CN2500460Y - Miniature core sampling cutting grinding machine - Google Patents

Miniature core sampling cutting grinding machine Download PDF

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Publication number
CN2500460Y
CN2500460Y CN 01251404 CN01251404U CN2500460Y CN 2500460 Y CN2500460 Y CN 2500460Y CN 01251404 CN01251404 CN 01251404 CN 01251404 U CN01251404 U CN 01251404U CN 2500460 Y CN2500460 Y CN 2500460Y
Authority
CN
China
Prior art keywords
clamp
base
dop
fixed
motor
Prior art date
Application number
CN 01251404
Other languages
Chinese (zh)
Inventor
张敏
樊银书
何宝林
曲永兴
汪玉泉
张莉
Original Assignee
大庆油田有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 大庆油田有限责任公司 filed Critical 大庆油田有限责任公司
Priority to CN 01251404 priority Critical patent/CN2500460Y/en
Application granted granted Critical
Publication of CN2500460Y publication Critical patent/CN2500460Y/en

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Abstract

A small scale rock sample abrasive cut-off machine relates to the cutting and abrading equipment for rock samples. A section cutter (2) includes a saw blade (8) and an electrical motor (7), as well as a water tank (4), a fixture body (9), a guide rail seat (22), and a guide rail (23). The fixture body is provided thereon with a hole (9-1) and a slot (9-2) opened thereon and coordinated with the saw blade. A section polisher (3) includes an electrical motor (14), and a polishing disc (13), as well as a glass slide (12), a clamping pole (11), a suspension arm (19), a polishing clamp head (15), a clamp head guide bushing (16), an upright post (18) and a spring (20). The upright post is fixed on a base seat (1) on the lower end thereof. One end of the suspension arm is equipped on the upright post and the other end thereof is equipped on the outer arm of the clamp head guide bushing. The upper end of the polishing clamp head is equipped inside the clamp head guide bushing and forms slide connection with the clamp head guide bushing. The lower end of the polishing clamp head is provided with a clamp jaw (15-3) and the left end of the clamp pole is also provided with a clamp jaw (11-1). The utility model has the advantage of short section manufacture time, thickness of 0.5-0.8mm and is applicable to site operation.

Description

Small-sized rock sample cutting machine
Technical field: the utility model relates to the cutting and the equipment for grinding of rock sample.
Background technology: though the rock sample cutting machine of usefulness is simple in structure at present, but its function singleness, and fully by manual operation, workload is big, poor safety performance, production efficiency is low, mill control gear is few in addition, operator's technical merit is required high, just cause scrapping of abrasive disc as careless slightly, the quality and the success rate of section are low, do not satisfy the requirement of work on the spot always.
Summary of the invention: the utility model is a kind of production efficiency height of development, and security performance is good, the operation that can realize semi-automation, and cutting, grinding are the small-sized rock sample cutting machine of one.The utility model is made up of base 1, slicer 2, wafer lapping machine 3; Slicer 2 is arranged on the end of base 1, and wafer lapping machine 3 is arranged on the other end of base 1.Slicer 2 comprises saw blade 8, motor 7, and motor 7 is fixed on the base 1, and saw blade 8 is fixed on the spindle nose of motor 7, and wafer lapping machine 3 comprises motor 14, mill 13, and motor 14 is fixed on the base 1, and mill 13 is fixed on the spindle nose of motor 14.Slicer 2 also includes water tank 4, clamp body 9, track base 22, guide rail 23, water tank 4 is fixed on the base 1, track base 22 be fixed on base 1 above, clamp body 9 is provided with hole 9-4, in the 9-4 of hole, be provided with guide rail 23, clamp body 9 forms with guide rail 23 and is slidingly connected, and is provided with hole 9-1 on clamp body 9, has the groove 9-2 that matches with saw blade 8 on clamp body 9.Wafer lapping machine 3 also includes slide 12, chucking bar 11, cantilever 19, abrasive disc dop 15, dop guide pin bushing 16, column 18, spring 20; The lower end of column 18 is fixed on the base 1, and an end of cantilever 19 is arranged on the column 18, and the other end of cantilever 19 is arranged on the outer arm of dop guide pin bushing 16, and the upper end of abrasive disc dop 15 is arranged in the dop guide pin bushing 16, and is slidingly connected with 16 formation of dop guide pin bushing.Be provided with claw 15-3 in the lower end of abrasive disc dop 15, be provided with claw 11-1 at the left end that tightens bar 11, slide 12 is stuck between claw 15-3 and the claw 11-1.Be provided with stepped hole 15-1 in the lower end of abrasive disc dop 15, chucking bar 11 is arranged in the stepped hole 15-1, and spring 20 is arranged between step 15-2 and the step 11-2.The utility model compact conformation, function is complete, and overall dimensions is 500 * 320 * 360, is fit to execute-in-place.It has realized semiautomation operation, alleviated labor strength, guaranteed operator's safety effectively, improved production efficiency, the film-making time shortened to every 20-30 minute by original average every 50-60 minute, and the quality and the success rate of cutting abrasive disc improve a lot, smooth surface is smooth, the thinnest 0.5-0.8mm that is milled to, in the time of abrasive disc, the position of alignment jig arbitrarily.The thickness of section and the stock removal of abrasive disc can show that all the motor of wafer lapping machine adopts stepless speed-regulating motor from graduation mark, and speed adjustable range is wide, easy grasp simple to operate, and this cutting machine is suitable for the cutting and the grinding of all deep-well rock samples.
Description of drawings: Fig. 1 is a structural representation of the present utility model, and Fig. 2 is the structural representation of slicer 2 in the specific embodiment two, and Fig. 3 is the structural representation of wafer lapping machine 3 in the specific embodiment three.
The specific embodiment one: present embodiment is made up of base 1, slicer 2, wafer lapping machine 3; Slicer 2 is arranged on the left end of base 1, and wafer lapping machine 3 is arranged on the right-hand member of base 1.Slicer 2 comprises saw blade 8, motor 7, water tank 4, clamp body 9, track base 22, guide rail 23, and motor 7 is fixed on the left end of base 1, and saw blade 8 is fixed on the spindle nose of motor 7.Water tank 4 is fixed on the left end of base 1, track base 22 be fixed on base 1 above, clamp body 9 is provided with hole 9-4, in the 9-4 of hole, be provided with guide rail 23, clamp body 9 forms with guide rail 23 and is slidingly connected, on clamp body 9, be provided with hole 9-1, on clamp body 9, have the groove 9-2 that matches with saw blade 8.Wafer lapping machine 3 comprises motor 14, mill 13, slide 12, chucking bar 11, cantilever 19, abrasive disc dop 15, dop guide pin bushing 16, column 18, spring 20; Motor 14 is fixed on the right-hand member of base 1, and mill 13 is fixed on the spindle nose of motor 14.The lower end of column 18 is fixed on the base 1, and an end of cantilever 19 is arranged on the column 18, and the other end of cantilever 19 is arranged on the outer arm of dop guide pin bushing 16, and the upper end of abrasive disc dop 15 is arranged in the dop guide pin bushing 16, and is slidingly connected with 16 formation of dop guide pin bushing.Be provided with claw 15-3 in the lower end of abrasive disc dop 15, be provided with claw 11-1 at the left end that tightens bar 11, slide 12 is stuck between claw 15-3 and the claw 11-1.Be provided with stepped hole 15-1 in the lower end of abrasive disc dop 15, chucking bar 11 is arranged in the stepped hole 15-1, and spring 20 is arranged between step 15-2 and the step 11-2.
The specific embodiment two: present embodiment and the specific embodiment one are different is that slicer 2 also includes and regulates bolt 5, push rod 6 and spring 10; Right-hand member at clamp body 9 is provided with screwed hole 9-3, regulating bolt 5 is threaded with screwed hole 9-3, on the outer wall of regulating bolt 5, be provided with graduation mark 5-3, be used for setting slice thickness, be provided with push rod 6 in the hole 5-1 on regulating bolt 5, the effect of push rod 6 is after section is finished, section is ejected, between the side 6-1 of step 5-2 on the adjusting bolt 5 and push rod 6, be provided with spring 10, spring 10 makes push rod reset after push rod ejects section, and other composition is identical with the specific embodiment one with annexation.
The specific embodiment three: what present embodiment and the specific embodiment one were different is that wafer lapping machine 3 also comprises adjusting nut 17, spring 21; Adjusting nut 17 is threaded with the upper end of abrasive disc dop 15, and spring 21 is arranged between step 16-1 and the step 15-4, and rotation adjusting nut 17 can be adjusted stock removal.Other composition is identical with the specific embodiment one with annexation.
Operation principle is: along track base 22 post-tensionings, make clamp body leave saw blade 8 fixture body 9, cylindrical rock sample is put into the hole 9-1 of slicer 2 and is clamped, and determines slice thickness with the scale of regulating on the bolt 5.Open the saw blade motor and make saw blade 8 rotations, push card concrete 9 is cut into slices forward, section back ejects section with push rod 6, again the rock sample that cuts is adhered on the slide 12, chucking bar 11 is automatically with its chucking, rotation adjusting nut 17 is set stock removal, start stepless speed-regulating motor 14, mill 13 rotates, rotating speed is adjustable arbitrarily in the 0-2000r/min scope, in abrasive disc, can regulate the position of abrasive disc arbitrarily, also can rotate adjusting nut 17 at any time and advance mill thickness down, so just can be milled to the size of requirement automatically.

Claims (3)

1, small-sized rock sample cutting machine, it is made up of base (1), slicer (2), wafer lapping machine (3); Slicer (2) is arranged on the end of base (1), and wafer lapping machine (3) is arranged on the other end of base (1); Slicer (2) comprises saw blade (8), motor (7), and motor (7) is fixed on the base (1), and saw blade (8) is fixed on the spindle nose of motor (7); Wafer lapping machine (3) comprises motor (14), mill (13), and motor (14) is fixed on the base (1), and mill (13) is fixed on the spindle nose of motor (14); It is characterized in that slicer (2) also includes water tank (4), clamp body (9), track base (22), guide rail 23; Water tank (4) is fixed on the base (1), track base (22) be fixed on base (1) above, clamp body (9) is provided with hole (9-4), in hole (9-4), be provided with guide rail (23), clamp body (9) forms with guide rail (23) and is slidingly connected, on clamp body (9), be provided with hole (9-1), on clamp body (9), have the groove (9-2) that matches with saw blade (8); Wafer lapping machine (3) also includes slide (12), chucking bar (11), cantilever (19), abrasive disc dop (15), dop guide pin bushing (16), column (18), spring (20); The lower end of column (18) is fixed on the base (1), one end of cantilever (19) is arranged on the column (18), the other end of cantilever (19) is arranged on the outer arm of dop guide pin bushing (16), the upper end of abrasive disc dop (15) is arranged in the dop guide pin bushing (16), and is slidingly connected with dop guide pin bushing (16) formation; Be provided with claw (15-3) in the lower end of abrasive disc dop (15), be provided with claw (11-1) at the left end that tightens bar (11), slide (12) is stuck between claw (15-3) and the claw (11-1); Be provided with stepped hole (15-1) in the lower end of abrasive disc dop (15), chucking bar (11) is arranged in the stepped hole (15-1), and spring (20) is arranged between step (15-2) and the step (11-2).
2, small-sized rock sample cutting machine according to claim 1 is characterized in that slicer (2) also includes adjusting bolt (5), push rod (6) and spring (10); Right-hand member at clamp body (9) is provided with screwed hole (9-3), regulating bolt (5) is threaded with screwed hole (9-3), on the outer wall of regulating bolt (5), be provided with graduation mark (5-3), be provided with push rod (6) in the hole (5-1) on regulating bolt (5), between the side (6-1) of step (5-2) on the adjusting bolt (5) and push rod (6), be provided with spring (10).
3, small-sized rock sample cutting machine according to claim 1, it is characterized in that wafer lapping machine (3) also comprises adjusting nut (17), spring (21), adjusting nut (17) is threaded with the upper end of abrasive disc dop (15), and spring (21) is arranged between step (16-1) and the step (15-4).
CN 01251404 2001-11-09 2001-11-09 Miniature core sampling cutting grinding machine CN2500460Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01251404 CN2500460Y (en) 2001-11-09 2001-11-09 Miniature core sampling cutting grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01251404 CN2500460Y (en) 2001-11-09 2001-11-09 Miniature core sampling cutting grinding machine

Publications (1)

Publication Number Publication Date
CN2500460Y true CN2500460Y (en) 2002-07-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01251404 CN2500460Y (en) 2001-11-09 2001-11-09 Miniature core sampling cutting grinding machine

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CN (1) CN2500460Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105690097A (en) * 2016-03-21 2016-06-22 株洲坦谱科技有限公司 Automatic cutting and grinding all-in-one machine
CN106092637A (en) * 2016-07-13 2016-11-09 黄淮学院 Multifunctional rock Experiments of Machanics cutting machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105690097A (en) * 2016-03-21 2016-06-22 株洲坦谱科技有限公司 Automatic cutting and grinding all-in-one machine
CN105690097B (en) * 2016-03-21 2018-05-22 株洲坦谱科技有限公司 Automatically all-in-one machine is cut
CN106092637A (en) * 2016-07-13 2016-11-09 黄淮学院 Multifunctional rock Experiments of Machanics cutting machine
CN106092637B (en) * 2016-07-13 2018-09-04 黄淮学院 Multifunctional rock experiment of machanics cutting machine

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C14 Grant of patent or utility model
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C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20111109

Granted publication date: 20020717