CN224192003U - A link communication device - Google Patents
A link communication deviceInfo
- Publication number
- CN224192003U CN224192003U CN202520819224.9U CN202520819224U CN224192003U CN 224192003 U CN224192003 U CN 224192003U CN 202520819224 U CN202520819224 U CN 202520819224U CN 224192003 U CN224192003 U CN 224192003U
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- China
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- fixedly connected
- motherboard
- fan
- communication device
- link communication
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Abstract
一种链路通信装置，所述装置包括：下壳体，所述下壳体上对立的两侧一体形成有侧板；固定板，固定连接于所述侧板；第一风扇，固定连接于所述固定板，且位于所述固定板背离所述侧板的一侧；开关电源，固定连接于所述下壳体，所述开关电源的表面设有第二风扇；其中，所述侧板贯穿形成有散热孔，所述装置内热量依次经过所述第一风扇、所述第二风扇和所述散热孔排出。
A link communication device includes: a lower housing with side plates integrally formed on opposite sides of the lower housing; a fixing plate fixedly connected to the side plates; a first fan fixedly connected to the fixing plate and located on the side of the fixing plate opposite to the side plates; and a switching power supply fixedly connected to the lower housing, with a second fan provided on the surface of the switching power supply; wherein, heat dissipation holes are formed through the side plates, and heat inside the device is discharged sequentially through the first fan, the second fan, and the heat dissipation holes.
Description
Technical Field
The present utility model relates to the field of communications hardware, and in particular, to a link communications device.
Background
In the current technical field of communication networks, a link communication gateway plays a crucial role as a key device for network connection and data transmission. However, with the proliferation of network traffic and the increasing complexity of data processing requirements, existing gateways expose a series of technical drawbacks in terms of heat dissipation design, which severely limit the performance stability and service life of the gateway.
First, the inefficiency of heat dissipation is a common problem with current gateways. During high-intensity data transmission and processing, a large amount of heat energy is generated inside the gateway, and the traditional heat dissipation design often cannot effectively discharge the heat in time, so that the temperature inside the equipment rises sharply. This not only affects the processing speed and response time of the gateway, but may also cause a series of performance bottlenecks, such as increased network delay, increased packet loss rate, etc., thereby severely degrading the quality of network communications. Secondly, because heat cannot be discharged in time, electronic elements (particularly the temperature of a switching power supply is usually high) in the equipment are extremely vulnerable to heat damage in a state of running at high temperature for a long time, and ageing, failure and even burning occur. This not only can result in frequent equipment failure and increased maintenance costs, but can also result in loss of data or interruption of communication, leading to immeasurable loss for the user.
Accordingly, it is desirable to provide a link communication device that is capable of efficiently dissipating heat and protecting internal electronic components.
Disclosure of utility model
The utility model aims to provide a link communication device which can effectively dissipate heat and protect internal electronic components.
According to an aspect of the present application, there is provided a link communication apparatus, the apparatus comprising:
the lower shell is provided with two opposite sides integrally formed with side plates;
the fixed plate is fixedly connected with the side plate;
the first fan is fixedly connected to the fixed plate and is positioned at one side of the fixed plate, which is away from the side plate;
The switch power supply is fixedly connected to the lower shell, and a second fan is arranged on the surface of the switch power supply;
The side plates penetrate through the heat dissipation holes, and heat in the device is discharged through the first fan, the second fan and the heat dissipation holes in sequence.
More preferably, the apparatus further comprises:
the upper shell is fixedly spliced with the lower shell;
And the front cover plate is fixedly connected between the upper shell and the lower shell as seen along a first direction parallel to the surface of the upper shell.
More preferably, the apparatus further comprises:
The main board is fixedly connected to the lower shell, is positioned between the upper shell and the lower shell, and is positioned at one side of the switching power supply, which is away from the front cover plate;
And the rear cover plate is observed along a first direction parallel to the surface of the upper shell, is fixedly connected with the upper shell and the lower shell, and is positioned on one side of the main board, which is away from the switching power supply.
More preferably, the method further comprises the steps of,
And one side of the main board, which is away from the lower shell, is fixedly connected with a main switch, a USB interface and a serial port, and the main switch, the USB interface and the serial port are respectively and electrically connected with the main board.
More preferably, the main switch, the USB interface and the serial port are further fixedly connected to the front cover plate respectively, and observed along the first direction, and the main switch, the USB interface and the serial port are sequentially arranged on the surface of the front cover plate.
More preferably, the main board further comprises:
the heat dissipation part is fixedly connected to the main board and is electrically connected with the main board;
The heat dissipation part is provided with a third fan for dissipating heat of the main board.
More preferably, the method further comprises the steps of,
The mainboard is deviate from one side of lower casing still fixedly connected with net gape and VGA interface, just net gape with VGA interface respectively with the mainboard electricity is connected.
More preferably, the network port and the VGA interface are further fixedly connected to the rear cover plate respectively, and observed along a second direction opposite to the first direction, and the network port and the VGA interface are sequentially arranged on the surface of the rear cover plate.
More preferably, the apparatus further comprises:
the filter is fixedly connected to the lower shell, is electrically connected with the main board and is positioned at one side of the net opening, which is away from the VGA interface, when the filter is observed along the second direction;
The power socket is fixedly connected to the rear cover plate, is electrically connected with the main board and is observed along the second direction, and the power socket is located on one side, deviating from the lower shell, of the filter.
More preferably, the second fan is electrically connected to the main board, and the switching power supply is also electrically connected to the main board.
The utility model has the following beneficial effects:
Through heat in the device passes through in proper order first fan second fan with the louvre discharges, makes the device can effectively dispel the heat, and adopts switching power supply also is equipped with the design of second fan will the interior geothermal energy of switching power supply effectively discharges, has protected electronic component in the device.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a link communication device according to an embodiment of the application;
Fig. 2 is a schematic plan view of a front view of a link communication device according to an embodiment of the present application;
fig. 3 is a schematic plan view illustrating a rear view of the link communication device according to an embodiment of the present application;
Fig. 4 is a schematic plan view of the link communication device according to an embodiment of the application with the upper housing removed;
fig. 5 is a schematic plan view of the main board of the link communication device according to an embodiment of the application;
FIG. 6 is an enlarged schematic view of the first fan and the fixing plate in the link communication device according to an embodiment of the present application;
Fig. 7 is an enlarged schematic diagram of a three-dimensional structure of the switching power supply in the link communication device according to an embodiment of the application;
The reference numerals are 200, a link communication device, 10, a lower shell, 11, a side plate, 11A, a radiating hole, 20, a fixing plate, 30, a first fan, 40, a switching power supply, 41, a second fan, 50, an upper shell, 60, a front cover plate, 70, a main board, 71, a main switch, 72, a USB interface, 73, a serial port, 74, a radiating part, 74A, a third fan, 75, a network port, 76, a VGA interface, 80, a rear cover plate, 90, a filter, 100, a power socket, F1, a first direction, F2 and a second direction.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 7, an embodiment of the present application provides a link communication device including a lower case 10, a fixing plate 20, a first fan 30, and a switching power supply 40.
The lower case 10 is integrally formed with side plates 11 at opposite sides thereof. The fixing plate 20 is fixedly connected to the side plate 11. The first fan 30 is fixedly connected to the fixing plate 20, and is located at a side of the fixing plate 20 away from the side plate 11. The switching power supply 40 is fixedly connected to the lower housing 10, and a second fan 41 is disposed on the surface of the switching power supply 40. The side plate 11 is formed with a heat radiation hole 11A therethrough, and the heat in the device is discharged through the first fan 30, the second fan 41, and the heat radiation hole 11A in this order.
Wherein, the opposite sides of the lower case 10 are integrally formed with side plates 11. The side panels 11 serve as extensions of the lower housing 10, provide structural support, and provide a foundation for the installation of the mounting plate 20 and other components. The fixing plate 20 ensures stable installation of the first fan 30 by connecting the side plates 11, and provides a basis for a heat dissipation path for the first fan 30. The first fan 30 is responsible for primary heat dissipation, and helps to reduce the overall temperature of the device by extracting and discharging heat from the interior of the device. The switching power supply 40 is a main power supply part of the device, and is prone to generate heat. The provision of the second fan 41 helps to rapidly discharge the heat generated from the switching power supply 40, preventing overheating. The heat dissipation holes 11A serve as final heat dissipation channels, allowing the heat cooled by the first fan 30 and the second fan 41 to be smoothly dissipated to the outside of the device, ensuring that the temperature inside the device is kept appropriate.
More preferably, the device further comprises an upper housing 50 and a front cover plate 60.
The upper case 50 is fixedly spliced with the lower case 10. The front cover 60 is fixedly coupled between the upper case 50 and the lower case 10, as viewed in a first direction F1 parallel to the surface of the upper case 50.
The upper casing 50 and the lower casing 10 are fixedly spliced together to form a main structure of the link communication device. This design not only enhances the stability of the device, but also provides overall protection for its internal components. The addition of the upper housing 50 creates a relatively enclosed space for the device, which helps to reduce the intrusion of external dust, moisture, etc. on the internal components, thereby improving the durability and reliability of the device. Although the upper case 50 itself does not directly participate in the heat dissipation process, the close fit between it and the lower case 10 helps to reduce air leakage around the heat dissipation holes 11A, thereby improving heat dissipation efficiency. In addition, the design of the surface of the upper housing 50 may also consider the heat dissipation requirement, such as using a heat dissipation fin or a vent structure to assist in heat dissipation. The front cover plate 60 is fixedly connected between the upper housing 50 and the lower housing 10, providing additional protection for the front interface of the device. This helps to prevent damage to the interface from accidental bumps or scratches.
More preferably, the device further comprises a main board 70 and a back cover board 80.
The main board 70 is fixedly connected to the lower housing 10, and is located between the upper housing 50 and the lower housing 10, and is located at a side of the switching power supply 40 facing away from the front cover 60. The rear cover 80 is fixedly connected between the upper case 50 and the lower case 10, and is located on a side of the main board 70 facing away from the switching power supply 40, when the rear cover 80 is viewed along a first direction F1 parallel to the surface of the upper case 50.
The main board 70 is used as a core component of the link communication device, and integrates key components such as a processor, a memory, an interface controller, and the like. It is responsible for handling data, controlling the communication between devices and providing a connection interface with external devices. The main board 70 is fixedly coupled to the lower housing 10 and located between the upper housing 50 and the lower housing 10, and such a layout ensures the stability and safety of the main board 70. Meanwhile, the main board 70 is located at one side of the switching power supply 40 away from the front cover board 60, so that the influence of heat and electromagnetic interference generated by the power supply on the main board 70 is avoided, and the normal operation of the main board 70 is ensured. The layout of the motherboard 70 also takes into account the heat dissipation requirements. Since a large number of heating elements are integrated on the motherboard 70, the position design thereof is beneficial to utilizing the heat dissipation channels (such as the fans and the heat dissipation holes 11A) in the device to effectively dissipate heat, and ensuring the stability of the motherboard 70 during high-load operation. The rear cover 80 is fixedly connected between the upper and lower cases 50 and 10, and forms a complete structure of the link communication device together with the main board 70, the front cover 60, and the like. The addition of the back cover plate 80 enhances the stability and closure of the device. The back cover 80 typically reserves the locations of interfaces that are connected to external devices through corresponding circuitry on the motherboard 70. The provision of the back cover 80 helps to protect these interfaces from the external environment, improving the durability of the device. The design of the back cover 80 may also take into account heat dissipation requirements. For example, vents or cooling fins may be provided on the back cover 80 to assist in cooling, ensuring that the temperature inside the device remains within a suitable range. The back cover 80 may be easily removed to access the interior of the device, which facilitates maintenance and upgrades of the device. For example, a user can conveniently replace components such as a memory bank, a hard disk, etc., or clean the inside of dust.
More preferably, a main switch 71, a USB interface 72 and a serial port 73 are fixedly connected to one side of the main board 70 facing away from the lower housing 10, and the main switch 71, the USB interface 72 and the serial port 73 are respectively electrically connected to the main board 70.
The main switch 71 is used as a key component for controlling the power on-off of the whole link communication device, and is fixedly connected to the main board 70, so that the straightness and reliability of power control are ensured. The user can conveniently turn on or off the device by operating the main switch 71, realizing a quick response of the power supply and energy saving management. The motherboard 70 is also fixedly connected with a USB interface 72 and a serial port 73, and these interfaces are respectively electrically connected with the motherboard 70. As one of the most commonly used interfaces in modern electronic devices, USB interface 72 provides high-speed, convenient data transfer and power functionality. The USB interface 72 fixedly connected to the motherboard 70 can support connection of various external devices, such as a storage device, a camera, a keyboard, etc., to expand functions and application range of the apparatus. The serial port 73 fixedly connected to the motherboard 70 can support low-speed and reliable serial communication, and meets the requirements of specific applications.
More preferably, the main switch 71, the USB interface 72, and the serial port 73 are further fixedly connected to the front cover plate 60, and the main switch 71, the USB interface 72, and the serial port 73 are sequentially arranged on the surface of the front cover plate 60 when viewed along the first direction F1.
The design enables the interfaces and the switches to be closer to a user operation area, and operation convenience is improved. At the same time, the front cover plate 60 acts as an external protective structure for the device, providing additional protection for these interfaces and switches from damage due to accidental bumps or scratches. The arrangement mode ensures that the layout of the interfaces and the switches is more reasonable and orderly, not only improves the beautiful degree, but also ensures that a user can quickly find the positions of the required interfaces or switches at a glance during operation. In addition, the arrangement of the devices in sequence is also beneficial to reducing the possibility of misoperation, and the overall usability of the device is improved.
More preferably, the motherboard 70 further includes a heat sink 74. The heat dissipation portion 74 is fixedly connected to the motherboard 70, and is electrically connected to the motherboard 70. The heat dissipation part 74 is provided with a third fan 74A to dissipate heat of the motherboard 70.
The heat dissipation portion 74 is an important component of the motherboard 70, and has a main function of helping the motherboard 70 dissipate heat. As the number of integrated components on the motherboard 70 increases and the performance increases, the amount of heat generated by the motherboard 70 increases. The heat dissipation part 74 can effectively take away the heat on the motherboard 70, prevent the motherboard 70 from overheating, and ensure the stable operation of the motherboard 70. The third fan 74A serves as a core member of the heat sink 74, and generates an air flow by rotating, thereby taking heat from the heat sink 74 and discharging the heat to the outside of the device. Compared with a natural heat dissipation mode, the active heat dissipation mode has higher heat dissipation efficiency, can lower the temperature of the main board 70 faster, and improves the heat dissipation performance of the main board 70. At the same time, the operation of the third fan 74A may also enhance the flow of air within the device, helping to reduce the temperature of the overall device.
More preferably, a network port 75 and a VGA interface 76 are fixedly connected to a side of the main board 70 facing away from the lower housing 10, and the network port 75 and the VGA interface 76 are respectively electrically connected to the main board 70.
The network port 75 and the VGA interface 76 are external interfaces commonly used in electronic devices, and are used for network connection and video output, respectively. The two interfaces are fixedly connected to the main board 70 and ensure that they are electrically connected to the main board 70 so that the link communication device can be conveniently connected to the network environment and the display apparatus. The portal 75 (often referred to as an ethernet interface) allows the link communication device to connect to a local or wide area network in a wired manner, enabling fast, stable transmission of data. This is particularly important for application scenarios where large data transfers are required or where a stable network connection is required. VGA interface 76 is an analog video transmission interface that may be coupled to a display device such as a display or projector for outputting video signals. VGA interface 76 has practical value in certain application scenarios due to its wide compatibility and low cost.
More preferably, the network port 75 and the VGA interface 76 are further fixedly connected to the back cover plate 80, and the network port 75 and the VGA interface 76 are sequentially arranged on the surface of the back cover plate 80 when viewed along a second direction F2 opposite to the first direction F1.
The network port 75 and the VGA interface 76 are not only fixedly connected to the main board 70, but are also further fixedly connected to the back cover board 80. This design makes the portal 75 and VGA interface 76 more robust, reducing the risk of the interface loosening or damage due to external factors (e.g., bumps, pulls, etc.). At the same time, the back cover 80 acts as an external protective structure for the device, providing additional protection to these interfaces, enhancing the durability and reliability of the device. The arrangement mode ensures that the interface layout is more reasonable and orderly, not only improves the beautiful degree, but also ensures that a user can see the position of the required interface at a glance when connecting external equipment. In addition, the arrangement of the devices in sequence is also beneficial to reducing the possibility of misconnection and improving the overall usability of the device.
More preferably, the apparatus further comprises a filter 90 and a power outlet 100.
The filter 90 is fixedly connected to the lower housing 10 and electrically connected to the motherboard 70, and the filter 90 is located at a side of the mesh 75 facing away from the VGA interface 76 when viewed along the second direction F2. The power jack 100 is fixedly connected to the back cover plate 80, is electrically connected to the main board 70, and is located on a side of the filter 90 facing away from the lower housing 10 when viewed along the second direction F2.
The filter 90 is used in the electronic device to filter out noise and interference in the power supply or the signal, so as to ensure the stable operation of the electronic device. In this arrangement, the provision of the filter 90 helps to reduce noise on the power and signal lines and to improve the efficiency and stability of operation of the components on the motherboard 70. At the same time, the filter 90 is fixedly connected to the lower case 10, not only enhancing its stability, but also helping to keep the inside of the device clean and orderly. The power outlet 100 is a critical component of the device to the connection of an external power source, and its placement and robustness is critical to the operation of the device. In the present device, the power outlet 100 is fixedly connected to the rear cover plate 80, so that a user can more conveniently connect or disconnect the power line, and also helps to protect the power line from external factors. In addition, the power jack 100 is arranged on the side of the filter 90 away from the lower housing 10, so that mutual interference between the power line and other elements such as the filter 90 is avoided, and stable transmission of the power line is ensured.
More preferably, the second fan 41 is electrically connected to the main board 70, and the switching power supply 40 is also electrically connected to the main board 70.
The second fan 41, which is an important component of the heat dissipation system, generates an air flow by rotating, and helps to lower the temperature of the motherboard 70 and other heating elements. The second fan 41 is electrically connected with the main board 70, so that the fan can be automatically started when the device is operated, and the rotating speed of the fan can be intelligently regulated according to the temperature monitoring and regulating system of the main board 70, so that the best heat dissipation effect can be achieved. This design not only improves heat dissipation efficiency, but also helps to extend the useful life of motherboard 70 and other components. The switching power supply 40 is responsible for converting the external power supply into a stable direct current required by the device to ensure the normal operation of the motherboard 70 and other components. The switch power supply 40 is electrically connected with the main board 70, so that stable supply of power can be ensured, and meanwhile, the main board 70 is allowed to intelligently regulate and control the power through a power management system, such as switching modes of standby, dormancy, shutdown and the like. The design not only improves the utilization efficiency of the power supply, but also helps to reduce the energy consumption and prolong the service life of the device. The second fan 41 and the switching power supply 40 are electrically connected to the main board 70 to form an efficient and stable power supply and heat dissipation system of the link communication device. The design not only improves the heat dissipation efficiency and the power utilization efficiency of the device, but also helps to prolong the service life of the main board 70 and other elements, and improves the reliability and durability of the device.
Therefore, the heat in the device is sequentially discharged through the first fan 30, the second fan 41 and the heat radiating holes 11A, so that the device can effectively radiate heat, and the switch power supply 40 is also provided with the second fan 41, so that the heat in the switch power supply 40 is effectively discharged, and the electronic elements in the device are protected.
The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520819224.9U CN224192003U (en) | 2025-04-27 | 2025-04-27 | A link communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520819224.9U CN224192003U (en) | 2025-04-27 | 2025-04-27 | A link communication device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN224192003U true CN224192003U (en) | 2026-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520819224.9U Active CN224192003U (en) | 2025-04-27 | 2025-04-27 | A link communication device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN224192003U (en) |
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2025
- 2025-04-27 CN CN202520819224.9U patent/CN224192003U/en active Active
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