CN2859960Y - Minitype microphone weldering plate - Google Patents
Minitype microphone weldering plate Download PDFInfo
- Publication number
- CN2859960Y CN2859960Y CN 200520084433 CN200520084433U CN2859960Y CN 2859960 Y CN2859960 Y CN 2859960Y CN 200520084433 CN200520084433 CN 200520084433 CN 200520084433 U CN200520084433 U CN 200520084433U CN 2859960 Y CN2859960 Y CN 2859960Y
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- CN
- China
- Prior art keywords
- solder joint
- bonding
- microphone
- center
- pad body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a minitype microphone bonding pad for connecting a minitype microphone, especially a minitype microphone using a surface mounting technique, to a carrier. A central bonding point is provided at center of the bonding pad body, circular bonding points are provided around the central bonding point, a projected connection bodies is provided at each side of the bonding pad body, bonding points electrically connected with the central bonding point and the circular bonding points are arranged on the connection bodies. With the minitype microphone bonding pad of the utility model, the object that an SMT roboticized production and manual operation can be applied is achieved. The connection mode reduces the effect factor on product performance during manual production to minimum, and reduces the effect on the product performance due to manual soldering.
Description
Technical field
The utility model relates to a kind of mini microphone pad, is used for especially adopting the mini microphone of surface mounting technology to be connected to carrier mini microphone.
Background technology
Existing common mini microphone has a defective aspect application surface mounting technology (SMT) production bigger difficulty being arranged exactly at present, be not easy to automated production, so the connected mode of common microphone and carrier normally adopts the method for solder joint or bonding wire, and the microphone of band gum cover, it is in order to add a gum cover between the performance need of bringing into play product and the carrier, so just increased the cost of product, the technology of manual welding simultaneously, because the relation of temperature, to product more or less some influences are all arranged, for example its sensitivity has some variations by a small margin etc. after the bonding wire.And two solder joints of surface mounting technology (SMT) mini microphone lay respectively at center and all around, can not adopt manual welding, and once be welded to and also can't pull down by hand on the carrier, bring inconvenience for user's use.
Summary of the invention
The purpose of this utility model provides a kind of SMT automated production that can be applied to mini microphone and can manual easily mini microphone pad.
For achieving the above object, the utility model adopts following technical scheme:
Mini microphone pad described in the utility model, the center of pad body has the center solder joint, around having a ring-type solder joint around the solder joint of center, the both sides of pad body respectively have the connector of a projection, have solder joint on the connector, are electrically connected with center solder joint and ring-type solder joint respectively.
The connector of above-mentioned pad body both sides is positioned at the both sides of pad body center line, and its shape can be rhombus or rectangle or semicircle.
The two sides of above-mentioned connector all has solder joint and connects by plated-through hole.
Mini microphone pad design of the present utility model in the middle of microphone circuit plate and carrier (for example, mobile phone board), has been reached and not only can use the SMT automated production but also can adopt manual purpose.This connected mode is minimum with in the manual production influencing factor of properties of product being reduced to, and has reduced the influence of manual welding to properties of product.Aspect cost, decrease simultaneously.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the present utility model;
Fig. 2 is the structural representation of another embodiment of the present utility model;
Fig. 3 is the structural representation of another embodiment of the present utility model;
Fig. 4 is that pad is connected the cutaway view on the microphone;
Fig. 5 is the vertical view of Fig. 4.
Embodiment
As shown in drawings, mini microphone pad described in the utility model, have center solder joint 2 at the center of circular pad body 1, around having a ring-type solder joint 3 around the center solder joint 2, the both sides of pad body 1 respectively have the connector 4 of a projection, have solder joint on the connector 4, be electrically connected with center solder joint 2 and ring-type solder joint 3 respectively.For the ease of manual operations, the connector 4 of pad body 1 both sides is positioned at the both sides of pad body 1 center line, and its shape can be designed to rhombus or rectangle or semicircle as required, can certainly be designed to other shape.
In order to be connected firmly, the two sides of connector 4 all has solder joint and connects by plated-through hole.
Adopt this method, when using SMT and produce, earlier the mini microphone pad is welded on the microphone 5, after being coated with solder(ing) paste on the solder joint of connector 4, can be welded direct on the relevant carrier again, as the wiring board of mobile phone etc.The solder joint that also needs only both sides connector 4 when needing dismounting welds.
Claims (3)
1, mini microphone pad, it is characterized in that: the center of pad body (1) has center solder joint (2), around having a ring-type solder joint (3) around the center solder joint (2), the both sides of pad body (1) respectively have the connector (4) of a projection, connector has solder joint on (4), is electrically connected with center solder joint (2) and ring-type solder joint (3) respectively.
2, mini microphone pad according to claim 1 is characterized in that: the connector (4) of pad body (1) both sides is positioned at the both sides of pad body (1) center line, and its shape can be rhombus or rectangle or semicircle.
3, mini microphone pad according to claim 1 and 2 is characterized in that: the two sides of connector (4) all has solder joint and connects by plated-through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520084433 CN2859960Y (en) | 2005-06-23 | 2005-06-23 | Minitype microphone weldering plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520084433 CN2859960Y (en) | 2005-06-23 | 2005-06-23 | Minitype microphone weldering plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2859960Y true CN2859960Y (en) | 2007-01-17 |
Family
ID=37612815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520084433 Expired - Fee Related CN2859960Y (en) | 2005-06-23 | 2005-06-23 | Minitype microphone weldering plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2859960Y (en) |
-
2005
- 2005-06-23 CN CN 200520084433 patent/CN2859960Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GOER TEK INC. Free format text: FORMER NAME OR ADDRESS: WEIFANG IEA ELECTRO-ACOUSTIC CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 261031 No. 268 Dongfang Road, Weifang hi tech Development Zone, Shandong, China Patentee after: Goertek Inc. Address before: 261031, Shandong, Weifang hi tech Industrial Development Zone, the first Road North Patentee before: Weifang IEA Electro-Acoustic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070117 Termination date: 20140623 |
|
| EXPY | Termination of patent right or utility model |