CN2747618Y - 5.25 inch CPU liquid cooling heat sink - Google Patents
5.25 inch CPU liquid cooling heat sink Download PDFInfo
- Publication number
- CN2747618Y CN2747618Y CN200420017247.6U CN200420017247U CN2747618Y CN 2747618 Y CN2747618 Y CN 2747618Y CN 200420017247 U CN200420017247 U CN 200420017247U CN 2747618 Y CN2747618 Y CN 2747618Y
- Authority
- CN
- China
- Prior art keywords
- heat
- liquid
- inch
- cpu
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 7
- 239000007788 liquid Substances 0.000 title abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种采用计算机部件标准尺寸设计的5.25英寸CPU液冷散热器，通过轴流驱动器驱动液体全封闭循环流动吸收热量，再通过经特殊设计的散热片将热量散发的工作方式，具有散热效率高，噪音小，结构紧凑，方便安装的优点。能用于计算机CPU和其它对散热要求较高的元件方面。
A 5.25-inch CPU liquid-cooled radiator designed with the standard size of computer components, through the axial flow driver to drive the liquid to flow in a fully enclosed cycle to absorb heat, and then dissipate the heat through the specially designed cooling fins, with high heat dissipation efficiency, The advantages of low noise, compact structure and convenient installation. It can be used in computer CPU and other components that require high heat dissipation.
Description
The utility model relates to a kind of liquid cooling heat radiator that is used for the computer microprocessor heat radiation, is specially adapted to the big microprocessor of high primary frequency thermal value.
At present, the dominant frequency of computer microprocessor is more and more higher, and thermal value is also increasing, and too high temperature not only influences the performance of computing machine, also can bring variety of problems, even causes processor to burn.Traditional heat dissipating method mainly relies on the fan forced heat radiation, this method more and more exposes the limitation of its heat-sinking capability along with the rising of computer processor thermal value, and this method is in order to improve heat-sinking capability, rotation speed of the fan is often very high, becomes the overriding noise source of computing machine.
In order to solve the more and more serious heat dissipation problem of present computer processor, the utility model provides a kind of CPU liquid cooling heat radiator.This utility model heat dissipation capacity is big, and noise is low, and adopts 5.25 inches standard sizes, can improve working environment in the cabinet effectively in the convenient installation of all computer housings.
The utility model realizes that the technical scheme of its purpose is: its main part is made of built-in axial flow pump driver 1, control circuit 2, heat radiation copper pipe 3, heat-dissipating fin 4, framework 5, radiator fan 6 and heat-absorbing block 7.Working method is that liquid circulates through the water pump driving, and absorbs the CPU heat by heat-absorbing block, and heat is taken back the heat radiation copper pipe, through being arranged in copper pipe heat radiator on every side heat is distributed again.Mini-fan makes air flow to strengthen radiating effect in the blowing of heat radiator bottom.
The utility model is compared traditional C PU radiating appliance following advantage:
1. the utility model absorbs CPU heat mode by the liquid circulation, caloric receptivity is big, and can dispel the heat by large-area heat-dissipating fin around being arranged in the heat radiation copper pipe, than traditional high speed fan forced heat radiation mode, the utility model is good heat dissipation effect not only, and can effectively reduce noise.
2. the utility model adopts the full immersed type axial wheel to drive the liquid circulation, adopts external micro pump type of drive than other, and this mode structure realizes simple, and cheap, and can effectively reduce operating noise.
3. the utility model adopts 5.25 inches computer equipment standard size integral type designs, can be in the convenient installation of computing machine.
4. the utility model circuit can further reduce operating noise, and can detect the heating radiator working temperature in real time, and demonstrate with numeral in the heating radiator front according to actual thermal value size adjustment radiating fan rotation speed under the condition that guarantees efficiently radiates heat.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Fig. 1 is that roughly design sketch, Fig. 2 are that heat-absorbing block top view and cut-open view, Fig. 4 are heat radiation steel duct structural drawing for radiator body part-structure figure, Fig. 3 to the utility model.
With reference to Fig. 2, main thermal component of the present utility model has: axial flow driver 1, control circuit 2, heat radiation copper pipe 3, heat radiator 4, framework 5, radiator fan 6 and heat-absorbing block 7.Working method is that axial flow driver 1 drives liquid working substance and flows, and liquid absorbs heat at heat-absorbing block, flow to heat radiation copper pipe 2, through copper pipe be contained in and return the axial flow driver portion after heat radiator on the copper pipe distributes heat.Being contained in fan below the heat radiator can regulate wind speed according to actual conditions and strengthen radiating effect.
Axial flow driver 1 shell can be processed with engineering plastics, also can adopt metallic cylinder, axially places a direct current generator that impeller is housed, and like this, the blade rotation produces driving force.Direct current generator can adopt the common computer radiator fan, but blade should be made appropriate change, to improve liquid driven efficient.The driving power circuit of fan is placed on axial flow and drives afterbody, and this spline structure is comparatively compact.
The heat radiation copper pipe can be formed by common copper pipe bending process, and in its outside stamped recess so that in the inner projection that forms of copper pipe, structure as shown in Figure 4, increase the disturbance of liquid at internal liquid, improve the internal convection coefficient of heat transfer, be added in venetian blind type aluminium foil heat radiator again, increase area of dissipation, improve heat dissipation capacity.
Heat-dissipating fin can adopt normal aluminium foil, is processed into folding shape or the projection of stamped recess formation in the above, improves outside convection transfer rate.
Fan can be dried by reverse side from the bottom up by screw retention in louvered fin one side, and hot-air is upwards flowed, and improves the heat loss through convection effect.
Heat-absorbing block can be formed by copper billet or aluminium block die-casting process, adopts buckle to contact closely with CPU, and heat is passed to liquid.
Liquid conduits adopts plastic processing ageing-resistant, that mechanical property is good to form, and is connected on top mode with pressure cuffs after being connected of each interface of heating radiator adopted coating glue, guarantees that liquid does not leak outside.
Each parts of heating radiator can be fixed on and form an integral body on the framework of 5.25 inches sizes, have processed screw on the framework, can be screwed on 5.25 inches carriages of computing machine.The heating radiator front panel can adopt plastics to make also and frame fixation, embeds a LCD in the plastic front board, shows the heating radiator working temperature in real time.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420017247.6U CN2747618Y (en) | 2004-02-25 | 2004-02-25 | 5.25 inch CPU liquid cooling heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420017247.6U CN2747618Y (en) | 2004-02-25 | 2004-02-25 | 5.25 inch CPU liquid cooling heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2747618Y true CN2747618Y (en) | 2005-12-21 |
Family
ID=35708157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200420017247.6U Expired - Fee Related CN2747618Y (en) | 2004-02-25 | 2004-02-25 | 5.25 inch CPU liquid cooling heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2747618Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132511A (en) * | 2019-12-13 | 2020-05-08 | 杭州泰宏新能源技术有限公司 | New energy automobile block terminal water-cooling radiator |
-
2004
- 2004-02-25 CN CN200420017247.6U patent/CN2747618Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132511A (en) * | 2019-12-13 | 2020-05-08 | 杭州泰宏新能源技术有限公司 | New energy automobile block terminal water-cooling radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Wenfang Document name: Notification of Termination of Patent Right |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |