CN2759390Y - Heat sink arrangement used of low light rapid spectrum analysis assembly of medical laser diagnosis apparatus - Google Patents
Heat sink arrangement used of low light rapid spectrum analysis assembly of medical laser diagnosis apparatus Download PDFInfo
- Publication number
- CN2759390Y CN2759390Y CN 200420082396 CN200420082396U CN2759390Y CN 2759390 Y CN2759390 Y CN 2759390Y CN 200420082396 CN200420082396 CN 200420082396 CN 200420082396 U CN200420082396 U CN 200420082396U CN 2759390 Y CN2759390 Y CN 2759390Y
- Authority
- CN
- China
- Prior art keywords
- heat
- low light
- medical laser
- semiconductor refrigerator
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003745 diagnosis Methods 0.000 title claims abstract description 23
- 238000010183 spectrum analysis Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000001228 spectrum Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
The utility model relates to a heat radiating device for a quick weak-light spectrum analysis component in a medical laser diagnosis instrument, which is composed of a metal outer casing arranged at the periphery of the quick weak-light spectrum analysis component, a semiconductor refrigerator and a metal heat radiator, wherein the refrigeration surface of the semiconductor refrigerator is connected with the metal outer casing, and the heat radiating surface of the semiconductor refrigerator is connected with the metal heat radiator; the outer side of the metal outer casing is coated with a heat preservation layer, and both ends of a rotary passage in the metal heat radiator are respectively connected with a minitype water pump and a pipe coil type heat exchanger through a sealing pipeline. The rotary passage and the sealing pipeline are filled with heat conducting fluid, and the connecting part of the refrigeration surface of the semiconductor refrigerator and the metal outer casing is provided with a temperature sensor. When the semiconductor refrigerator is operated, the heat of the quick weak-light spectrum analysis component is radiated to an instrument box, and the temperature sensor detects the temperature of the metal outer casing. When the temperature reaches a set upper limit and a set lower limit, the semiconductor refrigerator is opened or closed. The utility model is suitable for solving the problem of the variation of a spectrum curve of the diagnosis instrument, which is caused by temperature deviation.
Description
Technical field:
This utility model relates to medical apparatus and instruments, relate in particular to a kind of medical laser diagnosis instrument, particularly relate to the low light level fast spectral analysis modules OMA in a kind of medical laser diagnosis instrument, concrete is a kind of heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules.
Background technology:
In the prior art, the core parts of low light level fast spectral analysis modules OMA in the medical laser diagnosis instrument are photodiode array chips, its outer periphery is equipped with metal shell, the photodiode array chip can produce heat in the course of the work, heat can influence the operating characteristic of chip, is embodied in, and diagnostic apparatus is after the work long period, the fluorescent spectrum curve that produces can become straight line, the influence diagnosis.
Summary of the invention:
Technical problem of the prior art to be solved in the utility model is: because in the prior art, the core parts of low light level fast spectral analysis modules OMA in the medical laser diagnosis instrument are photodiode array chips, its outer periphery is equipped with metal shell, the photodiode array chip can produce heat in the course of the work, so can influence the operating characteristic of chip, be embodied in, diagnostic apparatus is after the work long period, the fluorescent spectrum curve that produces can become straight line, the influence diagnosis.
This utility model is that the technical scheme that solution above-mentioned technical problem of the prior art is adopted provides a kind of heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules, the described this heat abstractor of medical laser diagnosis instrument low light level fast spectral analysis modules that is used for is by the metal shell that is arranged on low light level fast spectral analysis modules periphery in the medical laser diagnosis instrument, a semiconductor cooler and a metal heat sink constitute, wherein, the chill surface of described semiconductor cooler is connected with described metal shell, the radiating surface of described semiconductor cooler is connected with described metal heat sink, the outside of described metal shell is enclosed with heat-insulation layer, be provided with the Clothoid type passage in the described metal heat sink, the two ends of described passage are connected with a coil exchanger with a micro pump by closed conduit respectively, be filled with heat-conducting liquid in described Clothoid type passage and the described closed conduit, the chill surface of described refrigerator and the connecting portion of described metal shell are provided with temperature sensor.
Further, described temperature sensor is connected with a temperature control circuit board.
Further, described semiconductor cooler is connected with temperature control circuit board, and described temperature control circuit board is connected with a power supply.
Work process of the present utility model is: during semiconductor cooler energising work, the chill surface of semiconductor cooler absorbs the heat of low light level fast spectral analysis modules in the medical laser diagnosis instrument, the radiating surface of semiconductor cooler is delivered to metal heat sink with heat, and the heat-conducting medium liquid in the metal heat sink takes heat to coil exchanger and distributes outside cabinet.Temperature sensor detects the temperature of metal shell, when temperature arrives the bound of setting, opens or close semiconductor cooler by temperature control circuit board.
Concrete, the semiconductor cooler described in this utility model, metal heat sink, coil exchanger, temperature sensor and temperature control circuit board all adopt known technology of the prior art, do not repeat them here.
This utility model and prior art contrast, and its effect is actively with tangible.This utility model absorbs the heat of low light level fast spectral analysis modules in the medical laser diagnosis instrument by semiconductor cooler, and utilize temperature sensor to detect the temperature of metal shell, when temperature arrives the bound of setting, open or close semiconductor cooler by temperature control circuit board.This utility model be fit to solve the variation of the curve of spectrum that diagnostic apparatus causes because of low light level fast spectral analysis modules temperature deviation, prevents Error Diagnostics.
Description of drawings:
Fig. 1 is the structural representation that is used for the heat abstractor of medical laser diagnosis instrument low light level fast spectral analysis modules of the present utility model.
The specific embodiment:
As shown in Figure 1, the heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules of the present utility model, by the metal shell 1 that is arranged on low light level fast spectral analysis modules 8 peripheries in the medical laser diagnosis instrument, a semiconductor cooler 2 and a metal heat sink constitute, wherein, the chill surface of described semiconductor cooler 2 is connected with described metal shell 1, the radiating surface of described semiconductor cooler 2 is connected with described metal heat sink, the outside of described metal shell 1 is enclosed with heat-insulation layer 4, be provided with Clothoid type passage 5 in the described metal heat sink, the two ends of described passage are connected with a coil exchanger 10 with a micro pump 9 by closed conduit respectively, be filled with heat-conducting liquid in described Clothoid type passage 5 and the described closed conduit, the connecting portion of the chill surface of described refrigerator 2 and described metal shell 1 is provided with temperature sensor 6.
Further, described temperature sensor 6 is connected with a temperature control circuit board 7.
Further, described semiconductor cooler 2 is connected with temperature control circuit board 7, and described temperature control circuit board 7 is connected with a power supply.
Claims (3)
1. heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules, by the metal shell that is arranged on low light level fast spectral analysis modules periphery in the medical laser diagnosis instrument, a semiconductor cooler and a metal heat sink constitute, it is characterized in that: the chill surface of described semiconductor cooler is connected with described metal shell, the radiating surface of described semiconductor cooler is connected with described metal heat sink, the outside of described metal shell is enclosed with heat-insulation layer, be provided with the Clothoid type passage in the described metal heat sink, the two ends of described Clothoid type passage are connected with a coil exchanger with a micro pump by closed conduit respectively, be filled with heat-conducting liquid in described Clothoid type passage and the described closed conduit, the chill surface of described refrigerator and the connecting portion of described metal shell are provided with temperature sensor.
2. the heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: described temperature sensor is connected with a temperature control circuit board.
3. the heat abstractor that is used for medical laser diagnosis instrument low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: described semiconductor cooler is connected with temperature control circuit board, and described temperature control circuit board is connected with a power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420082396 CN2759390Y (en) | 2004-08-31 | 2004-08-31 | Heat sink arrangement used of low light rapid spectrum analysis assembly of medical laser diagnosis apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420082396 CN2759390Y (en) | 2004-08-31 | 2004-08-31 | Heat sink arrangement used of low light rapid spectrum analysis assembly of medical laser diagnosis apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2759390Y true CN2759390Y (en) | 2006-02-22 |
Family
ID=36081593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420082396 Expired - Fee Related CN2759390Y (en) | 2004-08-31 | 2004-08-31 | Heat sink arrangement used of low light rapid spectrum analysis assembly of medical laser diagnosis apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2759390Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492794A (en) * | 2017-08-31 | 2017-12-19 | 国网河南省电力公司西峡县供电公司 | One kind sealing heat-conducting type outdoor power cabinet |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
-
2004
- 2004-08-31 CN CN 200420082396 patent/CN2759390Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492794A (en) * | 2017-08-31 | 2017-12-19 | 国网河南省电力公司西峡县供电公司 | One kind sealing heat-conducting type outdoor power cabinet |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
| WO2020073897A1 (en) * | 2018-10-12 | 2020-04-16 | Chengdu Superxon Communication Technology Co., Ltd. | Heat Dissipation Assembly and Communication Module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |