DE102006012960A1 - Device for embossing foil substrates for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll, heat conducting bodies and homogeneous temperable surfaces - Google Patents

Abstract

The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. An embossing or overlapping region of the foil substrate is conductible between the surfaces by the supplying unit. The heat conducting bodies in conveying direction of the foil substrates are directly arranged before the embossing roll. Each of the heat conducting bodies exhibits a heat capacity, which is larger than the heat capacity of the overlapping surface of the embedded foil substrate. The temperable surfaces of both bodies are spaced apart from each other and overlap within a coherent lap region. The overlapping region exhibits a shape and size, which correspond to the shape and size of the embossing regions of the embossing die or the embossing regions of the embossing roll. The temperable surfaces are rectangular and exhibit a counter contour three-dimensional surface contour. The bodies exhibit a metal plate shape with a width, a length and a thickness. The plate thickness is more than 5 mm. A first overlapping surface corresponds to a part of a cylinder outer cover inner surface of a first cylinder with a cylinder diameter D1. A second overlapping surface corresponds to a part of a cylinder cover inner surface of a second cylinder with a cylinder diameter D2. The diameter D1 is less than the diameter D2. The device is intended a negative pressure system connected with one of the body and the foil substrate is suctionable at the surface of this body by means of negative pressure. Means is provided for the adjustment of predefinable distances between the overlapping surfaces of the body. A tempering system provided with the surfaces is formed in such a way that the surfaces are temperable at 0-250[deg]C with an accuracy of +-0.1[deg]K respectively. The tempering system is formed in such a way that one of the surfaces is temperable at temperature T1 greater than Tg and the other surfaces at temperature T2 less than Tg. The thermal energy of the bodies is supplyable in the form infrared radiation by means of inductive heating, electrical resistive heating or heat exchanger. The foil substrate is a foil laminate composed of two single foils, which exhibit different glass transitions. The device is operated cyclically and/or continuously.

Description

Technical area

The The invention relates to a device for embossing a Foil substrate having a film substrate thickness D, with at least a stamping mill, that's a stamping tool provides, as well as one the film substrate feeding the embossing unit.

was standing of the technique

It is known that certain polymers, so-called thermoplastics can be permanently deformed by being heated to a temperature above the characteristic of the respective thermoplastic glass transition temperature T _g , then the desired mechanical deformation of the material takes place and then the material to a temperature is cooled below the glass transition temperature T _g . The so-called hot embossing of films or sheet-like film substrates of a thermoplastic material, which is also known today, is based on this property of the thermoplastics. For films or even thicker sheet-like substrates made of thermoplastic material, the term "film substrate" is used uniformly below.

Hot stamping is a process in which a film substrate having the glass transition temperature T _{g is} first heated above the temperature T _g at least on a surface of the film substrate. Subsequently, a desired structure is impressed on this surface by an embossing tool and, finally, by cooling the embossed film substrate below the glass transition temperature T _g, the embossed structure is retained in a dimensionally stable manner. Ideally, the embossing tool is also positively connected to the film substrate during cooling in order to prevent relaxation of the embossed film substrate.

• Typ (a): Prägevorrichtungen mit Prägestempel zum planaren, zyklischen Heißprägen
• Typ (b): Prägevorrichtungen mit Prägewalze zum rotativen, kontinuierlichen Heißprägen

The embossing devices used for the hot embossing typically have a so-called embossing with the embossing tool as well as feeding and discharging units, for the supply and removal of the film substrate to or from the stamping on. In embossing the actual embossing process, ie the mechanical imprinting of the desired surface structure on the film substrate surface by kraftbeaufschlagtes contacting the embossing tool with the film substrate surface. Depending on whether an embossing die or an embossing roll is used as an embossing tool in the embossing device, basically two types of embossing devices can be distinguished:

• Type (a): Embossing dies for planar, cyclic hot stamping
• Type (b): embossing machines with embossing roll for rotary, continuous hot stamping

• – Zuführen des Foliensubstrates in das Prägewerk,
• – Erwärmen des Foliensubstrates und des Prägestempels auf eine Temperatur oberhalb der Glasübergangstemperatur T_g des Foliensubstrates,
• – Kraftbeaufschlagtes Kontaktieren von Prägestempel und Foliensubstratoberfläche,
• – Abkühlen des Foliensubstrats und des Prägestempels auf eine Temperatur unterhalb der Glasübergangstemperatur T_g,
• – Trennen von Prägestempel und Foliensubstrat, und
• – Abführen des geprägten Foliensubstrats aus dem Prägewerk.

In an embossing device of type (a), the embossing process is carried out in the following steps:

• Feeding the film substrate into the stamping plant,
• Heating the film substrate and the embossing stamp to a temperature above the glass transition temperature T _{g of} the film substrate,
• - Contacting the die and the film substrate surface with force,
• Cooling the film substrate and the stamping die to a temperature below the glass transition temperature T _g ,
• - Separation of die and foil substrate, and
• - Removal of the embossed film substrate from the stamping mill.

Due to the relatively long heating and cooling phases, the cycle time is on the order of about 10 minutes, ie every 10 minutes a new film substrate can be embossed. In this case, the typical film substrate surfaces to be embossed are in the range of approximately 100 cm ² since, with larger film substrate surfaces, a sufficiently homogeneous embossing pressure is not achieved. A disadvantage is thus that the embossing device of type (a) is not suitable for a high film substrate throughput due to the restriction to small film substrates and especially because of the high cycle times, ie this device is only suitable for economical hot embossing of small batches.

The embossers of type (b), on the other hand a high film substrate throughput. Usually, they become too formative Foil substrates as quasi endless film unwindable on a roll provided and continuously passed through the mill to then as embossed Foil substrate to be wound up again on another roll (so-called role-to-role principle).

In 1 As a prior art, an embossing device of type (b) is shown schematically. The foil substrate 1 is unwound from a first roller (not shown) and coming from the right in the conveying direction (arrows) via a first guide roller 5 the stamping plant 2 fed. In the stamping shop 2 are an embossing roll 3 and a counter roll 4 arranged opposite one another such that an embossing gap is formed between the rollers. The foil substrate 1 will be between both rollers 3 . 4 passed through the embossing gap, the embossing roll 3 with a certain force against the film substrate 1 presses and the counter roll 4 acts as an abutment. The pressure force thus acts along a line. The embossing roller 3 typically consists of high quality steel. On its mantle surface, the desired negative embossing mold is formed. The backing roll 4 consists of an elastic compliant material, or their mantle surface is covered with such a material to allow the embossing of the formations of Narbtäler in the film substrate. After leaving the stamping shop 2 is the finished embossed film substrate on two more rolls 7 . 8th a second roller (not shown) supplied and wound there.

The Film substrate becomes continuous and with a relatively high conveying speed through the embossing gap passed. Typical conveying speeds lie in the range of about one meter per second.

Heating the film substrate 1 takes place in the present example, first by the first, heated deflection roller 5 which heats the film substrate such that the film substrate has a temperature slightly below the glass transition temperature just before reaching the embossing mill. Immediately in front of the stamping plant 2 becomes the side of the film substrate to be embossed then by means of a thermal radiator 6 , brought to a temperature above the glass transition temperature, wherein the opposite film substrate side remains below the glass transition temperature to ensure a mechanical stability of the film substrate during the embossing process. Note: After the film substrate enters the stamping plant 2 until the actual embossing process of the film substrate by the embossing tool, there is no significant change in the temperature conditions previously imposed on the film substrate, ie the entry of the film substrate into the embossing mill can be approximately equated with its entry into the embossing gap.

The embossing roller 3 is typically tempered and maintained at a temperature below the glass transition temperature to cool the film substrate to a temperature below the glass transition temperature during embossing so as to "freeze" the embossed structure In a continuous embossing process, heat is permanently transferred to the embossing roll 3 introduced so that they must be cooled in the rule in order to ensure a constant embossing roller temperature. The described system is very complex and requires a complex control to the sizes: embossing roll temperature, temperature of the film substrate top, temperature of the film substrate bottom, cooling capacity of the embossing roll 3 , Heat input at the deflection roller 5 , Heat input through the thermal radiator 6 and to keep the film substrate advance speed at the optimum value.

As described, the type (b) embossing device enables a high film substrate throughput. In addition, film substrates up to a few meters wide can be embossed. However, there is the disadvantage that when starting up the device typically several hundred meters of film substrate must pass through the device before a stationary thermal state sets. The film substrate processed until the stationary thermal state is reached is therefore to be regarded as waste. The device is therefore useful only if a large amount of embossed film substrate to be manufactured, since the committee is then quantitatively in an economically meaningful relationship to the ultimately produced hot-stamped film substrate. Another disadvantage is that fluctuations in the heat input into the film substrate as well as an inhomogeneous heat input, for example by a thermal radiator 6 , sensitive to the impact quality. An additional disadvantage is the only small temperature difference between the top and bottom of the film substrate that can be generated by the device before it enters the embossing machine. This leads to a distortion of the film substrate due to the shrinkage process during cooling of the film substrate, which is intolerable for some applications.

So exists today for numerous applications, for example in the field of microfluidics or biotechnology, a need for highly accurate, structured, flat Components made of thermoplastic materials, each containing surfaces of have a few square centimeters. Such components may preferably also using hot stamping devices getting produced. The necessities numbers are often of an order of magnitude, in the economical use of embossing devices of the type (a) not for planar, cyclic hot stamping more, and the economical use of embossing devices of type (b) still not possible is. The devices of type (b) for rotary, continuous Hot stamping shoots over that Goal and allow the production of the required annual production within a few minutes, so that the ratio of the resulting committee to be needed Number of pieces like this it is high that economic production is not possible.

presentation the invention

Of the Invention is based on a device for embossing the task To provide film substrates, the stated disadvantages of the prior art the technology largely remedies and in particular an economic Production of embossed High quality film substrates and in flexible quantities, in particular of film substrates for the production of components in the fields of microfluidics, biotechnology, medicine and chemistry allows.

The solution the object underlying the invention is specified in claim 1. The concept of the invention advantageously further-forming features Subject of the dependent claims and the description, in particular with reference to the embodiment refer to.

According to the invention is a Device for embossing a film substrate having a film substrate thickness D, with at least one stamping mill, that's a stamping tool as well as a unit feeding the film substrate to the embossing unit, designed in such a way that that the feeding Unit in conveying direction of the film substrate in front of the stamping plant at least two of a thermally conductive material existing bodies, each having a homogeneously temperable surface, thus providing that the homogeneously temperable surfaces of both bodies are spaced apart opposite each other and overlap at least in a contiguous overlap area, and that at least one to be influenced Area of the film substrate in the overlap area between the surfaces through the afferent Unit feasible is.

at the device according to the invention become the homogeneous temperature surfaces of the at least two thermally conductive body as heat or refrigeration sources used to generate predeterminable temperature conditions in the film substrate. The thermally conductive body are doing in the afferent Unit preferably arranged immediately in front of the embossing unit to reduce energy losses and thus temperature changes of the film substrate after its heating during transportation in the stamping shop largely prevent.

The Film substrate becomes non-contact or with one-sided, thermally conductive Contact with a homogeneously temperable surface between the heat-conducting body guided. Such a coherent one Contact can be realized, for example, by providing a vacuum system with a film substrate surface on one side to the surface of a body is sucked. So also a touch of the film substrate with the surface of the opposite body prevented.

Of the Heat transfer between a homogeneously temperable surface and the film substrate surface takes place by heat radiation and / or by heat conduction.

For a homogeneous heating or cooling of the respective film substrate surfaces, ie for generating a surface constant temperature on the film substrate surface, in particular for the setting of a certain area uniform temperature gradient over the film substrate thickness D, it is necessary that the heat-conducting body and thus their surfaces on a correspondingly predeterminable , surface constant temperature can be maintained. For this purpose, a tempering system is preferably provided, with which the opposing body surfaces can be tempered on one side at a temperature T ₁ , and on the other side at a temperature T ₂ . Temperature control systems with which the respective body surface can be tempered within a temperature range of 0-250 ° C. with an accuracy of ± 0.1 ° K are particularly suitable for the most flexible possible use of the device according to the invention.

The Temperature control system controls the supply and removal of thermal energy to or from the heat-conducting bodies and thus the temperature of the homogeneously tempered surfaces. The thermal energy becomes the heat-conducting bodies preferably in the form of electromagnetic radiation, in particular as IR radiation, by means of inductive heating, electrical resistance heating of a heat exchanger or a combination fed from this. For possibly necessary cooling of the body are known heat sinks used.

The body each consist of a good thermal conductivity Material, eg. Of metal and / or graphite, so in the bodies and especially on their surfaces a quick compensation of local temperature fluctuations cause or do not occur at all. Ideally a homogeneously tempered surface always has a surface constant during operation surface temperature on. The body Furthermore, they preferably have a heat capacity that is greater as the heat capacity of the enclosed by overlapping surfaces Surface substrate. This In particular, short-term fluctuations in the energy or -austrages in or out of the heat-conducting bodies as possible no significant temperature change the homogeneously tempered surfaces causes. Due to the tempering system, the good thermal conductivity and the high heat capacity of the body can thus the surface temperature the body very exact area constant be set and held. This becomes a surface constant Heat energy transfer on the film substrate surfaces guaranteed.

The homogeneous temperature surfaces are still as smooth as possible, ie unstructured, designed. They preferably overlap in an overlapping area which corresponds in shape and size to at least the shape and size of the embossing area of the embossing tool, ie an embossing punch or an embossing roller. Typically, the homogeneously tempered surfaces completely overlap. The distance of the overlapping surfaces is usually less than a hundred times, preferably less than ten times and particularly preferably less than five times the film substrate thickness D. Advantageously, a means is provided for setting a predeterminable distance between the overlapping, homogeneously heatable surfaces of both bodies. Thus, the device can be flexibly and optimally adjusted to the processing of differently thick film substrates.

The inventive embossing device has preferably as a stamping tool an embossing roll and can be both continuous and cyclical Shape be used. When continuous embossing can then, as in the state of Technology for embossing devices of type (b), high volumes be characterized by film substrates. To do this the conveying speed of the Film substrate and the temperature of the homogeneously tempered surfaces such be coordinated with each other, that in the film substrate before the embossing process the desired temperature conditions be generated. The device according to the invention makes it possible across from the prior art, a more homogeneous heating of the substrate surfaces. Though results in the continuous embossing operation also a certain Committee in the start-up phase, but this is much lower as in the prior art. In addition, the regulation of the temperatures from film top and bottom much more stable and responsive less sensitive to external influences than in the prior art. This is mainly due to the large heat capacity of the heat-conducting body across from the area to be embossed. Therefore Fluctuations in heat input have an effect in the body and thus also in the film substrate lower than that in a conventional infrared substrate heated film substrate would be the case.

Advantageously, the device according to the invention is suitable for a cyclic embossing operation. Here, the film substrate to be embossed is conveyed between the heat-conducting bodies and lingers there. After just a short residence time, the film substrate surfaces take on the temperatures of their directly opposite, homogeneously temperature-controllable surfaces, and a corresponding temperature gradient builds up over the film thickness. Thus, without taking damage, the film substrate piece in question can also stay between the bodies for longer. The achievable cycle times can indeed be reduced by the film substrate used to the order of one second, which compared to the prior art reduces the cycle time to a six hundredths (1/600) of the hitherto typical cycle time for planar hot stamping. Furthermore, the device according to the invention is not limited to film substrate sizes of about 100 cm ² in a cyclic operation, but can process film substrates with a film width of a few meters.

in the In the simplest case, the device sees two opposite ones body each with a two-dimensional, rectangular, homogeneously tempered surface in front. The body are preferably in the form of a plate having a width X, a length Y and a thickness Z executed. The width of the heating plates is at least as large as the width of the to be embossed Film substrate. It should preferably be even wider than the film substrate, each to a surface constant temperature at the To ensure film substrate top and bottom. The length of the Heating plates should continue to be at least as large as the circumference of the embossing roller. Larger lengths are also possible and increase the length during the of a cycle imprintable Film substrate piece. The thickness of the hotplate should always be selected so that the heat capacity of the hotplates is clearly above that Heat capacity of between located on the heating plates lying Folieniensatstücks. In trials has it turned out that for this in particular metal plates (heating plates) with a plate thickness Z of more than 1 mm, preferably more than 5 mm are suitable.

The homogeneously temperature-controllable surfaces can in principle also have a counter-contoured three-dimensional surface contour. Preferably, the cylindrical shape is suitable for this purpose. An advantageous embodiment is therefore characterized in that a first of the overlapping surfaces of a cylinder shell outer surface of a first cylinder with a cylinder diameter D ₁ or a part of just one, and a second of the overlapping surfaces of a part of a cylinder jacket inner surface of a second cylinder with a Cylinder diameter D ₂ corresponds, where D ₁ <D ₂ applies.

The The film substrate becomes in conclusive contact over the Cylinder shell outer surface of the first cylinder out. The outer cylinder surface of the The first cylinder is heated by a temperature control system below the glass transition temperature of the film substrate, the cylinder inner surface of the second cylinder becomes a temperature above the glass transition temperature held. This preserves the film substrate only on its the cylinder jacket inner surface of the second cylinder directly opposite Surface in the one to be shaped Depth the required optimum embossing temperature, while the attached to the inner cylinder film substrate surface at a temperature below the glass transition temperature mechanically remains stable. The first cylinder is preferably as a rotating Roller formed.

Is in the device according to the invention used as a film substrate consisting of at least two individual sheets with different glass transition temperatures film laminate, so can the distortion during hot stamping, especially of microstructures improve, ie reduce. For this purpose, the individual film to be embossed is laminated onto a film with greater temperature resistance and freedom from distortion (carrier film). In addition to polymer films, films of other materials, for example Kovar or Invar, whose coefficient of expansion is minimal, can also be used as carrier films.

The The invention thus describes a hot stamping device with which both high as well as low quantities embossed Products can be produced economically in high quality. A committee falls unlike the prior art, only negligible Amount of. The apparative tax expense of the embossing device is clear less than in known rotary hot stamping devices. In addition, the inventive device the setting of a big one Temperature gradient over the film substrate thickness D (depending from D: 1-100 ° K) and to the Prior art, a higher Embossing quality.

Short description the invention

The Invention will be described below without limiting the general inventive concept an embodiment described by way of example with reference to the one drawing. It shows:

1 Schematic structure of an embossing device with embossing roll for rotary, continuous hot embossing (prior art)

2 Schematic structure of the device according to the invention using the example of a hot stamping device with embossing roller

1 shows the schematic structure of an embossing device with embossing roll for rotary, continuous hot stamping, as known from the prior art. For a description, reference is made to the above statements.

2 shows the schematic structure of a preferred embodiment of the device according to the invention according to the roll-to-roll principle, the basic structure according to the prior art 1 equivalent. Contrary to the state of the art 1 are in the inventive device in 2 for heating the film substrate to be embossed 1 two opposing, vertically mounted heating plates 9 . 10 provided with good thermal conductivity and high heat capacity. The heating plates 9 . 10 be kept by means of a tempering with heat and cold source and a control device (not shown) each at a predetermined temperature, wherein the temperature of the heating plate 9 below, and the temperature of the heating plate 10 is above the glass transition temperature of the film substrate to be embossed.

The foil substrate 1 becomes non-contact between the homogeneously tempered surfaces 11 the heating plates 9 . 10 guided. Alternatively, the heating plate 9 be connected to a vacuum system by means of which the film substrate to the surface 11 the heating plate 9 is sucked, so that a slip on is still possible. This will be the direct contact between the film substrate 1 and the heated over the glass transition temperature heating plate 10 prevents sticking of foil 1 and hotplate 10 excluded.

The temperature difference between the two facing heating plates 9 . 10 causes the film substrate to pass between them 1 adjusts a corresponding temperature gradient across the film substrate thickness. In this case, the surface of the film substrate to be embossed becomes embossable, while the opposite film substrate surface retains its mechanical strength. Slight variations in the amount of heat introduced into the heating plates result in only negligible variations in heating plate temperature due to the large heat capacity of the heating plates, resulting in equally small variations in the film substrate temperature.

• – Heizplatte 10 auf eine Temperatur T₁ oberhalb der Glasübergangstemperatur T_g der zu prägenden Folie erwärmen und mittels Regelung konstant halten,
• – Heizplatte 9 auf eine Temperatur T₂ < T_g erwärmen bzw. kühlen und mittels Regelung konstant halten,
• – Foliensubstrat 1 zwischen die beiden Heizplatten 9, 10 führen und den Folienanfang zwischen Prägewalze 3 und Gegenwalze 4 einführen,
• – Foliensubstrat für eine kurze Verweilzeit zwischen den Heizplatten belassen,
• – gesamtes zwischen den Heizplatten 9, 10 befindliches Foliensubstrat, bzw. ein Foliensubstratstück dessen Länge dem Umfang der Prägewalze entspricht, mit gleichmäßiger Prägegeschwindigkeit prägen. Dabei wird ein neuer Abschnitt des quasi Endlosfoliensubstrats zwischen die Heizplatten gezogen. Bereits nach kurzer Verweilzeit ist dieses Folienstück auf die Solltemperatur aufgeheizt und kann durch ein Weiterdrehen der Prägewalze geprägt werden.

Ideally, the device according to the invention is not used for continuous but for cyclic hot stamping. The hot stamping process is as follows:

• - heating plate 10 heat to a temperature T ₁ above the glass transition temperature T _{g of} the film to be embossed and keep it constant by means of regulation,
• - heating plate 9 heat or cool to a temperature T ₂ <T _g and keep it constant by means of regulation,
• - film substrate 1 between the two heating plates 9 . 10 lead and the beginning of film between embossing roll 3 and counter roll 4 introduce,
• Leave the foil substrate for a short residence time between the heating plates,
• - entire between the heating plates 9 . 10 present film substrate, or a film substrate piece whose length corresponds to the circumference of the embossing roll, embossing with uniform embossing speed. In this case, a new section of the quasi endless foil substrate is drawn between the heating plates. After a short residence time, this piece of film is heated to the desired temperature and can be embossed by further rotation of the embossing roller.

The Cycle time of a stamping cycle depending on the used film substrate in the range of approx. 1 second lie.

By using longer heating plates or by preheating the stamping foil to a temperature slightly below the glass transition temperature by means of the heated deflecting roller 5 or other measures can also be carried out over the prior art optimized continuous embossing of the film substrate.

The following is now to the embodiment according to 2 a concrete embodiment can be specified.

In this case, a hot stamping device according to 2 used to emboss a polycarbonate film (PC) with a film thickness of 500 microns, a width of 250 mm and a glass transition temperature of 150 ° C. In the conveying direction of the film are immediately in front of the embossing roller 3 two hotplates 9 . 10 made of aluminum, with a specific thermal conductivity of 237 W / (mK), with a length of 280 mm, a width of 400 mm and a depth (thickness) of 10 mm. The distance between the heating plates is 2 mm. The heating plate 9 becomes at the temperature 210 ° C, the heating plate 10 tempered at 140 ° C temperature. Optionally, additional heating plates can be used. The film substrate to be embossed 1 is between the heating plates 9 . 10 passed. After a residence time of 3 minutes between the heating plates, the film substrate surfaces take the respective temperatures of the heating plates or the film substrate to the corresponding temperature gradient on the film substrate thickness. Subsequently, the film substrate is fed at a conveying speed of 0.2 m / s of the embossing roll and embossed by this. The embossing roll is tempered at a temperature of 120 ° C, so that simultaneously with the embossing and a solidification of the embossed structures is achieved.

1

foil substrate provided, for example, from a roll

2

stamping

3

embossing roller

4

backing roll

5

First deflecting

6

IR emitters

7

Second deflecting

8th

third deflecting

9 10

thermally conductive Body, heating plate

11

homogeneously temperature-controlled surface

Claims (23)

Device for embossing a film substrate ( 1 ), which has a film substrate thickness D, with at least one embossing unit ( 2 ), which provides an embossing tool, as well as a film substrate ( 1 ) the stamping plant ( 2 ) feeding unit, characterized in that the feeding unit in the conveying direction of the film substrate ( 1 ) in front of the stamping plant ( 2 ) at least two of a thermally conductive material existing body ( 9 . 10 ), each having a homogeneously tempered surface ( 11 ), in such a way that the homogeneously tempered surfaces ( 11 ) of both bodies ( 9 . 10 ) spaced from each other and overlap at least in a contiguous overlap region, and that at least one region of the film substrate to be embossed ( 1 ) in the overlap area between the surfaces ( 11 ) is feasible by the supplying unit. Apparatus according to claim 1, characterized in that the embossing tool is an embossing roll ( 3 ). Device according to claim 1 or 2, characterized in that the bodies ( 9 . 10 ) in the conveying direction of the film substrate ( 1 ) immediately before the mill ( 2 ) are arranged. Device according to one of claims 1 to 3, characterized in that each thermally conductive body ( 9 . 10 ) has a heat capacity which is greater than the heat capacity of the film substrate enclosed by the overlapping surfaces ( 1 ). Device according to one of claims 1 to 4, characterized in that the heat-conducting material of the body ( 9 . 10 ) Metal and / or graphite is. Device according to one of claims 1 to 5, characterized in that the distance of the overlapping surfaces of both bodies ( 9 . 10 ) is less than a hundred times, preferably less than ten times, and more preferably less than five times the film substrate thickness D. Device according to one of claims 1 to 6, characterized in that the overlapping surfaces of both bodies ( 9 . 10 ) are unstructured. Device according to one of claims 1 to 7, characterized in that the overlapping region has a shape and size which at least the shape and size of the embossing region of the embossing punch or the embossing region of the embossing roll ( 3 ) corresponds. Device according to one of claims 1 to 8, characterized in that the homogeneous tempe rierbaren surfaces ( 11 ) the body ( 9 . 10 ) are two-dimensional, in particular rectangular surfaces. Device according to one of claims 1 to 9, characterized in that the bodies ( 9 . 10 ) have a plate shape with a width X, a length Y and a thickness Z. Device according to claim 10, characterized in that the bodies ( 9 . 10 ) Metal plates and the plate thickness Z is more than 1 mm, preferably more than 5 mm. Device according to one of claims 1 to 8, characterized in that the homogeneously tempered surfaces ( 11 ) have a counter-contoured three-dimensional surface contour. Apparatus according to claim 12, characterized in that a first of the overlapping surfaces of a cylinder jacket outer surface of a first cylinder with a cylinder diameter D ₁ or a part thereof, and that a second of the overlapping surfaces of a part of a cylinder jacket inner surface of a second cylinder having a cylinder diameter D ₂ corresponds to where D ₁ <D ₂ . Device according to one of claims 1 to 13, characterized in that one with one of the body ( 9 . 10 ) is provided, and that the film substrate is sucked to the surface of this body by means of negative pressure. Device according to one of claims 1 to 14, characterized in that a means for setting a predeterminable distance between the overlapping homogeneously tempered surfaces ( 11 ) the body ( 9 . 10 ) is provided. Device according to one of claims 1 to 15, characterized in that a temperature control system is provided, with which one of the surfaces ( 11 ) at a temperature T ₁ and the other surface ( 11 ) are temperature-controlled at a temperature T ₂ . Apparatus according to claim 16, characterized in that the temperature control system is designed such that the surfaces ( 11 ) in each case in a temperature range of 0-250 ° C with an accuracy of ± 0.1 ° K are temperature controlled. Apparatus according to claim 16, characterized in that the tempering system is designed such that a surface ( 11 ) at a temperature T ₁ > T _G and the second surface ( 11 ) are temperature-controlled at a temperature T ₂ <T _G , wherein T _G corresponds to the glass transition temperature of the film substrate. Device according to one of claims 1 to 18, characterized in that thermal energy the body ( 9 . 10 ) in the form of electromagnetic radiation, in particular IR radiation, mediated inductive heating, electrical resistance heating, a heat exchanger or a combination thereof can be fed. Device according to one of claims 1 to 19, characterized in that the film substrate ( 1 ) is a polymer, kovar or invar foil. Device according to one of claims 1 to 20, characterized in that the film substrate ( 1 ) is a composite of at least two individual sheets film laminate. Apparatus according to claim 21, characterized that the two individual films have different glass transition temperatures. Device according to one of claims 1 to 22, characterized that the device cyclically and / or continuously operable is.