CN2516566Y - Thin copper sheet etching machine - Google Patents

Thin copper sheet etching machine Download PDF

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Publication number
CN2516566Y
CN2516566Y CN 01278079 CN01278079U CN2516566Y CN 2516566 Y CN2516566 Y CN 2516566Y CN 01278079 CN01278079 CN 01278079 CN 01278079 U CN01278079 U CN 01278079U CN 2516566 Y CN2516566 Y CN 2516566Y
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CN
China
Prior art keywords
copper sheet
etching machine
thin copper
thin
sheet etching
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 01278079
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Chinese (zh)
Inventor
王恩光
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Individual
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Individual
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Publication date
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Priority to CN 01278079 priority Critical patent/CN2516566Y/en
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Publication of CN2516566Y publication Critical patent/CN2516566Y/en
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Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a thin copper sheet etching machine, comprising an etching tank, a plurality of feeding wheels and feeding wheel shafts, a pipe nozzle and a nozzle; wherein, a chemical liquid is contained inside the etching tank, and an inlet and an outlet are arranged on both sides of the etching tank respectively; a plurality of feeding wheel shafts are arrayed in the transversal direction below and upon the chemical liquid level inside the etching tank, a plurality of feeding wheels as well as pipe nozzles are provided upon the feeding wheel shafts; the pipe nozzles are arranged among the feeding wheel shafts with an interval, and a plurality of nozzles are arranged on the pipe nozzle. The utility model has the advantages of enabling the chemical liquid sprayed by the nozzles to stir the thin copper foil etching chemical liquid soaking the base plate, and the thickness of copper foil layer on the printing circuit board more uniform.

Description

Thin copper sheet etching machine
Technical field
The utility model relates to a kind of thin device of copper thickness erosion that is used for the chemical corrosion tellite, relate in particular to a kind of by shower nozzle ejection chemical liquid with direct stirring tellite just, the current at place, the back side, make the Thin copper sheet etching machine more uniformly that chemical liquid is thin to the copper thickness erosion of tellite.
Background technology
Universal day by day at computer, science and technology is the information age of development gradually, and printed circuit board (PCB) is the soul member of all electronic products, and to the electronic product of precision on function and any peripheral fitting part do dexterous design and play keying action.The structure of general tellite is will have certain thickness copper foil earlier to be attached on the substrate with adhesion system, with just forming, the copper foil layer at the back side, the circuit that design planning is gone out again, on the plate body that presses dry film in advance, exposed, again through development and etching and on tellite, form circuit.Yet the copper thickness that attaches is littler, it is thinner then to form line thicknesses, and the little copper foil of thickness and be difficult for smooth being attached on the substrate, and attach the spent cost costliness of employed utensil, so use thicker copper foil behind the attaching substrate on the processing procedure, the substrate that will be pasted with copper foil again utilizes the chemical liquid erosion to approach and makes it to reach needed copper thickness more.
Traditional chemical Thin copper sheet etching machine (shown in Fig. 3,4) is to be pivoted with some feeding axles 62 that are combined with a plurality of delivery wheels 61 in the inside of Thin copper sheet etching machine 60, place with landscape mode on the position of upper and lower, and 61 of the delivery wheels of upper and lower keep suitable distance, make tellite 30 to be delivered in the Thin copper sheet etching machine 60 in the clamping mode, reach desired thickness to the front and the back side ejection chemical liquid of tellite 30 to lose the Copper Foil on the thin substrate 30 via jet pipe 63 set in the Thin copper sheet etching machine 60 again by the delivery wheel 61 of upper and lower.Carry when coming when tellite 30 is transferred wheel 61, by certain angle laterally or 63 pairs of tellites of jet pipe 30 of longitudinal oscillation spray chemical liquids.And traditional chemical Thin copper sheet etching machine 60 is because during jet pipe 63 ejection chemical liquids, delivery wheel 61 and feeding axle 62 are arranged between nozzle 64 and the tellite 30, so the chemical liquid of nozzle 64 ejections has part can be subjected to feeding axle 62 and delivery wheel 61 stops, make that the chemical liquid that arrives tellite 30 is inhomogeneous, and the phenomenon of generation erosion minimal thickness inequality, the copper foil layer that adds tellite 30 fronts easily makes chemical liquid stagnate generation thereon " water soaking ", make the copper thickness difference at substrate 30 fronts and the back side, influence product quality, therefore real have in addition improved necessity.
Summary of the invention
In view of this this creator commonly uses the deficiency in the Thin copper sheet etching machine design, actively studies, and through constantly making great efforts and test, develops the utility model finally.
Main purpose of the present utility model is, a kind of Thin copper sheet etching machine is provided, and it can make chemical liquid that nozzle sprayed stir substrate immersion erosion thin copper foil chemical liquid wherein, makes on the tellite thickness of copper foil layer more even.
To achieve these goals, the technical scheme that the utility model adopted is:
A kind of Thin copper sheet etching machine comprises delivery wheel, feeding axle, jet pipe, nozzle; It is characterized in that, the thin groove inside of the erosion of Thin copper sheet etching machine fills chemical liquid, the thin groove both sides of erosion are respectively equipped with inlet and outlet, the thin subsurface upper and lower of channelization soup of this erosion is sentenced landscape mode and is arranged with a plurality of feeding axles, be provided with a plurality of delivery wheels on the feeding axle, other is provided with many jet pipes, and this jet pipe is arranged at intervals between the feeding axle, and jet pipe is provided with several nozzles.
Aforesaid Thin copper sheet etching machine, wherein the ingress is respectively equipped with the dash cylinder up and down.
Aforesaid Thin copper sheet etching machine, wherein the exit is respectively equipped with the dash cylinder up and down.
Aforesaid Thin copper sheet etching machine, wherein jet pipe is arranged on the framework, and framework then links to each other with the mechanism that swings.
Aforesaid Thin copper sheet etching machine, wherein nozzle is a circular configuration.
The utility model can make chemical liquid that nozzle sprayed stir substrate immersion erosion thin copper foil chemical liquid wherein, makes on the tellite thickness of copper foil layer more even.
Description of drawings
Fig. 1 is the internal structure synoptic diagram of the utility model Thin copper sheet etching machine.
Fig. 2 is the plane relative position synoptic diagram of the utility model Thin copper sheet etching machine.
Fig. 3 is a structural representation of commonly using Thin copper sheet etching machine inside.
Fig. 4 is a plane relative position synoptic diagram of commonly using Thin copper sheet etching machine.
Embodiment
See also shown in Fig. 1,2, the utility model is a kind of Thin copper sheet etching machine 10, in the thin groove 11 of the erosion of Thin copper sheet etching machine 10, fill erosion thinning soup, the both sides of the thin groove 11 of erosion are respectively equipped with inlet 13 and export 14, and enter the mouth 13 and export 14 places and be respectively equipped with corresponding soft solid dash cylinder 15 up and down.
Upper and lower in the thin groove 11 of erosion is arranged with some feeding axles 16 with landscape mode, be provided with 17 groups of some delivery wheels on the feeding axle 16, other is provided with some jet pipes 18, this jet pipe 18 is arranged at intervals between the feeding axle 16, and jet pipe 18 is provided with several nozzles 19, this nozzle 19 can be circular configuration, to lose the thinning soup towards the ejection of tellite 30 directions.
And jet pipe 18 is arranged on the framework, and framework then links to each other with the mechanism's (located by prior art, not shown in the figures) that vertically swings, so that jet pipe 18 is made axial reciprocating type sprinkling erosion thinning soup.
By the combination of said structure, when using, control is gone into the water yield by the chemical liquid of the thin groove 11 of shower nozzle 19 injection erosions and is equated with the 14 chemical liquid amounts of overflowing of outlet with inlet 13 approximately, makes the liquid level of chemical liquid maintain on the height that is higher than jet pipe 18.Enter after erosion approaches groove 11 via feeding axle 16 and the delivery wheel 17 of inlet before 13 place's dash cylinders 15 when losing thin tellite 30, transport towards outlet 14 directions by the feeding axle 16 of thin groove 11 inside of motor (not shown) drive erosion and with the mode that tellite 30 is carried with clamping, and by the shower nozzle 19 of upper and lower settings towards tellite 30 ejection chemical liquids and stir the chemical liquid current, make tellite 30 just, that the copper-clad surface at the back side can be subjected to erosion uniformly is thin.
Therefore, by above explanation as can be known, the utility model adopts good structure design, possesses following advantage at least:
1. because of losing the height that the chemical liquid liquid level that approaches in the groove is higher than jet pipe,, can quicken to lose thin speed of response, that is reduce the thin required time of erosion so tellite is soaked among the chemical liquid fully.
2. the chemical liquid that utilizes shower nozzle and sprayed directly sprays to tellite and stirs the chemical liquid current simultaneously, makes that the copper foil layer thickness erosion on the tellite is evenly thin, and quickens the thin speed of reaction of erosion.
3. utilize the jet pipe gimbal axis to the mechanism that swings, chemical liquid evenly can be stirred the thin liquid of erosion, make tellite just, the copper-clad surface at the back side can lose evenly thin.
In sum, the utlity model has practicality and creativity, and before application, do not see any publication and public use, meet the regulation of the 97 of patent law, so file an application in accordance with the law.

Claims (5)

1. a Thin copper sheet etching machine comprises delivery wheel, feeding axle, jet pipe, nozzle; It is characterized in that, the thin groove inside of the erosion of Thin copper sheet etching machine fills chemical liquid, the thin groove both sides of erosion are respectively equipped with inlet and outlet, the thin subsurface upper and lower of channelization soup of this erosion is sentenced landscape mode and is arranged with a plurality of feeding axles, be provided with a plurality of delivery wheels on the feeding axle, other is provided with many jet pipes, and this jet pipe is arranged at intervals between the feeding axle, and jet pipe is provided with several nozzles.
2. Thin copper sheet etching machine according to claim 1 is characterized in that described ingress is respectively equipped with the dash cylinder up and down.
3. Thin copper sheet etching machine according to claim 1 is characterized in that described exit is respectively equipped with the dash cylinder up and down.
4. Thin copper sheet etching machine according to claim 1 is characterized in that described jet pipe is arranged on the framework, and framework then links to each other with the mechanism that swings.
5. Thin copper sheet etching machine according to claim 1 is characterized in that described nozzle is a circular configuration.
CN 01278079 2001-12-12 2001-12-12 Thin copper sheet etching machine Expired - Lifetime CN2516566Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01278079 CN2516566Y (en) 2001-12-12 2001-12-12 Thin copper sheet etching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01278079 CN2516566Y (en) 2001-12-12 2001-12-12 Thin copper sheet etching machine

Publications (1)

Publication Number Publication Date
CN2516566Y true CN2516566Y (en) 2002-10-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01278079 Expired - Lifetime CN2516566Y (en) 2001-12-12 2001-12-12 Thin copper sheet etching machine

Country Status (1)

Country Link
CN (1) CN2516566Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103820782A (en) * 2014-03-03 2014-05-28 杭州诺源铜艺装饰有限公司 Full-automatic plate corroding machine for copper crafts
CN111534838A (en) * 2020-06-16 2020-08-14 广东嘉元科技股份有限公司 Electrolytic copper foil raw foil machine
CN113316321A (en) * 2021-04-23 2021-08-27 厦门理工学院 Method and device for etching copper foil in roll-to-roll mode and computer equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103820782A (en) * 2014-03-03 2014-05-28 杭州诺源铜艺装饰有限公司 Full-automatic plate corroding machine for copper crafts
CN111534838A (en) * 2020-06-16 2020-08-14 广东嘉元科技股份有限公司 Electrolytic copper foil raw foil machine
CN111534838B (en) * 2020-06-16 2021-01-29 广东嘉元科技股份有限公司 Electrolytic copper foil raw foil machine
CN113316321A (en) * 2021-04-23 2021-08-27 厦门理工学院 Method and device for etching copper foil in roll-to-roll mode and computer equipment

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20111212

Granted publication date: 20021016