CN2682587Y - 复合色光式发光二极管 - Google Patents

复合色光式发光二极管 Download PDF

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CN2682587Y
CN2682587Y CNU2003201237670U CN200320123767U CN2682587Y CN 2682587 Y CN2682587 Y CN 2682587Y CN U2003201237670 U CNU2003201237670 U CN U2003201237670U CN 200320123767 U CN200320123767 U CN 200320123767U CN 2682587 Y CN2682587 Y CN 2682587Y
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led
utility
model
control
light
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唐台宁
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/155—Coordinated control of two or more light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

一种复合色光式发光二极管(LED)，主要是由该明灭控制集成电路(IC)、复数只不同色泽且体积极小的微型LED及可变电阻所组成，各该组件被安装于一般体积的LED透明灯体内，利用3～4.5V的直流低电压推动明灭控制IC，借由该明灭控制IC输出控制各只微型LED产生交替明灭，使本实用新型的灯体发出缤纷多彩的色光交替闪烁变化，达到以单一一只常用体积LED灯体，即能产生多种色光的效果。

Description

复合色光式发光二极管
技术领域
本实用新型涉及发光二极管(LED)，具体地说，本实用新型是关于一种复合色光式LED。
背景技术
LED灯由于体积颇小，安装容易，因此本广泛运用在许多机具、电器或玩具、装饰物品上，尤其是玩具或装饰物品上。为了营造美观、趣味或富变化的效果，对于灯光的色泽需求较高，因此便须运用不同色光的LED来组合使用。坊间现行习用的LED灯，为每一只单独只具有一种单纯色泽的灯体形态，较常见的有白色、红色、黄色、绿色、蓝色及橙色等几种色泽。通常一件装饰品，要呈现几种颜色的灯光效果，最起码便需安装至少几只不同色光的LED，方能让这些LED在各自的位置上，展现明灭闪烁效果。然而，欲行安装该些LED的物品，必须设置多个供该些LED安装的孔洞或灯座，并须逐一装设。在物品本身的结构上不仅会变得甚为复杂，甚至还会破坏物品本身的造型美感，而且安装过程亦繁复不便，成本较高；再者，若是欲行安装多只不同色泽LED的物品，本身体积即属于袖珍小巧型，那多只的LED如何在局促狭小的有限空间内安装规划，更是困难重重，阻碍不便，不言而喻。
实用新型内容
本实用新型的目的就在于改进前述传统LED均只具有单一色光所衍生在实际使用运作时发生的诸多积弊，从而提供一种以单一一只一般体积的LED灯体，即能发出多种缤纷色彩，且具有交替明灭闪烁变化效果的复合色光式发光二极管。
为达到上述目的，本实用新型的复合色光式发光二极管，主要由体积小巧的明灭控制集成电路，复数只分别具有不同色泽的微型发光二极管，及可变电阻等构件所组成；各该构件被安装于一只一般体积的透明发光二极管灯体内，由明灭控制集成电路及微型发光二极管所在的适当处，分别连结延伸出二支用以与电源接驳的端脚，得利用3～4.5V的直流低电压推动明灭控制集成电路，借该明灭控制集成电路输出控制各只微型发光二极管，产生交替明灭闪烁变化，经由发光二极管灯体的透射而呈现多彩缤纷的色光闪烁效果。
本实用新型的复合色光式发光二极管，仅以单一一只一般体积的LED灯体，即能发出多种缤纷色彩，且具有交替明灭闪烁变化效果，足以大幅简化多色光用途物品在与LED安装的结构及组装工序，达到降低成本、精简制程的功效，并有效提升运用范围及灵活度变化。
附图说明
图1为本实用新型的电路示意图；
图2为本实用新型的结构示意图；
图3为本实用新型的整体外观示意图。
其中：
10、明灭控制IC；
20、微型LED；
30、可变电阻；
40、LED灯体；
41、端脚。
具体实施方式
以下结合附图以具体实施例来对本实用新型的结构特征及实质功效作进一步说明。
如图1～3所示，本实用新型主要是由体积小巧的明灭控制集成电路(明灭控制IC)10，复数只不同色泽的微型LED20，及可变电阻30等构件所组成，各该构件被安装于一只一般体积的透明LED灯体40内，由明灭控制IC10及各只微型LED20所在的适当处，分别连结延伸出两只端脚41，用以与电源接驳；其中，明灭控制IC10可采用台湾超晶科技有限公司的SC3242-01型输出控制IC。这样的结构，可利用3～4.5V的直流低电压推动其明灭控制IC10，借该明灭控制IC10输出控制各微型LED20，使各微型LED20产生交替明灭的闪烁变化。而可变电阻30的阻值若改变，则微型LED20的明灭速度就跟着改变，所以可变电阻30可控制微型LED明灭的速度。由于各只微型LED20分别具有不同色泽，且全数被安装在同一个LED灯体40内，因此在本实用新型通电运作时，由该盏LED灯体40观察，可观察到其由透明的LED灯体40内，透射呈现出缤纷多彩且富动态效果的交替明灭色光变化，不仅各种色泽(例如：红、黄、蓝、绿等)交替呈现。在运用明灭控制IC10对各只微型LED20的控制设定下，更可使多只微型LED20的明灭产生延迟重叠状态，据以使该只同一体积的LED灯体40，产生的混色效果(例如红色及蓝色光可混色呈现紫色光)，极富美感变化。
再则，对于有多种色光呈现需求的物品而言，本实用新型仅以一盏与习式LED同体积的LED灯体40即能充分符合需要，因此该物品上只须设具一只供本实用新型安装的孔洞或灯座，及只须一道组装工序，即可完成本实用新型与物品的结合，相较于习式要达到同样需求效果的配合结构及工序，本实用新型确能有效大幅简化结构及制程，足以符合经济效益；当然，若是物品上欲同时安装多只本实用新型的LED亦完全没有问题。届时，多只本实用新型的LED运作状态所呈现的多样化色彩效果，绝非习式LED同样数量下所能望其项背的。而由于本实用新型只以单一一只LED灯体40的体积即能达到多色闪烁变化效果，因此，特别适合用以安装在袖珍小巧型的各种电器机具或玩具、饰品上，运用范围较习式LED更加灵活、广泛。
综上所述，本实用新型以巧思设计的崭新结构，巧妙地将多色光及明灭变化控制机制，设置于同一只LED灯体内部，达到交替明灭动态变化及混色效果，不仅在本身构造的优势上，或是其与欲安装物品的结构配合及组装工序上，皆能获得降低成本、精简结构、简化制程，以及更灵活、广泛的使用性功效增进，较之习式LED，本实用新型确实充分具备进步性、改良性及实用效益。

Claims (1)

1、一种复合色光式发光二极管，其特征在于，主要由体积小巧的明灭控制集成电路，复数只分别具有不同色泽的微型发光二极管，及可变电阻所组成，各该构件被安装于一只一般体积的透明发光二极管灯体内，由明灭控制集成电路及微型发光二极管所在的适当处，分别连结延伸出二支用以与电源接驳的端脚。
CNU2003201237670U 2002-12-10 2003-12-09 复合色光式发光二极管 Expired - Lifetime CN2682587Y (zh)

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US10/314,955 2002-12-10
US10/314,955 US20040108821A1 (en) 2002-12-10 2002-12-10 Compound color optical LED

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CN101656251B (zh) * 2009-06-22 2012-01-25 李建营 一种降低发光二极管光衰的方法

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CN105940769A (zh) * 2013-12-19 2016-09-14 飞利浦灯具控股公司 基于与玩耍区域中的玩具进行交互的照明控制
US10782335B2 (en) * 2017-11-06 2020-09-22 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight test circuit, backlight test method and backlight module using the same
CN107784968A (zh) * 2017-11-06 2018-03-09 武汉华星光电技术有限公司 背光检测电路及相关产品

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CN101656251B (zh) * 2009-06-22 2012-01-25 李建营 一种降低发光二极管光衰的方法

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