CN2750478Y - 多向发光二极管元件 - Google Patents

多向发光二极管元件 Download PDF

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CN2750478Y
CN2750478Y CNU2004200928089U CN200420092808U CN2750478Y CN 2750478 Y CN2750478 Y CN 2750478Y CN U2004200928089 U CNU2004200928089 U CN U2004200928089U CN 200420092808 U CN200420092808 U CN 200420092808U CN 2750478 Y CN2750478 Y CN 2750478Y
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light
emitting diode
shell
integrated circuit
circuit block
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CNU2004200928089U
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王永春
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麦特尔公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

一种多向发光二极管元件(10,10′,10″)包括一个发光二极管集成电路块(20,20′,20″),所述集成电路块被构造用于在通电时从其至少一侧发光。一个至少半透明的外壳(12,12′,12″)从发光二极管集成电路块的至少一侧延伸出来。所述外壳的远端(121,121′,121″)具有至少两个突起(12a,12b,12a′,12b′,12c′,12a″,12b″,12c″,12d″)。每个突起都具有至少一个基本平滑的远端表面,所述远端表面向外指向发光二极管集成电路块的方向,向内指向圆柱体侧壁(122,122′,122″)的中心线,从而形成一个位于外壳的远端内的突起之间的凹陷。来自发光二极管集成电路块的光线在内部被所述侧壁反射,在外部被引导沿输出方向通过平滑表面离开外壳,所述输出方向与平滑表面垂直。

Description

多向发光二极管元件
技术领域
本发明总体上涉及发光二极管,特别地涉及能够产生沿多个输出方向传播的光束的发光二极管元件。
背景技术
发光二极管(LED)是人们通常熟知的,并且已经用于各种用途,包括消息显示器,例如公众信息标志;状态监测器,例如开/关灯;交通信号;自行车灯;闪光灯;液晶显示器(LCD)的背面光;信号/应急灯和闪光灯;红外遥控器;传感器;和LED打印机。发光二极管通常具有一个带帽形顶部的圆柱状外壳,发光二极管沿单一方向向上发光,通常沿外壳的纵向中心轴。虽然这种照明区域在许多情况下都是合适的,如果使用能够沿多个方向发光的二极管,则有些应用效果会更好。因此,为了这些应用,希望出现能够从发光二极管中沿多个输出方向发光的二极管。
发明内容
简单地说,本发明是一种多向发光二极管元件,其包括一个被构造用于在通电时从其至少一例发光的发光二极管集成电路块。一个至少半透明的外壳从发光二极管集成电路块的至少所述一侧伸出。所述外壳具有一个远端和一个一直延伸至远端的基本呈圆柱状的侧壁,所述远端与发光二极管集成电路块的所述一侧相对且距离该侧最远。外壳的远端具有至少两个突起。每个突起都具有至少一个基本上平滑的远端表面,所述远端表面向外朝向远离发光二极管集成电路块的方向,向内指向圆柱体侧壁的中心线,从而形成一个位于外壳的远端内的突起之间的凹陷。来自发光二极管集成电路块的光线在内部被所述侧壁反射,在外部被引导沿输出方向通过平滑表面离开外壳,所述输出方向与平滑表面垂直。
附图说明
结合以下附图有助于更好地理解本发明的上述发明内容和下面要详细描述的优选实施方式。为了阐述本发明,在附图中表示了目前优选的实施方式。但是,应当理解,本发明并不限于所示的具体排布和手段。
在附图中:图1a是按照本发明的第一个具体实施方式的多向发光二极管元件的俯视图;图1b是图1a的二极管元件的侧视图;图1c是图1a的二极管元件的主视图;图2是图1a的二极管元件的立体图;图3是描述图1a的二极管元件的发光强度的图;图4是按照本发明的第二个具体实施方式的多向发光二极管元件的立体图;图5是按照本发明的第三个具体实施方式的多向发光二极管元件的立体图。
具体实施方式
下面的描述中使用了特定的术语,其目的仅仅是为了方便而不是给予限制。
参见详细的附图,在所有附图中相同的数字表示相同的元件,图1-3和5表示了本发明的多向发光二极管元件的一个优选实施方式,其用附图标记10表示。参见图1a、1b、1c和2,二极管元件10的第一个实施方式包括一个发光二极管集成电路块20,其具有一个从发光二极管集成电路块20的至少一侧延伸出来的至少半透明的塑料灯管或外壳20。优选地,外壳12完全地围绕发光二极管集成电路块20。外壳12优选是透明的且优选由环氧树脂制成,但是外壳12由其他半透明或透明材料制成也是涵盖在本发明的精神和范围内的。
本发明的第一个实施方式的外壳12基本上为圆柱状。外壳12具有一个远端121,即图中所示的顶端,它距离发光二极管集成电路块20最远,外壳12还具有一个一直延伸至远端121且基本上呈圆柱状的侧壁122。外壳12的远端121具有第一突起12a和第二突起12b。每个突起12a和12b优选具有一个基本上平滑的远端表面,所述表面向外/向上朝向远离发光二极管集成电路块20的方向,向内朝向圆柱体侧壁122的中心线,从而形成一个位于外壳12的远端121内的突起12a和12b之间的凹陷。
优选地,在外壳12的远端121内,在第一突起12a和第二突起12b之间形成一个V型凹槽(特别参见图1c和2)。为了保证二极管元件10的正常工作,优选将外壳12模塑成这种形状而不是切割或者切割和修饰成这种形状。第一突起12a和第二突起12b的平滑表面之间优选具有一个约90°的角度。虽然优选突起12a和12b的平滑表面呈约90°的角,但是只要二极管元件10能够按下述方式工作,所述表面呈不同角度也是涵盖在本发明的精神和范围内的。
发光二极管集成电路块20被构造用于在通电时从其至少一侧发光。可以使用通过负极和正极导线连接的任何传统电源(未示出)给集成电路块20供电,例如电池或其他等效电源。负极导线14是两根导线中较短的一根,且设置在接近外壳12的平滑区域120的位置。导线14和16优选是平滑的、经拉伸的导电金属片,它经由外壳12的底部从集成电路块20的任一侧伸出。正极导线16从集成电路块20的p区域(未示出)伸出,负极导线14从集成电路块20的n区域(未示出)伸出。用导线14和16连接电源导致集成电路块20发光。
发光二极管集成电路块20是一个半导体集成电路块,其具有工业上通常已知的结构。发光二极管集成电路块20优选设置在接近外壳12的近端123的位置,所述近端相对且距离远端121最远。优选地,反射器18设置在接近发光二极管集成电路块20另一侧的位置,朝向远离发光二极管集成电路块20的一侧和远离外壳12的远端121的方向。反射器18优选由高反射性的金属片制成,设置反射器的目的是将发光二极管集成电路块20发出的光放大并且将其朝向外壳12的远端121向上反射。
参见图3,外壳12的几何形状导致由发光二极管集成电路块20发出的光在内部被侧壁122反射,且在外部被引导沿输出方向通过第一突起12a和第二突起12b的平滑表面离开外壳12,所述输出方向通常垂直于突起12a和12b的平滑表面。可以看到,二极管元件10发出的光的输出方向从外壳12的远端121以两个增大的发光强度,相应于和垂直于突起12a和12b的平滑表面向外射出,从而从外壳12的远端121形成一种基本上呈V型的光图案。这样,就能够从单个二极管元件10发出沿多个输出方向和多个角度射出的光。
图4所示为与本发明的第二个具体实施方式相应的二极管元件10’。除了外壳12’的形状,二极管元件10’与第一个实施方式的二极管元件10基本相似。外壳12’的形状基本上是圆柱状,在其远端121’处具有一个呈反向三棱锥形的凹陷,从而形成第一、第二和第三突起12a’、12b’和12c’。每个突起12a’、12b’和12c’具有一个朝向上和朝向内的平滑表面,它们分别与反向三棱锥形凹陷的面相对应。优选地,突起12a’、12b’和12c’的平滑表面相互呈60°,但是所述平滑表面相互呈其他角度也是涵盖在本发明的精神和范围内的。二极管10’基本上按照与第一个实施方式的二极管10相同的方式工作,除了这里光是沿着相应和垂直于突起12a’、12b’和12c’的平滑表面的三个输出方向射出的。
图5所示为与本发明的第三个具体实施方式相应的二极管元件10”。除了外壳12”的形状,二极管元件10”与第一个实施方式的二极管元件10基本相似。外壳12”的形状基本上是圆柱状,在其远端121”处具有一个呈反向方形棱锥形的凹陷,从而形成第一、第二、第三和第四突起12a”、12b”、12c”和12d”。每个突起12a”、12b”、12c”和12d”具有一个朝向上和朝向内的平滑表面,它们分别呈90°。二极管10”基本上按照与第一个实施方式的二极管10相同的方式工作,除了这里光是沿着相应和垂直于突起12a”、12b”、12c”和12d”的平滑表面的四个输出方向射出的。
这样,本发明的发光二极管元件10、10’、10”能够用于从其远端121、121’、121”沿多个方向发光,而无需使用多个发光二极管元件。
本领域的熟练技术人员应当理解,在不偏离本发明的广义发明构思的前提下可以对具体实施方式进行变化。因此,本发明并不限于所公开的特定实施方式,而是试图涵盖包括在后附权利要求书限定的本发明的精神和范围内的变化。

Claims (7)

1.一种多向发光二极管元件(10,10’,10”),其特征在于,所述多向发光二极管元件包括:一个被构造用于在通电时从其至少一侧发光的发光二极管集成电路块(20,20’,20”);以及一个从发光二极管集成电路块的至少所述一侧伸出的至少半透明的外壳(12,12’,12”),所述外壳具有一个远端(121,121’,121”)和一个一直延伸至远端的基本呈圆柱状的侧壁(122,122’,122”),所述远端与发光二极管集成电路块的所述一侧相对且距离该侧最远,外壳的远端具有至少两个突起(12a,12b,12a’,12b’,12c’,12a”,12b”,12c”,12d”),每个突起都具有至少一个基本上平滑的远端表面,所述远端表面向外朝向远离发光二极管集成电路块的方向,向内朝向圆柱体侧壁的中心线,从而形成一个位于外壳的远端内的突起之间的凹陷,其中来自发光二极管集成电路块的光线在内部被所述侧壁反射,在外部被引导沿输出方向通过平滑表面离开外壳,所述输出方向与平滑表面垂直。
2.如权利要求1所述的多向发光二极管元件,其特征在于,外壳是透明的。
3.如权利要求1所述的多向发光二极管元件,其特征在于,外壳包括两个突起(12a,12b),它们形成一个位于其间的V型凹槽,从而从外壳的远端产生一种基本呈V型的光图案。
4.如权利要求1所述的多向发光二极管元件,其特征在于,外壳包括三个突起(12a’,12b’,12c’),它们形成一个位于其间的呈反向三棱锥型的凹陷。
5.如权利要求1所述的多向发光二极管元件,其特征在于,外壳包括四个突起(12a”,12b”,12c”,12d”),它们形成一个位于其间的呈反向方形棱锥型的凹陷。
6.如权利要求1所述的多向发光二极管元件,其特征在于,其进一步包括一个反射器(18,18’,18”),所述反射器设置在接近发光二极管集成电路块另一侧的位置,朝向远离发光二极管集成电路块的所述一侧和外壳的远端的方向,该反射器被设置在将发光二极管集成电路块发出的光线朝向外壳的远端反射的位置。
7.如权利要求1所述的多向发光二极管元件,其特征在于,集成电路块被设置在接近于与远端相对的外壳近端(123,123’,123”)的位置。
CNU2004200928089U 2003-09-19 2004-09-17 多向发光二极管元件 CN2750478Y (zh)

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CA2538016A1 (en) 2005-03-31
US6997580B2 (en) 2006-02-14

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