DE102005003320B3 - Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks - Google Patents

Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks Download PDF

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Publication number
DE102005003320B3
DE102005003320B3 DE102005003320A DE102005003320A DE102005003320B3 DE 102005003320 B3 DE102005003320 B3 DE 102005003320B3 DE 102005003320 A DE102005003320 A DE 102005003320A DE 102005003320 A DE102005003320 A DE 102005003320A DE 102005003320 B3 DE102005003320 B3 DE 102005003320B3
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DE
Germany
Prior art keywords
transport
sensor
laser
speed
building blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102005003320A
Other languages
German (de)
Inventor
Wilfried Philipp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tampoprint AG
Original Assignee
Tampoprint AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tampoprint AG filed Critical Tampoprint AG
Priority to DE102005003320A priority Critical patent/DE102005003320B3/en
Application granted granted Critical
Publication of DE102005003320B3 publication Critical patent/DE102005003320B3/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/0344Observing the speed of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67282Marking devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a use of a decorating device for marking surfaces of IC chips with a transport device, a first sensor for detecting a position, a laser station with at least one laser for decorating the IC chips by means of the laser beam, wherein the control device for the laser beam the first sensor and the second sensor is connected and the information of both sensors are linked to the control information for the laser beam, wherein a plurality of IC components are placed on a transport means that the transport means is moved by the transport device and the speed with the first sensor of the means of transport and with the second sensor, the position of the means of transport are detected.

Description

  • The The invention relates to the use of a decorating device for Marking surfaces of IC components, with a transport device, a first sensor for detecting the Transport speed, a second sensor for detecting a Position, a laser station with at least one laser for decoration the IC components by means of the laser beam, wherein the control device for the laser beam connected to the first sensor and to the second sensor, and the information of both sensors with the control information for the laser beam connected are.
  • From the DE 101 46 820 A1 is a device for marking surfaces of caps, in particular of screw caps for beverage bottles, known. In this device, the caps are passed by a laser, with a first sensor, the speed and a second sensor, the position of the caps are detected and this information is coupled to the control information of the laser, after which the laser marks the caps during transport. Although relatively high speeds can be achieved, resulting in a high throughput for the caps results, but this decorating device is only conditionally suitable for precise labeling.
  • at In the manufacture of IC devices, these are at their top either provided with a color print or the tops of the IC devices are engraved by means of a laser (US 2004/01 04 202 A1). The Device has a sensor for determining the position of the IC chip on. Therefor a variety of IC devices are placed on a tray and retracted the tray into the printing or laser station. In the printing or laser station stops the tablet and the IC components are printed one after the other or with the laser labeled. Therefor can one or more printing station or one or more lasers provided be. To keep the trays in the printing or laser station preferably To keep it short, several printing or laser stations are used.
  • When disadvantageous is considered that for the printing or laser process the tablet must be stopped, which is why the printing or labeling system can not be used as an online attachment.
  • Of the Invention is therefore the object of a decorating device to propose faster with the IC components with the same quality can be decorated.
  • These Task is inventively characterized solved, that uses a decorating device of the type mentioned and that several IC components are placed on a means of transport, that the means of transport is moved by the transport device and with the first sensor, the speed of the means of transport and detected with the second sensor, the position of the transport become.
  • One An essential advantage of the invention is seen in that with the sensors are no longer the speed of each individual, product to be decorated or the position of each to be decorated Product, but that several products, i. IC modules are combined on a means of transport, so that only the speed and position of this means of transport must be determined.
  • From The advantage is that much less information is processed have to and that the means of transport provided with special markings can be detected by the sensors better. The Transportation can be specially equipped for optimal detection be. Furthermore can placed on the means of transport a variety of IC components be without this the markings on the means of transport must be changed.
  • One Another advantage is that not only the speed and the position of the means of transport can be recognized, but that the means of transport itself can be recognized to get out of this To generate information, e.g. with which labels the individual IC modules are to be provided.
  • Consequently could Means of transport be occupied with different IC components (in chaotic Arrangement) and it can successively occupied by different means of transport.
  • In a preferred embodiment of the invention, it is provided that the transport means is scanned several times by the first and / or the second sensor. In a multi-scan by the first sensor, an average value for the speed can be calculated, which increases the accuracy of the label. If the second sensor scans the means of transport several times, then more precise information about the position of the individual can be obtained NEN IC modules are calculated.
  • at In a further development, the means of transport from the second sensor sampled at different locations. This can be a possible Game when picking up the IC components on the means of transport be significantly reduced. Indicates the means of transport, for example in regular order successively arranged holes on, so not only the position when scanning these holes of the means of transport, but at the same time the speed of the means of transport, for which only one sensor is needed, i.e. the first and second sensors are to a single sensor united. From the position of the holes and the temporal order of the capture can be the speed be calculated.
  • With Preference is used as a means of transport tray (tray), on which the IC modules in several rows next to each other and arranged one behind the other are. Such trays are used in conventional marking devices however, these trays are used for marking be stopped. In the conversion on the device according to the invention can The trays continue to be used, so the retooling costs are minimal.
  • at another device is a carrier tape as a means of transport used, on which the IC devices arranged one behind the other are. This carrier tape becomes, for example, together with IC components arranged thereon unwound from a supply roll and through the labeling station guided. After labeling, the carrier tape becomes rewound together with the IC modules and can the Loading station, in which the IC components are mounted on boards zugleitet become.
  • Further Advantages, features and details of the invention will become apparent the dependent claims as well as the following description, with reference to FIG the drawing a particularly preferred embodiment in detail is described. It can those shown in the drawing and in the claims and mentioned in the description Features individually for themselves or be essential to the invention in any combination.
  • In the 1 is a total with 10 designated laser station shown in which a laser 12 is arranged. Through the laser station 10 passes through a transport device 14 on which several as a tray 16 trained transport 18 in the direction of an arrow 20 be transported. On the means of transport 18 are located in several rows next to each other and behind each other a variety of IC devices 22 whose upper side facing the viewer by means of the laser 12 in the laser station 10 be labeled. For this purpose, by means of a first sensor 24 the speed (arrow 20 ) of the transport device 14 detected and with a second sensor 26 becomes the position of the means of transport 18 in the laser station 10 determined. This information is a control device 28 for the laser 12 fed from this information as well as the information for the captions the laser 12 controls.
  • The means of transport 18 can be provided with a plurality of markings, in particular edge markings, from the second sensor 26 be scanned, so even with large means of transport 18 Position inaccuracies of the individual IC components 22 are limited to a minimum. In particular, the second sensor determines 26 there the position of the means of transport 18 at a marker, where the axis 30 the laser 12 located. In this way, fluctuations in the transport speed affect 20 the transport device 14 not or only insignificantly on the mark. Also, with this second sensor 26 and with several markings on the means of transport 18 also the speed of the means of transport 18 be determined.
  • With the use according to the invention the o.g. Decorating device can in no time Time labeled a variety of IC devices with great precision and high quality or be marked.

Claims (7)

  1. Use of a decorating device for marking surfaces of IC components ( 22 ) with a transport device ( 14 ), a first sensor ( 24 ) for detecting the transport speed ( 20 ), a second sensor ( 26 ) for detecting a position, a laser station ( 10 ) with at least one laser ( 12 ) for decorating the IC components ( 22 ) by means of the laser beam, wherein the control device ( 28 ) for the laser beam with the first sensor ( 24 ) and with the second sensor ( 26 ) and the information from both sensors ( 24 . 26 ) are associated with the control information for the laser beam, characterized in that a plurality of IC components ( 22 ) to a means of transport ( 18 ) that the means of transport ( 18 ) of the transport device ( 14 ) and with the first sensor ( 24 ) the speed ( 20 ) of the means of transport ( 18 ) and with the second sensor ( 26 ) the position of the means of transport ( 18 ).
  2. Use of a decorating device according to Claim 1, characterized in that the means of transport ( 18 ) from the first and / or the second sensor ( 26 ) is scanned several times.
  3. Use of a decorating device according to claim 1 or 2, characterized in that the means of transport ( 18 ) from the second sensor ( 26 ) is scanned at different locations.
  4. Use of a decorating device according to one of the preceding claims, characterized in that the plurality of transport means ( 18 ) attached IC modules ( 22 ) are provided with different markings.
  5. Use of a decorating device according to one of the preceding claims, characterized in that as means of transport ( 18 ) a tablet ( 16 ) on which the IC components ( 22 ) are arranged in several rows next to each other and behind each other.
  6. Use of a decorating device according to one of claims 1 to 4, characterized in that as means of transport ( 18 ) a carrier tape is used on which the IC components ( 22 ) are arranged one behind the other.
  7. Use of a decorating device according to one of the preceding claims, characterized in that the first and the second sensor ( 24 . 26 ) are united to a sensor.
DE102005003320A 2005-01-17 2005-01-17 Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks Expired - Fee Related DE102005003320B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102005003320A DE102005003320B3 (en) 2005-01-17 2005-01-17 Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005003320A DE102005003320B3 (en) 2005-01-17 2005-01-17 Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks

Publications (1)

Publication Number Publication Date
DE102005003320B3 true DE102005003320B3 (en) 2006-01-19

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DE102005003320A Expired - Fee Related DE102005003320B3 (en) 2005-01-17 2005-01-17 Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks

Country Status (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008007466U1 (en) 2007-11-16 2008-07-31 Coskun, Ali Riza rattle
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip
WO2020073341A1 (en) * 2018-10-10 2020-04-16 南京理工大学 Laser beam welding system for regulating welding speed based on cloud server, and operating method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146820A1 (en) * 2001-09-19 2003-05-15 Tampoprint Gmbh Decorating device and method for decorating surfaces
US20040104202A1 (en) * 2000-01-28 2004-06-03 Gsi Lumonics, Inc. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040104202A1 (en) * 2000-01-28 2004-06-03 Gsi Lumonics, Inc. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
DE10146820A1 (en) * 2001-09-19 2003-05-15 Tampoprint Gmbh Decorating device and method for decorating surfaces

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008007466U1 (en) 2007-11-16 2008-07-31 Coskun, Ali Riza rattle
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip
WO2020073341A1 (en) * 2018-10-10 2020-04-16 南京理工大学 Laser beam welding system for regulating welding speed based on cloud server, and operating method therefor

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee