CN86108295A - Ethod for bonding electronic components - Google Patents
Ethod for bonding electronic components Download PDFInfo
- Publication number
- CN86108295A CN86108295A CN 86108295 CN86108295A CN86108295A CN 86108295 A CN86108295 A CN 86108295A CN 86108295 CN86108295 CN 86108295 CN 86108295 A CN86108295 A CN 86108295A CN 86108295 A CN86108295 A CN 86108295A
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- China
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- graphite
- feature
- electronic component
- ethod
- high temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention is an ethod for bonding electronic components, belongs to the radio industry.To Be Protected from Heat owing to electronic component, and high temperature can scorch part during welding.The present invention is with the clay assembling electronic element of electric conductors such as graphite and metal dust with the all-purpose adhesive preparation, through the following curing of normal temperature, can guarantee that electronic component finishes once assembling, just can debug and not fragile.
Description
The invention belongs to the radio industry, is to replace soldering process with electronic component.
To Be Protected from Heat for electronic component, and one meets high temperature has promptly damaged quietly, and electronic component must connect with soldering, generally about 180 ℃; The maximum junction temperature of the level pipe of semiconductor is only between 60 ℃ and 150 ℃, the soldered pipe period of the day from 11 p.m. to 1 a.m more than 180 ℃, be easy to scorch element, electric capacity also is afraid of high temperature, plant produced all is group's weldering, the temperature height, difficult for the moment heat radiation, so, after welding, factory all can dismount badly element when debugging, say that again element regulation should be one centimetre bending and welding, and the high frequency circuit element pin is short more good more, this is conflicting with welding with heat radiation and production just, and welding is the main key in electronic component life-span.Connect with bonded process now, save the sorrow that high-temperature soldering scorches element, can overcome above shortcoming, see " radio component application manual " for details and publish by Jiangsu science tech publishing house.P2。
It is purpose that the present invention replaces welding procedure with bonded process.
Behind the electronic devices and components installation in position, bonding with a kind of high frequency conductive glue, conductive glue is to use graphite.Glass putty, iron powder and all-purpose adhesive or epoxy resin viscose glue are mixed in proportion, be coated on the former solder joint, after doing admittedly, promptly the same with tin cold back curing, reach the splicing purpose, graphite and metal powder all are electric conductors, so, no breaking phenomena, the high frequency characteristics of resistance that graphite is done and tin, copper is good, in the primary electron product all from not it.Glue insulate, and should add some organic solution of conduction, as diluent, so can glued joint high-frequency circuit.
Advantage of the present invention is to need not the high temperature power consumption, does not scorch element, and firmly, high frequency characteristics is good, and scolding tin can scorch element, and big element meeting crack causes arcing, opens circuit, and noise and moire disturbance cause electrical noise and TV utmost point Qu Xianxiang.
The present invention is a method, does not need accompanying drawing.
The preferred embodiments of implementing is in detail: with all-purpose adhesive 502, or quick-drying gelatin and graphite, glass putty, copper powder, mixed proportion is 100 parts in a glue, 10 parts of glass puttys, 80 parts in graphite, 10 parts of copper powders, and then fully stir evenly with machine, be coated with sticking with pen or hollow pen, do solid after at once, also available flatiron is heated and is done admittedly, once group's weldering on the box can be leaked with the same clay that leaves aperture greatly on fixing solder joint of hectograph in factory, does solid back or low warm baking, individual elements changes, little electric drill that can band diamond customized bores a hole, glueds joint again.
High-volume parts can add curing agent and graphite and copper powder with epoxy resin and glued joint.
Claims (4)
1, electronic component is when welding, and the high temperature of tin can surpass the semiconductor junction temperature, can be destroyed; Feature of the present invention is to use conducting liquid, graphite with stir with all-purpose adhesive or Instant cement or epoxy resin again after copper powder, iron powder, glass putty mix after, splicing forms.
2, according to claim 1, its feature can be made into all-purpose adhesive, Instant cement, epoxy resin, bottle, tinned clay finished product.
3, according to claim 1, its feature can be made into the high frequency clay of graphite and copper powder.
4, according to claim 1, its feature can be produced the electronic product that high temperature does not have scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 86108295 CN86108295A (en) | 1986-12-04 | 1986-12-04 | Ethod for bonding electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 86108295 CN86108295A (en) | 1986-12-04 | 1986-12-04 | Ethod for bonding electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN86108295A true CN86108295A (en) | 1988-01-20 |
Family
ID=4803874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 86108295 Pending CN86108295A (en) | 1986-12-04 | 1986-12-04 | Ethod for bonding electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN86108295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325558C (en) * | 1998-08-21 | 2007-07-11 | 日立化成工业株式会社 | Paste composition, and protective film and semiconductor device both obtained with the same |
-
1986
- 1986-12-04 CN CN 86108295 patent/CN86108295A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325558C (en) * | 1998-08-21 | 2007-07-11 | 日立化成工业株式会社 | Paste composition, and protective film and semiconductor device both obtained with the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |