CN2881952Y

CN2881952Y - Radiating fin

Info

Publication number: CN2881952Y
Application number: CN 200620068889
Authority: CN
Inventors: 余春楊
Original assignee: Mitac Precision Technology Kunshan Ltd
Current assignee: Mitac Precision Technology Kunshan Ltd
Priority date: 2006-01-23
Filing date: 2006-01-23
Publication date: 2007-03-21
Anticipated expiration: 2016-01-23

Abstract

The utility model relates to a radiating fin that is used in the heat radiation of heat-generating transistors. The radiating fin comprises a baseplate of the radiating fin. A plurality of rectangular projected fins are folded on the baseplate by a proper machining process. The rectangular projected fins are vertical to the baseplate. On each rectangular projected fin, two fins that are in reverse directions and vertical to the projected fins are folded. By the radiating fin of above mentioned structure, the heat radiating efficiency can be greatly improved. Fixing the radiating fin on a heat-generating transistor can realize a good heat radiation effect.

Description

Fin

[Ji Intraoperative field]

The utility model relates to a kind of fin, and is particularly related to a kind of fin that is applied among the electronic building brick San Re Ji Intraoperative.

[Bei Jing Ji Intraoperative]

Along with the development of electronic industry, the transistor density of various electronic building bricks increases day by day, and the speed of deal with data is also more and more faster.As everyone knows, electronic building brick all can produce heat when work, and increase along with arithmetic speed, the power of its consumption and the heat of generation also increase thereupon, therefore we must utilize heat abstractor to come to distribute the heat that electronic building brick produces to the external world in time, be used for reducing the temperature of electronic building brick, to keep its normal steady operation.

In the design process of power supply adaptor, the design of heat abstractor has become its important component part, and in the design process of heat abstractor, the design of fin is again its important techniques index, the design of present power supply adaptor fin normally utilizes aluminium or copper radiating rib to be close on the heating transistor, in order to increase the transistorized area of dissipation of heating, realize heat distributing to the external world, be existing a kind of concrete assembling schematic diagram that is applied to the heat abstractor in the power supply adaptor as shown in Figure 1, this heat abstractor comprises a fin 7 and some screws 18, this fin 7 comprises one first cuboid 10, one side of this first cuboid 10 is provided with two riveted joint angles 13, and be extended with one and first cuboid, 10 orthogonal second cuboids 14 with respect to being provided with two riveted joint angle 13 opposite sides, and offer two through holes 17. above first cuboid 10

During assembling, as shown in Figure 1 and Figure 2, two riveted joint angles 13 that will be arranged on earlier on first cuboid 10 insert in the location hole 15 of heating transistor 19 1 sides, and then with screw 18 by the through hole 17 on first cuboid 10 with fin 7 be assembled in the heating transistor 19 on, can finish assembling.

Be not difficult to find out that there is following shortcoming in the fin of design at present:

1. thermal resistance value is bigger, and radiating efficiency is low: above-mentioned heat radiating fin structure is single, just utilizes the surface area of fin merely, and therefore general thermal resistance value is bigger, and radiating efficiency is lower.

2. stock utilization is low: above-mentioned fin thermal resistance value is bigger, and under identical radiating effect, common heat radiating fin structure needs more material to increase area of dissipation, so stock utilization is lower.

3. volume is big, takies more space: under present designer trends, electronic product is to small-sized, and miniature direction develops, but common fin volume is relatively large, takies more spaces, is not suitable for present development trend.

4. locate mode processed complex, the processing cost height: above-mentioned fin adopts the riveted joint angle to insert the reference column mode, and this mode needs extra material and operation, so cost is than higher.

In view of this, be necessary the fin that a kind of thermal resistance value is low, stock utilization is high, volume is little and processing cost is relatively low is provided in fact, transistorized normal steady operation guarantees to generate heat.

[summary of the invention]

Therefore, the purpose of this utility model just provides a kind of fin, and this fin thermal resistance value is low, stock utilization is high, volume is little and processing cost is relatively low.

Provide a fin for reaching above-mentioned purpose the utility model, this fin comprises a fin base plate, this fin base plate is a cuboid platy structure, the fin base plate is processed into structure by corresponding processing technology with some cuboid projection fins, these protruding fins are all perpendicular to the fin base plate, and fold the opposite and fin vertical with protruding fin of both direction respectively from these protruding fins.

Owing to adopted technique scheme, the utility model compared with prior art has the following advantages: because fin provided by the utility model makes full use of the area of dissipation of material, so thermal resistance value is smaller, the radiating efficiency height; And volume ratio is less, takies fewer space, meets present development trend; Moreover the utility model provides the fin handling ease, and the cost of material is low for prior art relatively.

For making structural feature of the present utility model and function thereof there are further understanding, cooperate diagram to be described in detail as follows now:

[description of drawings]

Fig. 1 is that an existing heat abstractor cooperates the transistorized concrete assembling schematic diagram of heating.

Fig. 2 is the structural representation of the fin of the utility model one preferred embodiment.

Fig. 3 is that the utility model one preferred embodiment is assembled in the transistorized perspective exploded view of heating.

Fig. 4 is that the utility model one preferred embodiment is assembled in the transistorized schematic diagram of heating.

[embodiment]

See also shown in Figure 2, structural representation for the fin of the utility model one preferred embodiment, this fin 1 comprises a fin base plate 20, and this fin base plate 20 is a cuboid platy structure, and the centre bit of this fin base plate 20 is equipped with a transistor connecting portion 30, offer some transistor connecting holes 33 on this transistor connecting portion 30, these some transistor connecting holes 33 can be through hole or counter sink, leave a little undressed 50 at these fin base plate 20 peripheries, between described transistor connecting portion 30 and undressed 50 then for adding the Ministry of worker 60, this adds the Ministry of worker 60 and is processed into by corresponding processing technology and has some protruding fins 61, these protruding fins 61 are rectangular structure and all perpendicular to fin base plate 20, then on the fin base plate 20 corresponding leave some to discharge orifice 63, these some convection current that discharge orifice 63 helped hot-air, and from these protruding fins 61, fold two fins 62 respectively again, these two fin 62 directions are opposite and vertical with protruding fin, projection fin 61 and two fins, 62 outstanding sides all are used for increasing the surface area of fin, cooperate transistor connecting hole 33 also to provide some screws 70 in addition.

See also Fig. 3, shown in Figure 4, two heating transistors 40 of above-mentioned fin 1 to be assembled are fixed on the substrate 80, and cooperate transistor connecting hole 33 and screw 70 on the fin 1 to offer a screw hole 75 respectively on above-mentioned two heating transistors 40, during assembling, fin 1 corresponding screw hole 75 is put on the heating transistor 40.With instrument screw 70 is screwed in the screw hole 75 by transistor connecting hole 33 again, is about to the end face that fin 1 is fixed in heating transistor 40.Heating transistor 40 conducts heat to fin 1 by heat conduction, and fin 1 arrives heat diffusion extraneous again, to guarantee the operate as normal of heating transistor 40.

The heat abstractor that the utility model provides is in the transistorized heat dissipation technology that can be widely used in generating heat. With Prior art is compared, and fin provided by the utility model has following good effect:

1. thermal resistance value is smaller, the radiating efficiency height: fin takes full advantage of the thickness of material, increases heat radiation Area by Sheet Metal Forming Technology, is gone out some protruding fins at flat board, and the outstanding side of fin is than common The surface area that fin has more, thereby thermal resistance value is smaller, the radiating efficiency height.

2. stock utilization height: protruding fin structure fin thermal resistance value is smaller, at identical radiating effect Lower, protruding fin structure fin only needs less material just can satisfy corresponding area of dissipation, therefore The stock utilization height.

3. volume is little, occupies little space: relatively common fin, protruding fin structure fin material utilization rate Height, volume is smaller, therefore takies fewer space, meets present development trend.

4. handling ease, cost is low: fin just can moulding by simple Sheet Metal Forming Technology, and processing charges is low.

Claims

1. fin, be applied to generate heat in the transistorized heat dissipation technology, it is characterized in that: this fin comprises a fin base plate, this fin base plate is a cuboid plate body structure, this fin base plate is processed into the structure with some cuboid projection fins by corresponding processing technology, and folds two fins again respectively from protruding fin.

2. fin as claimed in claim 1 is characterized in that: described protruding fin is perpendicular to the fin base plate, in order to increase the surface area of fin.

3. fin as claimed in claim 1 is characterized in that: described to fold two fin directions from the protruding fin respectively opposite and all vertical with protruding fin, in order to the surface area of increase fin.