DE102005019832A1 - Illumination device for LCD-display device, has auxiliary component designed as optical component and inserted into recess in optical unit, where component is connected with optical unit in connection region in mechanically stable manner - Google Patents

Abstract

The device has an optical unit (2) including a recess and forming a beam for a radiation emitted by a radiation-emitting semiconductor chip. An auxiliary component (11) designed as an optical component is inserted into the recess and is connected with the optical unit in a connection region in a mechanically stable manner. The optical unit partially deflects the radiation, generated by the chip, to the auxiliary component.

Description

The The invention relates to a lighting device with an optical Element used for beam shaping of a radiation source the radiation generated radiation device is provided.

One optical element, in particular a lens, for such a lighting device is often shaped so that a given radiation characteristics for the Lighting device is achieved at least approximately. As a basis for the shape of the optical element usually becomes a point radiation source accepted. However, real sources of radiation are usually not point-like, so that the optical element radiation generated by the radiation source often not only according to the given Radiation characteristic forms, but also residual radiation components, not according to the given Abstrahlcharakteristik run, emitted during operation of the lighting device become. Such residual radiation components can be undesirable Influence on the emission characteristics of the lighting device to have. Residual radiation components can e.g. due to manufacturing defects in the manufacture of the optical element be caused.

A The object of the present invention is an improved lighting device specify the above type, in particular, small and compact can be trained.

These Task is by a lighting device with the features of claim 1. Advantageous developments and refinements are the subject the dependent claims.

At least an embodiment the lighting device is an optical element that has a recess that has for the insertion of an additional component provided in the recess is. The additional component can be used for be provided a variety of functions, with advantage beam characteristics the lighting device improves, in particular application-specific influenced, or their handling, such as when installed in a Application, as for the backlighting of a display device, in particular an LCD display device, facilitated.

Farther can similar optical elements are manufactured in large quantities and provided with various additional components after production become.

It It should be noted that the additional component may also be outside the recess, such as by laying on the optical element with the optical element can be used. An insertion of the However, additional component in the recess is in terms of a small and compact lighting device of particular advantage.

At least a further embodiment is the optical element for beam shaping for one of a radiation source, in particular a radiation-emitting semiconductor chip, the illumination device provided radiation generated. A radiation-emitting semiconductor chip as Radiation source facilitates a particularly small and compact execution the lighting device.

At least a further embodiment The optical element deflects the radiation generated by the semiconductor chip at least partially past the additional component. The additional component Thus, for example, can be designed absorbent, without the Significantly reduce the efficiency of the lighting device.

At least a further embodiment The optical element has an optical axis. The optical Element is preferably rotationally symmetric about the optical axis educated. As a result, a particularly symmetrical emission characteristic the lighting device can be achieved. It should be noted that under a rotationally symmetrical training in this case a corresponding Forming the optical functional areas of the optical element is understood. Areas of the optical element that are not optical Fulfill function and, for example, the attachment, can be quite from the rotationally symmetric Deviate training.

At least a further embodiment extends the optical axis through the recess and / or the semiconductor chip. If the semiconductor chip is arranged on the optical axis, then radiation generated by the semiconductor chip to the optical element for Beam shaping are supplied particularly homogeneous or symmetrical. Furthermore, the optical axis can pass through the additional component.

In accordance with at least one further embodiment, the additional component is rotationally symmetrical, in particular with respect to the optical axis. The insertion of the additional component in the recess can thus, in particular in a rotationally symmetrical design of the optical Ele be relieved.

At least a further embodiment the optical element has a reflective surface and / or a breaking surface on. The breaking surface can be the reflective surface enclose and / or between the semiconductor chip or one of the radiation coupling serving surface, about a floor area, the arranged optical element and the reflective surface be.

With Advantage can radiation generated by the semiconductor chip, in particular a central first radiation portion of a in the optical element coupled radiation cone, above reflection at the reflecting surface the breaking surface to the Beam forming supplied become.

At least a further embodiment a wall of the recess forms the reflective surface or includes the reflective surface. The shape of the recess can thus determine the design of the reflective surface.

At least a further embodiment is the reflective surface for total reflection of a portion of the semiconductor chip on the reflective surface arranged and arranged radiation. On additional Activities, such as a reflection coating, to increase the reflectivity of the reflective surface can thus be dispensed with and the optical element can in the sequence economical getting produced.

At least a further embodiment is the reflective surface arranged and formed such that the reflective surface a Proportion of the radiation generated by the semiconductor chip to the refractive index surface deflects, with the refractive surface with preference as the main exit surface of Radiation from the optical element or the lighting device serves. By reflection on the reflective surface can the breaking surface additional Radiation fraction are fed to the beam shaping, so that radiation for beam shaping in the optical element also indirectly on the refractive surface can meet. A small and compact design of the lighting device will so relieved.

The breaking surface processes with preference both light bundles, that is, both the one, which comes from the reflective surface, as well as the one which directly, that is without interposed targeted deflection on a surface of the optical element originating from the radiation source. The impact areas the two light bundles are on the breaking surface focus on each other separated. The deflected by the reflective surface light beam strikes to one of a radiation entrance surface of the optical element adjacent or the semiconductor chip facing portion of the refractive surface and is broken and bundled by this. That directly from the radiation source originating light bundles meets one of the reflective surface adjacent or facing away from the semiconductor chip Area of refractive surface and is broken and bundled by this.

und

zur optischen Achse begrenzt ist. Diese Winkel werden im Wesentlichen durch die Anordnung und Ausgestaltung der brechenden Oberfläche bestimmt. Bevorzugt ist wenigstens einer, besonders bevorzugt sind beide, dieser Winkel kleiner als 90°. Bevorzugt liegt der Hauptabstrahlbereich im Winkelbereich zwischen einschließlich 80° und 90° zur optischen Achse. Bevorzugt liegt im Hauptabstrahlbereich, z.B. bei einem Winkel von ungefähr 80° zur optischen Achse, ein Maximum der aus dem optischen Element ausgekoppelten Strahlungsleistung.In accordance with at least one further embodiment, radiation generated by the semiconductor chip is coupled out of the optical element via the refractive surface laterally from the optical axis or transversely to the optical axis, in particular at an angle other than 0 ° to the optical axis. In particular, the radiation can be coupled away from the optical axis or at an angle, approximately obliquely, to the optical axis. In this way, a main radiation region of the radiation emerging from the optical element can be realized, which passes through two different angles

and

is limited to the optical axis. These angles are essentially determined by the arrangement and design of the refractive surface. Preferably, at least one, more preferably both, this angle is less than 90 °. Preferably, the main emission range is in the angular range between 80 ° and 90 ° to the optical axis. Preferably, in the main emission region, for example at an angle of approximately 80 ° to the optical axis, there is a maximum of the radiation output coupled out of the optical element.

At least a further embodiment is the distance of the semiconductor chip to the radiation entrance surface of optical element less than or equal to 2 mm, preferably smaller or equal 1 mm, more preferably less than or equal to 0.6 mm. A distance between inclusive 0.5 mm and 0.6 mm has proven to be particularly advantageous. A compact and small design of the lighting device is so simplified.

At least a further embodiment a proportion of the radiation generated by the semiconductor chip is detected entering the optical element directly on the refracting surface and a further portion of the radiation generated by the semiconductor chip strikes after reflection at the reflecting surface, preferably immediately, on the breaking surface. Advantageously, at least a majority of the semiconductor chip can thus be used generated radiation of the refractive surface in a particularly short ways fed to the beam shaping become.

At least a further embodiment is the breaking surface for bundling of the directly on this and the under reflection on the reflecting surface on the breaking surface formed appropriate radiation component. On the part of the breaking one surface From the optical element passing radiation can be bundled and optionally according to a be formed predetermined characteristic. This way a can homogeneous illumination of one by means of the lighting device to illuminating surface, in particular one arranged laterally offset to the optical axis and / or reaches the optical axis, in particular substantially perpendicular, intersecting surface become.

At least a further embodiment is the breaking surface, especially from outside considered the optical element, at least in a partial area convexly curved. With The refracting surface preferably has a central area a first radius of curvature, adjacent to an area having a second, larger radius of curvature. Especially Preferably, one side of the reflective surface to the Central area of the refracting surface adjacent area larger radius of curvature as the central area. Furthermore, one from the central area seen further than this of the reflective surface and / or a portion of the refractive surface remote from the optical axis have greater radius of curvature compared to the central region. This Area can be on the part of the radiation entrance surface of the optical element be arranged.

At least a further embodiment is the breaking surface, especially from outside considered the optical element, at least in a partial area concave curved. With Preference is this concave curved Area in a surface area adjacent to the reflective surface educated. A local homogeneous distribution of the radiation power, in particular the illuminance, on a to be illuminated by means of the lighting device, in particular levels, area can thus beam forming at the concave surface area be achieved in a simplified manner. In particular, such a component the radiation emitted by the illumination device in a Direction to be increased parallel to the optical axis.

The optical element may be approximated in shape as one in one Angle> 0 ° to the optical Axis or a main emission of the radiation source after Outside Tilted refractive convex lens with a reflective back accomplished be the radiation of the radiation source after entering the optical element, in particular by the radiation entrance surface, not directly on the refractive surface of the optical element is directed, to the side of the breaking surface redirected and coupled there with simultaneous bundling. Therefor A first breaking surface area is preferably provided.

A directly from the radiation source to one separate from the first second refractive surface area The incident radiation is absorbed by the latter while concurrently directly deflected towards the side of the optical element or laterally coupled to the optical axis.

At least a further embodiment is the breaking surface symmetrical or asymmetrical. Furthermore, the breaking surface be designed as freeform lens.

At least a further embodiment has the reflective surface a V-shaped cross-section. Such a design is particularly suitable for the reflection, in particular a total reflection of radiation at the reflective surface, especially in the direction of the refractive surface. Furthermore, the recess be formed such that the reflective surface a V-shaped cross-section having.

At least a further embodiment is at least one leg of the V-like shaped surface, in particular from outside the considered optical element, convex curved. In this way, the Increases the proportion of total reflected radiation and / or simultaneously with the Reflection on the reflective surface a first beam on the reflective surface be achieved.

At least a further embodiment is at least one leg of the substantially V-shaped reflective surface so curved S-like, that a front side, in particular the semiconductor chip facing away, edge region the refractive and / or reflective surface against direct radiation of the semiconductor chip is shadowed. Prefers for this purpose, a part of the leg adjacent to the optical axis, especially from outside considered, convex curved and another, in particular bordering on the refractive surface and / or farther from the semiconductor chip, part of the leg is concave curved. By shading, the return reflection of radiation components be reduced in the direction of the semiconductor chip.

According to at least one further embodiment The optical element has a radiation entrance surface. The radiation entrance surface can be flat or curved. A planar design is compared to a curved entrance surface usually less expensive feasible. By means of a curved radiation entrance surface, however, radiation can be further formed already upon entry into the optical element. In this way, by means of a suitable design of the curvature, it is possible to set the ratio of the radiant power or the corresponding radiation component, in particular directly, impinging on the refracting surface, to the radiation power or the corresponding radiation component striking the reflective surface, in particular directly. Preferably, the radiation entrance surface, in particular viewed from outside the optical element, is curved convexly or concavely, at least in a partial region. By means of a concave curvature, for example, the proportion of radiant power impinging directly on the reflecting surface can be increased, while a convex curvature tends to increase the proportion of radiation directly striking the refractive surface. The achievement of a predetermined radiation characteristic can be facilitated. Particularly preferably, a curved region of the radiation entrance surface crosses the optical axis and / or spans the semiconductor chip.

At least a further embodiment occurs a proportion of the semiconductor chip generated and the reflective surface incident radiation through the reflective surface or a radiation component enters the recess. This Radiation component can in particular the initially mentioned residual radiation For example, by the use of a non-point radiation source is conditional. The passing through the reflective surface portion The radiation can affect the additional component.

At least a further embodiment the additional component is designed as an optical component. The optical component is preferred for the entry of, in particular in the region of the recess, radiation emerging from the optical element formed in the optical component or for reflection of this radiation or provided. This radiation can thus advantageously by means of Additional component to be processed optically.

At least a further embodiment is the additional component as absorption, diffusion, refraction, Diffraction or reflection component executed. By means of the reflection component the proportion of reflected in the direction of the refractive surface Radiation around a passing through the reflective surface Share increased become. Preferably contains the reflection component is a metal or is part of the recess facing surface provided with a reflection-enhancing material. For a refractive component, about a lens, a beam forming by refraction occurs at a diffraction component by diffraction. An absorption component absorbs, preferably substantially all of them entering Radiation, so that a predetermined emission without residual radiation Shares can be realized in a simplified manner. Via a diffusion component can on the part of a radiation exit side of the additional component via diffusive Beam shaping simplifies a local homogeneous distribution of the radiation power, in particular the illuminance, on a to be illuminated by means of the lighting device, in particular levels, area be achieved. If necessary, beam shaping can also take place by means of an additional component with a location-dependent refractive index (GRIN: GRaded INdex).

At least a further embodiment the additional component is designed as a mechanical component, which a mechanical function. The additional component is preferred as a leader, Adjustment or spacing component executed. A guiding or adjusting component can the installation or the placement of the lighting device in an application, especially at a given location. A spacing component may be compliance with one, in particular predetermined, distance between the lighting device and these downstream structures, such as the display device, e.g. an LCD, or a diffuser film, ensure.

The Additional component may optionally also be used as mechanical and optical Component executed be, with the optical function by the additional mechanical function preferably not or not significantly affected and / or vice versa.

At least a further embodiment is the additional component at least in a partial area on the optical Element arranged attached to the optical element or with the connected optical element. A small, compact training of Lighting device is facilitated by such an arrangement.

In accordance with at least one further embodiment, the additional component is mechanically stably connected to or attached to the optical element in a connection region of the optical element. In this case, an area of the surface, in particular of the reflective surface, of the optical element is preferably Ver provided connection area, which is designed and arranged such that it is shadowed with respect to the semiconductor chip directly emitted in the direction of the connection region radiation. Advantageously, such a region of the surface of the optical element can be used as a connection region, which has essentially no optical function. The efficiency of the lighting device is thus not affected by a mechanically stable attachment of the additional component in the connection area.

At least a further embodiment the additional component is inserted in the recess. An attachment or compound of the additional component with the optical Element is not necessary here. If necessary, the Additional component by means of an outside of the lighting device and / or of the optical element arranged stabilizing element in the Be held recess. The stabilization element can, for example, by one arranged on the additional component or from the additional component be given shaped spacer element. Preferably the additional component in this case by means of the spacer element exerted Pressure held in the recess. The pressure can be, for example exercised by means of structures be over spaced the spacer element from the illumination device are. Furthermore, the additional component by means of the stabilizing element with preference held in a stable position in the recess, so that the optical Function of an additional optical component not due to change in position varied.

At least a further embodiment is the additional component by means of press fit, hot press fit, Caulking, hot caulking or an adhesive bond with the optical element or attached to this.

at a press fit, the additional component by means of the optical Element and the additional component of pressure exerted on each other attached to optical element. Preferably, this pressure acts essentially along the surface normal the surface the additional component or the recess of the optical Element.

at the hot press fit the additional component is heated in such a way that it is not flowable though nevertheless plastically malleable. In the hot press fit forms the heated Additional component accordingly under the action of force, in particular a press-fitting pressure to the optical element.

At the Calking learns the additional component and / or the optical element, if appropriate additionally to a press-fitting pressure, a mechanically generated deformation. For this purpose, the additional component and / or the optical element, for example with a deformation tool, such as a needle, so deformed, that the additional component is mechanically stable on the optical element is attached. The deformation can in particular punctually or in some areas. When hot caulking is the deformation tool additionally heated so that the additional component and / or the optical element in the contact area with The tool is plastically moldable and / or flowable. The effort can when stewing across from reduced caulking.

at an adhesive bond is the attachment by means of an adhesive material over the between the additional component and the optical element an adhesive bond is trained.

At least a further embodiment is the additional component according to the form shaped the recess. The insertion of the additional component or fixing, in particular by means of the above fastening methods, is so relieved. Preferably, the additional component is accurate formed so that they, for example, frictionally engaged in the recess can be.

At least a further embodiment if the additional component is arranged by means of an additional component, formed from the additional component or in the additional component preformed fastening device mechanically stable on the optical Element, in particular in the connection area attached.

At least a further embodiment is a holding device, in particular as a counterpart to the fastening device, arranged on the optical element, formed from the optical element or preformed in the optical element. Preferably, the mounting device arranged in the connection area.

For fixing the additional component on the optical element, the holding device can engage in the fastening device and / or vice versa. The fastening device and / or the holding device can be designed as a snap or screw device. Preferably, the additional component is screwed or snapped into the recess. On the optical element and on the additional component, rotating, coordinated screwing devices are particularly preferably provided for this purpose. Also, a snap device for a snap connection can be carried out accordingly. However, the additional component can also be screwed or snapped onto individual, spatially separated screw or snap locations, which are formed on the optical element or the additional component, with the optical element.

At least a further embodiment the recess extends from a semiconductor chip opposite Side of the optical element into the optical element. With Preference is the recess on the semiconductor chip opposite Side bounded by an edge of the optical element. The edge can be here circulate the recess and / or run flat.

At least a further embodiment the connection area adjoins the edge or is in the range of the edge. Due to the comparatively large distance of the Edge area of the semiconductor chip is an arrangement of the connection area advantageous in this area, since the edge area with preference only at low level or even no optical function takes over.

At least a further embodiment is the additional component in the recess spaced from the edge or closes off with the edge. The formation of small and compact lighting devices is facilitated because the additional component does not have the Edge protrudes.

At least a further embodiment is seen from the semiconductor chip between the optical element and the additional component a free space, in particular a cavity formed. Advantageously, the free space can be used further. For example For example, a refractive index matching material having a refractive index jump between the refractive index of the optical element and that of the additional component decreases, about in solid or liquid Form in which free space is arranged. A dense cavity is for the Introducing a particularly suitable in this remaining liquid.

At least a further embodiment the optical element is provided as an attachment optics on a component housing. This can be done with or without additional Refractive index adjustment done.

At least a further embodiment is the optical element for mounting on an optoelectronic Component, which includes the semiconductor chip, provided and / or formed.

At least a further embodiment is at the optical element at least one mounting member for mounting the optical element is arranged on the optoelectronic component, formed from the optical element or in the optical element preformed.

At least a further embodiment the optoelectronic component has a housing body which has at least one Has fastening element, in particular as a counterpart to the mounting element.

for Attachment of the optical element to the optoelectronic component can the mounting element in a recess of the housing body, the designed as a fastener is, intervene and / or vice versa. Preference is given to the optical Element by means of press fit, hot press fit, an adhesive bond or a thermal rivet connection to the optoelectronic Component, in particular attached to the housing body. In contrast to the former, fastening methods described in more detail above During thermal riveting, the mounting element is heated in such a way that it becomes fluid and to the optoelectronic component, in particular the housing body or the fastener of the housing body, flows into and at cooling down subsequently cured. Due to the deformation is a thermal rivet connection for attachment the additional component on the optical element rather unsuitable, as a such a strong warming of the optical element or the additional component is harmful can affect an optical functional area of the optical element.

At least a further embodiment According to the invention, the optoelectronic component has a first electrical Connecting part and a second electrical connection part and a, in particular, executed separately from the electrical connection parts, thermal Connection part on. about the thermal connection part can accumulate heat on the semiconductor chip, for example due to a high generated radiation power, regardless of the electrical contacting of the component via the electrical connection parts, be easily removed from the semiconductor chip. This will a stable operation of the component, in particular of a high-performance component, facilitated. The thermal connection part can, for example, with an external heat conducting device, e.g. a heat sink, get connected. This connection can be during the assembly of the component on a carrier plate, e.g. a circuit board, such as a metal core board, by means of a thermally conductive compound, such as a solder joint, the heat conducting device respectively.

The optical element may optionally be attached before or after the assembly of the optoelectronic component on the support plate to this. The same applies to an arrangement of the additional component in the recess and / or attachment of the additional component to the optical element.

The Component with the optical element can be used with advantage for the lateral emission of radiation of a top emitter component, for the lateral coupling of radiation of a top emitter into one Optical fiber, for large-area rear lights of displays and symbols and of LCD displays, for signal lights, for homogeneous illumination of reflectors and for ambient lighting. Optionally, the optical element may also be in an adapted form be integrated into a light guide.

At least a further embodiment the optical element and / or the additional component is integrally formed. Such an element or such a component can be made particularly cost-effective with advantage.

for Production of the optical element and / or the additional component For example, a casting or pressing process, such as an injection molding, Injection molding or compression molding or a transfer molding process be applied. With preference, the optical element contains a Plastic, such as PMMA (polymethyl methacrylate). In particular, can the optical element directly to the semiconductor chip, such as a light-emitting diode chip, molded, e.g. be poured. Residual radiation components, for example caused by a dimensional error of the mold.

for Production of the optical element or for molding of the optical Elements to the semiconductor chip, for example, a casting process, such as Injection molding, transfer molding or compression molding, or a pressing process, about transfer molding, especially suitable. The shape of the optical Elements is determined by the tool used here.

At least a further embodiment the optical element is free from undercuts. On the cost-intensive use of a slider in the casting tool at the production of the optical element can be dispensed with.

At least a further embodiment the additional component is manufactured separately from the optical element.

In In a particularly advantageous embodiment, the lighting device comprises an optical element having a recess, wherein the optical Element for beam forming for a from a radiation-emitting semiconductor chip of the illumination device generated radiation is provided, the recess for insertion an additional component is provided in the recess and the optical element, the radiation generated by the semiconductor chip at least partially deflects past the additional component.

The optical element can in this case depending on the desired function with different Additional components are provided so that the lighting device can be used variably. The additional component is as far as possible freely selectable and can be carried out in particular absorbent, since the optical Element deflects radiation past the additive component.

Farther For example, the lighting device may be due to the onset of the additional component be made particularly small and compact in the recess.

Further Advantages, advantageous embodiments and expediencies The invention will become apparent from the following description of the embodiments in conjunction with the figures.

It demonstrate:

1 in the 1A . 1B and 1C schematic sectional views of a first embodiment of a lighting device in 1A , A second embodiment of a lighting device in 1B and a third embodiment of a lighting device in 1C each with different optical elements,

2 in the 2A . 2 B schematic partial sectional views of a fourth embodiment of a lighting device in 2A and a fifth embodiment of a lighting device in 2 B .

3 FIG. 2 is a schematic partial sectional view of a sixth embodiment of a lighting device, FIG.

4 in the 4A . 4B and 4C schematic partial sectional views of a lighting device with three variants of an additional optical component,

5 in the 5A and 5B schematic partial sectional views of a Beleuchtungsvorrich with two variants of a mechanical additional component and in 5C a schematic sectional view of an optical element with an additional component and

6 in the 6A . 6B . 6C schematic partial sectional views of a lighting device with attached by means of different variants to the optical element additional components,

7 3 shows a schematic partial sectional view of a lighting device with an additional component attached to the optical element by means of a further variant,

8th a schematic sectional view of an optical element for a lighting device in 8A and a schematic plan view from below of the optical element in FIG 8B .

9 a schematic sectional view of an embodiment of a lighting device with an optical element attached to an optical element,

10 an embodiment of a particularly suitable for a lighting device optoelectronic device based on a schematic perspective view of the optoelectronic component in 10A , a schematic perspective sectional view of the component in 10B and a schematic perspective oblique view in FIG 10C and

11 a schematic sectional view of an embodiment of a particularly suitable for a lighting device semiconductor chip.

Same, similar and equally acting elements are in the figures with provided the same reference numerals.

In 1 are based on the 1A . 1B and 1C schematic sectional views of a first embodiment of a lighting device in 1A , A second embodiment of a lighting device in 1B and a third embodiment of a lighting device in 1C each shown with different optical elements.

The lighting device 1 as in the 1A . 1B and 1C shown, each comprises an optical element 2 for beam forming one of a radiation-emitting semiconductor chip 3 the radiation generated radiation device is provided. The optical element further has a recess 4 on.

An optical axis 5 of the optical element passes through the recess 4 and the semiconductor chip 3 , The optical axis preferably covers a main emission axis of the chip which is determined by the main emission direction of the semiconductor chip and which particularly preferably extends substantially perpendicular to the surface of the semiconductor chip facing the optical element. Furthermore, the optical element 2 preferably rotationally symmetrical about the optical axis 5 educated.

The optical element 2 has a reflective surface 6 and a breaking surface 7 on. Preferably, the reflecting surface is arranged and formed for the total reflection of a portion of the radiation generated by the semiconductor chip. This can be achieved, for example, by a substantially V-shaped shaping of the reflecting surface, for example according to the illustrations in FIGS 1A . 1B and 1C be achieved. In particular, a wall of the recess 4 form the reflective surface, so that the shape of the reflective surface is associated with that of the recess. The recess or the reflecting surface accordingly tapers from a semiconductor chip 3 opposite side of the optical element, from which the recess extends into the optical element, in the direction of the semiconductor chip. A tip of the V-like shaped reflecting surface is preferably on the optical axis. On her the semiconductor chip 3 opposite side is the recess 4 from one edge 8th of the optical element 2 limited.

The reflective surface is preferred 6 arranged and designed such that it deflects a portion of the radiation generated by the semiconductor chip under reflection to the refractive surface. In particular, the refractive surface can 7 serve as the main exit surface of radiation from the optical element. In the 1A . 1B and 1B this is due to radiation components 61 and 62 clarified. The reflective surface 6 is furthermore preferably designed to reflect a radiation component generated in a central region of the semiconductor chip, which in particular comprises the optical axis.

From the semiconductor chip 3 generated radiation couples at least partially across the refractive surface 7 from the optical element 2 out. In this case, radiation from the optical element is laterally spaced from the optical axis 5 and obliquely, in particular at an angle different from 90 °, coupled to the optical axis. The angle to the optical axis is expediently between 0 ° and 90 °. With preference, the angle of the radiation coupled over the refractive surface to the optical axis is as large as possible chooses. In this way, a homogeneous emission characteristic directed laterally away from the semiconductor chip towards the front can be achieved 1 be achieved.

Preferably, a portion of the radiation generated by the semiconductor chip meets after entering the optical element 2 via a radiation entrance surface 9 on the part of the semiconductor chip 3 is arranged, directly on the breaking surface 7 and another part, such as the radiation component 61 or 62 , the radiation generated in the semiconductor chip meets after reflection at the reflecting surface 6 , preferably directly on the refractive surface 7 , A radiation component which strikes the refractive surface directly is due to the proportion of radiation 71 in the 1A . 1B and 1C clarified. Radiation striking directly on the refractive surface is preferably arranged in an edge region, which is in particular spaced apart from the optical axis, of the semiconductor chip 3 generated. The refractive surface is preferably arranged and designed to concentrate the radiation component which impinges directly on the latter and the radiation component striking the refractive surface under reflection at the reflecting surface. A homogeneous laterally forward radiation of the lighting device is facilitated. The breaking surface 7 Accordingly, it preferably processes radiation components which strike it directly from the semiconductor chip and which strike the refractive surface by means of reflection at the reflecting surface. Impact areas of these radiation components on the refractive surface are particularly preferably separated from one another. The deflected by the reflecting surface radiation component (eg the proportion 61 or 62 ) strikes a region of the refractive surface adjacent to the radiation entrance surface and is refracted and bundled by it. A radiation component originating directly from the semiconductor chip, for example (for example the proportion 71 ) meets one of the reflective surfaces 6 adjacent area of the refractive surface and is broken and bundled by this.

Of the Distance of the semiconductor chip to the radiation entrance surface is, for example 0.5 mm. A maximum of the decoupled from the optical element Radiation power is for example at an angle of 80 ° to the optical Axis.

The breaking surface 7 of the optical element is in the 1A . 1B and 1C shown embodiments seen from outside the optical element convexly curved at least in a partial region. Also the breaking surface 6 is convexly curved at least in a partial region.

Further is the breaking surface partially seen in the vertical direction from the semiconductor chip between the reflective surface and the radiation entrance surface or the semiconductor chip arranged.

However, radiation generated by the semiconductor chip can not decouple from the optical element only on the part of the refractive surface. Rather, radiation generated by the semiconductor chip can partly also be caused by the reflective surface 6 through into the recess 4 to step. In 1A this is due to a radiation fraction emerging from the optical element via the reflecting surface under continuous total reflection in the optical element 31 shown. This can after total reflection at the reflecting surface 6 and the breaking surface 7 on the radiation exit surface 9 meet and if the angle of incidence is smaller than the critical angle of total reflection than reflection in the direction of the semiconductor chip from the optical element 2 emerge or upon total reflection at the radiation entrance surface 9 pass through the reflective surface at a critical angle smaller than the total reflection angle. An exit of this radiation component 31 as re-radiation from the radiation entrance surface 9 is in 1A indicated by dashed lines.

In the 1B and 1C occurs a radiation component 32 through the reflective surface 6 through into the recess 4 one. By way of example, these radiation components strike the reflective surface at an angle of incidence which is less than the critical angle of total reflection, or they pass through the reflective surface due to impaired total reflection. Disturbed total reflection can be caused for example by surface defects of the reflecting surface.

In the recess 4 An additional component can be used, for example, the residual radiation 31 ( 1A ) or 32 ( 1B and 1C ) further processed or improved the handling of the lighting device. With regard to a more detailed description of the additional component, reference is made to the comments below on the exemplary embodiments of the additional component (cf. 4 to 7 . 9 and 10 ).

The in the 1A . 1B and 1C shown embodiments of the lighting device, despite a, as described above, substantially the same design differences.

So has the convex curved reflective surface 7 of the optical element 2 in 1A a central area 700 with a small radius of curvature, at the side of the reflective surface 6 a first surface area 701 With a comparatively larger radius of curvature and from the radiation entrance surface 9 a second surface area 702 with one opposite the central area 700 also adjoin larger radius of curvature.

Furthermore, according to the embodiment 1A the reflective surface 6 essentially convexly curved viewed from outside the optical element. Therefore, there is an increased risk that one in a front edge area 80 the recess 4 on the reflective surface 6 reflected radiation continues to be internally totally reflected in the optical element. This radiation can contribute to a not necessarily desired residual or rear radiation.

In contrast, in the embodiment according to 1B the V-shaped reflective surface 6 in addition curved S-like. In particular, the reflective surface 6 in an area adjacent to the optical axis 602 from outside the optical element 2 considered convex and one farther from the semiconductor chip 3 removed and to the breaking surface 7 bordering area 603 concave curved. From the semiconductor chip in the optical element in the direction of the edge region 80 the reflective surface 6 or the recess 4 thus extending radiation is increasingly not directly to the edge area 80 but is at the concave curved area 603 reflects the reflective surface. A continuous total reflection or a return radiation in the direction of the semiconductor chip, which is a radiation component 81 in 1B without S-like curvature of the reflective surface according to the proportion 31 out 1A could be subject to such a reduction. The radiation component 81 rather becomes the breaking surface 7 fed to the beam shaping.

The front edge area 80 The recess or the reflective surface thus assumes essentially no optical function, since it is opposite to the semiconductor chip 3 is shadowed directly on this apt radiation. Therefore, the border area 80 as a connecting area one into the recess 4 Additional component to be used, in which the additional component can be attached to the optical element or connected to this, particularly suitable.

Unlike in 1B embodiment shown, the optical element 2 the lighting device 1 in 1C a breaking surface 7 on, which has a concavely curved portion 703 having. In this case, it is preferable to contact the reflective surface 6 adjacent portion of the refractive surface concavely curved. The radiation components emitted by the illumination device in a direction parallel to the optical axis and comparatively close to the optical axis can thus be increased. This is in 1C exemplified by a parallel component 710 of the radiation component 71 shown.

In 2 are schematic partial sectional views of a fourth embodiment of a lighting device in 2A and a fifth embodiment of a lighting device in 2 B shown.

Unlike the in 1 shown embodiments in which the optical element 2 essentially a planar radiation entrance surface 9 has, the radiation entrance surface in the in 2 curved embodiments shown. The radiation entrance surface 9 In this case, each has a curved partial area - partial area 902 in 2A and subarea 903 in 2 B - on, on the optical axis 5 crosses and the semiconductor chip 3 spans.

About a curved formation of the radiation entrance surface 9 For example, beam shaping of a radiation generated by the semiconductor chip can already take place on the radiation entrance side. By suitable formation of the curvature, it is possible to set the ratio of the radiation power directly striking the refractive surface or of the corresponding radiation component to the radiation power striking the reflective surface or the corresponding proportion of radiation directly in the optical element. The curvatures given above are considered to be convex or concave as viewed from outside the optical element respectively. By means of a convex curvature according to 2A For example, the proportion of radiation striking the refractive surface may be increased relative to the radiation impinging on the reflective surface. For a concave curvature according to 2 B the reverse is the case.

The curved sections 902 and 903 out 2 preferably have a focus, in which particularly preferably the semiconductor chip 3 is arranged. Such a curved radiation entrance surface can also be used in lighting devices such as those in 1 shown used.

In 3 is a schematic partial sectional view of a sixth embodiment of a lighting device shown. In contrast to the preceding embodiments, the optical element 2 in 3 arranged directly on the semiconductor chip and the semiconductor chip thus not as in the 1 and 2 from the optical element 2 spaced.

The optical element can in particular the semiconductor chip molded, about to be cast. For this purpose, the semiconductor chip is preferably on a carrier layer 10 , such as a printed circuit board, arranged and / or mounted (chip-on-board). The semiconductor chip arranged on the carrier 3 For this purpose, it is preferably arranged in a tool shaped in accordance with the desired design of the optical element, for example a casting mold, and subsequently the optical element is molded onto the semiconductor chip. An injection molding process is particularly suitable for this purpose, wherein the optical element (cf., for example, the in 1 shown optical elements) is advantageously free of undercuts and can be dispensed with the costly use of a slide.

In 4 are based on the 4A . 4B and 4C schematic partial sectional views of a lighting device 1 with three variants of an optical additional component 11 shown. The additional component 11 is in each case in the recess 4 of the optical element 2 inserted and crosses the optical axis 5 of the optical element in the direction perpendicular to the optical axis. The additional component 11 is preferably arranged such that a portion 32 through the reflective surface 6 the optical element passing through radiation impinges on the additional component. This proportion can be in an executed as an optical component additive component, as in 4A . 4B and 4C represented, further processed. The additional component is furthermore preferably at least in a partial region on the optical element 2 arranged, connected to the optical element and / or attached thereto. For further information on this, in particular for attachment, reference is made to exemplary embodiments described below.

The additional component 11 according to 4A is designed as a reflection component. Through the reflective surface 6 passing radiation 32 , For example, due to disturbed total reflection, applies to the reflection component, is reflected at this and re-enters the optical element. In particular, the proportion of radiation reflected in the direction of the refractive surface of the optical element can thus be increased. The reflection component can, as in 4A represented, the recess 4 essentially complete completely and in particular with the edge 8th complete the recess.

The additional component 11 However, the recess can 4 deviating from the illustration in 4A only partially complete. For example, this is the additional component spaced from the edge of the recess. This is especially true for an S-like curved embodiment of the reflective surface as shown 6 advantageous because of the reflective surface 6 at the edge 80 the recess has only a slight optical function. The arrangement of a reflection component in this area can optionally be dispensed with.

The Reflection component may for example contain a metal or have a basic component provided with a metal layer is, the metal being for a radiation generated by the semiconductor chip expediently a suitably high reflectivity having.

In the variant in 4B the additional component is designed as a refraction component, in particular as a lens. Residual radiation components 32 can thus be formed by means of the additional component and also on the semiconductor chip opposite side of the additional component, in particular in the region of the optical axis can be emitted from the illumination device in this way radiation which is malleable on the formation of the refractive component.

Between the additional component and the optical element in this case is a free space 12 in which, for example, a refractive index matching material for reducing the refractive index jumps that cause the radiation 32 learns, is arranged. If the additional component with the optical element essentially closes tightly or if the additional component is connected to the optical element in such a way that this connection is dense, a liquid can optionally be arranged in the free space which can likewise serve for refractive index matching.

Prefers is the additional optical component seen from the semiconductor chip convexly curved.

In the in 4C variant shown is the additional component 11 formed as an absorption component. The in the area of the recess through the reflective surface 6 passing radiation 32 can thus be absorbed in the additional component. Unwanted residual radiation components in the radiation characteristic of the optical are thus reduced.

Farther The additional component can also be used as a diffractive optical additive component or as a diffusion component, which radiation exit side generates a homogeneous radiation distribution, be formed. Also an execution as a GRIN component is possible.

The optical element 2 , in particular the reflective surface 6 , deflects in the embodiments according to 4A . 4B and 4C from the semiconductor chip 3 generated radiation at least partially past the additional component, in particular towards the refractive surface.

In 5 are based on the 5A and 5B illustrated schematic partial sectional views of a lighting device with two variants of a mechanical additional component. The additional component 11 is in each case in the recess 4 of the optical element 2 used.

The optical element 2 , in particular the reflective surface 6 , also deflects in the embodiments 5 from the semiconductor chip 3 generated radiation at least partially past the additional component, in particular towards the refractive surface.

In 5A is the additional component 11 executed as a spacing component. For this purpose, a spacing element is at the additional component 13 arranged, formed from the additional component or preformed in the additional component. By means of the spacer element 13 is the maintenance of a predetermined distance of the lighting device to one of the lighting device on the semiconductor chip 3 arranged opposite side structure 14 , in particular a surface to be illuminated by means of the illumination device, for example a diffuser foil or an LCD. The additional component 11 For example, can be inserted into the recess without additional fastening or connecting measures and by a by means of the structure 14 over the spacer element 13 be exerted on the additional component pressure held stable in the recess. The structure 14 thus serves as a stabilizing element.

In the 5B shown variant of the additional component 11 is designed as a management and / or adjustment component. For this purpose, one of the adjustment and / or the guide serving element 15 , in particular on the side facing away from the semiconductor chip side of the additional component, arranged on the additional component, formed from the additional component or preformed in the additional component. The element 15 can during installation of the lighting device in an application, such as the backlighting of a display device, in particular an LCD display device, engage in a correspondingly designed guide device of the application, such as a rail, so that the lighting device is guided by means of the guide device on the guide element. At a predetermined location in the application, an adjustment device corresponding to the adjustment component may be configured such that the illumination device is placed at a predetermined location when installed in the application.

To the 4 and 5 It should be noted that an additional component may optionally take over mechanical and optical functions. Especially with the in 5 shown mechanical additional components of the arranged in the recess portion of the additional component can assume an optical function, such as a reflection component.

Farther It should be noted that with advantage differently designed additional components for like preformed optical elements can be used. optical Elements can thus with advantage in high quantity be made similar and subsequently with one for each Purpose suitable additional component can be fitted.

Furthermore, a mechanical additional component, in particular the element 15 not necessarily as in 5 shown protrude beyond the edge of the recess, but may, for example as a recess, for example for a Rastjustage, be formed in the additional component. The element 15 can therefore be spaced from the edge of the recess or complete with this

5C shows a schematic sectional view of an optical element 2 , which according to the in 1C is formed shown optical element, wherein in the recess 4 an additional component 11 is used. The additional component can be embodied here as an optical or mechanical component. In particular, can also in the recesses 4 in the 1A and 1B be used an additional component shown optical elements.

6 shows by the 6A . 6B and 6C schematic partial sectional views of a lighting device with attached by means of different variants to the optical element additional components.

In the various variants, the additional component is in each case in a connection region 680 of the optical element mechanically stably connected to the optical element or on the optical element 2 attached. In particular, an intimate mechanical bond can be formed between the additional component and the optical element. The connection area 680 is each an area of the reflective surface 6 especially in the marginal area 80 the recess 4 is arranged and / or in particular due to the S-like shaping of the wall of the recess, with respect to a semiconductor chip directly to the edge region 80 shadowed radiation is shadowed. The connection area 680 thus assumes essentially no optical function in the optical element 2 and the optical area of the optical element is advantageously not reduced.

In the first, in 6A shown variant is in the recess 4 arranged additional component 11 by means of an adhesive connection, which is formed in the connection region, on the optical element 2 attached.

For this purpose, the additional component is preferably designed such that in the connection region between the optical element and the additional component, a gap 16 is designed for receiving the adhesive. For the largest possible adhesion-promoting surface between the optical element and the additional component, the intermediate space is preferably substantially completely filled with adhesive. In the case of a sufficiently thin adhesive layer, it may be possible to dispense with the intermediate space.

In the variants according to 6B and 6C has the additional component 11 a fastening device 17 for fixing the additional component to the optical element 2 on. For this purpose, the optical element expediently has a holding device formed as a counterpart to the fastening device 18 on. The fastening device 17 can be arranged on the additional component, be formed from the additional component or preformed in the additional component. A subsequent arrangement of the fastening device to the additional component, after their production, this means an additional expense compared to a molding or preforming. Furthermore, a preforming of the fastening device in producing the additional component compared to a molding of the already produced additional component is usually more cost-effective. The same applies to the holding device, which may be preformed in the optical element, formed from this or arranged on this.

In the in 6B variant shown are the fastening device 17 and the mounting device 18 designed as a screwing. This preferably rotates around the additional component and the connection area 680 of the optical element.

In the 6C shown fastening device or holding device is designed as a snap device. The additional component is thus in the recess 4 formed screwed or snapped. The mounting device 18 is always in the connection area 680 arranged.

It It should be noted that instead of a training of the fastening device as a peripheral fastening device also selectively separate fastening devices can be provided, the for snapping or screwing the additional component with formed the optical element. The same applies to the mounting device.

In 7 is a partial sectional view of a lighting device with a further variant of the optical element 2 attached additional component shown.

The additional component 11 is here by means of press fit, hot press fit, caulking or hot caulking with the optical element 2 connected or attached to this. Such a mounting variant comes with advantage without an additional fastening device or mounting device. With regard to these attachment methods, reference is made to the statements to be found further above in the description.

In 8th is a schematic sectional view of an optical element 2 for a lighting device in 8A and a schematic plan view from below of the optical element in FIG 8B shown. The optical element 2 here has a plurality of mounting elements 19 on, which are provided for mounting the optical element to an optoelectronic device. The mounting elements may be arranged on the optical element, formed from the optical element or preformed in the optical element. For example, the mounting elements are as pins, as in 8th shown executed. The mounting elements 19 are preferably on the part of the radiation entrance surface 9 of the optical element 2 arranged. In a plan view of the radiation entrance surface 9 can, as in 8B shown the optical element 2 for example, have a substantially circular configuration. Preferably, the mounting elements are arranged in an edge region of the optical element. For example, tighten the mounting elements 19 a rectangle, especially a square on.

The mounting elements 19 For example, they can engage in corresponding fastening elements of the optoelectronic component. A number of four mounting elements has proven to be particularly advantageous for stable mounting.

In 9 is a schematic sectional view of an embodiment of a lighting device is shown with an attached to an optoelectronic device optical element.

The lighting device 1 has an opto-electronic component 20 on, that the semiconductor chip 3 includes. The optical element 2 , approximately according to one of the preceding figures forms, has one in the recess 4 used additional component 11 on and is by means of the mounting elements 19 at the optoelectronic component 20 attached.

For attachment in the optoelectronic component fasteners 201 formed, in which engage the mounting elements. The fasteners 201 are preferably formed as recesses, which from a first main surface 202 a housing body 203 of the optoelectronic component up to one of the first main surface 202 opposite second major surface 204 of the housing body. For example, the fastening elements can already be preformed in this case during the production of the housing body.

The fasteners 201 are formed in this embodiment for a thermal riveting. In this case, the mounting element protrudes after insertion into the fastening element on the part of the second main surface 204 of the housing body 203 beyond the second main surface, which is in 9 indicated by dashed lines. In the outstanding section of the mounting element 19 the mounting element is subsequently heated in such a way that it becomes fluid at least in this subregion. The flowable portion forms ("flows") to the fastener, so that after cooling and the solidification of the mounting member, a mechanically stable attachment of the optical element 2 at the optoelectronic element 2 at the optoelectronic component 20 formed. If appropriate, the housing body can also be heated in the area adjoining the fastening elements on the part of the second main surface, so that the housing body and the flowable mounting element merge.

The lateral extent of the fastener 201 is preferably larger than that of the mounting element on the part of the second main surface 19 and particularly preferably decreases in the direction of the first main surface 202 , The volume of the fastening element which is free after insertion of the mounting element into the fastening element is intended to absorb the material projecting beyond the second main surface before heating the fastening element.

This is it Fastener for example in the area adjacent to the second main surface the housing body preferably with a tapering in the direction of the first major surface, such as trapezoidal, Cross section formed. After rejuvenation, the fastener may become essentially cylindrical in the direction of the first main surface extend.

To increase the mechanical stability of the attachment of the optical element to the optoelectronic component, the optical element or the mounting element is preferably designed such that the optical element rests on the part of the first main surface of the housing body on this. Particularly preferably, the optical element and the housing body are adapted to each other such that after the thermal riveting by the second main surface 204 a substantially planar surface of the housing body is formed.

It should be noted that not only thermal riveting is suitable for fixing the optical element to the optoelectronic component. The methods explained above in connection with the attachment of the additional component can also be used here. In particular, hot pressing, press-fitting or gluing should be mentioned, in which the formation of a recess extending through the entire housing body as a fastening element is not absolutely necessary. A fastener for these attachment methods can be performed as a recess in the housing body and / or on the part of the second main surface 204 be limited by the material of the housing body. For attachment by means of caulking or hot caulking, the mounting element is preferably accessible to mechanical deformation on the side of the housing body opposite the optical element. For this purpose, the fastening element can be designed as the housing body completely penetrating recess. The introduced into the recess mounting elements can be targeted by the second main surface, in particular punctually, mechanically deformed.

For a press fit, the mounting elements preferably taper in a direction from the radiation entrance surface 9 path. For this purpose, the fastening elements may be formed as a recess or recess in the housing body, which particularly preferably has a substantially constant lateral dimension. The tapered mounting elements can be inserted into the fasteners. When the mounting member contacts the housing body, pressure is applied to the fastener which increases with further pressing in of the optical element which is finally press-fitted to the housing body.

The optoelectronic component 20 has a first electrical connection conductor 205 and a second electrical connection conductor 206 on. These protrude preferably on different side surfaces of the housing body out of this. The connection conductors are used for electrical contacting of the semiconductor chip 3 , The semiconductor chip 3 can with the first connection conductor 205 via a connection layer 207 , For example, an electrically conductive adhesive or a solder layer, electrically conductively connected and / or be attached thereto. With the second connection conductor 206 the semiconductor chip is preferably via a bonding wire 208 conductively connected.

The optoelectronic component 20 , In particular, the housing body, by means of Umgießen, such as by means of an injection molding, transfer molding or compression molding, one of the two connection conductors 205 and 206 comprehensive lead frame with a suitable molding compound, such as a plastic material, in particular an epoxy or acrylic-based material, such as a reaction resin produced. Followed by the semiconductor chip can be connected to the connecting conductors. The optoelectronic component can accordingly have a preformed housing, in particular a so-called premolded package.

Preferably, the housing body 203 a cavity 209 on, in which the semiconductor chip 3 is arranged. Furthermore, in the cavity 209 a serving mass 210 be arranged, in which the semiconductor chip 3 is embedded. This enclosure protects the semiconductor chip with advantage against harmful external influences. For example, the sheath contains a reaction resin, such as an acrylic or epoxy resin, a silicone resin or a silicone.

The optoelectronic component can be designed to produce mixed-color, in particular white light. For this purpose, a part of the radiation generated by the semiconductor chip excites, for example, in the coating mass 210 arranged luminescence conversion material, such as a phosphor, for emitting longer-wave radiation. From the mixture of the radiation generated by the semiconductor chip and the radiation remitted by the luminescence conversion material, mixed-colored, in particular white, light can result in the sequence. For white light generation, a primary radiation generated by the semiconductor chip in the blue spectral range and a radiation re-emitted by the luminescence conversion material in the yellow spectral range are particularly suitable.

The housing body 203 is preferably made of a good reflective material, such as white plastic. The walls of the cavity may be coated with a reflection-enhancing material, such as a metal, to further enhance the reflection of radiation produced by the semiconductor chip at the wall of the cavity. About reflection on the wall of the cavity, the proportion of the optical element 2 For beamforming supplied radiation can be increased with advantage.

The optoelectronic component is furthermore preferably surface mountable (SMD: Surface Mountable Device). For surface mounting, for example, the connection conductors 205 and 206 on the part of soldering surfaces 211 and 212 the connecting conductor soldered to conductor tracks of a printed circuit board (not shown).

Becomes the optical element 2 before the assembly of the optoelectronic component, optionally with or without additional component attached thereto, the entire illumination device with the optoelectronic component and the optical element attached thereto 2 be executed surface mountable.

In 10 is an embodiment of a particularly suitable for a lighting device optoelectronic component based on a perspective view of the optoelectronic component in 10A a perspective sectional view of the component in 10B and a perspective oblique view in FIG 10C shown schematically.

One Such optoelectronic component is for example in WO 02/084749 closer whose disclosure content is hereby explicitly by reference is incorporated in the present application. As optoelectronic Component is a component with the type designation LW W5SG (manufacturer: Osram Opto Semiconductors GmbH), a related component of the same Manufacturer or similar Component particularly suitable.

The optoelectronic component 20 includes a first electrical connection conductor 205 and a second electrical connection conductor 206 coming from the side surfaces of the case body 203 of the optoelectronic component 20 can protrude and are formed, for example, like a swing.

The housing body 203 has a cavity 209 on, in which the semiconductor chip 3 is arranged. The semiconductor chip 3 is with the connection conductor 205 For example, electrically connected by means of a solder joint. A conductive connection to the second connection conductor 206 is over the bonding wire 208 produced. The connection of the bonding wire to the second connecting conductor 206 is preferred in the area of a bulge 213 a wall 214 the cavity 209 ,

The semiconductor chip 3 is on a thermal connection part 215 arranged, which acts as a chip carrier. The thermal connection part extends in the vertical direction with preference from the cavity to the second main surface 204 of the housing body 203 and facilitates a, in particular with respect to the chip mounting surface on the thermal connection part, large-area, thermal connection of the semiconductor chip on the part of the second main surface to an external heat conducting device, such as a heat sink, for example made of Cu. The thermal load of the housing body can thus be reduced, in particular during operation of the component as a high-performance component with a high-performance semiconductor chip, with advantage. The optoelectronic component can be designed to generate a high radiation power at a heat transfer which is advantageously improved at the same time on account of the thermal connection part. Such an optoelectronic component is particularly suitable for illuminating surfaces, for example for backlighting an LCD.

The thermal connection part is for example in a tab of the first connection conductor 205 knotted or otherwise connected to the first terminal conductor, in particular electrically conductive and / or mechanical, laterally circumferentially. The second connection conductor 206 , for contacting with the bonding wire 208 is provided, is preferably with respect to the chip mounting plane of the semiconductor chip 3 on the thermal connection part 215 elevated. The available for a reflection of radiation surface of the wall of the cavity is kept so advantageously large. Furthermore, the thermal connection part itself can be designed to be reflective and then forms with preference a part of the bottom and / or the wall of the cavity. The thermal connection part can furthermore protrude from the housing body on the part of the second main surface or terminate substantially flush with the housing body. For example, the thermal connection part contains a metal of high thermal conductivity, such as Cu or Al, or an alloy such as a CuWo alloy.

A lead frame with the two connecting leads 205 and 206 and the thermal connection part 215 can be encapsulated in the production of such an optoelectronic device in a suitable casting process, such as an injection molding process, with the material of the housing body. The thermal connection part 215 is preferably with one or more bulges or bulges 216 formed, whereby the mechanical connection of the thermal connection part to the housing body improved and thus the overall stability of the optoelectronic device is increased.

From the first main area 202 the housing body are fasteners 201 formed, which are provided for attachment of the optical element, optionally with the additional component, wherein the optical element and / or the additional component may be performed, for example, according to the preceding embodiments. For fixing the optical element to the housing body 203 For example, four fasteners 201 be provided, which facilitate a mechanically stable attachment of the optical element to the component.

In 10C is a lighting device 1 with an optoelectronic component 20 and an optical element attached thereto 2 that a recess 4 has shown.

In 11 an embodiment of a particularly suitable for a lighting device semiconductor chip is illustrated by a schematic sectional view.

The semiconductor chip 3 , such as an LED chip, has one on a support 301 arranged semiconductor layer sequence 302 on, which is an intended for generating radiation active zone 303 includes. On the side facing away from the carrier of the semiconductor layer sequence is a first contact 304 arranged over which the semiconductor chip in connection with a arranged on the side facing away from the semiconductor layer sequence of the carrier second contact 305 is electrically connected. The first contact 304 is in particular for conductive connection to a bonding wire and the second contact 305 provided for attachment to a connection conductor approximately according to the preceding embodiments. The contacts may, for example, contain a metal.

In a preferred embodiment, the semiconductor layer sequence contains 302 , in particular the active zone 303 , at least one III-V semiconductor material, such as a material from the material systems In _x Ga _y Al _1-xy P, In _x Ga _y Al _1-xy N or In _x Ga _y Al _1-xy As, each with 0 ≤ x ≤ 1, 0 ≤ y ≤ 1 and x + y ≤ 1.

III-V semiconductor materials are used for generating radiation in the ultraviolet (In _x Ga _y Al _1-xy N) over the visible (In _x Ga _y Al _1-xy N or In _x Ga _y Al _1-xy P) to the infrared ( In _x Ga _y Al _1-xy As) spectral range particularly suitable. III-V semiconductor materials, in particular from the mentioned material systems, are further characterized by high internal quantum efficiencies in the generation of radiation.

In a further preferred embodiment, the active zone comprises 303 a heterostructure, in particular a double heterostructure. Furthermore, the active zone may comprise or be formed as a single or a multiple quantum well structure. By means of such structures, in particular a multiple quantum well structure or a double heterostructure, particularly high internal quantum efficiencies can be achieved.

The term quantum well structure in the context of the application includes any structure, in the charge carriers by confinement undergo a quantization of their energy states. In particular, the term quantum well structure does not include information about the dimensionality of the quantization. It thus includes quantum wells, quantum wires and quantum dots and any combination of these structures.

In a further preferred embodiment, a mirror layer is provided between the semiconductor layer sequence and the carrier 306 arranged. The mirror layer can be embodied, for example, as a metal-containing, in particular substantially metallic, mirror layer. Radiation generated in the active zone may be reflected by the mirror layer, thereby preventing absorption in the downstream of the mirror layer from the active zone, such as the support. The efficiency of the semiconductor chip 3 can be increased. For example, the mirror layer contains Al, Ag, Au or an alloy with at least one of these materials. Al and Ag have particularly high reflectivities in the ultraviolet and blue spectral range, Au also in the yellow, orange and red to the infrared spectral range.

In a further preferred embodiment, a connection layer is present between the carrier and the mirror layer 307 arranged, by means of which the semiconductor layer sequence is fixed by the mirror layer on the carrier. The connection layer 307 can for example be designed as a solder layer.

The in 11 shown semiconductor chip 3 is designed as a thin-film chip, which means that during the production of the semiconductor chip, the substrate on which the semiconductor layer sequence has been produced for the semiconductor chip, for example by means of epitaxy, is detached. The carrier 301 is therefore different from the substrate with preference and does not have to meet the high demands on a production substrate, but can be selected comparatively freely with regard to further properties which are advantageous for the semiconductor chip, for example a high thermal conductivity.

The active zone 303 is preferred with the second contact 305 electrically conductively connected via the electrically conductive carrier, the electrically conductive connection layer and the electrically conductive mirror layer and the semiconductor layer sequence.

To produce a thin-film semiconductor chip, for example, firstly the semiconductor layer sequence is produced on the substrate. Subsequently, the mirror layer, for example by means of vapor deposition, in particular sputtering, is applied to the side of the semiconductor layer sequence facing away from the substrate. On the part of the mirror layer, the composite with the semiconductor layer sequence and the substrate is applied via the connection layer 307 with the carrier 301 after which the growth substrate is removed or peeled off, for example by means of etching or laser cutting.

Thin-film chips are characterized, in particular with a mirror layer, by a advantageous high efficiency. Furthermore, a thin-film chip have a cosinusoidal radiation characteristic corresponding essentially to a Lambertian radiator. By means of a thin-film chip, in particular with metal-containing mirror layer, can be simplified as a surface radiator engineered Semiconductor chip can be realized.

• – an einer zu einem Trägerelement, z.B. dem Träger 301, hin gewandten ersten Hauptfläche einer Halbleiterschichtenfolge, die ein aktive Zone umfasst, insbesondere einer Epitaxieschichtenfolge, ist eine Spiegelschicht aufgebracht oder, etwa als Braggspiegel in der Halbleiterschichtenfolge integriert, ausgebildet, die zumindest einen Teil der in der Halbleiterschichtenfolge erzeugten Strahlung in diese zurückreflektiert;
• – die Halbleiterschichtenfolge weist eine Dicke im Bereich von 20 μm oder weniger, insbesondere im Bereich von 10 μm auf; und
• – die Halbleiterschichtenfolge enthält mindestens eine Halbleiterschicht mit zumindest einer Fläche, die eine Durchmischungsstruktur aufweist, die im Idealfall zu einer annähernd ergodischen Verteilung des Lichtes in der Halbleiterschichtenfolge führt, d.h. sie weist ein möglichst ergodisch stochastisches Streuverhalten auf.

A thin-film chip, such as a thin-film light-emitting diode chip, can be characterized in particular by the following characteristic features:

• - At one to a support element, eg the carrier 301 , turned first first surface of a semiconductor layer sequence comprising an active zone, in particular an epitaxial layer sequence, a mirror layer is applied or, for example integrated as a Bragg mirror integrated in the semiconductor layer sequence, which reflects back at least a part of the radiation generated in the semiconductor layer sequence;
• The semiconductor layer sequence has a thickness in the range of 20 μm or less, in particular in the range of 10 μm; and
• The semiconductor layer sequence contains at least one semiconductor layer with at least one surface which has a mixed-through structure which, in the ideal case, leads to an approximately ergodic distribution of the light in the semiconductor layer sequence, ie it has as ergodically stochastic scattering behavior as possible.

One Basic principle of a thin-film LED chip For example, see I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18 October 1993, 2174 - 2176, their disclosure content insofar hereby by reference is incorporated in the present application.

It It should be noted that the lighting device of course not only with a thin-film chip can be realized. Also other semiconductor chips such as a semiconductor chip, in which the substrate is not detached is, can for one Lighting device to be suitable. Due to the high efficiency and a simplified achievable, with preference increased directly in Direction of the optical element directed, surface emission is a thin film chip but especially suitable.

The invention is not by the description Limited exercise using the embodiments. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the claims or exemplary embodiments.

Claims (43)

Lighting device ( 1 ) with an optical element ( 2 ), which has a recess ( 4 ), wherein the optical element for beam shaping for one of a radiation-emitting semiconductor chip ( 3 ) of the illumination device is provided, the recess for the insertion of an additional component ( 11 ) is provided in the recess and the optical element generates the radiation generated by the semiconductor chip ( 61 . 62 ) at least partially deflects past the additive component. Lighting device according to claim 1, characterized in that the optical element ( 2 ) an optical axis ( 5 ) having. Lighting device according to claim 2, characterized in that the optical axis ( 5 ) through the recess ( 4 ) runs. Lighting device according to claim 2 or 3, characterized in that the optical axis ( 5 ) through the semiconductor chip ( 3 ) runs. Lighting device according to one of claims 2 to 4, characterized in that the optical axis ( 5 ) by the additional component ( 11 ) runs. Lighting device according to one of claims 1 to 5, characterized in that the optical element ( 2 ) a reflective surface ( 6 ) and a refractive surface ( 7 ) having. Lighting device according to claim 6, characterized in that a wall of the recess ( 4 ) the reflective surface ( 6 ). Lighting device according to claim 6 or 7, characterized in that the reflective surface ( 6 ) for the total reflection of a portion of the radiation striking the reflective surface from the semiconductor chip ( 61 . 62 ) is arranged and formed. Lighting device according to one of claims 6 to 8, characterized in that the reflective surface ( 6 ) is arranged and designed such that it forms a portion of the semiconductor chip ( 3 ) generated radiation ( 61 . 62 ) to the refractive surface ( 7 ), wherein the refractive surface as main exit surface of radiation from the optical element ( 2 ) serves. Lighting device according to one of claims 6 to 9, characterized in that the semiconductor chip ( 3 ) generated radiation over the refractive surface ( 7 ) from the optical element transverse to the optical axis ( 5 ) decoupled. Lighting device according to one of claims 6 to 10, characterized in that a proportion ( 71 ) of the semiconductor chip ( 3 ) generated radiation ( 61 . 62 ) after entry into the optical element ( 2 ) directly onto the refracting surface ( 7 ) and another portion after reflection at the reflective surface ( 6 ) hits the breaking surface. Lighting device according to one of claims 6 to 11, characterized in that the refractive surface ( 7 ) for the bundling of the direct ( 71 ) and of the radiation component meeting the refractive surface under reflection at the reflecting surface ( 61 . 62 ) is trained. Lighting device according to one of claims 6 to 12, characterized in that the reflective surface ( 6 ) has a V-shaped cross section or the recess ( 4 ) is formed such that the reflective surface ( 6 ) has a V-shaped cross section. Lighting device according to one of claims 6 to 13, characterized in that the refractive surface ( 7 ) is convexly curved at least in a partial region. Lighting device according to one of claims 6 to 14, characterized in that the refractive surface ( 7 ) is concavely curved at least in a partial area. Lighting device according to one of claims 6 to 15, characterized in that a proportion ( 31 . 32 ) generated by the semiconductor chip and on the reflective surface ( 6 ) impinging radiation passes through the reflective surface. Lighting device according to claim 16, characterized in that the proportion of the by the reflective surface ( 6 ) transmitted radiation to the additional component ( 11 ) meets. Lighting device according to one of claims 1 to 17, characterized in that the Additional component ( 11 ) is designed as an optical component. Lighting device according to claim 18, characterized in that from the optical element ( 2 ) enters the optical component or the optical component of the optical element ( 2 ) reflected radiation. Lighting device according to one of claims 1 to 19, characterized in that the additional component ( 11 ) is designed as an absorption, diffusion, refraction, diffraction or reflection component. Lighting device according to one of claims 1 to 20, characterized in that the additional component ( 11 ) is designed as a mechanical component. Lighting device according to one of claims 1 to 21, characterized in that the additional component ( 11 ) is designed as a guide, adjustment or spacing component. Lighting device according to one of claims 1 to 22, characterized in that the additional component ( 11 ) at least in a subarea ( 80 . 680 ) are arranged on the optical element or with the optical element (FIG. 2 ) connected is. Lighting device according to one of claims 1 to 23, characterized in that the additional component ( 11 ) in the recess ( 4 ) is inserted. Lighting device according to one of claims 1 to 24, characterized in that the additional component ( 11 ) by means of an outside of the recess ( 4 ) and / or the optical element arranged stabilization element ( 13 ) is held in the recess. Lighting device according to one of claims 1 to 25, characterized in that the additional component ( 11 ) in a connection area ( 680 ) of the optical element ( 2 ) is mechanically stably connected to the optical element or attached to the optical element. Lighting device according to claim 26, characterized in that a region of the surface, in particular of the reflective surface ( 6 ), of the optical element ( 2 ) as a connection area ( 680 ) is provided, which is designed and arranged such that it is shaded with respect to radiation emitted by the semiconductor chip directly in the direction of the connection region. Lighting device according to one of claims 1 to 27, characterized in that the additional component ( 11 ) by means of a press fit, hot press fit, caulking, hot caulking or an adhesive bond with the optical element ( 2 ) is connected or attached to this. Lighting device according to one of claims 1 to 28, characterized in that the additional component ( 11 ) according to the shape of the recess ( 4 ) is shaped. Lighting device according to one of claims 1 to 29, characterized in that the additional component ( 11 ) by means of a fixing device arranged on the additional component and formed from the additional component or preformed in the additional component (US Pat. 17 ) mechanically stable on the optical element ( 2 ), in particular in the connection area ( 680 ), is attached. Lighting device according to one of claims 1 to 30, characterized in that a mounting device ( 18 ), in particular as a counterpart to the fastening device ( 17 ), on the optical element ( 2 ), formed from the optical element or preformed in the optical element. Lighting device according to claims 26 and 31, characterized in that the mounting device ( 18 ) in the connection area ( 680 ) is arranged. Lighting device according to one of claims 30 to 32, characterized in that the fastening device ( 17 ) and / or the mounting device ( 18 ) is designed as a snap or screw device. Lighting device according to one of claims 1 to 33, characterized in that the recess ( 4 ) of a semiconductor chip ( 3 ) opposite side of the optical element ( 2 ) extends into the optical element. Lighting device according to one of claims 1 to 34, characterized in that the recess on the side opposite the semiconductor chip side of an edge ( 8th ) of the optical element ( 2 ) is limited. Lighting device according to Claims 26 and 35, characterized in that the connection region ( 680 ) to the edge ( 8th ) or in the area of the edge ( 80 ) is arranged. Lighting device according to claim 35 or 36, characterized in that the additional component ( 11 ) in the recess ( 4 ) of the Edge ( 8th ) is spaced or terminates with the edge. Lighting device according to one of claims 1 to 37, characterized in that the semiconductor chip ( 3 ) seen between the optical element ( 2 ) and the additional component ( 11 ) a free space ( 12 ) is formed. Lighting device according to one of claims 1 to 38, characterized in that the lighting device ( 1 ) is provided for backlighting a display device, preferably an LCD display device. Lighting device according to one of claims 1 to 39, characterized in that the optical element ( 2 ) for mounting on an optoelectronic component ( 20 ), which the semiconductor chip ( 3 ) is provided. Lighting device according to claim 40, characterized in that on the optical element ( 2 ) at least one mounting element ( 19 ) for mounting the optical element to the optoelectronic component ( 20 ), formed from the optical element or preformed in the optical element. Lighting device according to claim 41, characterized in that the optoelectronic component ( 20 ) a housing body ( 203 ), the at least one fastening element ( 201 ) as a counterpart to the mounting element ( 19 ) having. Lighting device according to one of claims 40 to 42, characterized in that the optoelectronic component a first electrical connection part and a second electrical connection part and a thermal connection part.