CS261916B1 - Compositions based on epoxy acrylate resins - Google Patents

Abstract

The purpose of the solution is to obtain materials suitable for various floorings, adhesives, sealants, plastic concretes and laminates with improved mechanical properties, which are achieved by curing a composition containing an epoxy resin of the dian and/or novolak type with a molecular weight of 340 to 700, 2-ethylhexaacrylate and optionally additives from the group including fillers, pigments, dyes, surfactants and plasticizers, adducts of epoxy compounds with a molecular weight of 340 to 900 and polyalkylenepolyamines with a molecular weight of 100 to 450 in a molar ratio of 1 · 4.5 to 10.

Description

The invention relates to a new type of materials based on epoxy acrylate resins suitable for cast flooring, adhesives, sealants, plastic concretes and laminates.

Common epoxy resins are viscous liquids with a viscosity of 10 Pa.s/20 °C or even hard resins with a softening point of around 150 °C. For a number of applications, these above-mentioned resins are not suitable from a processing point of view and materials based on them with the lowest consistency, i.e. with a viscosity of around 10 Pa.s/20 °C, cannot be processed at normal temperatures by casting, laminating, etc. For the processing technique using the above-mentioned methods, a certain viscosity of the materials is required, which can be adjusted by the appropriate addition of non-reactive solvents, especially phthalates, adipates, phosphates, etc., or by the addition of reactive solvents, such as glycidyl ethers of phenols, alcohols, glycols, etc.', then

Thus, from the group of reactive solvents, glycamines, especially aniline, cyclohexylamine, and unsaturated polymerizable compounds can be used. The non-reactive hardeners used reduce the viscosity of the mixtures relatively little, on the contrary, they significantly affect and reduce the dimensional stability of the materials when hot. More favorable results are provided by the use of reactive solvents, which, however, have adverse physiological effects in the case of the use of glycidyl ethers, glycidyl esters and glycidylamines. If unsaturated polymerizable monomers are used, such as styrene, butyl methacrylate, they provide favorable results only if the polymerization of the unsaturated component takes place in a high conversion. This polymerization is disrupted by a number of factors, in this case, unreacted unsaturated monomer remains in the final material, which in most cases has an unpleasant odor. Far more advantageous final properties of the materials are achieved by using acrylates, especially 2-ethylhexyl acrylate, which significantly reduce the viscosity of the reaction system and are incorporated into the macromolecular network by the reaction of the double bond with the active hydrogen of the amine. The use of these acrylates as reactive solvents is mentioned in Czechoslovak patent No. 170 95B.

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A whole range of different compounds have been proposed for curing epoxy resins. Among the most important and practically widespread types of these hardeners are amino compounds, namely aliphatic and aromatic, cyclic and linear, monomeric and polymeric, and modified and unmodified, especially aliphatic and cycloaliphatic amines. In the case of using aliphatic amines dosed to resin mixtures in relatively small quantities applied as cast flooring, their curing is too slow and the applied surfaces have poorer mechanical properties and often many surface defects.

The above-mentioned shortcomings are eliminated by the present invention, the subject of which are materials based on epoxy acrylate resins suitable for cast floorings, adhesives, sealants, plastic concretes and laminates. The essence of the invention lies in the fact that they consist of 60 to 90 parts by weight of epoxy resin of the diane and/or novolak type with a molecular weight of 340 to 700, 10 to 40 parts by weight of 2-ethylhexyl acrylate, 10 to 65 parts by weight of an adduct of epoxy compounds with a molecular weight of 340 to 900 with polyalkylene polyamines with a molecular weight of 100 to 450 in a molar ratio of 1 : 4.5 to 10 and optionally up to 1500 parts by weight of additives from the group including fillers, pigments, dyes, surfactants and plasticizers.

The compositions according to the invention provide improved mechanical properties when cured with the above-mentioned adducts compared to compositions cured with the polyamines alone. Due to the increased content of hydroxyl groups in the hardener, curing occurs more quickly and provides a higher conversion of epoxy groups at room temperature. In applications such as flooring, these compositions provide smooth surfaces without surface defects.

For the formulation of these compositions according to the invention, epoxy resins of the dian and/or novolak type with a molecular weight of 340 to 700 are used.

As hardeners for these materials, adducts of epoxy compounds with a molecular weight of 340 to 900 with polyalkylenepolyamines with a molecular weight of 100 to 450 are used in a molar ratio of 1:4.5 to 10. Of the polyamines, diethylenetriamine, dipropylenetriamine, tetraethylenepentamine, tetrapropylenepentamine, triethylenetetramine, or their mixtures with cycloaliphatic amines, cyclohexylaminopropylamine or aromatic amines, especially 4,4-diaminodiphenylmethane, are used.

These materials may optionally contain other additives to improve the properties of the cured final products, such as various fillers, pigments, dyes and plasticizers.

The subject matter of the invention is further illustrated by the following examples.

- 3 Example 1

261,916

A diane-type epoxy resin with a molecular weight of 400 is mixed in various proportions with 2-ethylhexyl acrylate and cures 110% of the theoretical amount of adduct, prepared by reacting 1 mole of epoxy resin with a molecular weight of 400 with 6.5 moles of diethylenetriamine. When curing an epoxy composition with 10% 2-ethylhexyl acrylate, 22 parts by weight of the adduct is added per 100 parts by weight of the epoxy composition. The composition has a pot life of 40 minutes (80 minutes with diethylenetriamine alone) and cures at 20°C in 24 hours without the need for post-curing at elevated temperature.

Properties of the hardened material:

2-ethylhexyl acrylate parts by weight per 100 parts by weight of epoxy resin tensile strength MPa elasticity % impact strength kj m ² 75 4.5 12 20 70 6.0 15 30 35 65.0 80 40 12 70.0 80

Example 2

The mass contains 85 parts by weight of a diane-type epoxy resin with a molecular weight of 500, 15 parts by weight of 2-ethylhexyl acrylate and 60 parts by weight of an adduct prepared by reacting 1 mole of a diane-type epoxy resin with a molecular weight of 400 and 1 mole of a diane-type epoxy resin with a molecular weight of 500 with 18 moles of dipropylenetriamine with a molecular weight of 300.

The material is cured in 24 hours at a temperature of 20°C, has an impact strength of -2 kO m, a tensile strength of 65 MPa and an elongation of 12%.

Example 3

The mass consists of 70 parts by weight of a diane-type epoxy resin with a molecular weight of 700, 30 parts by weight of 2-ethylhexyl acrylate and 25 parts by weight of an adduct prepared by reacting 1 mole of a diane-type epoxy resin with a molecular weight of 400 with a mixture containing 6 moles of dipropylenetriamine, 0.5 moles of cyclohexylaminopropylamine and 0.5 moles of 4,4-diaminodiphenylmethane and 1500 parts by weight of silica sand.

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The material is cured in 24 hours at 20 °C and has an impact strength of 35 kO m ^-2 .

Example 4

The mass contains 40 parts by weight of a diane-type epoxy resin with a molecular weight of 400 and 30 parts by weight of a novolak-type epoxy resin with a molecular weight of 600 and 30 parts by weight of 2-ethylhexyl acrylate. 19 parts by weight of an adduct prepared by reacting 1 mole of an epoxy resin with a molecular weight of 480,

6.5 moles of diethylenetriamine. Curing occurs in 24 hours at 20 °C, impact o

toughness is 40k3 m~, dimensional stability under heat is 130 °C.

Example 5

The material consists of 60 parts by weight of epoxy resin of the novolak type with a molecular weight of 700 and 40 parts by weight of 2-ethylhexyl acrylate, and 10 parts by weight of an adduct prepared by the reaction of 1 mole of epoxy resin with a molecular weight of 400 and 8 moles of dipropylenetriamine are cured. The material can be colored with pigments added in an amount of 2 parts by weight. Curing occurs in 24 hours at 20 °C, impact strength is 30k0 m, dimensional stability under heat is 100 C.

Example 6

The mass prepared by mixing 60 parts by weight of a diane-type epoxy resin with a molecular weight of 700 is mixed with 40 parts by weight of 2-ethylhexyl acrylate, 16 parts by weight of an adduct prepared by reacting 1 mole of an epoxy resin with a molecular weight of 400 and 4.5 moles of diethylenetriamine are cured. Curing occurs in 24 hours at 20 °C, the impact toughness is 40 kJ m , the dimensional stability under heat is 100 °C.

Claims (1)

Compounds based on epoxyacrylate resins suitable for poured flooring, adhesives, sealants, plastics and laminates, characterized in that they consist of 60 to 90 parts by weight of dian and / or novolac epoxy resin of molecular weight 340 to 700, 10 to 40 parts by weight 2-ethylhexyl acrylate, 10 to 65 parts by weight of an adduct of epoxy compounds of molecular weight 340 to 900 with polyalkylene polyamines having a molecular weight of 100 to 450 in a molar ratio of 1 · 4.5 to 10 and optionally up to 1500 parts by weight of additives from the group of fillers, pigments , dyes, surfactants and plasticizers.