CN224157589U - Cold press molding die for inductance substrate - Google Patents

Abstract

The utility model provides an inductance substrate cold press molding die which comprises a base, wherein two support columns are arranged at the upper end of the base, a top plate is arranged at the top of each support column, an electric hydraulic cylinder is arranged at the upper end of each top plate, a telescopic rod is arranged at the output end of each electric hydraulic cylinder, a connecting plate is arranged at the tail end of each telescopic rod, an upper die is arranged on each connecting plate, a plurality of stamping heads are arranged at the lower end of each upper die, an adaptive lower die is arranged on the base, a die holder is arranged on each lower die, a plurality of die cavities matched with the stamping heads are arranged on each die holder, a cavity is formed in each upper die, and cooling liquid is filled in each cavity. Through set up the cavity that is full of the coolant liquid in last mould to utilize feed liquor pipe and drain pipe to link to each other with external cooling case, can take away the heat that the mould produced in the course of the work in time effectively, avoid leading to inductance substrate material deformation because of the high temperature, thereby improved inductance substrate's shaping quality and product percent of pass.

Description

Cold press molding die for inductance substrate

Technical Field

The utility model relates to the technical field of dies, in particular to a cold press molding die for an inductance substrate.

Background

In the field of electronic component manufacturing, an inductance substrate is taken as an important component, the molding quality of the inductance substrate directly influences the performance and reliability of an electronic component, and at present, the inductance substrate is molded by cold press molding by adopting a traditional mold;

On the one hand, in the cold press molding process, a large amount of heat is generated between the die and the inductance substrate material due to friction, if the heat cannot be timely dissipated, the temperature of the material is increased, the dimensional accuracy and the surface quality of the inductance substrate are affected, even the material is possibly deformed, and the product qualification rate is reduced;

therefore, a cold press molding die for an inductance substrate is provided to solve the problems.

Disclosure of utility model

In order to overcome the defects of the prior art and solve the problems of poor heat radiation performance and lack of buffer protection in the prior art, the utility model provides a cold press molding die for an inductance substrate.

The utility model is realized by adopting the following technical scheme:

The utility model provides an inductance substrate cold press forming die, includes the base, the base upper end is equipped with two support columns, the support column symmetry is fixed in the both sides of base, the top of support column is equipped with the roof, the roof upper end is equipped with electronic pneumatic cylinder, electronic pneumatic cylinder's output is equipped with the telescopic link, the telescopic link runs through the roof, the end of telescopic link is equipped with the connecting plate, be equipped with the cope match-die on the connecting plate, the cope match-die lower extreme is equipped with a plurality of punching heads, be equipped with the bed die of looks adaptation on the base, be equipped with the die holder on the bed die, be equipped with a plurality of die cavities with punching head looks adaptation on the die holder;

The upper die is internally provided with a cavity, the cavity is filled with cooling liquid, the upper surface of the upper die is provided with two symmetrical through holes, the through holes are communicated with the cavity, two liquid inlet pipes and liquid outlet pipes are respectively arranged in the through holes, and the liquid inlet pipes and the liquid outlet pipes are connected with an external cooling box.

Guide cylinders are arranged on two sides of the connecting plate, guide rods which are matched are arranged on the lower die, the guide rods are fixed on the lower die, and when the upper die and the lower die are assembled, the guide cylinders are inserted into the guide rods.

The guide rod is sleeved with a buffer spring, the bottom of the buffer spring is fixed on the lower die, and the top of the buffer spring is fixedly provided with a slip ring.

The top of guide bar is equipped with the limiting plate, the sliding ring sets up the below at the limiting plate.

The upper surface of the lower die is provided with an installation groove, and the die holder is clamped in the installation groove;

the upper die is fixedly connected with the connecting plate through bolts.

Compared with the prior art, the utility model has the following beneficial effects:

1. The cavity filled with the cooling liquid is formed in the upper die, and the liquid inlet pipe and the liquid outlet pipe are connected with the external cooling box, so that the circulating flow of the cooling liquid is realized, the heat generated in the working process of the upper die can be timely and effectively taken away, the temperature of the die is reduced, the deformation of the inductance substrate material caused by overhigh temperature is avoided, and the forming quality and the product qualification rate of the inductance substrate are improved;

2. The guide cylinders are arranged on two sides of the connecting plate, the guide rods matched with the guide cylinders are arranged on the lower die, the guide rods are inserted into the guide cylinders during die assembly, accurate alignment of the upper die and the lower die in the die assembly process is ensured, the problems of size deviation and surface quality of the inductance substrate caused by die assembly deviation are avoided, the forming precision of products is improved, the buffer springs and the slip ring structure sleeved on the guide rods play a role in buffering when the upper die is assembled, die assembly impact force is reduced, the risk of damage of the die due to impact is reduced, the service life of the die is prolonged, and the production cost is reduced.

Drawings

FIG. 1 is a schematic view of a three-dimensional structure of the present utility model;

FIG. 2 is an exploded schematic view of a three-dimensional structure of the present utility model;

FIG. 3 is a front view of the present utility model;

FIG. 4 is an enlarged schematic view of the structure of FIG. 2A in accordance with the present utility model;

The hydraulic cylinder comprises a hydraulic cylinder body 1, an electric hydraulic cylinder 11, a telescopic rod 2, a top plate 3, a connecting plate 31, bolts 32, a liquid inlet pipe 33, a liquid outlet pipe 34, a guide cylinder 4, an upper die, a lower die 5, a mounting groove 51, a die holder 6, a die holder 61, a die cavity 7, a base 71, a support column 8, a buffer spring 81, a slip ring 82, a guide rod 83 and a limiting plate.

Detailed Description

The present utility model will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.

The utility model is further described below with reference to the accompanying drawings,

As shown in fig. 1 to 4, a cold press molding die for an inductance substrate comprises a base 7, two support columns 71 are arranged at the upper end of the base 7, the support columns 71 are symmetrically fixed at two sides of the base 7 and play a role of stable support, a top plate 2 is arranged at the top of the support columns 71, an electric hydraulic cylinder 1 is arranged at the upper end of the top plate 2, a telescopic rod 11 is arranged at the output end of the electric hydraulic cylinder 1, the telescopic rod 11 penetrates through the top plate 2, the telescopic rod 11 is driven by the electric hydraulic cylinder 1 to move up and down, a connecting plate 3 is arranged at the tail end of the telescopic rod 11, an upper die 4 is arranged on the connecting plate 3, a plurality of stamping heads are arranged at the lower end of the upper die 4 and are used for stamping and molding an inductance substrate material, a lower die 5 matched with the stamping heads is arranged on the base 7, a die holder 6 is arranged on the lower die 5, and a plurality of die cavities 61 matched with the stamping heads are arranged on the die holder 6.

The inside cavity that is equipped with of last mould 4, and be full of the coolant liquid in the cavity, the upper surface of last mould 4 is equipped with two symmetrical through-holes, the through-hole is linked together with the cavity is interior, two be equipped with feed liquor pipe 32 and drain pipe 33 in the through-hole respectively, feed liquor pipe 32 and drain pipe 33 link to each other with the external cooling case, in the course of the operation, the external cooling case passes through feed liquor pipe 32 and carries the coolant liquid to the interior of last mould 4 cavity, and the coolant liquid absorbs the heat that goes up mould 4 at the during operation back, and rethread drain pipe 33 flows back to the external cooling case and cools off, so the circulation realizes the effective cooling to last mould 4, guarantees that the mould works under suitable temperature, improves inductance substrate's shaping quality.

The guide barrels 34 are arranged on two sides of the connecting plate 3, the guide rods 82 which are matched are arranged on the lower die 5, the guide rods 82 are fixed on the lower die 5, when the upper die 4 and the lower die 5 are assembled, the guide barrels 34 are inserted into the guide rods 82, the matching of the guide barrels 34 and the guide rods 82 plays a role in precise guiding, the upper die 5 and the lower die 5 are prevented from being deviated in the assembly process, the assembly accuracy is improved, and the molding quality of the inductance substrate is further guaranteed.

The guide rod 82 is sleeved with a buffer spring 8, the bottom of the buffer spring 8 is fixed on the lower die 5, and the top of the buffer spring 8 is fixedly provided with a slip ring 81.

The top of guide bar 82 is equipped with limiting plate 83, the sliding ring 81 sets up in the below of limiting plate 83, and at last mould 4 downward movement compound die, guide cylinder 34 earlier with sliding ring 81 contact, along with last mould 4 continued downward movement, guide cylinder 34 compression buffer spring 8, buffer spring 8 plays the cushioning effect, reduces the impact force when the compound die, avoids the mould to damage because of the impact, prolongs mould life, simultaneously, limiting plate 83 can prevent sliding ring 81 from sliding out on guide bar 82, guarantees the normal work of guide buffer structure.

The upper surface of the lower die 5 is provided with a mounting groove 51, the die holder 6 is clamped in the mounting groove 51, the design is convenient for mounting and replacing the die holder 6, and the corresponding die holder 6 can be quickly replaced according to the molding requirements of inductance substrates with different specifications.

The upper die 4 is fixedly connected with the connecting plate 3 through bolts 31, and the detachable connection mode is convenient for the installation, the disassembly and the maintenance of the upper die 4.

When the inductor base plate material to be molded is used, the inductor base plate material to be molded is placed in a die cavity 61 of the lower die 5, the electric hydraulic cylinder 1 is started, the electric hydraulic cylinder 1 drives the telescopic rod 11 to move downwards, and the connecting plate 3 and the upper die 4 are driven to move downwards together;

In the die assembly process, the guide barrels 34 on the two sides of the connecting plate 3 are gradually inserted into the guide rods 82 on the lower die 5, so that an accurate guide effect is achieved, the upper die 5 and the lower die 5 are ensured to be accurately aligned, when the guide barrels 34 are contacted with the slip ring 81, the guide barrels 34 compress the buffer springs 8 along with the continuous downward movement of the upper die 4, the buffer springs 8 play a role in buffering, and the die assembly impact force is reduced;

When the punch of the upper die 4 completely enters the cavity 61 of the lower die 5, the inductance substrate material is press-molded. In the stamping process, the upper die 4 generates heat due to friction with materials, the external cooling box conveys cooling liquid into the cavity of the upper die 4 through the liquid inlet pipe 32, and the cooling liquid flows back to the external cooling box for cooling through the liquid outlet pipe 33 after absorbing the heat, so that the temperature of the upper die 4 is kept stable;

After the forming is finished, the electric hydraulic cylinder 1 drives the telescopic rod 11 to move upwards to drive the upper die 4 to ascend, and the formed inductance substrate is taken out to complete a working cycle;

When the inductance substrates with different specifications are required to be produced, the bolts 31 between the upper die 4 and the connecting plate 3 are loosened, the original upper die 4 is taken down, the corresponding upper die 4 is replaced, meanwhile, the original die holder 6 is taken out from the mounting groove 51 of the lower die 5, the new die holder 6 matched with the original die holder 6 is replaced, and the replacement of the dies can be completed rapidly, so that different production requirements are met.

The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.

Claims (5)

1. The utility model provides an inductance substrate cold press forming die, includes base (7), base (7) upper end is equipped with two support columns (71), support column (71) symmetry is fixed in the both sides of base (7), the top of support column (71) is equipped with roof (2), roof (2) upper end is equipped with electronic pneumatic cylinder (1), the output of electronic pneumatic cylinder (1) is equipped with telescopic link (11), telescopic link (11) run through roof (2), a serial communication port, the end of telescopic link (11) is equipped with connecting plate (3), be equipped with mould (4) on connecting plate (3), mould (4) lower extreme is equipped with a plurality of punching press heads, be equipped with bed die (5) of looks adaptation on base (7), be equipped with die holder (6) on bed die (5), be equipped with a plurality of die cavities (61) with punching press head looks adaptation on die holder (6).

The inside cavity that is equipped with of last mould (4), and be full of the coolant liquid in the cavity, the upper surface of going up mould (4) is equipped with two symmetrical through-holes, the through-hole is linked together with the cavity is interior, two be equipped with feed liquor pipe (32) and drain pipe (33) in the through-hole respectively, feed liquor pipe (32) and drain pipe (33) link to each other with the external cooling case.

2. The cold press molding die for the inductance substrate according to claim 1, wherein guide cylinders (34) are arranged on two sides of the connecting plate (3), guide rods (82) which are matched with each other are arranged on the lower die (5), the guide rods (82) are fixed on the lower die (5), and when the upper die (4) and the lower die (5) are clamped, the guide cylinders (34) are inserted into the guide rods (82).

3. The cold press molding die for the inductance substrate according to claim 2, wherein the guide rod (82) is sleeved with a buffer spring (8), the bottom of the buffer spring (8) is fixed on the lower die (5), and a slip ring (81) is fixedly arranged at the top of the buffer spring (8).

4. The cold press molding die for the inductance substrate according to claim 3, wherein a limiting plate (83) is arranged on the top of the guide rod (82), and the slip ring (81) is arranged below the limiting plate (83).

5. The cold press molding die for the inductance substrate according to claim 1, wherein the upper surface of the lower die (5) is provided with a mounting groove (51), and the die holder (6) is clamped in the mounting groove (51);

The upper die (4) is fixedly connected with the connecting plate (3) through bolts (31).