CN2809778Y - Packaging structure of liquid crystal display driving integrated circuit - Google Patents

Abstract

The utility model relates to a liquid crystal display drive integrated circuit packaging structure, which can be applied to physical verification or failure analysis, and is mainly characterized in that a chip is arranged on a substrate of a drive integrated circuit chip, and welding points on the chip and all welding points on the substrate are welded by wires, and a transparent antistatic plastic cover is utilized to cover the chip; therefore, the packaging test process of entity verification or fault analysis is shortened, the connection state of each wire between the chip and the substrate can be clearly known by a chip design company through the transparent antistatic plastic cover, the number of test adapter plates can be reduced by using the substrate, test fixtures (SOCKET) can be shared among different drive integrated circuit products, the consumed time can be reduced, and the cost spent on entity verification or fault analysis can be reduced.

Description

Packaging structure of liquid crystal display driving integrated circuit

technical field

The utility model relates to a liquid crystal display driving integrated circuit packaging structure, especially a device that can be applied to physical verification or fault analysis, which makes the testing of chips easier and more convenient, and not only speeds up the time spent on chip design and testing. , and can relatively reduce the cost of the packaging and testing process, and increase the practicability and efficacy of the chip physical verification and failure analysis. The innovative application structure of the liquid crystal display driver integrated circuit packaging improvement.

Background technique

In recent years, with the rapid development of science and technology, various industries are changing with each passing day. Among them, liquid crystal display in the electronics industry is the most prosperous. In addition, the vigorous development of semiconductor process technology has shortened the cycle of IC design and development of new products.

As far as the various liquid crystal display driving integrated circuit chips that are usually seen, it is as shown in Figure 2, the chip 2 is mainly provided with a chip (HIP) 22 between the flexible substrates 21, and each chip 22 is provided with a chip (HIP) 22. Wires 23 are connected between the gold bumps (GOLD BUMP) 221 and each contact point 211 of the flexible substrate 21 , and then the flexible substrate 21 and the chip 22 are sealed and fixed by the resin 24 .

However, although the above-mentioned chip structure can achieve its predetermined expected effect, since the chip is manufactured and packaged, when performing physical verification and fault analysis operations, one or more adapter boards must be designed to transfer to the test fixture and then carry out physical testing. Verification or failure analysis, while the chip uses resin to seal and fix the flexible substrate together with the die, but it will seal and cover the wire connection status between the die contact and the flexible substrate, making it impossible for the chip design company to clearly know The connection state of each wire causes a lot of inconvenience and troubles in the physical verification or fault analysis process, which not only increases the time spent in physical verification or fault analysis, but also increases the difficulty of physical verification or fault analysis.

Utility model content

The task to be solved by the utility model is to provide a liquid crystal display driving integrated circuit packaging structure, which is mainly provided with a chip (CHIP) on the chip substrate of the driving integrated circuit, and soldering points (PAD) on the chip and each welding on the substrate The points are all connected by wire welding, and then covered on the chip with a transparent antistatic plastic cover.

The soldering points on the first surface of the substrate of the driving integrated circuit chip are arranged in a rectangle.

The through-hole contact on the second surface of the substrate of the driving integrated circuit chip is an electrical connection structure composed of optional pins, and is packaged into a plastic pin grid array package (Plastic Pin Grid Array Package).

The soldering point of the chip on the substrate of the driver integrated circuit chip is a copper pad (Cu pad), a gold bump (Gold Bump) or an aluminum pad (Al pad).

The wires between each soldering point of the chip on the substrate of the driver integrated circuit chip and the corresponding soldering point of the substrate are gold wires (Au Wire) or aluminum wires (Al Wire).

Therefore, during the test operation, the personnel of the chip design company can clearly know the connection status of the wires between the chip and the substrate through the transparent antistatic plastic cover, which not only makes the test operation easier and more convenient, but also Reduce the time spent on packaging and testing, and further reduce the cost of physical verification and failure analysis.

Description of drawings

FIG. 1 is a schematic diagram of the packaging structure of the liquid crystal display driving integrated circuit of the present invention.

FIG. 2 is a schematic diagram of the packaging structure of the known liquid crystal display driving integrated circuit.

1 Driver integrated circuit chip 11 Substrate

111 First surface 112 Welding point

113 second surface 114 through-hole contact

12 chips 121 soldering points

13 wires 14 antistatic plastic cover

2 chips 21 flexible substrate

211 contacts 22 chips

221 gold bumps 23 wires

24 resin

Detailed ways

First of all, please refer to Fig. 1. Fig. 1 is a liquid crystal display driving integrated circuit packaging structure of the present invention, and its driving integrated circuit chip 1 at least includes: a substrate (Substrate) 11, which mainly includes a first surface 111 of the substrate 11. There are welding points (Leadframe) 112 on it, and the welding points 112 are arranged in a rectangular shape, and a chip (CHIP) 12 is arranged on the central upper end of the substrate 11, and many welding points 121 (such as: copper) are also formed on the chip 12. Pads, gold bumps, aluminum pads, etc.), so that the soldering points 121 of the chip 12 and the corresponding soldering points 112 of the substrate 11 are mutually soldered with wires 13 (such as gold wires, aluminum wires, etc.). connected, bonded to the first surface 111 of the substrate 11, and electrically connected to the substrate 11, and then the chip 12 is covered with a transparent antistatic plastic cover 14, and the substrate 11 has a welding point 112 corresponding to the first surface 111 The second surface 113 penetrates the hole contacts 114. The second surface 113 of the substrate 11 penetrates the hole contacts 114. It is an electrical connection structure composed of optional pins, which can be packaged into a plastic pin grid arrangement structure;

In this way, when the driver integrated circuit chip 1 is sent to the test factory for testing, and the personnel of the chip design company can clearly know the soldering of the chip 12 through the transparent antistatic plastic cover 14 that covers the chip 12. The point 121 is connected to the wire 13 connection state between each welding point 112 of the substrate 11, so as to carry out physical verification or failure analysis test.

Claims (8)

1. A liquid crystal display driving integrated circuit packaging structure is characterized in that the driving integrated circuit chip at least comprises: a substrate, which mainly establishes welding points on the surface of the substrate, and is provided with a chip on the central upper end of the substrate, the chip A plurality of soldering points are also formed on the chip, so that each soldering point of the chip and the corresponding soldering point of the substrate are connected to each other by wires, bonded to the first surface of the substrate, and electrically connected to the substrate, and then on the chip The outer cover is covered with a transparent antistatic plastic cover, and the base plate has second surface through-hole contacts corresponding to first surface soldering points. 2 . The liquid crystal display driving integrated circuit packaging structure according to claim 1 , wherein the welding points on the first surface of the substrate of the driving integrated circuit chip are arranged in a rectangular shape. 3 . 3. The liquid crystal display driving integrated circuit packaging structure as claimed in claim 1, wherein the second surface through-hole contact of the substrate of the driving integrated circuit chip is an electrical connection structure composed of optional pins, and the packaging Formed into a plastic pin grid arrangement structure. 4 . The liquid crystal display driving integrated circuit packaging structure according to claim 1 , wherein the soldering point of the chip on the substrate of the driving integrated circuit chip is a copper pad. 5 . The liquid crystal display driving integrated circuit packaging structure according to claim 1 , wherein the welding points of the chip on the substrate of the driving integrated circuit chip are gold bumps. 6 . 6 . The liquid crystal display driving integrated circuit packaging structure according to claim 1 , wherein the soldering point of the chip on the substrate of the driving integrated circuit chip is an aluminum pad. 7 . 7. The liquid crystal display driving integrated circuit packaging structure according to claim 1, wherein the wires between each soldering point of the chip on the substrate of the driving integrated circuit chip and the corresponding soldering point of the substrate are gold wires. 8 . The liquid crystal display driving integrated circuit packaging structure according to claim 1 , wherein the wiring between each soldering point of the chip on the substrate of the driving integrated circuit chip and the corresponding soldering point of the substrate is an aluminum wire.

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