sealing segments of the seal can serve not only to seal off the free space but to completely house the laser diode element. Thus, the seal to complete the housekeeping or sealing may comprise at least a first sealing segment, which is connected to a first location of the sealing ring.

In addition, the first seal segment may be connected to at least a second location of the seal ring which is at least partially spaced clockwise from the first location by the first seal ring portion and spaced at least partially counterclockwise by the second seal ring portion. In this case, the first sealing segment is arranged at least in sections on the side facing away from the radiation emission surface side of the laser diode element and contributes to the sealing ring to a complete house of the laser diode element.

As already mentioned, the first contact body may have at least one first projection. This preferably protrudes in the first half-space complementary second half-space in a direction parallel to the plane of the first contact surface on the laser diode element. Similarly, the second contact body may have at least one second projection at least partially opposite the first projection, which preferably protrudes beyond the laser diode element in the second half space in a direction parallel to the plane of the second contact surface. In this case, the first sealing segment is preferably arranged at least in sections between the first and second projections. Preferably, the first seal ring segment contacts the first and second projections and is electrically insulating.

Particularly advantageously, the first and the second projection in the second half-space U-shaped formed by extending over the laser diode component both in one of the radiation emission direction opposite return direction and in two opposite side directions. Thus, the first sealing segment may be arranged in its complete course between the two contact bodies and contribute to the sealing of a third partial contribution of a between the two contact bodies. Thus, the laser diode element is completely housed.

The same applies to the case that the first and the second projection not only extend U-shaped in the second half-space, but also in addition to the first half-space, wherein one can speak of an O-shaped projection.

Another completion of the seal, which does not require said projections, utilizes the side surfaces which the laser diode element typically has at least in sections between the planes of the first and second electrical contact surfaces and which extend at an angle to the light exit surface in the second half space complementary to the first half space. It can do that first seal segment contact the first side surface in at least one region which extends from the plane of the first electrical contact surface to the plane of the second electrical contact surface. A second seal segment having at least a third seal segment end connected at a second location of the seal ring at least partially spaced clockwise from the first location by the first seal ring portion and spaced at least partially counterclockwise by the second seal ring portion For example, contact a second side surface of the laser diode element opposite the first side surface in at least one region that extends from the plane of the first electrical contact surface to the plane of the second electrical contact surface.

The invention will be explained in more detail below with reference to three exemplary embodiments. These show schematically and not necessarily true to scale

1a a top view of a seal according to the invention of a first embodiment,

1b a top view of a seal according to the invention of a first variant of a second embodiment,

1c an oblique view of a seal according to the invention of a third embodiment,

2a a front view of a laser diode bar of the first embodiment,

2 B an exploded view in side view of a diode laser subassembly of the first embodiment,

2c a side view of the first embodiment of a diode laser device according to the invention,

2d a front view of the first embodiment of 2c

3a a first cross-sectional view of a first variant of the second embodiment of a diode laser component according to the invention along the longitudinal section plane BB of 3b .

3b a second cross-sectional view of the first variant of the second embodiment along the depth sectional plane AA of 3a

3c an oblique view of the seal according to the invention of a second variant of the second embodiment,

3d a cross-sectional view of the second variant of the second embodiment along a longitudinal sectional plane, that of the designation BB of 3b equivalent.

4a a cross-sectional view of a first variant of the third embodiment of a diode laser component according to the invention along the central longitudinal sectional plane,

4b a front view of the first variant of the third embodiment of 4a

4c 3 a cross-sectional view of a first development of the first variant of the third exemplary embodiment along the central longitudinal sectional plane,

4d an oblique view of the seal according to the invention a second variant of the third embodiment

4e a side view of the second variant of the third embodiment of a diode laser component according to the invention

The 1a to 1c show three different types of seals 60 how to seal the open space 16 before the radiation emission sections 13a in the three embodiments described below are used. 1a shows a seal 60 as a sealing ring 61 is formed, which is used for the first embodiment. The gasket is an electrically insulating adhesive. 1b shows as a seal 60 a sealing ring 61 with two sealing segments 62 and 62 , which at two opposite points to the sealing ring 61 are connected. Also this seal 20 consists of electrically insulating adhesive. It is important for the second embodiment. 1c finally shows as a seal 60 a sealing ring 61 with a sealing segment 62 , which at two opposite points on the sealing ring 61 connected. The sealing ring 61 consists of an electrically insulating adhesive of low thermal conductivity (0.1 to 0.5 W / m / K), the sealing segment 62 consists of an electrically insulating adhesive of high thermal conductivity (1 to 5 W / m / K). This seal 60 is intended for the house of the laser diode element in the third embodiment.

Other types of seals are in the 3c and 4d shown.

It should also be noted that the windows 51 in the front views of the 2d and 4b are drawn transparent to the view of the underlying elements, in particular the laser diode element 10 and the sealing ring 61 to enable.

FIRST EMBODIMENT

A diode laser subassembly 40 represented in 2 B , consists of a laser diode bar 10 ( 2a ) as a laser diode element, a first contact body 20 , whose first connection surface 21 the epitaxial side of the laser diode bar 10 with the first, epitaxial-side contact surface 11 opposite and cohesively by means of a solder layer (not shown) areally to the first contact surface 11 is soldered, a second contact body 30 , whose second connection surface 31 the substrate side of the laser diode bar 10 with the second, substrate-side contact surface 12 opposite and cohesively by means of a solder layer (not shown) areally to the second contact surface 12 is soldered, as well as an electrically insulating layer 41 on the side of the laser diode bar facing away from the radiation emission surface 10 behind the laser diode bar 10 between the first and second contact bodies 20 and 30 is arranged and to a potential separation of the two contact bodies 20 and 30 contributes. In a first variant, the two contact bodies 20 and 30 made of copper, and the solder is an indium solder. In a second variant, the two contact bodies 20 and 30 in mass or volume, predominantly of a composite of carbon in a metal matrix, such as a silver-diamond composite, and the solder is a gold-tin solder. Both contact bodies 20 and 30 Due to their high electrical and thermal conductivity form an electrical and thermal contact for the laser diode bar 10 , A first, the first connection surface 21 opposite, connecting surface 22 of the first contact body 20 serves the heat transfer to a first heat sink (not shown). A second, the second pad 31 opposite, connecting surface 32 of the second contact body 30 serves the heat transfer to a second heat sink (not shown). Alternatively or optionally, the contact bodies form 20 and 30 each one heat sink.

The electrically insulating layer 40 is an electrically insulating adhesive, a plastic film provided on both sides with an adhesive layer, or a ceramic plate provided with a solder layer on both sides.

The laser diode bar 10 indicates its radiation emission surface 13 several radiation emission sections 13a - Also called emitter - on which make laser diode radiation in one direction by the radiation emission direction symbol 15 is displayed, is emitted from the drawing plane to the viewer.

The first contact body 20 has in radiation emission direction 15 a first face 23 parallel to the radiation emission surface 13 runs. The second contact body 30 has in radiation emission direction 15 a second end face 33 parallel to the radiation emission surface 13 runs. Both faces 23 and 33 lie in a common plane.

For the protection of the environmental emission sensitive radiation emission sections 13a is in the sense of completing the invention the diode laser component 80 by means of a sealing ring 61 trained seal 60 ( 1a ) as a window 51 trained optics unit 50 on the part of their laser diode bar 10 facing optically active radiation entrance surface at the radiation exit side of the diode laser subassembly 40 attached ( 2c ). In this case, a first sealing ring section 61a between the window 51 and the first end face 23 of the first contact body 20 arranged and bridges the space between the window 51 and the first end face 23 Completely ( 2d ). A second, the first sealing ring section 61a opposite, sealing ring section 61b is between the window 51 and the second end face 33 of the second contact body 30 arranged and bridges the space between the window 51 and the second end face 33 Completely. A third sealing ring section 61c standing in front view of 2d in a clockwise direction to the first seal ring section 61a connects and counterclockwise to the second sealing ring portion 61b is between the window and a first non-emitting region of the radiation emission surface 13 arranged and bridges the space between the window 51 and said first region of the radiation emission surface 13 Completely. A fourth sealing ring section 61d standing in front view of 2d counterclockwise to the first seal ring portion 61a connects and clockwise to the second seal ring section 61b is between the window and a second non-emitting region of the radiation emission surface 13 arranged and bridges the space between the window 51 and said second region of the radiation emission surface 13 Completely. Between the first and second non-emitting regions of the radiation emission surface 13 are the emitters 13a arranged. For the sake of completeness, it is mentioned that the solder layers between the electrical contact surfaces 11 . 12 and the connection surfaces 21 . 31 a contribution to sealing the free space in front of the emitters 13a contribute.

With this embodiment, only the sensitive surface areas of the radiation emission portions become 13a housed, but not the whole laser diode element 10 ,

SECOND EMBODIMENT

In the second embodiment, the laser diode element 10 a single-ended laser diode 10 , On the part of their two electrical contact surfaces are contact body 20 and 30 to form a diode laser subassembly 40 soldered to them ( 3a ). An optics unit 50 consists of a cylindrical sleeve 52 - Also called ferrule - as a socket for an optical fiber 51 serves. At its, the laser diode end facing it has an optically effective curved coupling surface, the emitter 13a the laser diode 10 is opposite and spaced by a clearance from her. The optics unit 50 is on the part of one of the base surfaces of the ferrule 52 at the radiation exit side of the diode laser subassembly 40 over the sealing ring 61 the seal 60 ( 1b ), wherein a first sealing ring portion 61a a lower part of the ferrule 52 and the first contact body 20 sealingly interconnecting and a second sealing ring portion 61b an upper part of the ferrule 52 and the second contact body 30 sealingly connects with each other.

To the sealing ring close at a first location, which is arranged between the contact surface planes, a first sealing segment 62 at, and at one, the first location opposite, second location a second sealing segment 62b ( 3b ). Both sealing segments contact both opposite side surfaces of the laser diode 10 as well as in each case the opposite connection surfaces of the contact body 20 and 30 , Thus, a house of the free space between the emitter and coupling surface of the optical fiber is created, but not a house of the laser diode 10 ,

A house of the laser diode 10 is achieved with the second variant of the second embodiment. This is indicated by the seal 60 a third seal segment 62c which is formed as a sealing ring and in two places at the second ends of the sealing segments 62 and 62b is connected, the first ends at two points of the sealing ring according to the invention 61 are connected ( 3c ).

The second variant of the second embodiment uses the same diode laser subassembly 40 out 3a like the first variant. As an optics unit 50 comes a composite of collimating lens 51 and mirrors 52 used, which is an optically effective mirror surface 53 has, which is opposite to the radiation exit surface inclined by 45 ° ( 3d ). It reflects the beam 55 which divergent from the emitter 13a exits, and deflects it by 90 °, as by the beam lines 55 is indicated. After the deflection, the beam passes 55 the collimation lens 51 , is collimated by them and leaves the optics unit 50 in a direction parallel to the normal of the first electrical contact surface. The optics unit 50 is by means of the sealing ring 61 at the radiation exit side of the diode laser subassembly 40 attached, in such a way that a lower part of the optics unit 50 - here: the mirror 52 - The first contact body 30 opposite, wherein a wherein a first sealing ring portion 61a of the sealing ring 61 the lower part of the optics unit 52 and the first contact body 20 sealingly connecting together, and an upper part of the optical unit 50 - here: the collimation lens 51 - The second contact body 30 opposite, wherein a second sealing ring portion 61b of the sealing ring 61 the upper part of the optics unit 52 and the second contact body 30 sealingly connects with each other. On the radiation exit of the beam 55 the laser diode 10 opposite side is a photodetector 70 arranged, at least part of the radiation, which the laser diode via the back facet 14 leaves, receives. The photodetector 70 as an example of a sensor unit by means of the third, designed as a sealing ring, sealing segment 62c cohesively on the back surface 24 of the first contact body 20 and on the back surface 34 and second contact body 30 attached. A house of the laser diode 10 So it is through the two contact bodies 20 and 30 , the optics unit 50 , the sensor unit 70 and the seal 60 out 3c completely achieved.

THIRD EMBODIMENT

A further embodiment is in a first variant by the diode laser component 80 from 4a (lateral cross section) and 4b (Frontal plan view against the radiation emission direction) with the seal 60 from 1c given. In particular, the seal 60 divided into two parts and has a seal segment 62 which is formed in the form of a layer of an electrically insulating, thermally conductive, filled with ceramic particles adhesive. Through this adhesive layer 62 between the contact bodies 20 and 30 is arranged and the laser diode bar 10 Surrounds U-shaped, the two contact bodies 20 and 30 interconnected cohesively and electrically insulating. The contact bodies 20 and 30 consist predominantly of a metal-containing composite material, externally at least in the laser diode bar 10 opposite Areas covered with a metal layer. In each case a layer of gold-tin solder (not shown), the said areas are mechanically, thermally and electrically to the opposite electrical contact surfaces 11 and 12 ( 2a ) of the laser diode bar. The contact bodies 20 and 30 are in all four pairs mutually perpendicular spatial directions parallel to the electrical contact surfaces 11 and 12 with O-shaped protrusions over the laser diode bars. The protrusion portions in the radiation emission direction 15 in each case have a 45 ° bevel on which the unimpeded propagation of the high-divergent in the fast-axis direction perpendicular to the electrical contact surfaces radiation of the laser diode bar 10 guarantee. There is a free space between these protruding sections 16 created a fiber lens as collimating lens 54 absorbs the radiation of the laser diode bar 10 collimated in the fast-axis direction. To the free space 16 closes one as a window 51 trained optics unit 50 on, via first and second sealing ring sections 61a and 61b a sealing ring 61 from electrically insulating, unfilled adhesive cohesively to the end faces of the two contact body 20 and 30 connected. The adhesive ring 61 is at two ends of the adhesive layer 62 connected and forms together with the adhesive layer 62 in the 1c shown seal 60 ,

In a further development, not shown, of this first variant of the third embodiment, the fiber lens forms 54 only the window of the optics unit 50 ,

In a development of the first variant of the third embodiment, shown in FIG 4c , gets on the fiber lens 54 waived. Instead, the collimation by partially convex formation of the window 51 achieved, with the convex portion of the window 51 both - as shown - on the laser diode bar 10 opposite side, as well as on the laser diode bar 10 may be formed facing side. In contrast to the first variant, the contact bodies 20 and 30 each second outer, the first inner chamfers in each case opposite chamfers at the in the radiation emission direction 15 trained protrusion sections. They serve as traps for the adhesive ring 61 , visible in cross-section with its sections 61a and 61b which, unlike the first variant, does not exist between the window 51 and the contact bodies 20 and 30 lies, but outwardly facing edge surfaces of windows 51 and contact body 20 and 30 connects together materially.

Both in the first and in the second variant, the diode laser component is in operation via the connection surface 22 his first contact body 20 connected to a heat sink (not shown), wherein the second contact body 30 absorbed portion of the heat of the laser diode bar 10 over the seal segment 62 is delivered to the first contact body.

All the aforementioned embodiments have a sealing ring 61 not even partially electrically conductive. In 4d is a seal for a second variant of the third embodiment 60 represented, the sealing ring 61 is divided into four sealing ring portions, of which a first sealing ring portion 61a and a, the first seal ring portion 61a opposite second seal ring section 61b electrically conductive and a third sealing ring section 61c passing through a first end portion of the seal segment 62 is formed, and a fourth sealing ring portion 61d passing through a second end portion of the seal segment 62 is formed and the third sealing ring portion 61c is opposite, electrically insulating.

On the in 4e shown diode laser component 80 transferred are the first sealing ring portion 61a and the second seal ring portion 61b as a solder layer, for example, as a vapor deposited indium or Zinnlotschicht realized. metallization 56a and 56b on the laser diode element facing side of the window 51 serve the wetting and compound formation of the solder layers on the window. The adhesive layer 62 abuts two opposite sides of the intended for the transmission of the laser light portion of the window 51 between the metallizations 56a and 56b on the window 51 and thus seals the open space from the facets.

It is understood that one or more features of the embodiments can be interchanged and combined with each other, without going beyond the scope of the invention.

LIST OF REFERENCE NUMBERS

10

laser diode element

11

first electrical contact surface

12

second electrical contact surface

13

Radiation emitting surface

13a

Radiation emission section, emitter

15

Radiation emission direction symbol

16

free space

20

first contact body

21

first connection surface

22

Connection surface of the first contact body 20

23

End face of the first contact body 20

24

Rear surface of the first contact body 20

30

second contact body

31

second connection surface

32

Connection surface of the second contact body 30

33

End face of the second contact body 30

34

Rear surface of the second contact body 30

40

Diode laser subassembly

41

electrical insulation

50

optical unit

51

transmission element

52

version

53

optically effective surface

54

collimating lens

55

Beam, beam lines

56a

first metallization

56b

second metallization

60

poetry

61

sealing ring

61a

first sealing ring section

61b

second sealing ring section

61c

third sealing ring section

61d

fourth sealing ring section

62

Seal ring segment

62a

first of several sealing ring segments

62b

second of several sealing ring segments

62c

third of several sealing ring segments

70

Sensor unit

80

diode laser component

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• JP 09275244 A [0001]
• EP 1341275 A2 [0013]
• US 2006029117 A1 [0013]

Claims (18)

Diode laser device ( 80 ) with - at least one edge-emitting laser diode element ( 10 ), - a first contact body ( 20 ) and - at least one second contact body ( 30 ), wherein the laser diode element ( 10 ) - on a first side at least a first electrical contact surface ( 11 ), on an opposite side of the first side at least one second electrical contact surface ( 12 ), and - at least one, disposed between the planes of the electrical contact surfaces, radiation emission surface ( 13 ) with at least one radiation emission section ( 13a ), from which during operation of the diode laser component ( 80 ) Radiation is emitted into a first half-space, which passes through the plane of the radiation emission surface ( 13 ) is limited, the first contact body ( 20 ) at least one first connection surface ( 21 ), the - the first electrical contact surface ( 11 ) and - with the first electrical contact surface ( 11 ) is in at least one first mechanical contact, which is in the projection of the laser diode element ( 10 ) perpendicular to the first electrical contact surface ( 11 ) from the first electrical contact surface ( 11 ) to the first pad ( 21 ), and the second contact body ( 30 ) at least one second pad ( 31 ), the - the second electrical contact surface ( 12 ) and - with the second electrical contact surface ( 12 ) is in at least a second mechanical contact, which is in the projection of the laser diode element ( 10 ) perpendicular to the second electrical contact surface ( 12 ) from the second electrical contact surface ( 12 ) to the second pad ( 31 ), characterized by - at least one optical unit ( 50 ), which at least one transmissive element (at least partially transparent to the radiation) ( 51 ) and at least one, at least partially arranged in the first half-space and the radiation emission section ( 13a ) at least partially opposite, optically effective surface ( 53 ) through a free space ( 16 ) from the radiation emission section (FIG. 13a ), and - at least one seal ( 60 ) leading to a sealing of the open space ( 16 ) contributes to the environment and at least one closed sealing ring ( 61 ), of which - a first sealing ring section ( 61a ) makes a first partial contribution to the seal, which between the optical unit ( 50 ) and the first contact body ( 20 ), and - a second sealing ring section ( 61b ) makes a second partial contribution to the seal, which between the optical unit ( 50 ) and the second contact body ( 30 ) he follows. Diode laser device ( 80 ) according to claim 1, characterized in that the first sealing ring section ( 61a ) the first contact body ( 20 ) and / or the optics unit ( 50 ) and / or the second sealing ring portion ( 61b ) the second contact body ( 30 ) and / or the optics unit ( 50 ) contacted. Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the seal ( 60 ) is cohesively and is partially or completely formed by an electrically insulating joining agent. Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the first sealing ring section ( 61a ) at least in sections between the first contact body ( 20 ) and the optics unit ( 50 ) is arranged and / or the second sealing ring portion ( 61b ) at least in sections between the second contact body ( 30 ) and the optics unit ( 50 ) is arranged. Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the sealing ring ( 61 ) - a third sealing ring section ( 61c ) between a first end of the first sealing ring portion ( 61a ) and a first end of the second sealing ring portion ( 61b ) is arranged and makes a third partial amount for sealing, and - a fourth sealing ring portion ( 61d ), which between a second end of the first sealing ring portion ( 61a ) and a second end of the second sealing ring portion ( 61b ) is arranged and makes a fourth partial amount for sealing. Diode laser device ( 80 ) according to claim 5, characterized in that the third and / or fourth sealing ring section ( 61c / 61d ) the radiation emission surface ( 13 ) of the laser diode element ( 10 ) to contact Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the seal ( 60 ) at least a first sealing segment ( 62 . 62 ), which at a first position of the sealing ring ( 61 ) connected. Diode laser device ( 80 ) according to claim 7, characterized in that the first sealing segment ( 62 . 62 ) at a second location of the sealing ring ( 61 ) which is opposite to the first position in a clockwise direction at least partially through the first sealing ring portion ( 61a ) and counterclockwise at least partially through the second sealing ring portion (FIG. 61b ), the first sealing segment ( 62 . 62 ) at least in sections on the radiation emission surface ( 13 ) facing away from the laser diode element ( 10 ) is arranged and with the sealing ring ( 61 ) to a complete house of the laser diode element ( 10 ) contributes. Diode laser device ( 80 ) according to claim 7 or 8, characterized in that the first contact body ( 20 ) has at least one first protrusion which, in the second half space which is complementary to the first half space, extends in at least one direction parallel to the plane of the first contact surface (FIG. 11 ) via the laser diode element ( 10 ), the second contact body ( 30 ) has at least one, the first projection at least partially opposite, the second projection in the second half space in at least one direction parallel to the plane of the second contact surface ( 12 ) via the laser diode element ( 10 ), and the first sealing segment ( 62 . 62 ) makes a third partial contribution for sealing, which between the first and the second contact body ( 20 . 30 ) he follows. Diode laser device ( 80 ) according to claim 9, characterized in that the first sealing ring segment ( 62 . 62 ) contacted the first and the second projection and is electrically insulating. Diode laser device ( 80 ) according to any one of claims 8 to 10, characterized in that the first mechanical contact by a first frictional connection of the first electrical contact surface ( 11 ) with the first connection surface ( 21 ) is formed by the first pad ( 21 ) directly or indirectly via at least one intermediate layer under pressure on the first electrical contact surface ( 11 ) rests and / or the second mechanical contact by a second non-positive connection of the second electrical contact surface ( 12 ) with the second pad ( 31 ) is formed by the second pad ( 31 ) directly or indirectly via at least one intermediate layer under pressure on the second electrical contact surface ( 12 ) rests. Diode laser device ( 80 ) according to one of claims 7 to 10, characterized in that the laser diode element 10 has at least one first side surface, which at least in sections between the planes of the first and second electrical contact surface ( 11 . 12 ) and at an angle to the radiation emission surface ( 13 ) extends in the first half-space complementary second half-space, and the first sealing segment ( 62 . 62 ) contacts the first side surface in at least one region which extends from the plane of the first electrical contact surface ( 11 ) to the level of the second electrical contact surface ( 12 ). Diode laser device ( 80 ) according to one of claims 7, 9, 10 and 12, characterized in that the seal comprises at least one second sealing segment ( 62b ), which at a second location of the sealing ring ( 61 ) which is opposite to the first position in a clockwise direction at least partially through the first sealing ring portion ( 61a ) and counterclockwise at least partially through the second sealing ring portion (FIG. 61b ) is spaced. Diode laser device ( 80 ) according to one of claims 1 to 10, 12 and 13, characterized in that the first mechanical contact by a first cohesive connection of the first electrical contact surface ( 11 ) with the first connection surface ( 21 ) is formed, wherein the first cohesive connection in the projection of the laser diode element ( 10 ) perpendicular to the first electrical contact surface ( 11 ) from the first electrical contact surface ( 11 ) to the first pad ( 21 ) and / or the second mechanical contact by a second cohesive connection of the second electrical contact surface ( 12 ) with the second pad ( 31 ), wherein the second cohesive connection in the projection of the laser diode element ( 10 ) perpendicular to the second electrical contact surface ( 12 ) from the second electrical contact surface ( 12 ) to the second pad ( 31 ). Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the optically effective surface ( 53 ) is a radiation reflecting, transmitting, refracting, diffracting and / or scattering surface. Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the optically active surface ( 53 ) at least in sections at least one surface of the transmission element ( 51 ). Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the transmission element ( 51 ) is at least one element of the group of windows, lenses and optical fibers. Diode laser device ( 80 ) according to one of the preceding claims, characterized in that the optical unit ( 50 ) a version ( 52 ), the material fit with the transmission element ( 51 ) connected is.

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