DD240984A1 - Structure arrangement for semiconductor components - Google Patents

Structure arrangement for semiconductor components Download PDF

Info

Publication number
DD240984A1
DD240984A1 DD28061985A DD28061985A DD240984A1 DD 240984 A1 DD240984 A1 DD 240984A1 DD 28061985 A DD28061985 A DD 28061985A DD 28061985 A DD28061985 A DD 28061985A DD 240984 A1 DD240984 A1 DD 240984A1
Authority
DD
German Democratic Republic
Prior art keywords
carrier strip
frame
pieces
component
semiconductor
Prior art date
Application number
DD28061985A
Other languages
German (de)
Inventor
Manfred Michalk
Helga Michalk
Guenter Schwarzrock
Original Assignee
Erfurt Mikroelektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erfurt Mikroelektronik filed Critical Erfurt Mikroelektronik
Priority to DD28061985A priority Critical patent/DD240984A1/en
Publication of DD240984A1 publication Critical patent/DD240984A1/en

Links

Abstract

The invention relates to a special arrangement for stretcher strips for the production of high-pole semiconductor devices that carry in particular on all four sides terminal rows. The aim of the invention is to improve the flatness of the entirety of the connections surface-mounted semiconductor devices. The object of the invention is to arrange the component bodies located within the stripper frame in a displaceable manner, in order to enable an adjustment from the respective component bodies to the terminal forming tool in the case of critical mechanical processes, such as, for example, the molding of the component terminals. According to the invention, this object is achieved in that a striper strip arrangement for semiconductor components, consisting of two or more juxtaposed stringer strip frame with therein alignment openings and located within the frame Halbleiterbauelementekoerpern, wherein the Halbleiterbauelementekoerper are attached to the outgoing of the frame holding webs and protrude from their sides Anschluesse is created, and that the holding webs elastically and / or plastically with low forces deformable Ausgleichstuecke. The application is carried out in special high-pole stretcher strip assemblies for mountable mountable semiconductor devices, the terminal ends must have a high overall flatness.

Description

Field of application of the invention
The invention relates to a special arrangement for carrier strip for the production of high-pole semiconductor devices, in particular carry on all four sides terminal rows.
Characteristic of the known technical solutions
Semiconductor devices are being developed to higher and higher degrees of integration. According to the degree of integration, the function and the type of circuit, the number of external terminals of the semiconductor devices increases. Nevertheless, in order to keep the area and the volume of the semiconductor devices as small as possible for cost and reliability reasons, the terminals are arranged at an ever smaller distance from each other and on all four side surfaces of the semiconductor device body. Furthermore, new forms of component terminal design are used, such as applied to flat-pack and chip-carrier packages, which are mounted and secured to the board surface. However, this type of mounting of the surface-mounted semiconductor devices requires that the component terminals are tolerated very accurately in the plane of the support on the circuit board.
However, tolerance requirements are met by the tolerances of the alignment holes and the location of the outer terminals in the carrier strip, the alignment pins, and the cap halves of the die and cap attachment tool, respectively, in glass and / or ceramic caps. In particular, in the chip-carrier design, in which the outer terminals are bent directly along the side surfaces of the component body, can not compensate for the tolerances occurred by the previous steps and the result is that, due to the offset of the cap halves in the plane relative To Trägerstfeifen, the bent terminals have an unequal length and thus no longer comply with the flatness tolerance.
A method is known in which, to limit the tolerances, a package shape of the semiconductor device is selected in which the cap half, under which the terminal ends are bent, bears a bead. The connections are bent as positively as possible around this bead; the bead is used as a bending gauge. A disadvantage is that the housing shape can be produced only with increased effort, and that mounted on the circuit board semiconductor components form a cavity through this frame-like bead on its underside, which is very difficult to clean, for example, flux residues, and that under or behind the bead forming solder pads are limited optically testable.
It is also known that to improve the flatness tolerance of the surface-mountable semiconductor devices, the devices are first made without the connections to the circuit board. The connections are made separately, mounted on the device and connected to the reduced terminal ends of the device.
The disadvantage here is that further technological steps must be performed, and that the overall reliability of the semiconductor device is deteriorated by the introduction of a further connection point.
It is also known a carrier strip arrangement, applied by the company Toshiba, are fixed in the diagonal webs in the interior near the edge of the component body, lead to the frame-like edge of the entire carrier strip and are connected thereto. These diagonal webs hold the finished semiconductor device in the frame-like carrier strip edge and, especially when there are several components in the carrier strip frame, facilitate mechanical processing, transport and measuring operations. It is finally known from DE-OS 2931449 a carrier strip assembly, according to which the chip carrier is suspended inside the housing at four diagonal webs, which extend over the corners of the housing body, extending to the carrier strip edge. For better removal of the protruding from the housing body diagonal webs after completion of the component, the diagonal webs are in housing edge near notch o.a. Provided. The disadvantage here is that these diagonal webs hold the semiconductor device very rigid with respect to its location in the carrier strip frame, so that desired adjustments from component to carrier strip frame before turning the connections are not possible.
Object of the invention
The aim of the invention is to improve the flatness of the entirety of the connections surface-mountable semiconductor devices.
Explanation of the essence of the invention
The object of the invention is to slidably arrange the component body located within the carrier strip frame in order to allow an adjustment of component body to a connection forming tool before or during critical mechanical processes, such as, for example, the molding of the component terminals. According to the invention, this object is achieved in that a carrier strip assembly for semiconductor devices, consisting of two or more juxtaposed carrier strip frame with adjustment openings therein and located within the frame semiconductor device bodies, wherein the semiconductor device body are attached to outgoing from the frame retaining webs and projecting from their sides connections , Is created, and that the holding webs elastically and / or plastically deformable with small forces balancing pieces.
With the solution according to the invention it is achieved that the semiconductor device body are arranged to be movable to some extent within their respective frame part. The tolerances between the adjustment opening on the carrier strip frame and thus the component connections on the one hand and the component body on the other hand, as well as the inevitably resulting tolerances in the bending tool are greatly reduced if the bending elements of the connections Justierprismen o. Ä. Are arranged for the component body and in Thus, the component connections are component-related and no longer carrier strip related bent. The movable component body can easily slide into the Justierprismen, which is not possible with rigid suspension of the component body on the support webs.
The holding webs and balancing pieces are part of the entire carrier strip assembly. They have only a mechanical function outside of the component body: mounting of the component body during turning operations of the connections, during transport and measuring operations. The holding webs end in the semiconductor device body in the vicinity of its edge or be continued as chip carrier holding webs in the component body interior.
Advantageously, the compensating pieces are designed as U-shaped or angular shaping of the holding webs. With low plasticity and / or elasticity of the carrier strip material, it is advantageous to follow several U-shaped or angular shapes of the holding webs in succession or to combine U-shaped or angular formations. Furthermore, it is advantageous to keep the shims closed until critical operations of Anschlußabbiegens by closing pieces. This ensures that in any manufacturing of the component body made of plastic no plastic runs into the compensation opening and the other operations are hindered, and that in mechanical and chemical cleaning and coating operations of the carrier strip or the outer terminals of the component body is rigidly supported and the shims not be damaged.
It is generally advantageous for achieving small tolerance errors of the respective pin / Justageöffnungspassung to perform the pin and in particular etched carrier strip assemblies and the adjustment opening conical. The conicity of the adjustment opening is achieved in that the side from which the pin penetrates into the adjustment opening has a larger by at least the etching tolerance Ätzmaskenöffnung. This measure ensures that any etching tolerances, such as etching mask offset from top to bottom of the carrier strip or oblique hole etching, do not become effective in terms of tolerance, since the adjusting pin adjusts the carrier strip by means of the smallest adjustment opening side. With the proposed arrangement is achieved by simple formation of shims in the retaining webs of the semiconductor device body, that the component body can be readjusted in the critical terminal bending operations. As a result, an improvement in the uniformity of the bent terminals and an improvement in the flatness of all terminal attachment points is achieved on the circuit board. The specified shape of the holding webs is still stable enough to continue to transport the finished semiconductor device in the carrier strip frame can. The movable arrangement of the component body is also advantageously applicable to the introduction of the components in the carrier strip association in the Meßfassungen.
embodiment
The solution according to the invention will be explained below using an application example. Show it
Figure 1: carrier strip with holding webs with U-shaped shims
Figure 2 :. Carrier strip with several U-shaped, sealed by plugs shims Figure 3: carrier strip with angle-shaped shims
The carrier strip in FIG. 1 carries three 36-pole semiconductor components. Each component is surrounded by a frame-like carrier strip part, the carrier strip frame 1. Starting from the corners of the carrier strip frame 1, extend, leading to the corners of the component body 2 and fixed in it, four holding webs 4, each having a U-shaped compensating piece 5. On or in the carrier strip frame 1 adjustment holes 7 are mounted in the form of square openings, which serve to adjust the carrier strip during the finishing, contacting and Verkappungsprozesse. From the four sides of the component body 2, the terminals 3 protrude in the direction of the carrier strip frame 1, with which they were connected until just before the turn.
The compensating pieces 5 of the holding webs 4 allow each component body 2 can be moved individually in the carrier strip frame 1 in the plane of the carrier strip frame 1 with little effort.
The carrier strip in FIG. 2 is similar to that of FIG. 1, but the holding webs 4 have angle-shaped compensating pieces 5. The selection of the compensating pieces 5 is determined by the specific geometric conditions of the entire carrier strip.
The carrier strip shown in FIG. 3 has four U-shaped compensating pieces 5 per holding bar, which are arranged offset in mirror image. Both U-shaped compensating pieces 5 are still closed by closure pieces 6, which should avoid the possible intrusion of, for example, plastic or glass material into the interior of the compensating piece 5 during the manufacturing process of the component body 2 itself. At the same time a rigid suspension of the component body 2 and a high stability of the holding webs 4 including their compensating pieces 5 is given to them by preferably cutting removal of the closing pieces 6 by them. The connections 3 are still connected to the carrier strip frame 1 in FIG. With the free-cutting of the terminals 3 from the carrier strip frame 1, the removal of the closure pieces 6 expediently takes place at the same time.

Claims (8)

  1. Invention claim:
    1. carrier strip arrangement for 'semiconductor components, consisting of two or more juxtaposed carrier strip frame (1) with adjustment openings (7) and within the frame (1) located semiconductor device bodies (2), wherein the semiconductor device body (2) of the frame (1) outgoing holding webs (4) are fixed and from the sides of the semiconductor device body (2) terminals (3) protrude, characterized in that the holding webs (4) elastically and / or plastically deformable with small forces balancing pieces (5).
  2. 2. carrier strip arrangement according to item 1, characterized in that the compensating pieces (5) are preferably U-shaped.
  3. 3. carrier strip arrangement according to item 1 and 2, characterized in that on a holding web (4) preferably two or more U-shaped compensating pieces (5) are arranged.
  4. 4. carrier strip assembly according to item 1, characterized in that the compensating pieces (5) are preferably formed angular.
  5. 5. carrier strip arrangement according to item 1 and 4, characterized in that on a holding web (4) preferably two or more angular compensating pieces (5) are arranged.
  6. 6. carrier strip arrangement according to item 1 to 5, characterized in that on a holding web (4) preferably angular and U-shaped compensating pieces (5) are arranged.
  7. 7. carrier strip assembly according to item 1 to 6, characterized in that the compensating pieces (5) are preferably closed by closure pieces (6), and that the closure pieces (6) are removed only before the bending of the terminals (3).
  8. 8. carrier strip arrangement according to item 1 to 7, characterized in that the closure pieces (6) are preferably removed by cutting technique simultaneously with the free cutting of the terminals (3) from the carrier strip frame (1).
    For this 2 pages drawings
DD28061985A 1985-09-16 1985-09-16 Structure arrangement for semiconductor components DD240984A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD28061985A DD240984A1 (en) 1985-09-16 1985-09-16 Structure arrangement for semiconductor components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD28061985A DD240984A1 (en) 1985-09-16 1985-09-16 Structure arrangement for semiconductor components

Publications (1)

Publication Number Publication Date
DD240984A1 true DD240984A1 (en) 1986-11-19

Family

ID=5571263

Family Applications (1)

Application Number Title Priority Date Filing Date
DD28061985A DD240984A1 (en) 1985-09-16 1985-09-16 Structure arrangement for semiconductor components

Country Status (1)

Country Link
DD (1) DD240984A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0269336A2 (en) * 1986-11-24 1988-06-01 AT&T Corp. Semiconductor integrated circuit packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0269336A2 (en) * 1986-11-24 1988-06-01 AT&T Corp. Semiconductor integrated circuit packages
EP0269336A3 (en) * 1986-11-24 1989-12-13 AT&T Corp. Semiconductor integrated circuit packages

Similar Documents

Publication Publication Date Title
US5998878A (en) Image sensor assembly and packaging method
EP1528595B1 (en) Lead frame, wire-bonding stage and method for fabricating a semiconductor apparatus
US4465898A (en) Carrier for integrated circuit
EP0374833B1 (en) Connector structure for hybrid integrated circuit
KR100486400B1 (en) High-frequency module and manufacturing method thereof
DE60029807T2 (en) OPTOELECTRONIC MODULES WITH DOUBLE WRAPPING
US5671531A (en) Fabrication process for circuit substrate having interconnection leads
US4641222A (en) Mounting system for stress relief in surface mounted components
US4331831A (en) Package for semiconductor integrated circuits
KR940010647B1 (en) Resin sealing device for semiconductor element and manufacture of semiconductor device
US5783861A (en) Semiconductor package and lead frame
US4897769A (en) Right angle light emitting diode assembly with snap-in feature
US4767984A (en) Protective fixture for chip carrier
DE60022479T2 (en) METHOD FOR CONSTRUCTING AN OPTOELECTRONIC ARRANGEMENT
US6653724B1 (en) Chip on board package for optical mice and lens cover for the same
US4491377A (en) Mounting housing for leadless chip carrier
US5600178A (en) Semiconductor package having interdigitated leads
KR100963851B1 (en) Mounting plate for solid-state imaging device and method for bonding solid-state imaging device to mounting plate
US4165607A (en) Watch module
KR960008184B1 (en) Parts of coil
US4985753A (en) Semiconductor package
DE19727214C2 (en) Semiconductor acceleration sensor, especially for airbags
US5314606A (en) Leadless ceramic package with improved solderabilty
EP1406300B1 (en) Method of manufacturing a lead frame
KR20000048222A (en) Ball-grid-array semiconductor device and manufacturing method therefor

Legal Events

Date Code Title Description
ENJ Ceased due to non-payment of renewal fee