DE102004001108A1 - Product production process for chips and actuators places foil and component on a substrate with a gap between them that is closed by foil wrinkling - Google Patents
Product production process for chips and actuators places foil and component on a substrate with a gap between them that is closed by foil wrinkling Download PDFInfo
- Publication number
- DE102004001108A1 DE102004001108A1 DE102004001108A DE102004001108A DE102004001108A1 DE 102004001108 A1 DE102004001108 A1 DE 102004001108A1 DE 102004001108 A DE102004001108 A DE 102004001108A DE 102004001108 A DE102004001108 A DE 102004001108A DE 102004001108 A1 DE102004001108 A1 DE 102004001108A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- film
- component
- gap
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Chips, MEMS, Sensoren, Aktoren und andere Bauelemente müssen vor schädlichen Umwelteinflüssen temporär oder permanent geschützt werden. Ersteres ist beispielsweise während der Herstellung wichtig. Letzteres dient dazu, den Luft- und Feuchteaustausch mit der Umgebung zu verringern und damit schädliche Prozesse wie Korrosion zu verhindern. Derzeit werden Bauelemente auf Substraten mit Globtop oder Overmolden geschützt.Crisps, MEMS, sensors, actuators and other components must be harmful environmental influences temporary or permanently protected become. For example, the former is important during manufacture. The latter is used to exchange air and moisture with the environment reduce and thus harmful Prevent processes like corrosion. Currently are building elements protected on substrates with Globtop or Overmolden.
Davon ausgehend liegt der Erfindung die Aufgabe zugrunde, einen alternativen temporären oder permanenten Schutz für auf Substraten angeordnete Bauelemente zu entwickeln.From that Based on the invention, the object is an alternative temporary or permanent protection for To develop arranged on substrates components.
Diese Aufgabe wird durch die in den unabhängigen Ansprüchen angegebenen Erfindungen gelöst. Vorteilhafte Ausgestaltungen ergeben sich aus den abhängigen Ansprüchen.These The object is achieved by those specified in the independent claims Inventions solved. Advantageous embodiments emerge from the dependent claims.
Dementsprechend werden in einem Verfahren zur Herstellung eines Erzeugnisses eine Folie und ein Bauelement so nebeneinander auf einem Substrat angeordnet, dass zunächst zwischen der Folie und dem Bauelement ein Spalt entsteht und dieser Spalt zwischen der Folie und dem Bauelement dann geschlossen wird, so dass die Folie dicht an dem Bauelement anliegt.Accordingly become in a process for the production of a product a Film and a device so juxtaposed on a substrate, that first a gap is created between the film and the component and this Gap between the film and the device is then closed, so that the film rests close to the component.
Die Erfindung geht dabei von der Erkenntnis aus, dass es oft schwierig ist, eine Folie direkt im Anordnungsprozess dicht am Bauelement anliegend neben diesem auf dem Substrat anzuordnen. Deshalb wird ein Schritt zum Schließen eines zwischen der Folie und dem Bauelement entstehenden Spaltes vorgesehen.The Invention is based on the knowledge that it is often difficult is, a film directly in the assembly process close to the device adjacent to this to arrange on the substrate. That's why a step to close provided between the film and the component resulting gap.
Insbesondere wird der Spalt zwischen der Folie und dem Bauelement durch einen Schrumpfungsprozess geschlossen. Dazu wird als Folie eine Schrumpffolie verwendet, die bei einem Schrumpfungsprozess einerseits in dichtem Kontakt mit der Substratoberfläche bleibt, andererseits in dichten Kontakt mit dem Bauelement gerät.Especially is the gap between the film and the device by a Shrinkage process closed. This is a shrink film as a film used in a shrinking process on the one hand in dense Contact with the substrate surface remains, on the other hand in tight contact with the device device.
Insbesondere werden die Folie und das Bauelement so nebeneinander auf dem Substrat angeordnet, dass die Folie auf dem Substrat um das Bauelement herum angeordnet ist und der Spalt zwischen der Folie und dem Bauelement um das Bauelement herum entsteht und geschlossen wird.Especially The film and the device are thus next to each other on the substrate arranged the film around the device on the substrate is arranged and the gap between the film and the component arises around the device around and is closed.
In vielen Anwendungsbereichen entsteht zwischen dem Bauelement und dem Substrat ein Zwischenraum. Dies ist beispielsweise der Fall, wenn das Bauelement erhöhte Kontaktstellen auf seiner dem Substrat zugewandten Seite aufweist. In diesem Fall wird vorzugsweise eine Folie verwendet, die dicker als der Zwischenraum ist. So kann diese dichtend am Bauelement anliegen und verhindern, dass bei einer weiteren Prozessierung des Erzeugnisses etwa Chemikalien unter das Bauelement laufen.In many applications arise between the device and the substrate a gap. This is the case for example when the component increased Having contact points on its side facing the substrate. In this case, it is preferable to use a film that is thicker as the gap is. So this can rest against the component sealing and prevent further processing of the product, for example Chemicals are running under the device.
Vorzugsweise wird eine Folie verwendet, die so dick ist, dass ihre dem Substrat abgewandet Seite in etwa auf einem Niveau mit der dem Substrat abgewandten Seite des Bauelements verläuft. Das heißt, die Dicke der Folie entspricht in etwa +/–10% der Dicke des Bauelementes und eventuell unter dem Bauelement befindlicher Strukturen wie etwa den erwähnten erhöhten Kontaktstellen oder dem Zwischenraum.Preferably a film is used that is so thick that its the substrate turned away side in about the same level with the side facing away from the substrate Side of the device runs. That is, the Thickness of the film corresponds approximately to +/- 10% of the thickness of the component and any underlying structures such as the mentioned increased Contact points or the gap.
Besonders einfach lässt sich das Verfahren durchführen, wenn eine vorstrukturierte Folie auf dem Substrat angeordnet wird, die im Bereich des Bauelements bereits eine Öffnung aufweist, die in etwa so groß ist wie das Bauelement.Especially just lets to perform the procedure when a pre-structured foil is placed on the substrate, which already has an opening in the region of the component, which is approximately so big like the component.
Alternativ oder für weitere Bauelemente ergänzend wird die Folie auf dem Substrat und auf dem Bauelement angeordnet und der auf dem Bauelement angeordnete Teil der Folie wird beispielsweise durch Laserablation entfernt.alternative or for supplementary components the film is placed on the substrate and on the device and arranged on the component part of the film is, for example, by Laser ablation removed.
Ein Erzeugnis weist ein Substrat, ein Bauelement, das auf dem Substrat angeordnet ist, und eine Folie auf, die auf dem Substrat neben dem Bauelement angeordnet und eine Schrumpffolie ist. Vorteilhafte Ausgestaltungen des Erzeugnisses ergeben sich analog zu den vorteilhaften Ausgestaltungen des Verfahrens und umgekehrt.One Product has a substrate, a device on the substrate is placed, and a slide on top of the substrate next to the Component arranged and a shrink film is. Advantageous embodiments of the product are analogous to the advantageous embodiments of Procedure and vice versa.
Weitere Vorteile und Merkmale der Erfindung ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der Zeichnung. Dabei zeigt:Further Advantages and features of the invention will become apparent from the description of exemplary embodiments based on the drawing. Showing:
Die Erfindung bezieht sich auf Chips, MEMS, Sensoren, Aktoren und andere aktive oder passive Bauelemente, die auf ein Substrat in Form einer Leiterplatte, einer Flex, eines Leadframes oder ähnlichem montiert oder gelötet sind.The invention relates to chips, MEMS, sensors, actuators and other active or passive Devices mounted or soldered to a substrate in the form of a printed circuit board, a flex, a leadframe, or the like.
Nun
wird gemäß
Damit
die Folie
- – Die Folie ist vorstrukturiert. Dabei sind die späteren Positionen der Bauelemente ausgespart.
- – Die Folie wird ganzflächig aufgebracht. In einem weiteren Prozessschritt wird die Folie an dem und um das oder die Bauelemente entfernt. Dies ist zum Beispiel durch einen Laserprozess realisierbar.
- - The film is prestructured. The later positions of the components are omitted.
- - The film is applied over the entire surface. In a further process step, the film is removed on and around the component (s). This can be achieved, for example, by a laser process.
Anschließend wird
ein Schrumpfungsprozess durchgeführt,
bei dem der Spalt (Lücke,
Hohlraum)
Das
fertige Erzeugnis mit dem Substrat
Die Folie kann nun als permanenter Schutz des Bauelements eingesetzt werden, der den Gas- und Flüssigkeitsaustausch mit der Umgebung verlangsamt. Alternativ kann die Folie als temporärer Schutz verwendet werden, der nach Abschluss weiterer Prozesse wieder entfernt wird. Das Entfernen kann beispielsweise in einem Laser- oder Plasmaprozess oder auch nasschemisch erfolgen.The Film can now be used as a permanent protection of the device Be the gas and fluid exchange slowed down with the environment. Alternatively, the foil may serve as temporary protection used to be removed after completing other processes becomes. The removal may be, for example, in a laser or plasma process or wet-chemically.
Das
alternative Ausführungsbeispiel
nach
Das
in
Allgemein weist die Folie vorzugsweise folgende technische Merkmale auf:
- – Die Folie haftet gut auf der Oberfläche. Dies gilt auch während und nach dem Schrumpfungsprozess.
- – Die Folie lässt sich entfernen, wenn sie als temporärer Schutz dient.
- – Die Folie schließt nach dem Schrumpfungsprozess plan mit der Oberfläche des Bauelements ab. Dadurch ist eine weitere Prozessierung erleichtert.
- - The film adheres well to the surface. This also applies during and after the shrinking process.
- - The film can be removed if it serves as a temporary protection.
- The film is flush with the surface of the device after the shrinking process. This facilitates further processing.
Das geschilderte Verfahren ist technisch leicht durchführbar und kostengünstig. Es erleichtert den Einsatz von weiteren Prozessen, da unter Umständen Medien verwendet werden können, die das Substrat ohne Schutzfolie angreifen würden.The described method is technically easy to carry out and inexpensive. It facilitates the use of other processes, as may media can be used which would attack the substrate without protective film.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004001108A DE102004001108B4 (en) | 2004-01-05 | 2004-01-05 | Permanent or temporary protection of components by means of shrink film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004001108A DE102004001108B4 (en) | 2004-01-05 | 2004-01-05 | Permanent or temporary protection of components by means of shrink film |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102004001108A1 true DE102004001108A1 (en) | 2005-08-04 |
DE102004001108B4 DE102004001108B4 (en) | 2005-12-15 |
Family
ID=34716305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004001108A Expired - Fee Related DE102004001108B4 (en) | 2004-01-05 | 2004-01-05 | Permanent or temporary protection of components by means of shrink film |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004001108B4 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014114166A1 (en) * | 2014-09-30 | 2016-03-31 | Elringklinger Ag | Carrier for packaging and transport of at least one component |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3274302A (en) * | 1964-05-06 | 1966-09-20 | Grace W R & Co | Method of employing electrostatic means in a heat shrinking process |
US4702788A (en) * | 1983-02-28 | 1987-10-27 | Uzo Tomii | Method of receiving small-sized electronic parts |
JP2001237347A (en) * | 2000-02-25 | 2001-08-31 | Sharp Corp | Bare chip packaging substrate and packaging method using the same |
-
2004
- 2004-01-05 DE DE102004001108A patent/DE102004001108B4/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3274302A (en) * | 1964-05-06 | 1966-09-20 | Grace W R & Co | Method of employing electrostatic means in a heat shrinking process |
US4702788A (en) * | 1983-02-28 | 1987-10-27 | Uzo Tomii | Method of receiving small-sized electronic parts |
JP2001237347A (en) * | 2000-02-25 | 2001-08-31 | Sharp Corp | Bare chip packaging substrate and packaging method using the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014114166A1 (en) * | 2014-09-30 | 2016-03-31 | Elringklinger Ag | Carrier for packaging and transport of at least one component |
Also Published As
Publication number | Publication date |
---|---|
DE102004001108B4 (en) | 2005-12-15 |
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OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |