DE102004043478A1 - Shielding case for use with printed circuit board in vehicle-mounted apparatus, has opening for application of moisture-proof coating agent on upper region of integrated circuit mounted on circuit board - Google Patents

Shielding case for use with printed circuit board in vehicle-mounted apparatus, has opening for application of moisture-proof coating agent on upper region of integrated circuit mounted on circuit board

Info

Publication number
DE102004043478A1
DE102004043478A1 DE200410043478 DE102004043478A DE102004043478A1 DE 102004043478 A1 DE102004043478 A1 DE 102004043478A1 DE 200410043478 DE200410043478 DE 200410043478 DE 102004043478 A DE102004043478 A DE 102004043478A DE 102004043478 A1 DE102004043478 A1 DE 102004043478A1
Authority
DE
Germany
Prior art keywords
circuit board
mounted
cover material
opening
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE200410043478
Other languages
German (de)
Other versions
DE102004043478B4 (en
Inventor
Koichiro Nagata
Masaki Niwayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003317231A priority Critical patent/JP2005086021A/en
Priority to JP2003-317231 priority
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102004043478A1 publication Critical patent/DE102004043478A1/en
Application granted granted Critical
Publication of DE102004043478B4 publication Critical patent/DE102004043478B4/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
    • H05K9/0026Shield cases mounted on a PCB, e.g. cans, caps, conformal shields integrally formed from metal sheet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/064Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Abstract

The shield case (200) has an opening (201) for application of the moisture-proof coating agent (130) on the upper region of an integrated circuit (IC) (101) mounted on printed circuit board (100). A convex-shaped wall portion (202) prevents diffusion of coating agent from opening to the periphery of the shielding case.

Description

  • BACKGROUND OF THE INVENTION Field of the Invention
  • The The present invention relates to a printed circuit board mounted Shield.
  • description of the prior art
  • Usually, as for example in JP 7-240591 A (paragraph 0009 and 1 ), a shield case is soldered to a ground pattern of the circuit board to cover electronic components mounted on the circuit board in a circuit board requiring high frequency shielding. In addition, as in, for example, JU 63-089297 A (page 5, line 1 to page 6, line 6), a filler such as a solder resist is incorporated to prevent solder from being contained within a range in which a shield case is soldered to a circuit board, present through-holes flows.
  • As In JP 7-240591 A and JU 63-089297 A, the shield case is, if the shielding housing on the circuit board at a C-surface, which is the upper end face of the Printed circuit board is arranged so arranged that the housing the Electronic components covers, and the shielding on a S-surface soldered which is the bottom surface the circuit board is, thereby the shielding housing electrically and mechanically Connecting to the PCB.
  • If the circuit board on which such a shield case is mounted, for example used for vehicle equipment this is responsible for the generation of condensation on the circuit board due to a sudden change in the ambient temperature or humidity, therefore, thereby Behavior of a high impedance circuit strongly influencing and on desired Behavior of disturbing. In particular, the high impedance circuit is at risk of the worst Case exposed that they go into a fault condition can, which emits smoke from the electronic components and a permanent destruction caused by it. To such by condensation on the circuit board To avoid conditional danger, it is common to have a mounting area the electronic components or the larger part of the PCB cover with a moistureproof cover material. As typical Moisture-resistant cover material mainly uses the following which, solved in a liquid with fleeting solvent is applied to circuit boards, and then the volatile Components of it are evaporated to a subsequent one Cure drying process.
  • The typical assembly processes in which the electronic components are mounted on both sides of the circuit board, the circuit board is covered with the moistureproof cover material, and the shield housing is manually mounted to the C surface of the circuit board, include:
    • (1) covering the C surface with solder paste;
    • (2) mounting surface mount components on the C surface;
    • (3) reflow soldering the C surface;
    • (4) covering the C surface with the moistureproof cover material;
    • (5) drying the moistureproof cover material;
    • (6) covering the S surface with adhesive for fixing the surface mounting components;
    • (7) mounting the surface mount components on the S surface;
    • (8) drying the S surface covering adhesive;
    • (9) inserting components such as the shield case into the circuit board from the C surface by hand; and
    • (10) Reflow soldering the S surface.
  • In the above assembly processes when the shield on the printed circuit board is mounted, covers the cover mounted on the C surface Components off. Therefore, this fact requires applying the Moisture-resistant cover material on the C-surface in the process (4) assembled components, before the shield case in the process (9) is mounted thereto. Further, to the manual soldering at the S surface to reduce the S surface at least with a reflow soldering process Processed in the process (10). In cases however, in which the viscosity of the moistureproof cover material is low, or in cases where which the diameter of one applied to the on the circuit board Covering adjacent through-hole is large, flows when covering the C-surface with moisture-resistant cover material in the process (4) the moisture-resistant cover material through this through hole to the S surface of the circuit board and the Cover material leads to cover a Lötauges on the S surface. This can cause difficulties in soldering the electronic components to lead, those on the S surface in the subsequent process (10) are to be mounted.
  • An assembling method for avoiding such a problem provides for applying the moistureproof masking material thereon after electronic components have been mounted on both sides of the boards by reflow soldering, and then soldering the shield case by hand. If there are a lot of solder insertion components where reflow soldering is not applicable, the workload of manual soldering will be raised as an inevitable consequence. Alternatively, a method may be devised in which patterns of the circuit board are designed in which electronic components to be mounted on the S surface are not disposed in the vicinity of a through-hole. However, the method can not be said to be desirable because of the limitations imposed on a component layout in the pattern design.
  • If Accordingly, the conventional shielding mounted on the circuit board will force it to use moisture resistant masking material on the Apply PCB in the previous process. This causes Difficulty in soldering S surface mount components in the after covering with moisture-resistant cover material executed Process. Meanwhile raised a process in which electronic components on both sides the circuit board will be mounted and then the moistureproof Covering material is applied to the scope of manual Soldering work. In addition leads a method in which S-surface mounting electronic components near a through hole are arranged to accept restrictions in the pattern design of the circuit board.
  • RESUME OF THE INVENTION
  • The The present invention has been made to solve the above-mentioned problems and an object of the present invention is to provide a shielding housing, which poses no difficulty in soldering an S surface mount component, no Increase the labor of manual soldering and no restrictions with respect to the pattern design of the circuit board.
  • One shielding housing mounted on a printed circuit board comprises an opening, from a variety of holes is formed and for injecting moisture-resistant cover material in one the upper part of a moistureproof cover material serves to be covered electronic component corresponding area when the case is on the circuit board is mounted.
  • Therefore includes according to the present invention the shielding housing an opening one formed of a plurality of holes for injection the moistureproof cover material. This allows that Mounting the electronic components on both sides of the PCB and applying a cover of moistureproof cover material on the electronic components, after being mounted on the circuit board resulting in no problems in soldering an S surface mount component leads, No increase in manual soldering work and no restrictions in relation to the pattern design of printed circuit boards.
  • SUMMARY THE DRAWINGS
  • The 1A and 1B 13 are views of a printed circuit board-mounted shielding case according to a first embodiment of the present invention; and
  • 2A and 2 B 13 are views of other shielding cases mounted on a printed circuit board according to a first embodiment.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • A preferred embodiment The invention will now be described below with reference to the accompanying drawings Drawings described.
  • First embodiment
  • 1A and 1B 13 are views of a printed circuit board-mounted shielding case according to a first embodiment of the present invention. 1A is a sectional view and 1B is a top view. In 1A is the upper surface of the in 1 shown circuit board 100 a C surface and the in 1A Lower surface shown is an S surface. As in 1A shown are at the C surface of the circuit board 100 a to be covered with a moistureproof cover material integrated circuit or IC 101 , Electronic components such as a surface mount component 102 and a solder insertion component 103 and a shield case 200 assembled. At the S surface are electronic components, such as a surface mount component 104 , assembled. In addition, in the circuit board 100 extending through the circuit board from the C-surface to the S-surface extending through holes 111 near the mounting area of the IC 101 educated.
  • As in 1B is shown on the upper surface of the shield case 200 in an area that is the upper part of the moisture-resistant cover material 130 to be covered IC 101 matches if the case is on the PCB 100 is mounted, an opening 201 formed, which is formed from a plurality of rectangular holes and for injecting the moistureproof cover materials 130 serves. This opening 201 is formed of rectangular small holes, each of which holes is sufficiently dimensioned to a shielding effect of the shield 200 not to interfere.
  • In addition, as in 1A and 1B shown, the outer edge of the upper surface of the shielding 200 with a convex wall (diffusion prevention section) 202 provided to prevent the moistureproof cover material 130 diffused. Some electronic components shrink when the liquid, moisture-resistant cover material hardens and degrade their own performance through the application of physical forces. However, this convex wall prevents 202 the adhesion of the moistureproof cover material 130 on the electronics component surrounding the shielding housing 200 mounted and prone to be prone to deterioration in their performance.
  • Also injected as in 1A shown a nozzle 120 an applicator, the liquid moisture-resistant cover material in a in the shield case 200 trained opening 201 to thereby the electronic components of the IC 101 cover. The nozzle 120 of the applicator is drivable in the arrow direction by a driver mechanism (not shown).
  • Mounting the electronic components on both sides of the PCB 100 , the application of the moistureproof cover material 130 on it and the mounting of the shielding housing 200 are executed in the following processes involving:
    • (11) covering the C surface with solder paste;
    • (12) Mounting the IC 101 and the surface mount component 102 at the C surface;
    • (13) reflow soldering the C surface;
    • (14) covering the S surface with adhesive for fixing the surface mounting components;
    • (15) Mounting Surface Mount Components 104 at the S surface;
    • (16) drying the adhesive covered on the S surface;
    • (17) Inserting components, such as solder inserting components 103 and the shield case 200 , on the circuit board of the C-surface by hand;
    • (18) reflow soldering the S surface;
    • (19) Applying the moistureproof cover material 130 on the IC; and
    • (20) drying the moistureproof cover material 130 ,
  • 1A shows the state in which the moistureproof cover material 130 on the IC 101 is applied. Covering the moistureproof cover material 130 is performed in process 19 after reflow soldering the S surface of the shield case 200 in the process (18). This is because covering the moistureproof cover material 130 on the IC mounted on the C surface 101 through the shielding in the housing 200 trained opening 201 becomes possible.
  • In the process (19), the moistureproof cover material becomes 130 from the nozzle 120 of the applicator in the opening 201 of the shielding housing 200 injected and reaches the IC 101 to be put on it. Depending on what kind of shape the opening 201 It is possible to get most of it through the nozzle 120 of the applicator injected moistureproof cover material 130 in the inside of the shielding housing 200 contribute. However, as in 1A shown during injection of the moistureproof cover material 130 a part of the moistureproof cover material 130 on the upper surface of the shield case 200 remain. In this case, the provision of the convex wall prevents 202 around the outer edge of the area which is larger than the opening 201 in the upper surface of the shield case 200 that the moistureproof cover material 130 over the wall 202 occurs and diffused.
  • 2A and 2 B FIG. 12 are views of another printed circuit board-mounted shielding case according to a first embodiment. FIG. 2A is a sectional view and 2 B is a top view. In 2A and 2 B For example, components shown in these figures are the same as those in FIG 1A and 1B except for the shield case 300 , In 2A are the in 1A shown nozzle 120 of the applicator and the moistureproof cover material 130 omitted. However, the moistureproof cover material becomes 130 through the nozzle 120 of the applicator and is injected onto the IC 101 applied, as in 1A ,
  • As in 2 B is shown on the upper surface of the shield case 300 one formed from a plurality of rectangular holes opening 301 formed to the moisture-resistant cover material 130 in one in the upper part of the moisture-resistant cover material 130 to be covered IC 101 Inject appropriate area when the housing on the circuit board 100 is mounted. This opening 301 is equivalent to in 1A and 1B shown opening 201 , Moreover, as in 2A and 2 B shown at the periphery of the opening 301 that is larger than the opening 201 , a concave groove (diffusion prevention portion) 302 designed to prevent the moistureproof cover material 130 diffused.
  • The shielding housing 300 becomes similar in the assembly process to that for the shield case 200 assembled. Since covering the IC mounted on the C surface 101 with moistureproof cover material 130 through the in the shield case 300 trained opening 301 becomes possible, the covering with moisture-resistant cover material 130 in the process after reflow soldering the S surface of the shield case 300 executed.
  • During the injection of the moistureproof cover material 130 may be a part of the moistureproof cover material 130 on the upper surface of the shield case 300 remain. But in this case, forming the concave groove 302 around you the opening 201 surrounding area larger than the opening 301 , exceeding the groove 302 through the moistureproof cover material 130 and prevent its diffusion.
  • As mentioned above, the claimed invention enables by the arrangement according to the first embodiment, in which each of the openings formed from a plurality of holes 201 . 301 in the shielding housings 200 respectively. 300 are formed and for injecting the moistureproof cover material 130 serve, covering the electronic components with the moistureproof cover material 130 After the electronic components of the circuit board 100 and again the shielding housings 200 . 300 are mounted on the circuit board. This introduces no difficulty in soldering an S-surface mount component, does not increase the labor of manual soldering, and does not restrict the pattern design of the printed circuit board.
  • Moreover, although the arrangement according to the first embodiment prevents the claimed invention in which the convex wall 202 and the concave groove 302 are each provided around the area which is larger than the openings 201 . 301 in the shielding housings 200 . 300 , the adhesion of the moistureproof cover material 130 on the electronic components that are threatened by deterioration.
  • While in the first embodiment, the openings 201 . 301 have a rectangular shape, the openings can of course have other shapes, for example, a round shape. Furthermore, the goal is that with moisture-resistant cover material 130 is to cover, the IC 101 , and the openings 201 . 301 have such dimensions that the entirety of the IC 101 can be seen through the openings. Instead, this can be done with moisture resistant cover material 130 be covered target solder joints and electrodes or connections of the electronic components and the openings 201 . 301 may have such dimensions that the soldering and electrodes thereof are visible through the openings.
  • In addition, while in the first embodiment, the convex wall 202 around the hem of the top surface of the shield case 200 is provided, which is larger than the opening 201 , and the concave groove 302 is formed around the area of the opening 301 surrounds, which is larger than the opening 301 , can the concave groove 302 also around the hem of the upper surface of the shield case 200 be formed, and the convex wall 202 can around the opening 301 be provided.
  • In addition, the wall needs 202 for preventing the diffusion of the moistureproof cover material 130 not to have a definite convex shape, as in 1A but the wall may be one to the outer edge of the shield case 200 with the opening 201 have a rising incline as soil. Alternatively, the upper surface of the shield case 200 partly on the wall 202 without.

Claims (4)

  1. On a printed circuit board ( 100 ) mounted shielding housing ( 200 ), an opening ( 201 ), which is formed from a plurality of holes and for the injection of moisture-resistant cover material ( 130 ) is provided in the assembly of the housing on the circuit board in an area corresponding to the upper part of an electronic component to be covered with moisture-resistant cover material.
  2. A shield case according to claim 1, further comprising a diffusion preventing portion (14). 202 ) for preventing the diffusion of the moistureproof cover material ( 130 ) in an area that is larger than the opening ( 201 ).
  3. A shield case according to claim 2, wherein said diffusion preventing portion (16) 202 ) consists of a convex wall.
  4. A shield case according to claim 2, wherein said diffusion preventing portion (16) 202 ) consists of a concave groove.
DE200410043478 2003-09-09 2004-09-08 shield Expired - Fee Related DE102004043478B4 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003317231A JP2005086021A (en) 2003-09-09 2003-09-09 Shielding case
JP2003-317231 2003-09-09

Publications (2)

Publication Number Publication Date
DE102004043478A1 true DE102004043478A1 (en) 2005-04-14
DE102004043478B4 DE102004043478B4 (en) 2007-11-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410043478 Expired - Fee Related DE102004043478B4 (en) 2003-09-09 2004-09-08 shield

Country Status (2)

Country Link
JP (1) JP2005086021A (en)
DE (1) DE102004043478B4 (en)

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WO2012127209A3 (en) * 2011-03-22 2013-02-21 Enecsys Limited Solar photovoltaic inverters
US9112379B2 (en) 2006-12-06 2015-08-18 Solaredge Technologies Ltd. Pairing of components in a direct current distributed power generation system
US9130401B2 (en) 2006-12-06 2015-09-08 Solaredge Technologies Ltd. Distributed power harvesting systems using DC power sources
US9235228B2 (en) 2012-03-05 2016-01-12 Solaredge Technologies Ltd. Direct current link circuit
US9291696B2 (en) 2007-12-05 2016-03-22 Solaredge Technologies Ltd. Photovoltaic system power tracking method
US9318974B2 (en) 2014-03-26 2016-04-19 Solaredge Technologies Ltd. Multi-level inverter with flying capacitor topology
US9362743B2 (en) 2008-05-05 2016-06-07 Solaredge Technologies Ltd. Direct current power combiner
US9368964B2 (en) 2006-12-06 2016-06-14 Solaredge Technologies Ltd. Distributed power system using direct current power sources
US9401599B2 (en) 2010-12-09 2016-07-26 Solaredge Technologies Ltd. Disconnection of a string carrying direct current power
US9407161B2 (en) 2007-12-05 2016-08-02 Solaredge Technologies Ltd. Parallel connected inverters
US9537445B2 (en) 2008-12-04 2017-01-03 Solaredge Technologies Ltd. Testing of a photovoltaic panel
US9543889B2 (en) 2006-12-06 2017-01-10 Solaredge Technologies Ltd. Distributed power harvesting systems using DC power sources
US9548619B2 (en) 2013-03-14 2017-01-17 Solaredge Technologies Ltd. Method and apparatus for storing and depleting energy
US9590526B2 (en) 2006-12-06 2017-03-07 Solaredge Technologies Ltd. Safety mechanisms, wake up and shutdown methods in distributed power installations
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US9647442B2 (en) 2010-11-09 2017-05-09 Solaredge Technologies Ltd. Arc detection and prevention in a power generation system
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US9673711B2 (en) 2007-08-06 2017-06-06 Solaredge Technologies Ltd. Digital average input current control in power converter
US9680304B2 (en) 2006-12-06 2017-06-13 Solaredge Technologies Ltd. Method for distributed power harvesting using DC power sources
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US9831824B2 (en) 2007-12-05 2017-11-28 SolareEdge Technologies Ltd. Current sensing on a MOSFET
US9853538B2 (en) 2007-12-04 2017-12-26 Solaredge Technologies Ltd. Distributed power harvesting systems using DC power sources
US9853565B2 (en) 2012-01-30 2017-12-26 Solaredge Technologies Ltd. Maximized power in a photovoltaic distributed power system
US9866098B2 (en) 2011-01-12 2018-01-09 Solaredge Technologies Ltd. Serially connected inverters
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US9112379B2 (en) 2006-12-06 2015-08-18 Solaredge Technologies Ltd. Pairing of components in a direct current distributed power generation system
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