CN2828895Y

CN2828895Y - Storag module with radiation pressed piece

Info

Publication number: CN2828895Y
Application number: CN 200520105111
Authority: CN
Inventors: 资重兴; 廖镇麒; 史凯日; 忻鼎国
Original assignee: Individual
Current assignee: Liang Xiwei
Priority date: 2005-08-05
Filing date: 2005-08-05
Publication date: 2006-10-18
Anticipated expiration: 2015-08-05

Abstract

The utility model relates to a storage module with a radiation pressed piece. The utility model comprises a circuit board of which the board surface is provided with a plurality of frame-shaped chip bearings. A space chamber is arranged in each of the chip bearings, which ensures that circuit contact points of the board surface of the circuit board are exactly arranged on the bottom of each of the space chambers, the circuit contact points can ensure that chips are inserted into the space chamber and form electrical connection with the circuit board. In addition, the chip bearings are jointly covered with a flaky pressed piece. The bottom surface of the pressed piece is convexly provided with a plurality of butting pressed blocks which respectively correspond to each of the space chambers, and moreover, the pressed piece and the chips or the circuit board form buckle fixation, rivet fixation, or bond fixation, thereby, the pressed piece and the butting pressed blocks which the chips can be fixed to are formed and are used as a memory module of a chip cooling structure.

Description

Memory module with heat radiation rolled-up stock

Technical field

The utility model is relevant a kind of memory module with heat radiation rolled-up stock, but refers in particular to a kind of rolled-up stock fixed chip that has, and with the memory module improvement of rolled-up stock as radiator structure.

Background technology

Traditional memory module (internal memory), be to be provided with plural in the direct weldering of a circuit board plate face to encapsulate the storage chip of finishing, and be provided with in circuit board one edge surface and connect point (golden finger) outside a plurality of, with temporary memory module as computing machine or miscellaneous equipment; Since traditional memory module with chip directly weldering be located at circuit board, be difficult for repair and replacement during not only single chips generation flaw, and the upgrading requirement that can't make rapid progress in response to electronics technology at any time, the demand on difficult realistic.Therefore, relevant dealer once proposed a kind of memory module of replaceable storage chip, consult shown in Figure 7, it is to select a circuit board 10 for use, be provided with a plurality of chip carrier sockets 20 side by side in circuit board 10 plate faces, each chip carrier socket 20 is provided with an accommodation chamber 201 and can installs for storage chip 30, and make storage chip 30 and circuit board 10 constitute electric connection, thus, be provided with a stator 40 in each chip carrier socket 20, each storage chip 30 is fixed in the sheet socket 20, and is provided with the heat radiator 50 that a slice can cover whole row's chip carrier socket 20, promptly form the memory module that storage chip 30 can be changed arbitrarily in stator 40.

Take off the composition structure of memory module in the thought, be to use a stator 40 that storage chip 30 is suppressed in chip carrier socket 20 in advance, cover described heat radiator 50 in stator 40 again, it is loaded down with trivial details to cause its package assembly and program to increase on foot, and the heat when seeing through 30 runnings of a stator 40 commentaries on classics biography storage chips, its radiating effect and rate of heat dispation detract between commentaries on classics passes again and again, cause the radiating effect of these heat radiator 50 reality bad, as seen its package assembly, still non-suitable appropriate design.

The utility model content

The utility model fundamental purpose, be that a kind of memory module with heat radiation rolled-up stock is being provided, be with can be simultaneously as the rolled-up stock structural improvement of compacting and heat radiation use, and the package assembly of rolled-up stock and circuit board creation, reaching its chip of memory module can change arbitrarily, and integral assembling structure and program are simplified, and can promote effects such as radiating efficiency.

According to above-mentioned purpose, a kind of memory module with heat radiation rolled-up stock of the present utility model is characterized in that, is to comprise:

One circuit board is provided with circuit, electronic package and plural circuit junction group in the plate face, is provided with the Plug Division that can electrically connect fast in circuit board one side;

Number chip bearings are to be incorporated into side by side on each circuit junction group of circuit board, and this chip bearing has a penetration state cavity volume that makes at the bottom of the circuit junction group of circuit board is positioned at cavity volume; And

One rolled-up stock, for be covered in a lamellar body on plural chip bearing top comprehensively, its bottom surface convexes with the press block of several respectively corresponding each its cavity volumes of chip bearing.

Wherein, comprise that this circuit board chosen place is provided with several pilot holes, this chip bearing lateral wall is provided with projection, and this rolled-up stock punching out has sidewall, be provided with the cramp of several corresponding each chip bearing projections in the rolled-up stock sidewall, the cramp of rolled-up stock and chip bearing projection fasten mutually.

Wherein, comprise that this circuit board chosen place is provided with several pilot holes, the selected end of this rolled-up stock is respectively equipped with lug, is provided with the through hole of each pilot hole of corresponding circuits plate in lug, and places a fixation kit in through hole and pilot hole.

Wherein, comprise this circuit board plate face adhesive tape that has been sticked, the corresponding adhesive tape of this rolled-up stock place is provided with the lug of adhesive tape adhesion rolled-up stock.

Description of drawings

For further specifying technology contents of the present utility model, below in conjunction with drawings and Examples architectural feature of the present utility model and other effect, purpose are described in detail as follows, wherein:

Fig. 1 is the schematic perspective view of the utility model decomposing state.

Fig. 2 is the partial schematic diagram of the utility model rolled-up stock Assembly Action.

The partial schematic diagram that Fig. 3 finishes for the assembling of the utility model rolled-up stock.

The sectional schematic diagram that Fig. 4 finishes for the assembling of the utility model rolled-up stock.

Fig. 5 is one of another embodiment synoptic diagram of the utility model rolled-up stock package assembly.

Fig. 6 is two of another embodiment synoptic diagram of the utility model rolled-up stock package assembly.

Fig. 7 is the memory module synoptic diagram of known replaceable storage chip.

Embodiment

Consult shown in the accompanying drawing, the utility model is done " memory module with heat radiation rolled-up stock ", is to comprise a circuit board 1, number chip bearing 2, a rolled-up stock 3, and counts chip 4 and form that this chip 4 is to be known contents, thus do not give unnecessary details in addition, wherein:

Circuit board 1, consult shown in Figure 1, be to be provided with circuit, electronic package etc. in the plate face, and can constitute the plural circuit junction group 11 that electrically connects with chip 4, the plural circuit junction that this circuit junction group 11 can be two rows or arranged shape forms (for example contact of P.e.c.), and is provided with the Plug Division 12 (can be golden finger) that electrically connects fast with motherboard or checkout equipment in a side;

Number chip bearing 2, consult Fig. 1 and shown in Figure 3, be to be incorporated into side by side on circuit board 1 each circuit junction group 11, can be for having a penetration state cavity volume 21 for the ccontaining hollow framework of chip 4, its shape can be rectangle, circle or other shape, the demand of looking is changed difform chip bearing 2 in conjunction with using, and is not limited to specific;

Rolled-up stock 3 is consulted Fig. 1 and shown in Figure 3, is for can be covered in a high-cooling property lamellar body on plural chip bearing 2 tops, can be the sheet metal punching press and make, convex with the press block 31 of several respectively corresponding each chip bearing 2 cavity volumes 21 in its bottom surface comprehensively; Wherein, this press block 31 can be surperficial punching press one depressed part 32 and constitutes;

Thus, consult shown in Figure 3, cavity volume 21 respectively at each chip bearing 2 has installed a chip 4, make the outer electrical contact 41 of chip 4 bottoms constitute electric connection with circuit board 1 circuit junction group 11, make a described rolled-up stock 3 be covered in plural chip bearing 2 tops again, its press block 31 is contacted with chip 4 surfaces respectively, and it is fixing to make this rolled-up stock 3 combine with chip bearing 2 or circuit board 1, further press down each chip 4 strong fix, promptly form the memory module (in conjunction with consulting Fig. 4) that the utlity model has the heat radiation rolled-up stock.

Directly contact the structural improvement that presses down by the utility model rolled-up stock 3 with chip 4 surfaces, and the package assembly design of rolled-up stock 3 and chip bearing 2 or circuit board 1, be to take off known stator 40 before exempting, so can reach package assembly by this rolled-up stock 3 and simplify, and synchronous fixed chip 4 and the effect of dispelling the heat, because of directly contact chip 4 surface contacts, can promote radiating efficiency especially, keep the stability of memory module running.

As mentioned above, this rolled-up stock 3 of the utility model is to combine with chip bearing 2 or circuit board 1 to fix, and its embodiment comprises as shown in Figure 1 to Figure 3, is provided with several pilot holes 13 in circuit board 1 chosen place; Be respectively equipped with a projection 22 in chip bearing 2 two lateral walls; And make these rolled-up stock 3 punching out become the ㄇ shape, be provided with the cramp 34 of several corresponding each chip bearing 2 projections 22 in its sidewall 33, and be respectively equipped with lug 35 in rolled-up stock 3 selected ends, be provided with the through hole 36 of corresponding circuits plate 1 each pilot hole 13 in lug 35, can provide a fixation kit 37 to be arranged in (this fixation kit 37 can be register pin, screw or rivet etc.) in through hole 36 and the pilot hole 13; If this can utilize the cramp 34 of rolled-up stock 3 sidepieces to fasten mutually with chip bearing 2 projections 22, after fastening is finished, be arranged in through hole 36 and the pilot hole 13 by this fixation kit 37 again, combine fixing structure with chip bearing 2 so that form rolled-up stock 3.

Or as shown in Figure 5, only be provided with described several pilot holes 13 in this circuit board 1 chosen place; And this rolled-up stock 3 only is provided with lug 35 in selected end, be provided with the through hole 36 of corresponding circuits plate 1 each pilot hole 13 in lug 35, can provide a fixation kit 37 to be arranged in (this fixation kit 37 also can be register pin, screw or rivet etc.) in through hole 36 and the pilot hole 13; If this can be arranged in the through hole 36 of rolled-up stock 3 by

fixation kit

37, and 13 of the pilot holes of circuit board 1, reach rolled-up stock 3 and combine fixed function with circuit board 1.

Or as shown in Figure 6, also can be in the circuit board 1 plate face stickability adhesive tape 5 that has been sticked, and be provided with identical above-mentioned lug 35 in these rolled-up stock 3 corresponding adhesive tapes 5 places, can rolled-up stock 3 be combined with circuit board 1 fix by the lug 35 of these adhesive tape 5 adhesion rolled-up stocks 3; By above-mentioned explanation as seen, every the utility model rolled-up stock 3 that can make is incorporated into chip bearing 2 tops, in order to the contact and the package assembly of pressure holding chip 4, in the utility model enforcement that all can be applied, takes off embodiment more than not and exceeds.

In sum, the utility model memory module of rolled-up stock " have heat radiation ", really tool practicality and creativity, the utilization of its means also undoubtedly for novelty, and effect and purpose of design really meet.For this reason, novel patented claim is proposed in accordance with the law.

Claims

1, a kind of memory module with heat radiation rolled-up stock is characterized in that, is to comprise:

2, the memory module that has the heat radiation rolled-up stock according to claim 1, it is characterized in that, wherein, comprise that this circuit board chosen place is provided with several pilot holes, this chip bearing lateral wall is provided with projection, this rolled-up stock punching out has sidewall, is provided with the cramp of several corresponding each chip bearing projections in the rolled-up stock sidewall, and the cramp of rolled-up stock and chip bearing projection fasten mutually.

3, the memory module that has the heat radiation rolled-up stock according to claim 1, it is characterized in that, wherein, comprise that this circuit board chosen place is provided with several pilot holes, the selected end of this rolled-up stock is respectively equipped with lug, be provided with the through hole of each pilot hole of corresponding circuits plate in lug, and in through hole and pilot hole, place a fixation kit.

4, have the memory module of heat radiation rolled-up stock according to claim 1, it is characterized in that, wherein, comprise this circuit board plate face adhesive tape that has been sticked, the corresponding adhesive tape of this rolled-up stock place is provided with the lug of adhesive tape adhesion rolled-up stock.