CN2693395Y - Solder ball welding device - Google Patents

Solder ball welding device Download PDF

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Publication number
CN2693395Y
CN2693395Y CN 200420002390 CN200420002390U CN2693395Y CN 2693395 Y CN2693395 Y CN 2693395Y CN 200420002390 CN200420002390 CN 200420002390 CN 200420002390 U CN200420002390 U CN 200420002390U CN 2693395 Y CN2693395 Y CN 2693395Y
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CN
China
Prior art keywords
cover
base
solder ball
gate
heating device
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Expired - Fee Related
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CN 200420002390
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Chinese (zh)
Inventor
李宏祺
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Dimip Technology Co ltd
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Dimip Technology Co ltd
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Priority to CN 200420002390 priority Critical patent/CN2693395Y/en
Application granted granted Critical
Publication of CN2693395Y publication Critical patent/CN2693395Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a tin ball welding device, which comprises a base, a cover body, a cooling device and a constant temperature structure, wherein a lower heating device is arranged in the base, and the cooling device is arranged at the side of the base close to the lower heating device; the base is pivoted with a cover body, one side of the cover body is provided with a side cover plate, the interior of the cover body is provided with an upper heating device, one side of the cover body is provided with a control part, the control part jacks the side cover plate when the cover body moves to the upper part of the lower heating device, a chip fixing device is arranged between the upper heating device of the cover body and the lower heating device of the base and is used for heating, meanwhile, a constant temperature structure is used for detecting the heating temperature, after the heating is finished, cold air is conveyed into the accommodating space of the cover body by the cooling device on one side of the base, the control part on one side of the accommodating space opens the gate, so that the cold air is sent out to the air outlet through the gate, and the rapid heating and cooling circulation between the accommodating.

Description

Tin ball fusion splicing devices
Technical field
The utility model relates to a kind of tin ball fusion splicing devices, refers to especially can heat fast in this fusion splicing devices, cool cycles, reaches the carrying out of finishing tin ball welding processing rapidly, to increase work efficiency, to shorten the activity duration.
Background technology
The high-tech electronic information industry is flourish now, the electronic product of many high values also has suitable graceful function, provide the user when using electronic product fast with convenient, also lead the mankind to move towards high-tech high civilized society, enjoy the comfortable life under the high-tech product, no matter be in the work or in the usual life, the capital uses high-tech electronic product, and form various, various electronic product be filled in the human lives arround, only in various various electronic product, the capital is equiped with the electronics spare part interior, resistance for example, electric capacity, transistor, connector, circuit board and chip etc., its chips refers to be used on circuit board manage, analyze, the function of processing data in the electronics spare part, is to be one of member of the utmost importance.
And all be provided with many pins on the chip usually, with in the chip not the functional utilization pin of same-action be connected on the circuit board, and the various electric messages on the circuit board are imported in the chip by the chip pin, utilize chip to process; Also, also arrange quite intensively simultaneously, so when chip will be installed on the circuit board, carrying out steady job at each pin of chip must be quite trouble and inconvenience because the pin count of chip is many.Promptly have the dealer to utilize the mode of hot air reflux, set firmly the tin ball on the pin of chip, announce the one eight four "606" or salvarsan number " the improvement structure of hot air reflux soft soldering machine " novel patent case as Taiwan, it includes:
One body, one heater, mesh plate, two-layer above conveying device, one guiding device, one fan assembly, the wind that blows via fan assembly can become the hot-air of a uniform temperature and the mesh plate of this tool small through hole of dirty process by the heat of mixing in the hot blast mixed zone, and provide one deck steady flow of heat wind, and blow PC plate to the ground floor conveying device equably, a part of hot blast is then by the guiding device of the conveying device side below the second layer, make it produce the conveying device of stabilized uniform hot-fluid wind below the second layer, so, can weld the circuit board of multilayer simultaneously, improve welding production efficiency thereby reach.
Above-mentioned existing hot air reflux soft soldering machine for utilizing the mode of hot-fluid wind circulation in the body, welds the electronics spare part on the circuit board, so but has many disappearances, for example:
1, the hot-fluid wind circulation temperature that can produce is not high, and easy loss, heals from pyrotoxin that far then hot blast temperature is lower, and makes the non-uniform temperature of hot-fluid wind.
2, utilize electro-heat equipment to produce the heat temperature, form hot-fluid wind with the fan blowing again and in body, circulate, can form the different existing picture of body Nei Rewen, cause tin ball fusing speed also different.
3, the circulation of the hot-fluid wind of internal body also can't be detected the temperature of hot blast, and promptly difficulty judges how long just to make the fusion of tin ball heat time heating time.
4, internal body can't be detected temperature, and promptly difficulty judges in process time whether all tin balls are fused fully.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art and defective, a kind of tin ball fusion splicing devices is provided, this kind is provided with the constant temperature structure in the base interior of fusion splicing devices, thereby can detect the base interior heating-up temperature, continue heating, insulation with judgement length heat time heating time and also or no longer heat, effectively control heating-up temperature.
For reaching above-mentioned purpose, the utility model provides a kind of tin ball fusion splicing devices, has following heater on the pedestal of this fusion splicing devices, and forming positioning framework on the heater down, can on positioning framework, put the utensil of tool chip, and be provided with cooling device in positioning framework one side, locating structure, and on the pedestal and be pivoted with lid, lid one side tool slotted eye, this slotted eye place then is provided with movable side cover plate, an and heater and side has interior room on the tool in the accommodation space of lid portion inside, and in interior room, control part is set, the control part top has displacement aperture, inside is provided with gate, this displacement aperture stretches into for the holding piece of the side cover plate of lid one side, and this gate has gate hole and can be in the seal apron of gate hole activity displacement, and seal apron is driven by cylinder and in the activity displacement of gate hole, thereby when lid is moved to the positioning framework top, control part also drives holding piece side cover plate is started, and the slotted eye of lid one side is to being positioned at cooling device, can utilize, following heater is heated to the tin ball in the utensil on the positioning framework, and the back tin ball fusion of heating, again by the cooling device transporting cold wind in the lid accommodation space, thereby in accommodation space, can carry out Fast Heating, the effect of cooling.
Secondary objective of the present utility model is that the control part of room has gate in the lid, and this gate is provided with gate hole and can be in the seal apron of gate hole activity displacement, and seal apron is driven by cylinder.
A purpose more of the present utility model is that the constant temperature structure of pedestal one side controls heating-up temperature in the pedestal and time, to prevent that heating-up temperature is too high chip is caused damage, or the circuit board that makes electronics spare part place is not because of overheated flexural deformation.
Description of drawings
Fig. 1 is a stereo appearance figure of the present utility model;
Fig. 2 is a part sectioned view of the present utility model;
Fig. 3 is the part sectioned view of the utility model lid;
Fig. 4 is the control part three-dimensional exploded view of the utility model lid;
Fig. 5 is the control part stereo appearance figure of the utility model lid;
Stereo appearance figure when Fig. 6 is the side cover plate start of the utility model lid;
Fig. 7 is the partial side, cross-sectional view after the displacement of the utility model lid;
Stereo appearance figure when Fig. 8 is the control part gate start of the utility model lid;
Fig. 9 is the stereo appearance figure after the displacement of the utility model lid;
The profile that Figure 10 blows for the utility model cooling device;
Figure 11 is a preferred embodiment side cutaway view of the present utility model.
Symbol description among the figure
1 pedestal
11 times heater 121 utensils
12 positioning frameworks, 13 slide rails
2 lids
21 accommodation spaces, 222 biasing members
Heater 2221 cylinders on 211
Room 2222 guide ramp in 212
2121 exhaust outlets, 23 shifting rollers
2122 displacement aperture, 24 slotted eyes
213 reflection units, 241 side cover plates
22 control parts, 2411 holding pieces
221 valve systems 2412 hold hypotenuse
2211 gate holes
2212 seal aprons
3 cooling devices
31 cooling fans, 32 air outlets
4 constant temperatures structure
41 detecting members
The specific embodiment
For reaching above-mentioned purpose and structure, technological means that the utility model adopted and effect thereof illustrate in detail that with regard to embodiment of the present utility model its conformation function is as follows in conjunction with the accompanying drawings, in order to understanding fully.
See also shown in Fig. 1,2,3,4, be the part sectioned view of stereo appearance figure of the present utility model, part sectioned view, lid, the control part three-dimensional exploded view of lid, include pedestal 1, lid 2 and cooling device 3 and constant temperature structure 4 by fusion splicing devices of the present utility model as can be seen among each figure, wherein:
This pedestal 1 inside is provided with down heater 11, and is provided with the positioning framework 12 of several separations in the top of following heater 11, to be embedded for utensil 121 by positioning framework 12; Limit, two opposite sides in pedestal 1 then is provided with slide rail 13.
The interior sidewall surface of this lid 2 in the limit, two opposite sides then is provided with several shifting rollers 23, and be provided with slotted eye 24 in lid 2 one sides, and be pivoted with movable side cover plate 241 in slotted eye 24 places, side cover plate 241 1 sides then are provided with holding piece 2411, and these holding piece 2411 bottoms then are provided with and hold hypotenuse 2412; These lid 2 inside then have accommodation space 21, and be provided with heater 211 in accommodation space 21 inside, and room 212 and extended exhaust outlet 2121 outward in being provided with by accommodation space 21 1 sides, displacement aperture 2122, displacement aperture 2122 can stretch into for the holding piece 2411 of side cover plate 241, and should be provided with control part 22 in the interior room 212, and control part 22 is provided with valve system 221 in a side, this valve system 221 has gate hole 2211 and seal apron 2212 that can the 2211 one side activity displacements in the gate hole, and seal apron 2212 is driven to do the activity displacement by cylinder 2221; Again, this control part 22 also is provided with biasing member 222, this biasing member 222 is positioned at displacement aperture 2122 belows, it also drives movable displacement for cylinder 2221, and biasing member 222 is provided with guide ramp 2222, this guide ramp 2222 is positioned at displacement aperture 2122 belows, and with hold hypotenuse 2412 and support and engage.
This cooling device 3 is provided with several cooling fans 31 in inside, and outer surface then is provided with several air outlets 32.
This constant temperature structure 4 is provided with detecting member 41, can detect the height of temperature.
The slide rail 13 of above-mentioned pedestal 1 is pivoted for each shifting roller 23 of lid 2, and make lid 2 can be on pedestal 1 slide displacement, and pedestal 1 is provided with cooling device 3 in the side of nearly positioning framework 12, in this cooling device 3 and be equiped with constant temperature structure 4, and constant temperature structure 4 utilizes detecting members 41 to extend positioning framework 12 tops.
See also Fig. 5 again, 6,7, shown in 8, control part stereo appearance figure for lid of the present utility model, stereo appearance figure during the side cover plate start of lid, partial side, cross-sectional view after the lid displacement, stereo appearance figure during the control part gate start of lid, when the chip or the electronics spare part (not shown) of in the utensil 121 of the positioning framework 12 of pedestal 1, putting the desire heating, and lid 2 passed and utilize shifting roller 23 on the slide rail 13 of pedestal 1, to slide, and by the control part 22 in the room in lid 2 accommodation spaces 21 1 sides 212 with cylinder 2221 drive displacement members 222, and make biasing member 222 guide ramp 2222 pushing tow holding pieces 2411 hold hypotenuse 2412, and side cover plate 241 is up started, and make seal apron 2212 displacements leave gate mouth 2211, and after lid 2 moves to positioning framework 12 tops, the slotted eye 24 of lid 2 one sides i.e. air outlet 32 to being positioned at cooling device 3, can be by the last heater 211 in the accommodation space 21 of lid 2, on following heater 11 in the pedestal 1 carries out the utensil 121 of positioning framework 12 simultaneously, following heating, thereby make the chip of the heating of desire in the utensil 121 or electronics spare part on, the below is subjected to identical temperature heating simultaneously, and the tin ball on chip or the electronics spare part can be fused, engage, and on utensil 121, the below is subjected to identical high temperature heating simultaneously, the chip of utensil 121 inside or the tin ball on the electronics spare part are fused fast, effectively shorten high temperature heat time heating time, and promote operating efficiency.
And in the process of heating, the detecting member 41 by constant temperature structure 4 is at last heater 211,11 of heaters carry out temperature detecting down, if heating-up temperature does not reach design temperature, then goes up heater 211, following heater 11 continues to heat; If detecting member 41 detecting heating-up temperatures have reached design temperature, even last heater 211, following heater 11 no longer heat or carry out the preservation and controlling temperature, under the cooperation detecting of detecting member 41, can effectively control in the pedestal 1 with lid 2 accommodation spaces 21 in temperature, tin ball fusion or engagement state are not good when preventing that heating-up temperature is not enough, or prevent that temperature is too high and make chip damage, circuit board produce situations generations such as bending, distortion.
When above-mentioned lid 2 slides, utilize shifting roller 22 slippage on slide rail 13 of both sides on pedestal 1, and this shifting roller 22 with upper and lower method of clamping mounting board on the slide rail 13 of pedestal 1, sliding effect is preferable, and lid 2 is difficult for by breaking away from the pedestal 1.
See also Fig. 8 again, 9, shown in 10, stereo appearance figure during for the control part gate start of the utility model lid, stereo appearance figure after the lid displacement, the profile that cooling device is blown, after the chip in the utensil 121 or electronics spare part machine, 221 of the valve systems of the control part 22 of room 212 drive seal apron 2212 displacements with cylinder 2213 and leave 2211 places, gate hole in the lid 2, then the detecting member 41 of constant temperature device 4 is promptly controlled cooling device 3 and with cooling fan 31 cooling air is blowed to positioning framework 12 places via air outlet 32, and the utensil 121 that makes positioning framework 12 places is cooled off wind and is stroked, and after cooling air blowed positioning framework 12, gate hole 2211 by the control part 22 of room 212 in the lid 2 enters again, discharge toward exhaust outlet 212 via interior room 212, cooling air can be circulated in positioning framework 12 and accommodation space 21, and allow utensil 121 interior chip or electronics spare parts cool off fast, the then also rapid condensation of tin ball of fusing on chip or the electronics spare part can be effectively and finish the processing operation of chip or electronics spare part apace.
And as shown in figure 11, be preferred embodiment side cutaway view of the present utility model, wherein should go up the reflection unit (as: metal plate of tool reflection function) that heater 211 can be heat pipe, heat conduction coil or infrared lamp, tool reflection function; And heater 11 also can be heat pipe, heat conduction coil or infrared lamp down, and the thermal source that heater 11 sends under promptly utilizing is projected to heater 12, produces reflexs by last heater 12 again, to form high temperature circulation in accommodation space; Again, constant temperature structure 4 also can be arranged in the accommodation space 21 of lid 2, and utilizes the temperature in the detecting member 41 detecting accommodation spaces 21, whether continues heating can control down heater 11.
Above-mentioned detailed description is only for to describe at preferred embodiment of the present utility model; only; this embodiment is not in order to limit to claim of the present utility model; such as other does not break away from equalization that technical spirit that the utility model discloses finished down and changes and modify change; all should be contained in the protection domain that the utility model contains; and on tin ball fusion splicing devices of the present utility model utilizes; the following mode of heating simultaneously; and the detecting member of constructing by constant temperature carries out temperature detecting in base interior; if do not reach design temperature; then make; following heater continues heating; if heating has reached design temperature; promptly no longer heat or be incubated; with the heating-up temperature of effective control pedestal, prevent to cause chip to damage or the diastrophic effect of circuit board because of heating-up temperature is too high.

Claims (14)

1、一种锡球熔接装置,该熔接装置包括有基座、盖体、冷却装置及定温构造,其中:1. A solder ball welding device, the welding device includes a base, a cover, a cooling device and a constant temperature structure, wherein: 该基座内部设有下加热装置,并于下加热装置的上方设有数个分隔的定位框架,而定位框架上可供嵌固器具,并于近定位框架的一侧设有冷却装置,且于基座上罩设有盖体,而盖体内部设有容置空间,并于容置空间内设有上加热装置;当盖体移动至基座的定位框架上方,即利用盖体内的上加热装置、基座内的下加热装置,同时对定位框架的上、下方的器具进行加热,且加热后利用冷却装置使定位框架上的器具快速冷却;其特征在于:The base is provided with a lower heating device inside, and several separate positioning frames are provided above the lower heating device, and the positioning frame can be used for embedding appliances, and a cooling device is provided on the side near the positioning frame. The base is covered with a cover, and the inside of the cover is provided with an accommodating space, and an upper heating device is provided in the accommodating space; when the cover moves to the top of the positioning frame of the base, the upper heating device in the cover The device and the lower heating device in the base simultaneously heat the utensils above and below the positioning frame, and use the cooling device to rapidly cool the utensils on the positioning frame after heating; it is characterized in that: 该基座上罩覆的盖体一侧设有槽孔,且于槽孔处枢设有活动式侧盖板,而侧盖板一侧设有顶持件,该顶持件由盖体一侧的控制部带动作升降位移,且控制部设于盖体内部容置空间一侧,于控制部设有活动式闸门装置及排风口,当盖体位移至基座的定位框架上方,盖体一侧的控制部即带动顶持件将侧盖板掀起,而使槽孔对位于基座一侧的冷却装置,该冷却装置设有冷却出风口及定温构造,且定温构造介于基座的下加热装置与盖体的上加热装置之间,进行锡球熔接;并于加热完成后,由冷却装置输送冷风于盖体的容置空间内,而盖体一侧的控制部再启开闸门装置,以使冷风经闸门装置而由排风口排出,以达到盖体容置空间内循环加热与快速冷却的功效。One side of the cover body covered on the base is provided with a slot hole, and a movable side cover plate is pivoted at the slot hole, and a top holder is provided on one side of the side cover plate. The control part moves up and down, and the control part is set on one side of the inner accommodation space of the cover. The control part is equipped with a movable gate device and an air exhaust port. When the cover moves to the top of the positioning frame of the base, the cover will The control part on the side drives the top holder to lift the side cover, so that the slot hole faces the cooling device on the side of the base. The cooling device is equipped with a cooling air outlet and a constant temperature structure, and the constant temperature structure is located under the base. Between the heating device and the upper heating device of the cover, solder balls are welded; and after the heating is completed, the cooling device sends cold air to the accommodating space of the cover, and the control part on the side of the cover opens the gate device , so that the cold air is discharged from the air outlet through the gate device, so as to achieve the effect of circulating heating and rapid cooling in the accommodating space of the cover body. 2、如权利要求1所述的锡球熔接装置,其中,该控制部设置于容置空间一侧的内容室内部,且内容室设有排风口。2. The solder ball welding device according to claim 1, wherein the control unit is disposed inside the inner chamber on one side of the accommodating space, and the inner chamber is provided with an air exhaust port. 3、如权利要求1所述的锡球熔接装置,其中,该控制部顶面设有位移孔,以供侧盖板的顶持件伸入位移孔内。3. The solder ball welding device as claimed in claim 1, wherein a displacement hole is provided on the top surface of the control part, for the top holder of the side cover to extend into the displacement hole. 4、如权利要求3所述的锡球熔接装置,其中,该位移孔下方设有气缸带动的位移构件。4. The solder ball welding device as claimed in claim 3, wherein a displacement member driven by a cylinder is arranged below the displacement hole. 5、如权利要求1所述的锡球熔接装置,其中,该控制部的闸门具有闸门孔及可于闸门孔一侧活动位移的闸门挡板。5 . The solder ball welding device as claimed in claim 1 , wherein the gate of the control part has a gate hole and a gate baffle movable on one side of the gate hole. 6、如权利要求5所述的锡球熔接装置,其中,该闸门的闸门挡板由气缸带动而可于闸门孔处活动位移。6 . The solder ball welding device as claimed in claim 5 , wherein the gate baffle of the gate is driven by a cylinder so as to be movable in the gate hole. 7、如权利要求1所述的锡球熔接装置,其中,该盖体的容置空间内的上加热装置为热导管。7. The solder ball welding device as claimed in claim 1, wherein the upper heating device in the accommodating space of the cover is a heat pipe. 8、如权利要求1所述的锡球熔接装置,其中,该盖体的容置空间内的上加热装置为导热线圈。8. The solder ball welding device as claimed in claim 1, wherein the upper heating device in the accommodating space of the cover is a heat conduction coil. 9、如权利要求1所述的锡球熔接装置,其中,该盖体的容置空间内的上加热装置为红外线灯管。9. The solder ball welding device as claimed in claim 1, wherein the upper heating device in the accommodating space of the cover is an infrared lamp. 10、如权利要求1所述的锡球熔接装置,其中,该盖体的容置空间内的上加热装置为具反射功能的反射装置。10. The solder ball welding device as claimed in claim 1, wherein the upper heating device in the accommodating space of the cover is a reflective device with a reflective function. 11、如权利要求10所述的锡球熔接装置,其中,该反射装置为具反射功能的金属板体。11. The solder ball welding device as claimed in claim 10, wherein the reflector is a metal plate with reflective function. 12、如权利要求1所述的锡球熔接装置,其中,该基座内部的下加热装置为热导管。12. The solder ball welding device as claimed in claim 1, wherein the lower heating device inside the base is a heat pipe. 13、如权利要求1所述的锡球熔接装置,其中,该基座内部的下加热装置为导热线圈。13. The solder ball welding device as claimed in claim 1, wherein the lower heating device inside the base is a heat conduction coil. 14、如权利要求1所述的锡球熔接装置,其中,该基座内部的下加热装置为红外线灯管。14. The solder ball welding device as claimed in claim 1, wherein the lower heating device inside the base is an infrared lamp.
CN 200420002390 2004-02-26 2004-02-26 Solder ball welding device Expired - Fee Related CN2693395Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420002390 CN2693395Y (en) 2004-02-26 2004-02-26 Solder ball welding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420002390 CN2693395Y (en) 2004-02-26 2004-02-26 Solder ball welding device

Publications (1)

Publication Number Publication Date
CN2693395Y true CN2693395Y (en) 2005-04-20

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Application Number Title Priority Date Filing Date
CN 200420002390 Expired - Fee Related CN2693395Y (en) 2004-02-26 2004-02-26 Solder ball welding device

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CN (1) CN2693395Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102723427A (en) * 2012-05-30 2012-10-10 惠州市大亚湾永昶电子工业有限公司 Eutectic crystal welding process for LED wafers
CN103286407A (en) * 2013-05-31 2013-09-11 常州盛士达传感器有限公司 Sensor welding tool
CN103367181A (en) * 2012-04-02 2013-10-23 国际商业机器公司 Method and device for bonding a substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367181A (en) * 2012-04-02 2013-10-23 国际商业机器公司 Method and device for bonding a substrate
CN103367181B (en) * 2012-04-02 2016-02-24 国际商业机器公司 For the method and apparatus of bonded substrate
CN102723427A (en) * 2012-05-30 2012-10-10 惠州市大亚湾永昶电子工业有限公司 Eutectic crystal welding process for LED wafers
CN102723427B (en) * 2012-05-30 2015-09-02 惠州市大亚湾永昶电子工业有限公司 LED wafer eutectic welding procedure
CN103286407A (en) * 2013-05-31 2013-09-11 常州盛士达传感器有限公司 Sensor welding tool
CN103286407B (en) * 2013-05-31 2015-05-13 常州盛士达传感器有限公司 Sensor welding tool

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050420

Termination date: 20120226