CN224139308U

CN224139308U - Electrical connection components and electronic devices

Info

Publication number: CN224139308U
Application number: CN202520324675.5U
Authority: CN
Inventors: 黄杰; 刘俊岩; 周耀; 唐巍; 张世君; 廖军鹏; 杨威; 黄飞
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2025-02-25
Filing date: 2025-02-25
Publication date: 2026-04-17
Anticipated expiration: 2035-02-25

Abstract

The application provides an electric connection assembly and electronic equipment, wherein the electronic equipment comprises an electric conduction heat conduction medium, a heat dissipation module and a functional module, the electric conduction heat conduction medium is respectively contacted with the heat dissipation module and the functional module to conduct heat generated by the functional module to the heat dissipation module, a first insulating heat conduction piece is further arranged between the heat dissipation module and the functional module, and the first insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium to enable the heat dissipation module and the functional module to be in insulating connection. The first insulating heat conducting piece can enable the heat radiating module to be in insulating connection with the functional module, and the heat radiating module and the functional module cannot be electrically conducted due to the conductive heat conducting medium, so that the problem of electromagnetic compatibility (such as radiation stray) can be reduced. In addition, the first insulating heat conducting piece is of an independent structure, and the position of the first insulating heat conducting piece can be flexibly set according to the design requirements of the functional module and the heat dissipation module, so that the electronic equipment can be conveniently installed.

Description

Electrical connection assembly and electronic device

Technical Field

The present application relates to the field of heat dissipation technologies of devices, and in particular, to an electrical connection assembly and an electronic device.

Background

Electronic equipment is widely applied to various fields of life and work, and along with the improvement of the internal integration level and the increase of the power of a functional module, the heat dissipation of the electronic equipment becomes a key factor for restricting the improvement of the performance of the electronic equipment.

To increase the efficiency of heat transfer, liquid gold silicone grease may be used to establish a physical connection between the functional module of the electronic device and the heat dissipation module. However, the liquid Jin Guizhi metal-containing material is electrically conductive. When the electronic equipment operates, the functional module and the heat radiation module are easily electrically conducted through liquid metal silicone grease, so that the problem of electromagnetic compatibility is caused, wherein radiation stray is particularly prominent, and the performance reliability of the electronic equipment is easily reduced.

Disclosure of utility model

The embodiment of the application provides an electric connection assembly and electronic equipment, which can realize the insulation connection between a functional module and a heat dissipation module while guaranteeing the heat dissipation performance and have higher reliability.

In a first aspect, an electronic device includes an electrically conductive and thermally conductive medium, a heat dissipation module, and a functional module, where the electrically conductive and thermally conductive medium is disposed between the heat dissipation module and the functional module to conduct heat generated by the functional module to the heat dissipation module;

The heat dissipation module is characterized in that a first insulating heat conduction piece is further arranged between the heat dissipation module and the functional module, and the first insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium facing the heat dissipation module, or drives the first insulating heat conduction piece to be arranged on one side of the electric conduction heat conduction medium facing the functional module, so that the heat dissipation module is in insulating connection with the functional module.

It should be noted that, the functional module in the electronic device is a hardware unit that is composed of a plurality of electronic elements, has a specific function, and can relatively independently implement the function, and these functional modules are important components of the electronic device, and cooperate with each other to make the electronic device complete various complex tasks. By way of example, the functional module may be a display screen, camera, central processing unit, memory, microcontroller, flash memory, wireless communication module, wired communication module, battery management module, gravity sensor, etc. In some embodiments, each functional module is designed to perform a particular function or class of functions. In some embodiments, for some complex functions of the electronic device, a plurality of functional modules are needed to cooperate together to realize, for example, a smart phone is needed to access the internet, a communication module is needed to establish network connection, a central processing unit performs data processing and protocol analysis, a display screen presents webpage content, a memory caches related data and the like, and the plurality of functional modules respectively play roles to jointly complete the complex function of surfing the internet.

It should be noted that, the functional module generally generates heat when it is powered on. When current passes through the electronic element in the functional module, the current can work and convert into heat energy due to the resistor of the electronic element, even if the current passes through a lead with smaller resistance, certain heat can be generated, and the generated heat can be accumulated continuously along with the increase of the current and the extension of time. In addition, a semiconductor element may be disposed in the functional module, and during operations such as data processing, signal transmission, and logic operation, complex processes such as electron transfer and charge transfer may occur in the semiconductor element, and during these processes, electrons collide with a crystal lattice, so that part of electrical energy is converted into thermal energy. And the higher the operating frequency of the semiconductor element, the greater the amount of data processed, the more heat is generated. For example, when a cpu performs a high-intensity computing task, the internal transistors thereof are turned on and off rapidly, and a large amount of electrons flow therein, which generates more heat, resulting in an increase in the temperature of the cpu. In general, certain heat is generated during the power-on operation of the functional module.

It should be noted that the electrically and thermally conductive medium is a substance capable of efficiently transferring heat, and generally has a certain electrical conductivity, and in some embodiments, the material of the electrically and thermally conductive medium may be metal, carbon, or the like, and in other embodiments, the electrically and thermally conductive medium may be a mixture of metal and polymer, or a mixture of carbon material and polymer.

It should be noted that, the electrically conductive heat conduction medium is disposed between the heat dissipation module and the functional module, when the first insulating heat conduction member is disposed between the electrically conductive heat conduction medium and the heat dissipation module, the electrically conductive heat conduction medium is in indirect contact with the heat dissipation module, and when the first insulating heat conduction member is disposed between the electrically conductive heat conduction medium and the functional module, the electrically conductive heat conduction medium is in indirect contact with the functional module. The heat generated by the functional module can be transferred to the heat dissipation module through the electric conduction and heat conduction medium, so that the heat dissipation of the functional module is realized.

It should be noted that, common forms of the heat dissipation module include an air cooling heat dissipation module, a water cooling heat dissipation module, a heat pipe heat dissipation module, a temperature equalization plate heat dissipation module, a liquid cooling plate heat dissipation module, a natural heat dissipation module, and the like. The air-cooled heat dissipation module is generally composed of a heat dissipation fan, heat dissipation fins, a heat dissipation base and the like, and generates air flow through rotation of the heat dissipation fan, so that air flows through the heat dissipation fins to take away heat. The water cooling module generally comprises a water cooling head, a water pump, a water tank, a water cooling row, a cooling fan and the like, wherein the water cooling head is in contact with a heating component, heat is transferred to circulating water cooling liquid, the water cooling liquid flows through the water cooling row under the driving of the water pump, the cooling fan dissipates heat of the water cooling row, and the water cooling liquid returns to the water cooling head after being cooled, so that the circulating water cooling liquid circulates. The heat pipe radiating module consists of a heat pipe, radiating fins, a radiating base and the like, working medium in the heat pipe evaporates into a gaseous state after the heat is absorbed by the evaporating section, the gaseous working medium flows to the condensing section under the action of pressure difference in the heat pipe, the gaseous working medium is condensed into a liquid state again after the heat is released by the condensing section, the liquid working medium flows back to the evaporating section through structures such as a liquid absorption core and the like, so that efficient heat transfer is realized in a circulating way, and finally the heat is radiated into the air by the radiating fins. The heat dissipation module of the temperature equalization plate mainly comprises a temperature equalization plate, and in some embodiments, the temperature equalization plate may be used together with a cooling fan or cooling fins, and a vacuum cavity is arranged inside the temperature equalization plate, and special heat conducting medium and capillary structures are arranged in the cavity. When one side of the temperature equalization plate is heated, the heat conducting medium evaporates to form steam, the steam is rapidly diffused to a region with lower temperature in the vacuum cavity and is condensed into liquid, the liquid flows back to the heated region through the capillary structure, and evaporation and heat dissipation are continued, so that rapid and uniform heat dissipation is realized. The liquid cooling plate heat radiation module comprises a liquid cooling plate, a cooling liquid circulation system and the like, wherein the cooling liquid flows in the liquid cooling plate to absorb heat, and then the heat is brought to an external heat radiation device through the circulation system to radiate. The natural heat radiation module mainly depends on the structures of a shell or a radiating fin of the equipment, and the like, and utilizes heat conduction to transfer heat in the equipment to the shell or the radiating fin, and then radiates the heat to the surrounding environment in a natural convection and heat radiation mode. The heat dissipation module of corresponding form can be selected according to the type of the functional module to ensure the heat dissipation effect to the functional module, so that the functional module can operate at a more proper temperature.

It should be noted that, the first insulating and heat conducting member is a material for realizing dual functions of insulation and heat conduction, and generally uses a high molecular polymer as a matrix, such as silicone rubber, polyimide, and the like, and these materials have good insulating properties, flexibility and chemical stability, and can provide basic physical and chemical properties for the insulating and heat conducting member, so as to ensure that the performance is kept stable under different environmental conditions. In addition, in order to provide the material with good heat conduction performance, some heat conduction materials can be arranged on the base material so as to improve the whole heat conduction capability of the first insulating heat conduction member. In some embodiments, the first insulating and thermally conductive member may be in the form of a sheet.

It should be noted that the first insulating heat conducting member is disposed on one side of the conductive heat conducting medium, and the first insulating heat conducting member is used for insulating and connecting the heat dissipating module and the functional module. In some embodiments, the first insulating and heat conducting member may be disposed between the electrically and thermally conductive medium and the functional module. In other embodiments, the first insulating and heat conducting member may be disposed between the electrically and thermally conductive medium and the heat dissipating module.

It should be noted that, one side of the first insulating heat conducting member may be provided with an adhesive layer, when the first insulating heat conducting member is disposed between the conductive heat conducting medium and the functional module, the adhesive layer of the first insulating heat conducting member may be adhered to the functional module, and when the first insulating heat conducting member is disposed between the conductive heat conducting medium and the heat dissipating module, the adhesive layer of the first insulating heat conducting member may be adhered to the heat dissipating module, so as to reduce the offset of the position of the first insulating heat conducting member.

The electronic equipment provided by the embodiment of the application has the advantages that the electric conduction and heat conduction medium is arranged between the functional module and the heat dissipation module, so that heat generated by the functional module can be timely transferred to the heat dissipation module, the accumulation of heat in the functional module is reduced, the overall performance of the electronic equipment is ensured, the first insulating and heat conduction piece is arranged between the functional module and the heat dissipation module, the first insulating and heat conduction piece can realize insulating connection between the heat dissipation module and the functional module, the heat dissipation module and the functional module cannot be electrically conducted due to the electric conduction and heat conduction medium, the electromagnetic compatibility (such as radiation stray) problem can be reduced, and the overall performance and reliability of the electronic equipment can be improved. In addition, the first insulating heat conduction piece is independent structure, can set up the position of first insulating heat conduction piece in a flexible way according to the design demand of function module and heat dissipation module, and first insulating heat conduction piece can set up between electrically conductive heat conduction medium and function module, perhaps set up between electrically conductive heat conduction medium and heat dissipation module to realize electronic equipment's easy to assemble.

In one possible implementation manner, the first insulating and heat conducting member includes a first insulating layer and a first heat conducting layer laminated on one side of the first insulating layer;

The first insulating layer is arranged between the first heat conducting layer and the electric conduction heat conducting medium, or the first heat conducting layer is arranged between the first insulating layer and the electric conduction heat conducting medium.

It should be noted that the first insulating layer is made of an insulating material, and the first heat conductive layer may be made of an insulating material, in which case the first heat conductive layer does not have an electric conductive capability, and in addition, the first heat conductive layer may be made of an electric conductive material, in which case the first heat conductive layer has an electric conductive capability.

The first insulating layer and the first heat conduction layer which are arranged in a laminated mode are used for forming the first insulating heat conduction piece, the first insulating layer can play an insulating role to realize insulating connection between the functional module and the heat dissipation module, and the first heat conduction layer can improve the heat conduction capacity of the first insulating heat conduction piece so as to ensure that heat generated by the functional module can be quickly transferred to the heat dissipation module. In addition, the layered first insulating layer has a larger area, so that insulation between the functional module and the heat dissipation module is guaranteed, the possibility of electric conduction between the functional module and the heat dissipation module is reduced, and the performance of the electronic equipment is guaranteed.

In some embodiments, when the first insulating heat conducting member is disposed between the functional module and the conductive heat conducting medium, the first heat conducting layer may be disposed between the first insulating layer and the conductive heat conducting medium, that is, the first insulating layer may be connected with the functional module, and the first insulating layer may insulate and connect the functional module with the first heat conducting layer, so that the first insulating layer may block the current flowing from the functional module to the first heat conducting layer, that is, reduce the interference current flowing from the functional module, and help to improve stability and reliability of the electronic device.

In one possible implementation, the first heat conducting layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that, in some embodiments, the first heat conducting layer may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the first heat conducting layer may be a multi-layer structure, which may include two graphite layers, two metal layers, or include a graphite layer and a boron nitride layer, or include a boron nitride layer and a metal layer, or include a graphite layer, a boron nitride layer, and a metal layer, and the number of layers of the first heat conducting layer may be two, three, four, five, or even more. In some embodiments, when the first heat conductive layers are provided with multiple layers, the first insulating layer may or may not be sandwiched between the two first heat conductive layers.

The graphite layer, the boron nitride layer and the metal layer are strong in heat conduction capacity, and the first heat conduction layer formed by at least one of the graphite layer, the boron nitride layer and the metal layer is high in heat conduction capacity, so that the whole heat conduction capacity of the first insulating heat conduction piece can be improved, and heat generated by the functional module can be quickly transferred to the heat dissipation module.

In one possible implementation, the first insulating layer includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the first insulating layer may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the first insulating layer may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of first insulating layers may be two, three, four, five or more. In some embodiments, when the first insulating layers are provided with multiple layers, the first heat conducting layer may or may not be sandwiched between two first insulating layers.

The polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer, and the polyvinyl chloride layer have relatively low density and light weight, and thus, do not additionally or excessively increase the weight of the electronic device, and, in addition, the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer have good flexibility, so that the first insulating heat conducting piece can bear external force effects such as bending and stretching to a certain extent, and the electronic equipment is assembled.

In some embodiments, the overall thickness of the first insulating and heat conducting member 22 is 0.1mm to 0.15mm, and exemplary values of the overall thickness of the first insulating and heat conducting member may be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm.

The integral thickness of the first insulating heat conducting piece is set to be not less than 0.1mm, so that the first insulating heat conducting piece can have certain strength, the risk of fracture of the first insulating heat conducting piece is reduced, the integral thickness of the first insulating heat conducting piece is set to be not more than 0.15mm, the occupied space of the first insulating heat conducting piece in the electronic equipment can be reduced, the influence of the first insulating heat conducting piece on the integral size of the electronic equipment can be reduced, and the electronic equipment is light, thin and miniaturized design is facilitated.

In one possible implementation manner, the first insulating heat conducting member is disposed on a side of the electrically conductive heat conducting medium facing the functional module, and the second insulating heat conducting member is disposed on a side of the electrically conductive heat conducting medium facing the heat dissipating module, so that the electrically conductive heat conducting medium and the heat dissipating module are in insulating connection.

It should be noted that the second insulating and heat conducting member is a material for realizing dual functions of insulation and heat conduction, and generally uses a high molecular polymer as a matrix, such as silicone rubber, polyimide, and the like, and these materials have good insulating properties, flexibility and chemical stability, and can provide basic physical and chemical properties for the insulating and heat conducting member, so as to ensure that the performance is kept stable under different environmental conditions. In addition, in order to provide the material with good heat conduction performance, some heat conduction materials can be arranged on the base material so as to improve the whole heat conduction capability of the first insulating heat conduction member. In addition, the second insulating and heat conducting member may have the same structure and material as the first insulating and heat conducting member, or may be different from the first insulating and heat conducting member. In some embodiments, the second insulating and thermally conductive member may be in the form of a sheet.

The first insulating heat conducting piece is arranged on one side of the electric conduction heat conducting medium facing the functional module, the second insulating heat conducting piece is arranged on one side of the electric conduction heat conducting medium facing the heat dissipation module, and the first insulating heat conducting piece and the second insulating heat conducting piece can insulate the electric conduction heat conducting medium from the functional module and the heat dissipation module respectively, so that insulating connection between the functional module and the heat dissipation module can be further guaranteed, the possibility that current in the functional module flows into the heat dissipation module is reduced, and the reliability of the electronic equipment is guaranteed. In addition, when one of the first insulating heat conducting piece and the second insulating heat conducting piece is damaged, the other insulating heat conducting piece can still play an insulating role, so that insulating connection between the functional module and the heat dissipation module is ensured, and the reliability of the electronic equipment is further improved.

In one possible implementation manner, the second insulating and heat conducting member includes a second insulating layer and a second heat conducting layer disposed on one side of the second insulating layer;

The second insulating layer is arranged between the second heat conducting layer and the electric conduction heat conducting medium, or the second heat conducting layer is arranged between the second insulating layer and the electric conduction heat conducting medium.

It should be noted that the second insulating layer is made of an insulating material, and the second heat conductive layer may be made of an insulating material, in which case the second heat conductive layer does not have an electric conductive capability, and in addition, the second heat conductive layer may be made of an electric conductive material, in which case the second heat conductive layer has an electric conductive capability.

The second insulating layer and the second heat conduction layer which are arranged in a laminated mode are used for forming a second insulating heat conduction piece, the second insulating layer can play an insulating role to realize insulating connection between the functional module and the heat dissipation module, and the second heat conduction layer can improve the heat conduction capacity of the second insulating heat conduction piece so as to ensure that heat generated by the functional module can be quickly transferred to the heat dissipation module. In addition, the layered second insulating layer has a larger area, so that insulation between the electric conduction and heat conduction medium and the heat dissipation module is guaranteed, the possibility of electric conduction between the functional module and the heat dissipation module is reduced, and the performance of the electronic equipment is guaranteed.

In some embodiments, the second heat conducting layer may be disposed on a side of the second insulating layer away from the conductive heat conducting medium, that is, the second insulating layer is connected with the conductive heat conducting medium, and the second heat conducting layer is connected with the heat dissipation module.

In one possible implementation, the second heat conducting layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that in some embodiments, the second heat conducting layer may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the second heat conducting layer may be a multi-layer structure, which may include two graphite layers, two metal layers, or include a graphite layer and a boron nitride layer, or include a boron nitride layer and a metal layer, or include a graphite layer, a boron nitride layer, and a metal layer, and the number of layers of the second heat conducting layer may be two, three, four, five, or even more. In some embodiments, when the second heat conductive layers are provided with multiple layers, the second insulating layer may or may not be sandwiched between the two second heat conductive layers.

The graphite layer, the boron nitride layer and the metal layer are strong in heat conduction capacity, and the second heat conduction layer formed by at least one of the graphite layer, the boron nitride layer and the metal layer has high heat conduction capacity, so that the whole heat conduction capacity of the second insulating heat conduction piece can be improved, and heat generated by the functional module can be quickly transferred to the heat dissipation module.

In one possible implementation, the second insulating layer includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the second insulating layer may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the second insulating layer may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of layers of the second insulating layer may be two, three, four, five or more. In some embodiments, when the second insulating layers are provided with multiple layers, the second heat conducting layer may or may not be sandwiched between two second insulating layers.

The polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer, and the polyvinyl chloride layer have relatively low density and light weight, and thus, do not additionally or excessively increase the weight of the electronic device, and, in addition, the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer have good flexibility, so that the second insulating heat conducting piece can bear external force effects such as bending and stretching to a certain extent, and the electronic equipment is assembled.

In some embodiments, the overall thickness of the second insulating and heat conducting member is 0.1mm to 0.15mm, and exemplary, the overall thickness of the second insulating and heat conducting member may be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

The integral thickness of the second insulating heat conducting piece is set to be not less than 0.1mm, so that the second insulating heat conducting piece can have certain strength, the risk of breakage of the second insulating heat conducting piece is reduced, the integral thickness of the second insulating heat conducting piece is set to be not more than 0.15mm, the space occupied by the second insulating heat conducting piece in the electronic equipment can be reduced, the influence of the second insulating heat conducting piece on the integral size of the electronic equipment can be reduced, and the electronic equipment is light, thin and miniaturized design is facilitated.

It should be noted that, in some embodiments, the sizes, structures and materials of the first insulating heat conductive member and the second insulating heat conductive member may be the same, and in other embodiments, the sizes, structures and materials of the first insulating heat conductive member and the second insulating heat conductive member may be different.

The mounting manners of the first insulating heat conducting member and the second insulating heat conducting member may be diversified, and in some embodiments, the first heat conducting layer of the first insulating heat conducting member and the second heat conducting layer of the second insulating heat conducting member may be bonded with the conductive heat conducting medium, at this time, the first insulating layer of the first insulating heat conducting member is bonded with the functional module, and the second insulating layer of the second insulating heat conducting member is bonded with the heat dissipating module. In some embodiments, the first heat conductive layer and the first insulating layer of the first insulating heat conductive member may be respectively bonded to the conductive heat conductive medium and the functional module, and the second heat conductive layer and the second insulating layer of the second insulating heat conductive member may be respectively bonded to the heat dissipation module and the conductive heat conductive medium. In some embodiments, the first heat conductive layer and the first insulating layer of the first insulating heat conductive member may be respectively bonded to the functional module and the conductive heat conductive medium, and the second heat conductive layer and the second insulating layer of the second insulating heat conductive member may be respectively bonded to the heat dissipation module and the conductive heat conductive medium. In still other embodiments, the first heat conductive layer and the first insulating layer of the first insulating heat conductive member may be respectively bonded to the functional module and the conductive heat conductive medium, and the second heat conductive layer and the second insulating layer of the second insulating heat conductive member may be respectively bonded to the conductive heat conductive medium and the heat dissipation module. In some other embodiments, the first and second insulating and heat conducting members may be mounted in other forms within the electronic device.

In one possible implementation, the electrically and thermally conductive medium comprises a colloid having at least one of liquid metal, metal particles, and carbon particles disposed therein, or,

The electric and heat conducting medium is liquid metal.

The colloid may be inorganic colloid, organic colloid, composite colloid, or the like.

Liquid metal is generally a metal or alloy having a melting point lower than normal temperature (25 ℃) or kept in a liquid state in a certain temperature range. Common liquid metals are mercury, gallium-based alloys (e.g., gallium indium alloy, gallium indium tin alloy, etc.), sodium potassium alloys, etc.

The metal particles are fine particles of a metal material having conductive properties, and may be, for example, silver particles, gold particles, copper particles, nickel particles, or the like.

The carbon particles are a fine particulate matter composed of carbon elements, and the main types of carbon particles include carbon black particles, activated carbon particles, carbon nanotubes, graphene, and the like. The carbon particles have various forms, and are generally spherical, flaky, fibrous, and the like. For example, carbon black particles are generally spherical and are formed by aggregating a plurality of nano-scale carbon crystallites, graphene can be regarded as a special flaky carbon particle consisting of a single layer of carbon atoms, and carbon nanotubes are fibrous and have a high aspect ratio.

The glue body of the conductive and heat-conductive medium may be provided with only one of liquid metal, metal particles, and carbon particles, or may be provided with any two of liquid metal, metal particles, and carbon particles, or may be provided with liquid metal, metal particles, and carbon particles at the same time.

The colloid has certain bonding capability, so that the colloid can be contacted with the functional module and the heat dissipation module to form a stable heat conduction channel, the generated heat of the functional module can be ensured to be continuously transferred to the heat dissipation module, and at least one of liquid metal, metal particles and carbon particles is arranged in the colloid of the electric conduction heat conduction medium, so that the overall heat conduction performance of the electric conduction heat conduction medium can be improved, and the heat generated by the functional module can be quickly transferred to the heat dissipation module, thereby realizing the quick heat dissipation of the functional module.

When the conductive heat-conducting medium comprises a colloid, the conductive heat-conducting medium can be attached to the heat-radiating module and the functional module, when the conductive heat-conducting medium is provided with a second insulating heat-conducting piece towards one side of the heat-radiating module, the conductive heat-conducting medium can be attached to the second insulating heat-conducting piece, and when the conductive heat-conducting medium is provided with a first insulating heat-conducting piece towards one side of the heat-radiating module, the conductive heat-conducting medium can be attached to the first insulating heat-conducting piece. It can be understood that the fluidity of the colloid is weaker, that is, the flow resistance of the conductive and heat-conductive medium is larger, and when the conductive and heat-conductive medium is disposed between the functional module and the heat dissipation module, the conductive and heat-conductive medium is difficult to flow out of the gap between the functional module and the heat dissipation module by virtue of the fluidity of the conductive and heat-conductive medium.

In other embodiments, the electrically and thermally conductive medium may be a liquid metal. Common liquid metals are mercury, gallium-based alloys (e.g., gallium indium alloy, gallium indium tin alloy, etc.), sodium potassium alloys, etc. In addition, the liquid metal has certain fluidity, and can change the appearance of the liquid metal to fill in a gap between the functional module and the heat dissipation module, so that the liquid metal can be stably contacted with the functional module and the heat dissipation module to form a stable heat conduction channel.

In one possible implementation, the liquid metal comprises a gallium-based alloy and/or a sodium-potassium alloy, i.e. the liquid metal may be a gallium-based alloy, a sodium-potassium alloy, or a mixture of a gallium-based alloy and a sodium-potassium alloy.

The gallium-based alloy and the sodium-potassium alloy can be kept in a liquid state at normal temperature (25 ℃), so that the electric conduction and heat conduction medium can be well contacted with the functional module and the heat dissipation module, and heat generated by the functional module can be quickly transferred to the heat dissipation module.

It should be noted that, when the electrically conductive heat-conducting medium is a liquid metal, the electrically conductive heat-conducting medium may be attached to the heat dissipation module and the functional module, when the electrically conductive heat-conducting medium is provided with the second insulating heat-conducting member towards one side of the heat dissipation module, the electrically conductive heat-conducting medium may be attached to the second insulating heat-conducting member, and when the electrically conductive heat-conducting medium is provided with the first insulating heat-conducting member towards one side of the heat dissipation module, the electrically conductive heat-conducting medium may be attached to the first insulating heat-conducting member. It can be understood that the fluidity of the liquid metal is weak, that is, the flow resistance of the electrically and thermally conductive medium is large, and when the electrically and thermally conductive medium is disposed between the functional module and the heat dissipation module, the electrically and thermally conductive medium is difficult to flow out of the gap between the functional module and the heat dissipation module by virtue of the fluidity of the electrically and thermally conductive medium.

In one possible implementation manner, the electronic device further includes an insulation limiting portion surrounding the electrically and thermally conductive medium, and the end portions of the insulation limiting portion are respectively in contact with the functional module and the heat dissipation module, so that the electrically and thermally conductive medium is located in a central empty area of the insulation limiting portion.

It should be noted that, when the electrically conductive heat conduction medium is extruded by the heat dissipation module and the functional module, the electrically conductive heat conduction medium can flow towards both sides, and if the electrically conductive heat conduction medium flows to be close to the insulating spacing portion, the medial surface of the insulating spacing portion can offset with the edge of the electrically conductive heat conduction medium, so that the electrically conductive heat conduction medium can be located in the central empty area of the insulating spacing portion all the time.

The end parts of the insulation limiting parts are respectively connected with the functional module and the heat dissipation module, and the insulation limiting parts are arranged on the periphery of the electric conduction and heat conduction medium in a surrounding mode, so that the inner side faces of the insulation limiting parts can limit the flow of the electric conduction and heat conduction medium, the central empty area of the insulation limiting parts is reduced, the contact probability of the electric conduction and heat conduction medium and other electronic elements in the electronic equipment is reduced, and the stability of the electronic equipment is guaranteed.

In some embodiments, the insulating limiting portion may be integrated into the functional module, after the functional module and the heat dissipation module are assembled, an end portion of the insulating limiting portion, which is away from the functional module, may be in contact with the heat dissipation module, in other embodiments, the insulating limiting portion may be integrated into the heat dissipation module, and after the functional module and the heat dissipation module are assembled, an end portion of the insulating limiting portion, which is away from the heat dissipation module, may be in contact with the functional module.

In some embodiments, the cross-sectional shape of the insulating and limiting portion may be a circular ring, in other embodiments, the cross-sectional shape of the insulating and limiting portion may be a square ring, in still other embodiments, the cross-sectional shape of the insulating and limiting portion may be irregular, and the cross-sectional shape of the insulating and limiting portion may be designed according to the actual shapes of the functional module and the heat dissipation module.

In one possible implementation, the insulating limiting part is a foam piece, a glass fiber piece or a ceramic fiber piece. In other embodiments, the insulating limiting portion may be made of other insulating materials.

The insulating limiting part is arranged to be the foam piece, the glass fiber cotton piece or the ceramic fiber cotton piece, so that the insulating performance of the insulating limiting part can be effectively ensured, the possibility that the electric conduction and heat conduction medium flows out of a central empty area of the insulating limiting part is reduced, the contact probability of the electric conduction and heat conduction medium and other electronic elements in the electronic equipment is reduced, and the stability of the electronic equipment is ensured.

In some embodiments, the electronic device may not be provided with an insulating limiting portion, and at this time, the coverage of the conductive and heat-conductive medium may be reduced by controlling the amount of the conductive and heat-conductive medium, so as to reduce the probability of contact between the conductive and heat-conductive medium and other electronic components in the electronic device, thereby ensuring stability of the electronic device.

It should be noted that, the first insulating heat conducting member and the second insulating heat conducting member may be arranged in any way, and the electronic device may or may not be provided with an insulating limiting portion.

In one possible implementation manner, the functional module includes a circuit board and a component disposed on the circuit board, and the conductive and heat-conductive medium contacts with a side of the component facing away from the circuit board.

It should be noted that, the first insulating heat conducting member, the second insulating heat conducting member and the insulating limiting portion may be arranged in any manner, and the electronic device may or may not be provided with a shielding member.

The components are basic constituent units in the electronic circuit, have specific electrical performance and function, and are used for realizing various signal processing, energy conversion and other operations of the electronic equipment. Such as a processor chip, a memory chip, an image sensor in a camera module, etc., in the mobile phone are all components.

It can be understood that in the operation process of the functional module, more heat is generated by the components, the conductive and heat-conducting medium is contacted with one side of the components, which is away from the circuit board, and the heat generated by the components can be directly transferred to the heat-dissipating module through the conductive and heat-conducting medium, so that the heat absorbed by the circuit board can be reduced, the temperature of the circuit board can be reduced, and the influence on other components connected with the circuit board can be reduced.

In one possible implementation manner, a shielding member is further arranged on the circuit board, the component is located in a shielding area of the shielding member, and the electric conduction and heat conduction medium is in contact with the component through the shielding member.

It should be noted that, in some embodiments, a plurality of components may be disposed in a shielding region of the shielding member, and in other embodiments, one shielding member may be disposed corresponding to each component, that is, only one component may be disposed in one shielding region.

The shielding area of the shielding piece can block the components from the external environment, and the external electromagnetic interference is blocked outside the shielding area, so that the components in the shielding area can work normally, a relatively stable electromagnetic environment is provided for signal transmission, the coupling of signals and the external electromagnetic interference is reduced, and the integrity of the signals is ensured; in addition, the shielding piece can limit electromagnetic radiation generated by the components within a certain range, so that interference to other electronic components on the circuit board and surrounding electronic equipment is reduced, namely, the shielding piece can isolate each component from a signal line, crosstalk between signals is restrained, and each signal can be transmitted and processed accurately.

In some embodiments, the conductive medium may contact the surface of the shielding member, and the first insulating heat conducting member is disposed between the conductive medium and the shielding member, and the first insulating heat conducting member may be attached to the surface of the shielding member, so that heat generated by the component may be transferred to the heat dissipation module through the shielding member and the conductive medium. In some embodiments, when the first insulating and heat conducting member is provided with an adhesive layer, the first insulating and heat conducting member may be adhered to the surface of the shielding member.

In one possible implementation manner, the shielding piece includes a frame body and a board body, the frame body is connected with the board body and encloses to form the shielding area, one side of the frame body away from the board body is connected with the circuit board, and the electric conduction and heat conduction medium is contacted with one side of the board body away from the component.

The shielding piece formed by enclosing the frame body and the plate body has definite geometric shapes and boundaries, and is convenient to determine the position and the direction of the shielding piece when being mounted on a circuit board or equipment, the shielding piece can be accurately matched with other parts, the mounting efficiency and the accuracy are improved, and the problems that the shielding effect is poor or interference occurs with other parts due to improper mounting are solved. The structural form of the frame and the plate makes it easy to integrate with other structural components of the electronic device. For example, the frame body can be designed to be matched with the edge of the circuit board or other fixed structures, and the board body can be customized according to the needs so as to adapt to different installation spaces and functional requirements, so that the integrated design of the shielding piece and the whole equipment structure is realized. In addition, the frame body is connected with the plate body in an interconnecting way, electromagnetic signals can be prevented from entering and exiting the shielding area from all directions, and compared with a shielding structure with a part being opened, the electromagnetic shielding structure can provide more comprehensive and efficient electromagnetic shielding, ensure that internal electronic elements are prevented from being interfered by external electromagnetic interference, and simultaneously prevent electromagnetic radiation generated in the internal parts from affecting the outside.

In some embodiments, the frame body and the plate body can be made of metal materials, so that the shielding effect of the shielding piece on signals can be improved, and in addition, heat generated by the components can be quickly transferred to the heat radiation module through the shielding piece and the electric conduction heat conduction medium, so that the heat radiation effect on the components is improved. The frame and the plate may be made of copper, silver, gold, or other metals, and the frame and the plate may be made of the same or different materials.

In some embodiments, the edges of the plate may be bonded to the end faces of the frame. In other embodiments, fasteners such as screws may be used to attach the plate to the frame.

In some embodiments, the frame body and the plate body can be connected into a whole through welding and other modes, so that an integrated shielding piece is formed, the possibility of gaps between the frame body and the plate body can be reduced, and the shielding capacity of the shielding piece is improved.

In some embodiments, the inner side surface of the insulating limiting part surrounding the conductive and heat-conducting medium can be propped against the peripheral side surface of the shielding piece, and the inner side surface of the insulating limiting part can be propped against the peripheral side surface of the frame body, so that the path of the conductive and heat-conducting medium flowing to the circuit board can be blocked, and the probability of short circuit of the circuit board is reduced.

In one possible implementation, the electronic device further includes a support portion connected to the circuit board and the heat dissipation module, respectively, so that the heat dissipation module is spaced apart from the circuit board.

The supporting part is arranged between the circuit board and the heat radiation module, two ends of the supporting part are respectively connected with the circuit board and the heat radiation module, so that the size of a gap between the circuit board and the heat radiation module is stable, and the electric conduction and heat conduction medium can be stably contacted with the components and the heat radiation module, so that the heat generated by the components can be stably transferred to the heat radiation module.

In a second aspect, an electrical connection assembly is provided, including an electrically conductive and thermally conductive medium, a heat dissipation module, and a functional module, where the electrically conductive and thermally conductive medium is disposed between the heat dissipation module and the functional module to conduct heat generated by the functional module to the heat dissipation module;

The heat dissipation module is characterized in that an insulating heat conduction piece is further arranged between the heat dissipation module and the functional module, the insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium facing the heat dissipation module, and/or the insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium facing the functional module, so that the heat dissipation module and the functional module are connected in an insulating mode.

The electric connection component provided by the embodiment of the application has the advantages that the electric conduction and heat conduction medium is arranged between the functional module and the heat dissipation module, so that heat generated by the functional module can be timely transferred to the heat dissipation module, the accumulation of heat in the functional module is reduced, the integral performance of the electric connection component is ensured, the insulating and heat conduction piece is arranged between the functional module and the heat dissipation module, the insulating and heat conduction piece can realize insulating connection between the heat dissipation module and the functional module, the heat dissipation module and the functional module cannot be electrically conducted due to the electric conduction and heat conduction medium, the electromagnetic compatibility (such as radiation stray) problem can be reduced, and the integral performance and reliability of the electric connection component can be improved. In addition, the insulating heat conduction piece is independent structure, can set up the position of insulating heat conduction piece in a flexible way according to the design demand of function module and heat dissipation module, and insulating heat conduction piece can set up between electrically conductive heat conduction medium and function module, perhaps set up between electrically conductive heat conduction medium and heat dissipation module to realize the easy to assemble of electric coupling assembling.

The insulating and heat conducting member disposed between the electrically conductive and heat conducting medium and the functional module may be referred to as a first insulating and heat conducting member, and the insulating and heat conducting member disposed between the electrically conductive and heat conducting medium and the heat dissipating module may be referred to as a second insulating and heat conducting member.

In some embodiments, the electrical connection assembly may be applied to the electronic device described above, so that the electrical conduction medium, the first insulating heat conduction member, the second insulating heat conduction member, the heat dissipation module, and the functional module of the electrical connection assembly correspond to the electrical conduction medium, the first insulating heat conduction member, the second insulating heat conduction member, the heat dissipation module, and the functional module of the electronic device described in any of the above embodiments, respectively.

In one possible implementation manner, the insulating and heat conducting member comprises an insulating layer and a heat conducting layer laminated on one side of the insulating layer;

the insulating layer is arranged between the heat conducting layer and the electric conduction heat conducting medium, or the heat conducting layer is arranged between the insulating layer and the electric conduction heat conducting medium.

The insulating layer is made of an insulating material, and the heat conductive layer may be made of an insulating material, in which case the heat conductive layer does not have an electric conductive ability, and in addition, the heat conductive layer may be made of an electric conductive material, in which case the heat conductive layer has an electric conductive ability.

The insulating layer and the heat conducting layer which are arranged in a laminated mode are used for forming the insulating heat conducting piece, the insulating layer can play an insulating role, insulating connection between the functional module and the heat radiating module is achieved, and the heat conducting layer can improve the heat conducting capacity of the insulating heat conducting piece so as to ensure that heat generated by the functional module can be quickly transferred to the heat radiating module. In addition, the layered insulating layer has a larger area, so that insulation between the functional module and the heat dissipation module is ensured, the possibility of electric conduction between the functional module and the heat dissipation module is reduced, and the performance of the electric connection assembly is ensured.

In some embodiments, the insulating and thermally conductive member may be sheet-like.

In one possible implementation, the thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that in some embodiments, the heat conducting layer may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the heat conducting layer may be a multi-layer structure, which may include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer, and the number of heat conducting layers may be two, three, four, five, or more. In some embodiments, when the heat conductive layers are provided with multiple layers, the insulating layer may or may not be sandwiched between two heat conductive layers.

The graphite layer, the boron nitride layer and the metal layer are strong in heat conduction capacity, and the heat conduction layer formed by at least one of the graphite layer, the boron nitride layer and the metal layer has high heat conduction capacity, so that the whole heat conduction capacity of the insulating heat conduction piece can be improved, and heat generated by the functional module can be quickly transferred to the heat dissipation module.

In one possible implementation, the insulating layer includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the insulating layer may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the insulating layer may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of insulating layers may be two, three, four, five or more. In some embodiments, when the insulating layers are provided with multiple layers, the heat conducting layer may or may not be sandwiched between two insulating layers.

The polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer, and the polyvinyl chloride layer have relatively low density and light weight, and thus, do not additionally or excessively increase the weight of the electrical connection assembly, and, in addition, the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer have better flexibility, so that the insulating heat conducting piece can bear the external force effects such as bending, stretching and the like to a certain extent, and the assembly of the electric connection component is realized.

In some embodiments, the overall thickness of the insulating and thermally conductive member is 0.1mm to 0.15mm, and exemplary, the overall thickness of the insulating and thermally conductive member may be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm.

The whole thickness value of the insulating heat conducting piece is set to be not less than 0.1mm, so that the insulating heat conducting piece can have certain strength, the risk of breakage of the insulating heat conducting piece is reduced, the whole thickness of the insulating heat conducting piece is set to be not more than 0.15mm, occupied space of the insulating heat conducting piece can be reduced, the influence of the insulating heat conducting piece on the whole size of the electric connection assembly can be reduced, and the light and thin design and the miniaturization design of electronic equipment are facilitated.

The insulating and heat conducting member disposed between the electrically conductive and heat conducting medium and the functional module may be referred to as a first insulating and heat conducting member, and at this time, the heat conducting layer and the insulating layer of the first insulating and heat conducting member may be referred to as a first heat conducting layer and a first insulating layer, respectively, the insulating and heat conducting member disposed between the electrically conductive and heat conducting medium and the heat dissipating module may be referred to as a second insulating and heat conducting member, and in addition, the sizes, structures and materials of the first insulating and heat conducting member and the second insulating and heat conducting member may be the same, and in other embodiments, the sizes, structures and materials of the first insulating and heat conducting member and the second insulating and heat conducting member may be different.

When the electric connection assembly is applied to the electronic equipment, the first heat conduction layer, the first insulation layer, the second heat conduction layer and the second insulation layer of the electric connection assembly respectively correspond to the first heat conduction layer, the first insulation layer, the second heat conduction layer and the second insulation layer of the electronic equipment.

The electric and heat conducting medium is liquid metal.

When the conductive heat-conducting medium comprises a colloid, the conductive heat-conducting medium can be attached between the heat-radiating module and the functional module, when the conductive heat-conducting medium is provided with an insulating heat-conducting piece towards one side of the heat-radiating module, the conductive heat-conducting medium can be attached to the insulating heat-conducting piece, and when the conductive heat-conducting medium is provided with the insulating heat-conducting piece towards one side of the heat-radiating module, the conductive heat-conducting medium can be attached to the insulating heat-conducting piece. It can be understood that the fluidity of the colloid is weaker, that is, the flow resistance of the conductive and heat-conductive medium is larger, and when the conductive and heat-conductive medium is disposed between the functional module and the heat dissipation module, the conductive and heat-conductive medium is difficult to flow out of the gap between the functional module and the heat dissipation module by virtue of the fluidity of the conductive and heat-conductive medium.

By way of example, the electrically and thermally conductive medium may be liquid Jin Guizhi, which may include silicone grease and liquid gallium indium alloy mixed within the silicone grease.

In one possible implementation, the liquid metal comprises a gallium-based alloy and/or a sodium-potassium alloy.

That is, the liquid metal may be a gallium-based alloy, a sodium-potassium alloy, or a mixture of a gallium-based alloy and a sodium-potassium alloy.

The gallium-based alloy and the sodium-potassium alloy can be kept in a liquid state at normal temperature (25 ℃), so that the electric conduction and heat conduction medium can be well contacted with the functional module and the heat dissipation module, and heat generated by the functional module can be quickly transferred to the heat dissipation module. In addition, the gallium-based alloy and the sodium-potassium alloy have good stability and are not easy to volatilize at normal temperature, so that the pollution to the environment can be reduced, and the safety of users is ensured.

It should be noted that, when the electrically conductive heat-conducting medium is a liquid metal, the electrically conductive heat-conducting medium may be attached between the heat dissipation module and the functional module, when the electrically conductive heat-conducting medium is provided with the second insulating heat-conducting member towards one side of the heat dissipation module, the electrically conductive heat-conducting medium may be attached to the second insulating heat-conducting member, and when the electrically conductive heat-conducting medium is provided with the first insulating heat-conducting member towards one side of the heat dissipation module, the electrically conductive heat-conducting medium may be attached to the first insulating heat-conducting member. It can be understood that the fluidity of the liquid metal is weak, that is, the flow resistance of the electrically and thermally conductive medium is large, and when the electrically and thermally conductive medium is disposed between the functional module and the heat dissipation module, the electrically and thermally conductive medium is difficult to flow out of the gap between the functional module and the heat dissipation module by virtue of the fluidity of the electrically and thermally conductive medium.

In one possible implementation manner, the electrical connection assembly further includes an insulation limiting portion surrounding the electrical conduction and heat conduction medium, and the end portions of the insulation limiting portion are respectively in contact with the functional module and the heat dissipation module, and the electrical conduction and heat conduction medium is located in a central empty area of the insulation limiting portion.

The end parts of the insulation limiting parts are respectively contacted with the functional module and the heat dissipation module, and the insulation limiting parts are arranged on the periphery of the electric conduction and heat conduction medium in a surrounding mode, so that the inner side faces of the insulation limiting parts can limit the flow of the electric conduction and heat conduction medium, the possibility that the electric conduction and heat conduction medium flows out of the central empty area of the insulation limiting parts is reduced, the contact probability of the electric conduction and heat conduction medium and other electronic elements is reduced, and the stability of the electric connection assembly is guaranteed.

In some embodiments, the cross-sectional shape of the insulating limiting portion may be a circular ring, in other embodiments, the cross-sectional shape of the insulating limiting portion may be a square ring, in addition, the cross-sectional shape of the insulating limiting portion may be irregular, and the cross-sectional shape of the insulating limiting portion may be designed according to the actual shapes of the functional module and the heat dissipation module.

In one possible implementation, the insulating limiting part is a foam piece, a glass fiber piece or a ceramic fiber piece.

The insulating limiting part is arranged to be the foam piece, the glass fiber cotton piece or the ceramic fiber cotton piece, so that the insulating performance of the insulating limiting part can be effectively ensured, the possibility that the electric conduction and heat conduction medium flows out of a central empty area of the insulating limiting part is reduced, the probability that the electric conduction and heat conduction medium contacts with other electronic elements is reduced, and the stability of electronic equipment is ensured.

When the electric connection assembly is applied to the electronic equipment, the insulation limiting part of the electric connection assembly corresponds to the insulation limiting part of the electronic equipment.

It should be noted that, the first insulating heat conducting member and the second insulating heat conducting member may be arranged anyway, and the electrical connection assembly may or may not be provided with an insulating limiting portion. When the electric connection component is not provided with the insulation limiting part, the coverage range of the electric conduction and heat conduction medium can be reduced by controlling the consumption of the electric conduction and heat conduction medium, so that the probability of contact between the electric conduction and heat conduction medium and other electronic elements is reduced, and the stability of the electric connection component is ensured.

It should be noted that, the first insulating heat conducting member, the second insulating heat conducting member and the insulating limiting portion may be arranged anyway, and the electrical connection assembly may or may not be provided with a shielding member.

In some embodiments, when the electrical connection assembly is applied to the electronic device, the shielding member of the electrical connection assembly corresponds to the shielding member of the electronic device.

The shielding piece formed by enclosing the frame body and the plate body has definite geometric shapes and boundaries, and is convenient to determine the position and the direction of the shielding piece when being mounted on a circuit board or equipment, the shielding piece can be accurately matched with other parts, the mounting efficiency and the accuracy are improved, and the problems that the shielding effect is poor or interference occurs with other parts due to improper mounting are solved. The structural form of the frame and the plate makes it easy to integrate with other structural components. For example, the frame body can be designed to be matched with the edge of the circuit board or other fixed structures, and the board body can be customized according to the needs so as to adapt to different installation spaces and functional requirements, so that the integrated design of the shielding piece and the whole equipment structure is realized. In addition, the frame body is connected with the plate body in an interconnecting way, electromagnetic signals can be prevented from entering and exiting the shielding area from all directions, and compared with a shielding structure with a part being opened, the electromagnetic shielding structure can provide more comprehensive and efficient electromagnetic shielding, ensure that internal electronic elements are prevented from being interfered by external electromagnetic interference, and simultaneously prevent electromagnetic radiation generated in the internal parts from affecting the outside.

In some embodiments, when the electrical connection assembly is applied to the electronic device, the frame and the board of the electrical connection assembly correspond to the frame and the board of the electronic device.

Drawings

Fig. 1 is a schematic structural view of a related-art electronic device.

Fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of an electronic device according to another embodiment of the present application.

Fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present application.

Fig. 5 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 6 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 7 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 8 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 9 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 10 is a schematic cross-sectional top view of an insulation limiting portion according to an embodiment of the present application.

Fig. 11 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 12 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 13 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 14 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 15 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

Fig. 16 is a schematic structural diagram of an electronic device according to still another embodiment of the present application.

The marks in fig. 1:

1', functional modules, 2', liquid Jin Guizhi ', 3', heat dissipation modules;

The marks in fig. 2 to 16:

1. The device comprises a functional module, a circuit board, a 12, a component, a 13, a shielding piece, a 131, a frame, a 132, a board, a 133 and a shielding area, wherein the functional module is arranged in the frame;

21. An electric conduction and heat conduction medium, 22, a first insulating and heat conduction member, 221, a first heat conduction layer, 222, a first insulating layer, 23, a second insulating and heat conduction member, 231, a second heat conduction layer, 232 and a second insulating layer;

3. A heat dissipation module;

4. an insulating limit part;

5. A supporting part.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected or communicable with each other, directly connected, indirectly connected through an intermediary, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present application, it should be understood that the terms "upper," "lower," "side," "front," "rear," and the like indicate an orientation or a positional relationship based on installation, and are merely for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

The term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean that a exists alone, while a and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the age of rapid development of technology today, electronic devices have been widely used in various fields of people's life and work. From daily smart phones and tablet computers to servers, high-performance computers and the like in the professional field, the electronic devices are increasingly powerful in function and continuously improved in performance. However, with the continuous improvement of the internal integration level of the electronic device and the gradual increase of the operating power of the functional module, the heat dissipation problem becomes one of the key factors that restrict the further improvement of the performance of the electronic device.

Fig. 1 is a schematic structural view of a related-art electronic device. In the related art, referring to fig. 1, an electronic device mainly includes a heat dissipation module 3 'and a power consumption function module 1'. The function of the heat radiation module 3' is to timely radiate a large amount of heat generated by the functional module 1' in the operation process, so that the functional module 1' can stably work in a proper temperature environment, and performance degradation and even damage caused by overheating are avoided. The functional module 1' is a core component of the electronic device for implementing various specific functions, such as a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU) and the like in the mobile phone, which consume a large amount of electric energy and generate heat during operation.

To achieve efficient heat transfer, liquid silicone grease 2' is often used to connect the heat sink module 3' to the functional module 1 '. The liquid metal silicone grease 2 'is a heat dissipation material, combines the advantages of good heat conduction performance of liquid metal, plasticity, filling performance and the like of silicone grease, can form a compact heat conduction path between the heat dissipation module and the functional module 1', and effectively improves heat dissipation efficiency.

However, this liquid gold silicone grease 2' also presents some problems. Since the liquid gold silicone grease 2' contains metal materials, the metal materials have good conductivity. During the operation of the electronic device, if the physical connection is established between the functional module 1' and the heat dissipation module 3' through the liquid metal silicone grease 2', an electrical conduction path is easy to form. If the electrical signal in the functional module 1 'is transferred to the heat sink module 3' through this conductive path, a series of electromagnetic compatibility (electromagnetic compatibility, EMC) problems are caused, wherein radiation spurs are a more prominent problem.

The radiation stray refers to that when the electronic device is in normal operation, unnecessary electromagnetic signals are radiated to the surrounding space through various paths due to electromagnetic interference of an internal circuit. These stray radiation signals tend to interfere with the proper operation of other surrounding electronic equipment, affecting its performance and stability. In addition, radiation spurious problems can also affect the signal receiving and processing capabilities of the electronic device itself, reducing the overall performance and reliability of the electronic device.

Based on the above, the embodiment of the application provides an electric connection assembly and electronic equipment, which can realize the insulation connection between a functional module and a heat dissipation module while guaranteeing the heat dissipation performance, and have higher reliability.

The embodiment of the application firstly provides an electronic device, which can be, for example, an electronic product with a communication function, a photographing or shooting function, such as a mobile phone, a tablet computer, a notebook computer, a television, a vehicle-mounted device, a wearable device, a Personal Digital Assistant (PDA), a point of sale (POS), a video monitoring device and the like. The mobile phone can be a conventional straight mobile phone, or a foldable mobile phone, for example, a small up-down folding mobile phone, a left-right inner folding mobile phone or a left-right outer folding mobile phone. The wearable device may be, for example, a smart bracelet, a smart watch, a wireless headset, augmented reality (augmented reality, AR) glasses, AR helmets, virtual Reality (VR) glasses, VR helmets, or the like.

The electronic device may have a display screen, a camera, a central processing unit (central processing unit, abbreviated as CPU), a memory, and other functional modules, where the central processing unit serves as an operation and control core of the computer system, and is an ultimate execution unit for information processing and program running, and exemplary, the central processing unit may be respectively connected to the display screen, the camera, and the memory, so that the display screen can display a picture shot by the camera, and the memory can store the shot picture.

Fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application. Referring to fig. 2, the electronic device provided by the embodiment of the application includes an electrically conductive and thermally conductive medium 21, a heat dissipation module 3 and a functional module 1, wherein the electrically conductive and thermally conductive medium 21 is disposed between the heat dissipation module 3 and the functional module 1 to conduct heat generated by the functional module 1 to the heat dissipation module 3, wherein a first insulating and thermally conductive member 22 is further disposed between the heat dissipation module 3 and the functional module 1, and the first insulating and thermally conductive member 22 is disposed on a side of the electrically conductive and thermally conductive medium 21 facing the heat dissipation module 3, or the first insulating and thermally conductive member 22 is disposed on a side of the electrically conductive and thermally conductive medium 21 facing the functional module 1 to make an insulating connection between the heat dissipation module 3 and the functional module 1.

It should be noted that, the functional module 1 in the electronic device is a hardware unit that is composed of a plurality of electronic elements, has a specific function, and can relatively independently implement the function, and these functional modules 1 are important components of the electronic device, and cooperate with each other to enable the electronic device to perform various complex tasks. By way of example, the functional module 1 may be a display screen, a camera, a central processing unit, a memory, a microcontroller, a flash memory, a wireless communication module, a wired communication module, a battery management module, a gravity sensor, etc. In some embodiments, each functional module 1 is designed to perform a specific function or class of functions. In some embodiments, for some complex functions of the electronic device, a plurality of functional modules 1 are needed to cooperate together to realize, for example, a smart phone is needed to access the internet, a communication module is needed to establish network connection, a central processing unit performs data processing and protocol analysis, a display screen presents webpage content, a memory caches related data and the like, and the plurality of functional modules 1 play roles respectively to jointly complete the complex function of surfing the internet.

The functional module 1 generally generates heat when it is energized. When current passes through the electronic component in the functional module 1, the current can work and convert into heat energy due to the resistance of the electronic component, even if the current passes through a lead with smaller resistance, certain heat can be generated, and the generated heat can be accumulated continuously along with the increase of the current and the extension of time. In addition, a semiconductor device may be disposed in the functional module 1, and during operations such as data processing, signal transmission, and logic operation, complex processes such as electron transfer and charge transfer may occur in the semiconductor device, and during these processes, electrons collide with a crystal lattice, so that part of electrical energy is converted into thermal energy. And the higher the operating frequency of the semiconductor element, the greater the amount of data processed, the more heat is generated. For example, when a CPU performs a high-intensity computing task, the transistors inside the CPU are turned on and off rapidly, and a large amount of electrons flow therein, so that more heat is generated, resulting in an increase in the CPU temperature. In general, a certain amount of heat is generated during the power-on operation of the functional module 1.

It should be noted that the electrically and thermally conductive medium 21 is a substance capable of efficiently transferring heat, and generally has a certain electrical conductivity, and in some embodiments, the material of the electrically and thermally conductive medium 21 may be metal, carbon, or the like, and in other embodiments, the electrically and thermally conductive medium 21 may be a mixture of metal and polymer, or a mixture of carbon material and polymer.

It should be noted that, when the first insulating heat conducting member 22 is disposed between the heat dissipating module 3 and the heat dissipating module 3, the heat conducting and conducting medium 21 is in indirect contact with the heat dissipating module 3, and when the first insulating heat conducting member 22 is disposed between the heat conducting and conducting medium 21 and the function module 1, the heat conducting and conducting medium 21 is in indirect contact with the function module 1. No matter the electric conduction heat conduction medium 21 is in direct contact or indirect contact with the functional module 1 and the heat dissipation module 3, heat generated by the functional module 1 can be transferred to the heat dissipation module 3 through the electric conduction heat conduction medium 21, so that heat dissipation of the functional module 1 is realized.

It should be noted that, the heat dissipation module 3 is commonly formed by an air cooling heat dissipation module, a water cooling heat dissipation module, a heat pipe heat dissipation module, a temperature equalizing plate heat dissipation module, a liquid cooling plate heat dissipation module, a natural heat dissipation module, and the like. The air-cooled heat dissipation module is generally composed of a heat dissipation fan, heat dissipation fins, a heat dissipation base and the like, and generates air flow through rotation of the heat dissipation fan, so that air flows through the heat dissipation fins to take away heat. The water cooling module generally comprises a water cooling head, a water pump, a water tank, a water cooling row, a cooling fan and the like, wherein the water cooling head is in contact with a heating component, heat is transferred to circulating water cooling liquid, the water cooling liquid flows through the water cooling row under the driving of the water pump, the cooling fan dissipates heat of the water cooling row, and the water cooling liquid returns to the water cooling head after being cooled, so that the circulating water cooling liquid circulates. The heat pipe radiating module consists of a heat pipe, radiating fins, a radiating base and the like, working medium in the heat pipe evaporates into a gaseous state after the heat is absorbed by the evaporating section, the gaseous working medium flows to the condensing section under the action of pressure difference in the heat pipe, the gaseous working medium is condensed into a liquid state again after the heat is released by the condensing section, the liquid working medium flows back to the evaporating section through structures such as a liquid absorption core and the like, so that efficient heat transfer is realized in a circulating way, and finally the heat is radiated into the air by the radiating fins. The heat dissipation module of the temperature equalization plate mainly comprises a temperature equalization plate, and in some embodiments, the temperature equalization plate may be used together with a cooling fan or cooling fins, and a vacuum cavity is arranged inside the temperature equalization plate, and special heat conducting medium and capillary structures are arranged in the cavity. When one side of the temperature equalization plate is heated, the heat conducting medium evaporates to form steam, the steam is rapidly diffused to a region with lower temperature in the vacuum cavity and is condensed into liquid, the liquid flows back to the heated region through the capillary structure, and evaporation and heat dissipation are continued, so that rapid and uniform heat dissipation is realized. The liquid cooling plate heat radiation module comprises a liquid cooling plate, a cooling liquid circulation system and the like, wherein the cooling liquid flows in the liquid cooling plate to absorb heat, and then the heat is brought to an external heat radiation device through the circulation system to radiate. The natural heat radiation module mainly depends on the structures of a shell or a radiating fin of the equipment, and the like, and utilizes heat conduction to transfer heat in the equipment to the shell or the radiating fin, and then radiates the heat to the surrounding environment in a natural convection and heat radiation mode. The corresponding form of the heat dissipation module 3 can be selected according to the type of the functional module 1 to ensure the heat dissipation effect on the functional module 1, so that the functional module 1 can operate at a more proper temperature.

It should be noted that, the first insulating and heat conducting member 22 is a material for achieving dual functions of insulation and heat conduction, and generally uses a high polymer as a matrix, such as silicone rubber, polyimide, and the like, which has good insulating properties, flexibility and chemical stability, and can provide basic physical and chemical properties for the insulating and heat conducting member, so as to ensure that the performance is kept stable under different environmental conditions. In addition, in order to impart good heat conductive properties to the material, some heat conductive material may be provided on the base material to enhance the heat conductive capability of the first insulating heat conductive member 22 as a whole. In some embodiments, the first insulating and thermally conductive member 22 may be sheet-like.

The first insulating and heat conducting member 22 is disposed on one side of the electrically and thermally conductive medium 21, and the first insulating and heat conducting member 22 is used for insulating and connecting the heat dissipation module 3 and the functional module 1. Referring to fig. 2, in some embodiments, a first insulating heat conductive member 22 may be disposed between the electrically and thermally conductive medium 21 and the functional module 1. Fig. 3 is a schematic structural diagram of an electronic device according to another embodiment of the present application. Referring to fig. 3, in other embodiments, a first insulating and heat conducting member 22 may be disposed between the electrically and thermally conductive medium 21 and the heat dissipation module 3.

It should be noted that, one side of the first insulating and heat conducting member 22 may be provided with an adhesive layer, when the first insulating and heat conducting member 22 is disposed between the electrically conductive and heat conducting medium 21 and the functional module 1, the adhesive layer of the first insulating and heat conducting member 22 may be adhered to the functional module 1, and when the first insulating and heat conducting member 22 is disposed between the electrically conductive and heat conducting medium 21 and the heat dissipating module 3, the adhesive layer of the first insulating and heat conducting member 22 may be adhered to the heat dissipating module 3, so as to reduce the offset of the position of the first insulating and heat conducting member 22.

In the electronic equipment provided by the embodiment of the application, the electric conduction and heat conduction medium 21 is arranged between the functional module 1 and the heat dissipation module 3, so that heat generated by the functional module 1 can be timely transferred to the heat dissipation module 3, the accumulation of heat in the functional module 1 is reduced, the overall performance of the electronic equipment is ensured, the first insulating and heat conduction piece 22 is arranged between the functional module 1 and the heat dissipation module 3, the first insulating and heat conduction piece 22 can realize insulating connection between the heat dissipation module 3 and the functional module 1, the heat dissipation module 3 and the functional module 1 cannot be electrically conducted due to the electric conduction and heat conduction medium 21, and thus, the problem of electromagnetic compatibility (such as radiation stray) can be reduced, and the overall performance and reliability of the electronic equipment can be improved. In addition, the first insulating and heat conducting member 22 is of an independent structure, and can be flexibly arranged at the position of the first insulating and heat conducting member 22 according to the design requirements of the functional module 1 and the heat dissipation module 3, and the first insulating and heat conducting member 22 can be arranged between the electric conduction and heat conducting medium 21 and the functional module 1 or between the electric conduction and heat conducting medium 21 and the heat dissipation module 3 so as to realize convenient installation of the electronic equipment.

Fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present application, and fig. 5 is a schematic structural diagram of an electronic device according to yet another embodiment of the present application. Referring to fig. 2 to 5, the first insulating and heat conducting member 22 includes a first insulating layer 222 and a first heat conducting layer 221 laminated on one side of the first insulating layer 222, and referring to fig. 2 and 3, in some embodiments, the first insulating layer 222 is disposed between the first heat conducting layer 221 and the electrically and thermally conductive medium 21, and in other embodiments, referring to fig. 4 and 5, the first heat conducting layer 221 is disposed between the first insulating layer 222 and the electrically and thermally conductive medium 21.

Note that the first insulating layer 222 may be made of an insulating material, and the first heat conductive layer 221 may be made of an insulating material, in which case the first heat conductive layer 221 does not have an electric conductive capability, and in addition, the first heat conductive layer 221 may be made of an electric conductive material, in which case the first heat conductive layer 221 has an electric conductive capability.

The first insulating layer 222 and the first heat conducting layer 221 which are arranged in a laminated manner are used for forming the first insulating heat conducting piece 22, the first insulating layer 222 can play an insulating role to realize insulating connection between the functional module 1 and the heat dissipation module 3, and the first heat conducting layer 221 can improve the heat conducting capacity of the first insulating heat conducting piece 22 so as to ensure that heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3. In addition, the layered first insulating layer 222 has a larger area, thereby ensuring insulation between the functional module 1 and the heat dissipation module 3, reducing the possibility of electrical conduction between the functional module 1 and the heat dissipation module 3, and helping to ensure performance of the electronic device.

Referring to fig. 4, in some embodiments, when the first insulating and heat conducting member 22 is disposed between the functional module 1 and the electrically and thermally conductive medium 21, the first heat conducting layer 221 may be disposed between the first insulating layer 222 and the electrically and thermally conductive medium 21, that is, the first insulating layer 222 may be connected to the functional module 1, and the first insulating layer 222 may insulate the functional module 1 from the first heat conducting layer 221, so that the first insulating layer 222 may block the current flowing from the functional module 1 to the first heat conducting layer 221, that is, reduce the interference current flowing from the functional module 1, which is helpful for improving the stability and reliability of the electronic device.

In some embodiments, the first thermally conductive layer 221 includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that, in some embodiments, the first heat conductive layer 221 may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the first heat conductive layer 221 may be a multi-layer structure, which may include two graphite layers, two metal layers, or include a graphite layer and a boron nitride layer, or include a boron nitride layer and a metal layer, or include a graphite layer, a boron nitride layer, and a metal layer, and the number of layers of the first heat conductive layer 221 may be two, three, four, five, or more, which is not limited herein. In some embodiments, when the first heat conductive layers 221 are provided with multiple layers, the first insulating layer 222 may or may not be sandwiched between the two first heat conductive layers 221.

The graphite layer, the boron nitride layer and the metal layer have strong heat conduction capability, and the first heat conduction layer 221 formed by at least one of the graphite layer, the boron nitride layer and the metal layer has high heat conduction capability, so that the whole heat conduction capability of the first insulating heat conduction piece 22 can be improved, and the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

In some embodiments, the first insulating layer 222 includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the first insulating layer 222 may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the first insulating layer 222 may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of the first insulating layers 222 may be two, three, four, five or more, and embodiments of the present application are not limited herein. In some embodiments, when the first insulating layers 222 are provided with multiple layers, the first heat conductive layer 221 may or may not be sandwiched between the two first insulating layers 222.

The density of the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer is relatively small, and the weight is light, so that the weight of the electronic equipment is not increased additionally or excessively, and in addition, the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer have good flexibility, so that the first insulating and heat conducting piece 22 can bear the external force effects such as bending, stretching and the like to a certain extent, and the electronic equipment is assembled.

In some embodiments, the overall thickness of the first insulating and heat conducting member 22 is 0.1mm to 0.15mm, and exemplary values of the overall thickness of the first insulating and heat conducting member 22 may be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm.

The integral thickness of the first insulating and heat conducting piece 22 is set to be not less than 0.1mm, so that the first insulating and heat conducting piece 22 can have certain strength, the risk of fracture of the first insulating and heat conducting piece 22 is reduced, the integral thickness of the first insulating and heat conducting piece 22 is set to be not more than 0.15mm, the occupied space of the first insulating and heat conducting piece 22 in the electronic equipment can be reduced, the influence of the first insulating and heat conducting piece 22 on the integral size of the electronic equipment can be reduced, and the electronic equipment is light, thin and miniaturized design is facilitated.

Fig. 6 is a schematic structural diagram of an electronic device according to still another embodiment of the present application. Referring to fig. 6, in some embodiments, a first insulating and heat conducting member 22 is disposed on a side of the electrically and heat conducting medium 21 facing the functional module 1, and a second insulating and heat conducting member 23 is disposed on a side of the electrically and heat conducting medium 21 facing the heat dissipating module 3, so as to make an insulating connection between the electrically and heat conducting medium 21 and the heat dissipating module 3.

It should be noted that, the second insulating and heat conducting member 23 is a material for achieving dual functions of insulation and heat conduction, and generally uses a high molecular polymer as a matrix, such as silicone rubber, polyimide, and the like, which has good insulating properties, flexibility and chemical stability, and can provide basic physical and chemical properties for the insulating and heat conducting member, so as to ensure that the performance is kept stable under different environmental conditions. In addition, in order to impart good heat conductive properties to the material, some heat conductive material may be provided on the base material to enhance the heat conductive capability of the first insulating heat conductive member 22 as a whole. In addition, the second insulating and heat conducting member 23 and the first insulating and heat conducting member 22 may be the same or different in structure and material. In some embodiments, the second insulating and heat conducting member 23 may be in the form of a sheet.

The first insulating heat conducting piece 22 is arranged on one side of the electric conduction heat conducting medium 21 facing the functional module 1, and the second insulating heat conducting piece 23 is arranged on one side of the electric conduction heat conducting medium 21 facing the heat radiation module 3, and the first insulating heat conducting piece 22 and the second insulating heat conducting piece 23 can insulate the electric conduction heat conducting medium 21 from the functional module 1 and the heat radiation module 3 respectively, so that insulating connection between the functional module 1 and the heat radiation module 3 can be further ensured, the possibility that current in the functional module 1 flows into the heat radiation module 3 is reduced, and the reliability of the electronic equipment is ensured. In addition, when one of the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 is damaged, the other insulating and heat conducting member can still play an insulating role, so that the insulating connection between the functional module 1 and the heat dissipation module 3 is ensured, and the reliability of the electronic equipment is further improved.

Fig. 7 is a schematic structural diagram of an electronic device according to still another embodiment of the present application. Referring to fig. 6 and 7, the second insulating and heat conducting member 23 includes a second insulating layer 232 and a second heat conducting layer 231 disposed at one side of the second insulating layer 232, and referring to fig. 7, in some embodiments, the second insulating layer 232 is disposed between the second heat conducting layer 231 and the electrically and thermally conductive medium 21, and referring to fig. 6, in other embodiments, the second heat conducting layer 231 is disposed between the second insulating layer 232 and the electrically and thermally conductive medium 21.

It should be noted that the second insulating layer 232 may be made of an insulating material, the second heat conductive layer 231 may be made of an insulating material, and the second heat conductive layer 231 may not have an electrical conductivity at this time, and the second heat conductive layer 231 may be made of an electrical conductivity material, and the second heat conductive layer 231 may have an electrical conductivity at this time.

The second insulating layer 232 and the second heat conducting layer 231 which are arranged in a laminated manner are used for forming the second insulating heat conducting piece 23, the second insulating layer 232 can play an insulating role to realize insulating connection between the functional module 1 and the heat dissipation module 3, and the second heat conducting layer 231 can improve the heat conducting capacity of the second insulating heat conducting piece 23 so as to ensure that heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3. In addition, the layered second insulating layer 232 has a larger area, thereby ensuring insulation between the conductive heat-conducting medium 21 and the heat dissipation module 3, reducing the possibility of electrical conduction between the functional module 1 and the heat dissipation module 3, and helping to ensure the performance of the electronic device.

Referring to fig. 7, in some embodiments, the second heat conducting layer 231 may be disposed on a side of the second insulating layer 232 facing away from the electrically and thermally conductive medium 21, that is, the second insulating layer 232 is connected to the electrically and thermally conductive medium 21, and the second heat conducting layer 231 is connected to the heat dissipation module 3, if the electrically and thermally conductive medium 21 is accidentally connected to the functional module 1, the second insulating layer 232 may block the current from flowing to the second heat conducting layer 231, that is, the flowing range of the interference current may be reduced, which is helpful for improving the stability and reliability of the electronic device.

In some embodiments, the second thermally conductive layer 231 includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that, in some embodiments, the second heat conductive layer 231 may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the second heat conductive layer 231 may be a multi-layer structure, which may include two graphite layers, two metal layers, or include a graphite layer and a boron nitride layer, or include a boron nitride layer and a metal layer, or include a graphite layer, a boron nitride layer, and a metal layer, and the number of layers of the second heat conductive layer 231 may be two, three, four, five, or more, which is not limited herein. In some embodiments, when the second heat conductive layers 231 are provided with multiple layers, the second insulating layer 232 may or may not be sandwiched between the two second heat conductive layers 231.

The graphite layer, the boron nitride layer and the metal layer have strong heat conduction capability, and the second heat conduction layer 231 formed by at least one of the graphite layer, the boron nitride layer and the metal layer has high heat conduction capability, so that the whole heat conduction capability of the second insulating heat conduction piece 23 can be improved, and the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

In some embodiments, the second insulating layer 232 includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the second insulating layer 232 may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the second insulating layer 232 may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of the second insulating layers 232 may be two, three, four, five or more, and embodiments of the present application are not limited herein. In some embodiments, when the second insulating layers 232 are provided with multiple layers, the second heat conducting layer 231 may or may not be sandwiched between the two second insulating layers 232.

The density of the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer is relatively small, and the weight is light, so that the weight of the electronic equipment is not increased additionally or excessively, and in addition, the polyethylene terephthalate layer, the polyethylene layer, the polypropylene layer and the polyvinyl chloride layer have good flexibility, so that the second insulating and heat conducting piece 23 can bear the external force effects such as bending, stretching and the like to a certain extent, and the electronic equipment is assembled.

In some embodiments, the overall thickness of the second insulating and heat conducting member 23 is 0.1mm to 0.15mm, and exemplary, the overall thickness of the second insulating and heat conducting member 23 may be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

The integral thickness of the second insulating and heat conducting piece 23 is set to be not less than 0.1mm, so that the second insulating and heat conducting piece 23 can have certain strength, the risk of breakage of the second insulating and heat conducting piece 23 is reduced, the integral thickness of the second insulating and heat conducting piece 23 is set to be not more than 0.15mm, the occupied space of the second insulating and heat conducting piece 23 in the electronic equipment can be reduced, the influence of the second insulating and heat conducting piece 23 on the integral size of the electronic equipment can be reduced, and the electronic equipment is light, thin and miniaturized design can be realized.

It should be noted that, in some embodiments, the sizes, structures and materials of the first insulating and heat conducting members 22 and the second insulating and heat conducting members 23 may be the same, and in other embodiments, the sizes, structures and materials of the first insulating and heat conducting members 22 and the second insulating and heat conducting members 23 may be different.

Fig. 8 is a schematic structural diagram of an electronic device according to another embodiment of the present application, and fig. 9 is a schematic structural diagram of an electronic device according to another embodiment of the present application. The mounting manners of the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 may be varied, for example, referring to fig. 6, in some embodiments, the first heat conducting layer 221 of the first insulating and heat conducting member 22 and the second heat conducting layer 231 of the second insulating and heat conducting member 23 may be bonded to the electric and heat conducting medium 21, and at this time, the first insulating layer 222 of the first insulating and heat conducting member 22 is bonded to the functional module 1, and the second insulating layer 232 of the second insulating and heat conducting member 23 is bonded to the heat dissipation module 3. Referring to fig. 7, in some embodiments, the first heat conductive layer 221 and the first insulating layer 222 of the first insulating and heat conductive member 22 may be respectively attached to the electrically conductive and heat conductive medium 21 and the functional module 1, and the second heat conductive layer 231 and the second insulating layer 232 of the second insulating and heat conductive member 23 may be respectively attached to the heat dissipation module 3 and the electrically conductive and heat conductive medium 21. Referring to fig. 8, in some embodiments, the first heat conductive layer 221 and the first insulating layer 222 of the first insulating and heat conductive member 22 may be respectively attached to the functional module 1 and the electrically and thermally conductive medium 21, and the second heat conductive layer 231 and the second insulating layer 232 of the second insulating and heat conductive member 23 may be respectively attached to the heat dissipation module 3 and the electrically and thermally conductive medium 21. Referring to fig. 9, in still other embodiments, the first heat conductive layer 221 and the first insulating layer 222 of the first insulating and heat conductive member 22 may be respectively bonded to the functional module 1 and the electrically conductive and heat conductive medium 21, and the second heat conductive layer 231 and the second insulating layer 232 of the second insulating and heat conductive member 23 may be respectively bonded to the electrically conductive and heat conductive medium 21 and the heat dissipation module 3. In some other embodiments, the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 may be installed in other forms in the electronic device, and the embodiments of the present application are not described herein.

In some embodiments, the electrically and thermally conductive medium 21 includes a colloid, and at least one of liquid metal, metal particles, and carbon particles is disposed in the colloid.

It should be noted that, the glue body of the electrically and thermally conductive medium 21 may be provided with only one of the liquid metal, the metal particles, and the carbon particles, or may be provided with any two of the liquid metal, the metal particles, and the carbon particles, or may be provided with the liquid metal, the metal particles, and the carbon particles at the same time.

The colloid has certain bonding capability, so that the colloid can be contacted with the functional module 1 and the heat dissipation module 3 to form a stable heat conduction channel, the generated heat of the functional module 1 can be ensured to be continuously transferred to the heat dissipation module 3, and at least one of liquid metal, metal particles and carbon particles is arranged in the colloid of the electric conduction heat conduction medium 21, so that the integral heat conduction performance of the electric conduction heat conduction medium 21 can be improved, and the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3, thereby realizing the quick heat dissipation of the functional module 1.

Wherein, when the electrically conductive heat conducting medium 21 includes a colloid, the electrically conductive heat conducting medium 21 may be attached to the heat dissipation module 3 and the functional module 1, when the electrically conductive heat conducting medium 21 is provided with the second insulating heat conducting member 23 toward the side of the heat dissipation module 3, the electrically conductive heat conducting medium 21 may be attached to the second insulating heat conducting member 23, and when the electrically conductive heat conducting medium 21 is provided with the first insulating heat conducting member 22 toward the side of the heat dissipation module 3, the electrically conductive heat conducting medium 21 may be attached to the first insulating heat conducting member 22. It can be understood that the fluidity of the colloid is weak, that is, the flow resistance of the electrically and thermally conductive medium 21 is large, and when the electrically and thermally conductive medium 21 is disposed between the functional module 1 and the heat dissipation module 3, the electrically and thermally conductive medium 21 is difficult to flow out of the gap between the functional module 1 and the heat dissipation module 3 by virtue of the fluidity thereof.

Illustratively, the electrically and thermally conductive medium 21 may be a liquid Jin Guizhi, which includes silicone grease and liquid gallium indium alloy mixed in the silicone grease.

In other embodiments, the electrically and thermally conductive medium 21 may be a liquid metal. Common liquid metals are mercury, gallium-based alloys (e.g., gallium indium alloy, gallium indium tin alloy, etc.), sodium potassium alloys, etc. In addition, the liquid metal has certain fluidity, and can change the appearance of the liquid metal to be filled in the gap between the functional module 1 and the heat dissipation module 3, so that the liquid metal can be stably contacted with the functional module 1 and the heat dissipation module 3 to form a stable heat conduction channel.

In some embodiments, the liquid metal comprises a gallium-based alloy and/or a sodium-potassium alloy, i.e., the liquid metal may be a gallium-based alloy, a sodium-potassium alloy, or a mixture of a gallium-based alloy and a sodium-potassium alloy.

The gallium-based alloy and the sodium-potassium alloy can be kept in a liquid state at normal temperature (25 ℃), so that the electric conduction and heat conduction medium 21 can be in good contact with the functional module 1 and the heat dissipation module 3, and heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3. In addition, the gallium-based alloy and the sodium-potassium alloy have good stability and are not easy to volatilize at normal temperature, so that the pollution to the environment can be reduced, and the safety of users is ensured.

It should be noted that, when the electrically conductive and thermally conductive medium 21 is a liquid metal, the electrically conductive and thermally conductive medium 21 may be attached to the heat dissipation module 3 and the functional module 1, when the electrically conductive and thermally conductive medium 21 is provided with the second insulating and thermally conductive member 23 toward the side of the heat dissipation module 3, the electrically conductive and thermally conductive medium 21 may be attached to the second insulating and thermally conductive member 23, and when the electrically conductive and thermally conductive medium 21 is provided with the first insulating and thermally conductive member 22 toward the side of the heat dissipation module 3, the electrically conductive and thermally conductive medium 21 may be attached to the first insulating and thermally conductive member 22. It can be understood that the fluidity of the liquid metal is weak, that is, the flow resistance of the electrically and thermally conductive medium 21 is large, and when the electrically and thermally conductive medium 21 is disposed between the functional module 1 and the heat dissipation module 3, the electrically and thermally conductive medium 21 is difficult to flow out of the gap between the functional module 1 and the heat dissipation module 3 depending on the fluidity thereof.

Referring to fig. 9, in some embodiments, the electronic device further includes an insulation limiting portion 4 surrounding the electrically and thermally conductive medium 21, and the end portions of the insulation limiting portion 4 are respectively in contact with the functional module 1 and the heat dissipation module 3, so that the electrically and thermally conductive medium 21 is located in the central empty area of the insulation limiting portion 4.

It should be noted that, when the electrically and thermally conductive medium 21 is extruded by the heat dissipation module 3 and the functional module 1, the electrically and thermally conductive medium 21 may flow toward two sides, and if the electrically and thermally conductive medium 21 flows to approach the insulating limiting portion 4, the inner side surface of the insulating limiting portion 4 may abut against the edge of the electrically and thermally conductive medium 21, so that the electrically and thermally conductive medium 21 may be always located in the central empty area of the insulating limiting portion 4.

The end parts of the insulation limiting parts 4 are respectively contacted with the functional module 1 and the heat dissipation module 3, and the insulation limiting parts 4 are arranged on the periphery of the electric conduction and heat conduction medium 21 in a surrounding mode, so that the inner side surfaces of the insulation limiting parts 4 can limit the flow of the electric conduction and heat conduction medium 21, the central empty area of the insulation limiting parts 4 is reduced when the electric conduction and heat conduction medium 21 flows out, the contact probability of the electric conduction and heat conduction medium 21 and other electronic elements in the electronic equipment is reduced, and the stability of the electronic equipment is ensured.

In some embodiments, the insulating limiting portion 4 may be integrated in the functional module 1, after the functional module 1 and the heat dissipation module 3 are assembled, an end portion of the insulating limiting portion 4, which is away from the functional module 1, may be in contact with the heat dissipation module 3, in other embodiments, the insulating limiting portion 4 may be integrated in the heat dissipation module 3, and after the functional module 1 and the heat dissipation module 3 are assembled, an end portion of the insulating limiting portion 4, which is away from the heat dissipation module 3, may be in contact with the functional module 1.

Fig. 10 is a schematic cross-sectional top view of an insulation limiting portion 4 according to an embodiment of the present application. Referring to (a) of fig. 10, in some embodiments, the cross-sectional shape of the insulating and limiting portion 4 may be a circular ring shape, referring to (b) of fig. 10, in other embodiments, the cross-sectional shape of the insulating and limiting portion 4 may be a square ring shape, referring to (c) of fig. 10, the cross-sectional shape of the insulating and limiting portion 4 may be irregular, and the cross-sectional shape of the insulating and limiting portion 4 may be designed according to the actual shapes of the functional module 1 and the heat dissipation module 3, which is not limited herein.

In some embodiments, the insulating limiting portion 4 is a foam piece, a glass fiber piece, or a ceramic fiber piece. In other embodiments, the insulating limiting portion 4 may be made of other insulating materials, which is not limited herein.

The insulating limiting part 4 is arranged to be a foam piece, a glass fiber cotton piece or a ceramic fiber cotton piece, so that the insulating performance of the insulating limiting part 4 can be effectively ensured, the possibility that the electric conduction and heat conduction medium 21 flows out of a central empty area of the insulating limiting part 4 is reduced, the probability that the electric conduction and heat conduction medium 21 contacts with other electronic elements in the electronic equipment is reduced, and the stability of the electronic equipment is ensured.

Fig. 11 is a schematic structural view of an electronic device according to another embodiment of the present application, and fig. 12 is a schematic structural view of an electronic device according to another embodiment of the present application. Referring to fig. 11 and 12, in some embodiments, the electronic device may not be provided with the insulating limiting portion 4, and at this time, the coverage of the electrically and thermally conductive medium 21 may be reduced by controlling the amount of the electrically and thermally conductive medium 21, so as to reduce the probability that the electrically and thermally conductive medium 21 contacts other electronic components in the electronic device, thereby ensuring the stability of the electronic device.

The first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 are respectively disposed on two sides of the conductive and heat conducting medium 21 of the electronic device shown in fig. 9, the insulating and heat conducting portion 4 is disposed on the periphery of the conductive and heat conducting medium 21, the first insulating and heat conducting member 22 is disposed on the side, facing the component 12, of the conductive and heat conducting medium 21 of the electronic device shown in fig. 11, the second insulating and heat conducting member 23 is not disposed on the side, facing the heat dissipation module 3, of the conductive and heat conducting medium 21, the insulating and heat conducting portion 4 is not disposed on the periphery of the conductive and heat conducting medium 21 of the electronic device shown in fig. 12, the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 are respectively disposed on two sides of the conductive and heat conducting medium 21, and the insulating and heat conducting portion 4 is not disposed on the periphery of the conductive and heat conducting medium 21. That is, the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 may be arranged in any way, and the insulating and limiting portion 4 may or may not be arranged in the electronic device.

Referring to fig. 9, the functional module 1 includes a circuit board 11 and a component 12 disposed on the circuit board 11, and an electrically and thermally conductive medium 21 contacts a side of the component 12 facing away from the circuit board 11.

The component 12 is a basic component in an electronic circuit, and has specific electrical performance and functions for realizing various operations such as signal processing and energy conversion of an electronic device. Such as a processor chip in a cell phone, a memory chip, an image sensor in a camera module, etc., are all components 12.

It can be understood that in the operation process of the functional module 1, the heat generated by the component 12 is more, the conductive heat-conducting medium 21 contacts with one side of the component 12 away from the circuit board 11, and the heat generated by the component 12 can be directly transferred to the heat dissipation module 3 through the conductive heat-conducting medium 21, so that the heat absorbed by the circuit board 11 can be reduced, the temperature of the circuit board 11 can be reduced, and the influence on other components 12 connected with the circuit board 11 can be reduced.

Fig. 13 is a schematic structural view of an electronic device according to another embodiment of the present application, fig. 14 is a schematic structural view of an electronic device according to another embodiment of the present application, fig. 15 is a schematic structural view of an electronic device according to another embodiment of the present application, and fig. 16 is a schematic structural view of an electronic device according to another embodiment of the present application. Referring to fig. 13 to 16, the circuit board 11 is further provided with a shield member 13, and the component 12 is located in a shield region 133 of the shield member 13, and the electrically and thermally conductive medium 21 is in contact with the component 12 through the shield member 13.

Note that, the electronic device shown in fig. 5 is not provided with the shielding member 13, and the conductive and heat-conductive medium 21 may be in contact with the surface of the component 12; the electronic device shown in fig. 9 is not provided with the shielding member 13, a first insulating heat conducting member 22 is arranged on one side of the electric conduction heat conducting medium 21 facing the component 12, the electric conduction heat conducting medium 21 can be contacted with the surface of the component 12 through the first insulating heat conducting member 22, and an insulating limit part 4 is arranged on the periphery of the electric conduction heat conducting medium 21; the electronic device shown in fig. 13 is provided with a shielding member 13, both sides of an electric conduction heat conduction medium 21 are respectively provided with a first insulation heat conduction member 22 and a second insulation heat conduction member 23, both sides of the electric conduction heat conduction medium 21 are respectively provided with the first insulation heat conduction member 22 and the surface of the shielding member 13, the periphery of the electric conduction heat conduction medium 21 is provided with an insulation limit part 4, the electronic device shown in fig. 14 is provided with the shielding member 13, one side of the electric conduction heat conduction medium 21 facing the component 12 is provided with the first insulation heat conduction member 22, the first insulation heat conduction member 22 is attached to the surface of the shielding member 13, one side of the electric conduction heat conduction medium 21 facing the heat radiation module 3 is not provided with the second insulation heat conduction member 23, the periphery of the electric conduction heat conduction medium 21 is not provided with the insulation limit part 4, the electronic device shown in fig. 16 is provided with the shielding member 13, one side of the electric conduction medium 21 facing the component 12 is provided with the first insulation heat conduction member 22, the periphery of the electric conduction medium 21 is not provided with the insulation limit part 4, one side of the electric conduction medium 21 facing the first insulation heat conduction medium 23 is attached to the first insulation heat conduction medium 13, the first insulation heat conduction medium 21 is not provided with the surface of the first insulation heat conduction medium 23, the electronic device shown in fig. 15 is provided with the shielding member 13, both sides of the electric conduction medium 21 are respectively provided with the insulation heat conduction member 22 and the insulation heat conduction part 4 are respectively provided with the insulation limit part 4, and the insulation heat conduction part 4 is respectively, and the insulation heat conduction part 4 is provided with the insulation heat-insulating part 4, and the insulation heat-insulating part and the electric device is respectively. The periphery of the electrically and thermally conductive medium 21 is provided with an insulating stopper 4. That is, the first insulating and heat conducting member 22, the second insulating and heat conducting member 23, and the insulating and limiting portion 4 are arranged anyway, and the shielding member 13 may be disposed or not disposed in the electronic device.

It should be noted that, in some embodiments, a plurality of components 12 may be disposed in the shielding region 133 of the shielding member 13, and in other embodiments, one shielding member 13 may be disposed separately for each component 12, that is, only one component 12 may be disposed in one shielding region 133.

The shielding region 133 of the shielding member 13 can block the components 12 from the external environment, block the external electromagnetic interference outside the shielding region 133, ensure the components 12 in the shielding region 133 to work normally, provide a relatively stable electromagnetic environment for signal transmission, reduce the coupling of signals and the external electromagnetic interference, and further ensure the signal integrity, and in addition, the shielding member 13 can limit the electromagnetic radiation generated by the components 12 within a certain range, reduce the interference of the electromagnetic radiation on other electronic components on the circuit board 11 and surrounding electronic equipment, namely, the shielding member 13 can isolate each component 12 from the signal circuit, inhibit the crosstalk between the signals and ensure that each signal can be transmitted and processed accurately.

In some embodiments, the electrically and thermally conductive medium 21 may contact the surface of the shielding member 13, and the first insulating and thermally conductive member 22 is disposed between the electrically and thermally conductive medium 21 and the shielding member 13, and the first insulating and thermally conductive member 22 may be attached to the surface of the shielding member 13, so that the heat generated by the component 12 can be transferred to the heat dissipation module 3 through the shielding member 13 and the electrically and thermally conductive medium 21. In some embodiments, when the first insulating and heat conducting member 22 is provided with an adhesive layer, the first insulating and heat conducting member 22 may be adhered to the surface of the shielding member 13.

With continued reference to fig. 13, the shielding member 13 includes a frame 131 and a plate 132, where the frame 131 and the plate 132 are connected and enclose to form a shielding region 133, and a side of the frame 131 facing away from the plate 132 is connected to the circuit board 11, and the conductive and heat-conductive medium 21 contacts a side of the plate 132 facing away from the component 12.

The shielding member 13 formed by enclosing the frame 131 and the plate 132 has definite geometric shapes and boundaries, is convenient to determine the position and the direction of the shielding member when being mounted on the circuit board 11 or equipment, can be accurately matched with other components, improves the mounting efficiency and the accuracy, and reduces the problems of poor shielding effect or interference with other components caused by improper mounting. The structural forms of the frame 131 and the board 132 make it easy to integrate with other structural components of the electronic device. For example, the frame 131 may be designed to match with the edge of the circuit board 11 or other fixing structures, and the board 132 may be customized according to requirements, so as to adapt to different installation spaces and functional requirements, and realize an integrated design of the shielding member 13 and the whole device structure. In addition, the frame 131 and the plate 132 are connected with each other, so as to block electromagnetic signals from entering and exiting the shielding region 133 from all directions, and compared with a partially open shielding structure, the shielding structure can provide more comprehensive and efficient electromagnetic shielding, ensure that the internal electronic components are prevented from being interfered by external electromagnetic interference, and prevent electromagnetic radiation generated in the internal electronic components from affecting the outside.

In some embodiments, the frame 131 and the plate 132 may be made of metal materials, so that the shielding effect of the shielding member 13 on the signal can be improved, and in addition, the heat generated by the component 12 can be rapidly transferred to the heat dissipation module 3 through the shielding member 13 and the conductive and heat-conductive medium 21, so that the heat dissipation effect on the component 12 is improved. Illustratively, the frame 131 and the plate 132 may be made of copper, silver, gold, or other metals, and the frame 131 and the plate 132 may be made of the same or different materials.

In some embodiments, the edges of the plate 132 may be adhered to the end face of the frame 131. In other embodiments, fasteners such as screws may be used to attach the plate 132 to the frame 131.

In some embodiments, the frame 131 and the plate 132 may be integrally connected by welding, so as to form the integrated shielding member 13, so that the possibility of a gap between the frame 131 and the plate 132 may be reduced, and the shielding capability of the shielding member 13 may be improved.

With continued reference to fig. 13, in some embodiments, the inner side surface of the insulating and limiting portion 4 surrounding the electrically and thermally conductive medium 21 may abut against the peripheral side surface of the shielding member 13, and illustratively, the inner side surface of the insulating and limiting portion 4 may abut against the peripheral side surface of the frame 131, so that a path of the electrically and thermally conductive medium 21 flowing to the circuit board 11 may be blocked, and the probability of short-circuiting of the circuit board 11 is reduced.

With continued reference to fig. 13, the electronic device further includes a supporting portion 5, and the supporting portion 5 is connected to the circuit board 11 and the heat dissipation module 3, respectively, so that the heat dissipation module 3 is spaced apart from the circuit board 11.

The supporting part 5 is arranged between the circuit board 11 and the heat radiation module 3, and two ends of the supporting part 5 are respectively connected with the circuit board 11 and the heat radiation module 3, so that the size of a gap between the circuit board 11 and the heat radiation module 3 is stable, and the electric conduction heat conduction medium 21 can be stably contacted with the component 12 and the heat radiation module 3, so that heat generated by the component 12 can be stably transferred to the heat radiation module 3.

According to the electronic equipment provided by the embodiment of the application, the functional module 1 and the heat radiation module 3 are connected in an insulating way by using the first insulating heat conducting piece 22, the heat radiation module 3 and the functional module 1 are not electrically conducted due to the electric conduction heat conducting medium 21, so that the problem of electromagnetic compatibility (such as radiation stray) can be reduced, the overall performance and reliability of the electronic equipment can be improved, the electronic equipment uses the electric conduction heat conducting medium 21 to enable the heat of the functional module 1 to be transferred to the heat radiation module 3, the heat radiation speed of the components 12 in the functional module 1 can be ensured, the possibility of faults caused by overheat of the components 12 is reduced, and the electronic equipment can continuously run at a high speed. In addition, the first insulating and heat conducting member 22 is of an independent structure, and the position of the first insulating and heat conducting member 22 can be flexibly set according to the design requirements of the functional module 1 and the heat dissipation module 3, so that the electronic equipment can be conveniently installed.

Referring to fig. 2, 3 and 6, an electrical connection assembly is further provided according to an embodiment of the present application, which includes an electrically conductive and thermally conductive medium 21, a heat dissipation module 3 and a functional module 1, wherein the electrically conductive and thermally conductive medium 21 is disposed between the heat dissipation module 3 and the functional module 1 to conduct heat generated by the functional module 1 to the heat dissipation module 3, and an insulating and thermally conductive member is disposed between the heat dissipation module 3 and the functional module 1, and referring to fig. 3, in some embodiments, the insulating and thermally conductive member is disposed on a side of the electrically conductive and thermally conductive medium 21 facing the heat dissipation module 3, and referring to fig. 2, in other embodiments, the insulating and thermally conductive member is disposed on a side of the electrically conductive and thermally conductive medium 21 facing the functional module 1, and in still other embodiments, the insulating and thermally conductive member is disposed on a side of the electrically conductive and thermally conductive medium 21 facing the functional module 1, respectively, so as to make an insulating connection between the heat dissipation module 3 and the functional module 1.

The electric connection component in the embodiment of the application is characterized in that the electric conduction and heat conduction medium 21 is arranged between the functional module 1 and the heat dissipation module 3, so that heat generated by the functional module 1 can be timely transferred to the heat dissipation module 3, accumulation of heat in the functional module 1 is reduced, the overall performance of the electric connection component is ensured, the electric conduction and heat conduction component is arranged between the functional module 1 and the heat dissipation module 3, the electric conduction and heat conduction component can realize electric conduction between the heat dissipation module 3 and the functional module 1, the heat dissipation module 3 and the functional module 1 cannot generate electric conduction due to the electric conduction and heat conduction medium 21, the electromagnetic compatibility (such as radiation stray) problem can be reduced, and the overall performance and reliability of the electric connection component can be improved. In addition, the insulating heat conduction piece is independent structure, can set up the position of insulating heat conduction piece in a flexible way according to the design demand of function module 1 and heat dissipation module 3, and insulating heat conduction piece can set up between electrically conductive heat conduction medium 21 and function module 1, or set up between electrically conductive heat conduction medium 21 and heat dissipation module 3 to realize the easy to assemble of electric connection subassembly.

The insulating and heat conducting member provided between the electrically conductive and heat conducting medium 21 and the functional module 1 may be referred to as a first insulating and heat conducting member 22, and the insulating and heat conducting member provided between the electrically conductive and heat conducting medium 21 and the heat dissipation module 3 may be referred to as a second insulating and heat conducting member 23.

In some embodiments, the electrical connection assembly may be applied to the electronic device in any of the above embodiments, so that the electrical conduction medium 21, the first insulating and heat conducting member 22, the second insulating and heat conducting member 23, the heat dissipation module 3, and the functional module 1 of the electrical connection assembly correspond to the electrical conduction medium 21, the first insulating and heat conducting member 22, the second insulating and heat conducting member 23, the heat dissipation module 3, and the functional module 1 of the electronic device in any of the above embodiments, respectively.

Referring to fig. 6 to 9, in some embodiments, the insulating and heat conducting member includes an insulating layer and a heat conducting layer laminated on one side of the insulating layer, and the insulating layer is disposed between the heat conducting layer and the electrically and thermally conductive medium 21 or the heat conducting layer is disposed between the insulating layer and the electrically and thermally conductive medium 21.

Use insulating layer and the heat conduction layer composition insulating heat conduction spare of range upon range of setting, the insulating layer can play insulating effect, realizes the insulating connection between functional module 1 and the heat dissipation module 3, and the heat conduction layer can promote the heat conduction ability of insulating heat conduction spare to guarantee that the heat that functional module 1 produced can transmit to the heat dissipation module 3 fast. In addition, the layered insulating layer has a larger area, thereby ensuring insulation between the functional module 1 and the heat dissipation module 3, reducing the possibility of electrical conduction between the functional module 1 and the heat dissipation module 3, and helping to ensure the performance of the electrical connection assembly.

In some embodiments, the thermally conductive layer comprises at least one of a graphite layer, a boron nitride layer, and a metal layer.

It should be noted that, in some embodiments, the heat conducting layer may be a single layer structure, which may be a graphite layer, a boron nitride layer, or a metal layer, and in other embodiments, the heat conducting layer may be a multi-layer structure, which may include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer, and the number of heat conducting layers may be two, three, four, five or more, which is not limited herein. In some embodiments, when the heat conductive layers are provided with multiple layers, the insulating layer may or may not be sandwiched between two heat conductive layers.

The graphite layer, the boron nitride layer and the metal layer are strong in heat conduction capacity, and the heat conduction layer formed by at least one of the graphite layer, the boron nitride layer and the metal layer has high heat conduction capacity, so that the whole heat conduction capacity of the insulating heat conduction piece can be improved, and heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

In some embodiments, the insulating layer comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

It should be noted that in some embodiments, the insulating layer may be a single layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer, and in other embodiments, the insulating layer may be a multi-layer structure, which may include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer, as examples. The number of insulating layers may be two, three, four, five or more, and embodiments of the present application are not limited in this regard. In some embodiments, when the insulating layers are provided with multiple layers, the heat conducting layer may or may not be sandwiched between two insulating layers.

The insulating and heat conducting member provided between the electrically conductive and heat conducting medium 21 and the functional module 1 may be referred to as a first insulating and heat conducting member 22, in which case the heat conducting layer and the insulating layer of the first insulating and heat conducting member 22 may be referred to as a first heat conducting layer 221 and a first insulating layer 222, respectively, and the insulating and heat conducting member provided between the electrically conductive and heat conducting medium 21 and the heat dissipating module 3 may be referred to as a second insulating and heat conducting member 23, in which case the heat conducting layer and the insulating layer of the second insulating and heat conducting member may be referred to as a second heat conducting layer 231 and a second insulating layer 232, respectively. In addition, the sizes, structures and materials of the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 may be the same, and in other embodiments, the sizes, structures and materials of the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 may be different.

When the electrical connection assembly is applied to the electronic device in any of the above embodiments, the first heat conductive layer 221, the first insulating layer 222, the second heat conductive layer 231, and the second insulating layer 232 of the electrical connection assembly correspond to the first heat conductive layer 221, the first insulating layer 222, the second heat conductive layer 231, and the second insulating layer 232 of the electronic device in any of the above embodiments, respectively.

In some embodiments, the electrically and thermally conductive medium 21 of the electrical connection assembly includes a gel, and at least one of liquid metal, metal particles, and carbon particles is disposed in the gel.

It should be noted that, the colloid of the conductive and heat-conductive medium 21 may be provided with only one of the liquid metal, the metal particles, and the carbon particles, or may be provided with any two of the liquid metal, the metal particles, and the carbon particles, or may be provided with the liquid metal, the metal particles, and the carbon at the same time

Wherein, when the electrically conductive heat conduction medium 21 includes the colloid, the electrically conductive heat conduction medium 21 can be attached between the heat dissipation module 3 and the functional module 1, when the electrically conductive heat conduction medium 21 is provided with an insulating heat conduction member toward one side of the heat dissipation module 3, the electrically conductive heat conduction medium 21 can be attached to the insulating heat conduction member, and when the electrically conductive heat conduction medium 21 is provided with an insulating heat conduction member toward one side of the heat dissipation module 3, the electrically conductive heat conduction medium 21 can be attached to the insulating heat conduction member. It can be understood that the fluidity of the colloid is weak, that is, the flow resistance of the electrically and thermally conductive medium 21 is large, and when the electrically and thermally conductive medium 21 is disposed between the functional module 1 and the heat dissipation module 3, the electrically and thermally conductive medium 21 is difficult to flow out of the gap between the functional module 1 and the heat dissipation module 3 by virtue of the fluidity thereof.

It should be noted that, when the electrically conductive and thermally conductive medium 21 is a liquid metal, the electrically conductive and thermally conductive medium 21 may be attached between the heat dissipation module 3 and the functional module 1, when the electrically conductive and thermally conductive medium 21 is provided with the second insulating and thermally conductive member 23 toward the side of the heat dissipation module 3, the electrically conductive and thermally conductive medium 21 may be attached to the second insulating and thermally conductive member 23, and when the electrically conductive and thermally conductive medium 21 is provided with the first insulating and thermally conductive member 22 toward the side of the heat dissipation module 3, the electrically conductive and thermally conductive medium 21 may be attached to the first insulating and thermally conductive member 22. It can be understood that the fluidity of the liquid metal is weak, that is, the flow resistance of the electrically and thermally conductive medium 21 is large, and when the electrically and thermally conductive medium 21 is disposed between the functional module 1 and the heat dissipation module 3, the electrically and thermally conductive medium 21 is difficult to flow out of the gap between the functional module 1 and the heat dissipation module 3 depending on the fluidity thereof.

Referring to fig. 9, in some embodiments, the electrical connection assembly further includes an insulation limiting portion 4 surrounding the electrically and thermally conductive medium 21, and the end portions of the insulation limiting portion 4 are respectively in contact with the functional module 1 and the heat dissipation module 3, so that the electrically and thermally conductive medium 21 is located in the central empty area of the insulation limiting portion 4.

The end parts of the insulation limiting parts 4 are respectively contacted with the functional module 1 and the heat dissipation module 3, and the insulation limiting parts 4 are arranged on the periphery of the electric conduction and heat conduction medium 21 in a surrounding mode, so that the inner side surfaces of the insulation limiting parts 4 can limit the flow of the electric conduction and heat conduction medium 21, the possibility that the electric conduction and heat conduction medium 21 flows out of the central empty area of the insulation limiting parts 4 is reduced, the contact probability of the electric conduction and heat conduction medium 21 and other electronic elements is reduced, and the stability of the electric connection assembly is guaranteed.

Referring to (a) of fig. 10, in some embodiments, the cross-sectional shape of the insulating and limiting portion 4 may be a circular ring shape, referring to (b) of fig. 10, in other embodiments, the cross-sectional shape of the insulating and limiting portion 4 may be a square ring shape, referring to (c) of fig. 10, the cross-sectional shape of the insulating and limiting portion 4 may be irregular, and the cross-sectional shape of the insulating and limiting portion 4 may be designed according to the actual shapes of the functional module 1 and the heat dissipation module 3, which is not limited herein.

The insulating limiting part 4 is arranged to be a foam piece, a glass fiber cotton piece or a ceramic fiber cotton piece, so that the insulating performance of the insulating limiting part 4 can be effectively ensured, the central empty area of the insulating limiting part 4 is reduced when the electric conduction heat conduction medium 21 flows out, the contact probability of the electric conduction heat conduction medium 21 and other electronic elements is reduced, and the stability of the electric connection assembly is ensured.

When the electrical connection assembly is applied to the electronic device in any of the above embodiments, the insulating stopper 4 of the electrical connection assembly corresponds to the insulating stopper 4 of the electronic device in any of the above embodiments.

Referring to fig. 11 and 12, in some embodiments, the electrical connection assembly may not be provided with the insulation limiting portion 4, and at this time, the coverage of the electrically and thermally conductive medium 21 may be reduced by controlling the amount of the electrically and thermally conductive medium 21, so as to reduce the probability that the electrically and thermally conductive medium 21 contacts other electronic components, thereby ensuring the stability of the electrical connection assembly.

The first insulating heat conducting member 22 and the second insulating heat conducting member 23 are respectively disposed on two sides of the conductive heat conducting medium 21 shown in fig. 9, the insulating limit portion 4 is disposed on the periphery of the conductive heat conducting medium 21, the first insulating heat conducting member 22 is disposed on the side, facing the component 12, of the conductive heat conducting medium 21 shown in fig. 11, the second insulating heat conducting member 23 is not disposed on the side, facing the heat dissipation module 3, of the conductive heat conducting medium 21, the insulating limit portion 4 is not disposed on the periphery of the conductive heat conducting medium 21, the first insulating heat conducting member 22 and the second insulating heat conducting member 23 are respectively disposed on two sides of the conductive heat conducting medium 21 shown in fig. 12, and the insulating limit portion 4 is not disposed on the periphery of the conductive heat conducting medium 21. That is, the first insulating and heat conducting member 22 and the second insulating and heat conducting member 23 are arranged anyway, and the electrical connection assembly may be provided with or without the insulating and limiting portion 4.

Referring to fig. 13 to 16, the circuit board 11 is further provided with a shield member 13, and the component 12 is located in a shield region 133 of the shield member 13, and the electrically and thermally conductive medium 21 is in contact with the component 12 through the shield member 13.

It should be noted that, the electrical connection assembly shown in fig. 5 is not provided with the shielding member 13, and the conductive and heat-conductive medium 21 may contact the surface of the component 12; the electric connection assembly shown in fig. 9 is not provided with a shielding piece 13, one side of an electric conduction heat conduction medium 21 facing a component 12 is provided with a first insulation heat conduction piece 22, the electric conduction heat conduction medium 21 can be contacted with the surface of the component 12 through the first insulation heat conduction piece 22, the electric connection assembly shown in fig. 13 is provided with the shielding piece 13, two sides of the electric conduction heat conduction medium 21 are respectively provided with the first insulation heat conduction piece 22 and a second insulation heat conduction piece 23, the first insulation heat conduction piece 22 is attached to the surface of the shielding piece 13, the periphery of the electric conduction heat conduction medium 21 is provided with an insulation limiting part 4, one side of the electric conduction heat conduction medium 21 facing the component 12 is provided with the first insulation heat conduction medium 22, the first insulation heat conduction medium 22 is attached to the surface of the shielding piece 13, one side of the electric conduction medium 21 facing the heat dissipation module 3 is not provided with a second insulation heat conduction medium 23, the periphery of the electric conduction medium 21 is not provided with the insulation limiting part 4, two sides of the electric conduction medium 21 are respectively provided with the first insulation heat conduction medium 22 and the second insulation heat conduction medium 23, the electric conduction medium 21 is attached to the surface of the shielding piece 13, the electric conduction medium 21 is contacted with the first insulation heat conduction medium 21 is not provided with the surface of the insulation heat conduction medium 21, the electric conduction medium 21 is contacted with the surface of the first insulation part 16, the electric conduction medium is contacted with the electric conduction medium 21 is not provided with the surface of the insulation part 16, and the electric conduction medium is contacted with the electric conduction medium 21 is contacted with the surface of the electric conduction medium 12, and the electric conduction medium is not is provided with the electric conduction medium 1, and the electric conduction medium 21 is contacted with the surface of the component 12, and is not is contacted with the electric conduction medium 12, and is heated to the electric conduction medium is heated. That is, the first insulating and heat conducting member 22, the second insulating and heat conducting member 23, and the insulating and limiting portion 4 are arranged anyway, and the electrical connection assembly may be provided or not provided with the shielding member 13.

In some embodiments, when the electrical connection assembly is applied to the electronic device in any of the above embodiments, the shield 13 of the electrical connection assembly corresponds to the shield 13 of the electronic device in any of the above embodiments.

The shielding member 13 formed by enclosing the frame 131 and the plate 132 has definite geometric shapes and boundaries, is convenient to determine the position and the direction of the shielding member when being mounted on the circuit board 11 or equipment, can be accurately matched with other components, improves the mounting efficiency and the accuracy, and reduces the problems of poor shielding effect or interference with other components caused by improper mounting. The frame 131 and the plate 132 are constructed in such a manner that they are easily integrated with other structural members. For example, the frame 131 may be designed to match with the edge of the circuit board 11 or other fixing structures, and the board 132 may be customized according to requirements, so as to adapt to different installation spaces and functional requirements, and realize an integrated design of the shielding member 13 and the whole device structure. In addition, the frame 131 and the plate 132 are connected with each other, so as to block electromagnetic signals from entering and exiting the shielding region 133 from all directions, and compared with a partially open shielding structure, the shielding structure can provide more comprehensive and efficient electromagnetic shielding, ensure that the internal electronic components are prevented from being interfered by external electromagnetic interference, and prevent electromagnetic radiation generated in the internal electronic components from affecting the outside.

In some embodiments, when the electrical connection assembly is applied to the electronic device in any of the above embodiments, the frame 131 and the board 132 of the electrical connection assembly correspond to the frame 131 and the board 132 of the electronic device in any of the above embodiments.

In some embodiments, when the electrical connection assembly is applied to the electronic device in any of the above embodiments, the supporting portion 5 of the electronic device may be disposed between the circuit board 11 and the heat dissipation module 3, and the supporting portion 5 may be connected to the circuit board 11 and the heat dissipation module 3 such that the heat dissipation module 3 is spaced apart from the circuit board 11.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The electronic equipment is characterized by comprising an electric conduction heat conduction medium (21), a heat dissipation module (3) and a functional module (1), wherein the electric conduction heat conduction medium (21) is arranged between the heat dissipation module (3) and the functional module (1) so as to conduct heat generated by the functional module (1) to the heat dissipation module (3);

The heat dissipation module comprises a heat dissipation module (3) and a functional module (1), wherein a first insulating heat conduction piece (22) is further arranged between the heat dissipation module (3) and the functional module (1), the first insulating heat conduction piece (22) is arranged on one side of an electric conduction heat conduction medium (21) facing the heat dissipation module (3), or the first insulating heat conduction piece (22) is arranged on one side of the electric conduction heat conduction medium (21) facing the functional module (1), so that the heat dissipation module (3) is in insulating connection with the functional module (1).

2. The electronic apparatus according to claim 1, wherein the first insulating heat conductive member (22) includes a first insulating layer (222) and a first heat conductive layer (221) laminated on one side of the first insulating layer (222);

The first insulating layer (222) is disposed between the first heat conductive layer (221) and the electrically and thermally conductive medium (21), or the first heat conductive layer (221) is disposed between the first insulating layer (222) and the electrically and thermally conductive medium (21).

3. The electronic device of claim 2, wherein the first thermally conductive layer (221) comprises at least one of a graphite layer, a boron nitride layer, a metal layer.

4. The electronic device of claim 2 or 3, wherein the first insulating layer (222) comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, a polyvinyl chloride layer.

5. The electronic device according to any one of claims 1-4, characterized in that the first insulating heat conducting member (22) is arranged on a side of the electrically and thermally conductive medium (21) facing the functional module (1), and that a side of the electrically and thermally conductive medium (21) facing the heat dissipating module (3) is provided with a second insulating heat conducting member (23) for insulating connection between the electrically and thermally conductive medium (21) and the heat dissipating module (3).

6. The electronic device according to claim 5, wherein the second insulating and heat conducting member (23) includes a second insulating layer (232) and a second heat conducting layer (231) provided on one side of the second insulating layer (232);

The second insulating layer (232) is disposed between the second heat conducting layer (231) and the electrically and thermally conductive medium (21), or the second heat conducting layer (231) is disposed between the second insulating layer (232) and the electrically and thermally conductive medium (21).

7. The electronic device of claim 6, wherein the second thermally conductive layer (231) comprises at least one of a graphite layer, a boron nitride layer, and a metal layer.

8. The electronic device of claim 6 or 7, wherein the second insulating layer (232) comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, a polyvinyl chloride layer.

9. The electronic device according to any one of claims 1-8, wherein the electrically and thermally conductive medium (21) comprises a colloid having at least one of liquid metal, metal particles, carbon particles disposed therein, or,

The electric and heat conducting medium (21) is liquid metal.

10. The electronic device of claim 9, wherein the liquid metal comprises a gallium-based alloy and/or a sodium-potassium alloy.

11. The electronic device according to any one of claims 1-10, further comprising an insulating spacing portion (4) surrounding the electrically and thermally conductive medium (21), wherein the end portions of the insulating spacing portion (4) are respectively in contact with the functional module (1) and the heat dissipation module (3), and the electrically and thermally conductive medium (21) is located in a central empty area of the insulating spacing portion (4).

12. The electronic device of claim 11, wherein the insulating limiting portion is a foam piece, a glass fiber piece, or a ceramic fiber piece.

13. Electronic device according to any of claims 1-12, characterized in that the functional module (1) comprises a circuit board (11) and components (12) arranged on the circuit board (11), the electrically and thermally conductive medium (21) being in contact with a side of the components (12) facing away from the circuit board (11).

14. Electronic device according to claim 13, characterized in that the circuit board (11) is further provided with a shielding member (13), the component (12) being located in a shielding area (133) of the shielding member (13), the electrically and thermally conductive medium (21) being in contact with the component (12) via the shielding member (13).

15. The electronic device according to claim 14, characterized in that the shielding member (13) comprises a frame body (131) and a plate body (132), the frame body (131) and the plate body (132) are connected and enclose to form the shielding area (133), a side of the frame body (131) facing away from the plate body (132) is connected with the circuit board (11), and the electrically and thermally conductive medium (21) contacts with a side of the plate body (132) facing away from the component (12).

16. Electronic device according to any of claims 13-15, characterized in that the electronic device further comprises a support part (5), the support part (5) being connected to the circuit board (11) and the heat sink module (3), respectively, such that the heat sink module (3) is spaced from the circuit board (11).

17. The electric connection assembly is characterized by comprising an electric conduction heat conduction medium (21), a heat dissipation module (3) and a functional module (1), wherein the electric conduction heat conduction medium (21) is arranged between the heat dissipation module (3) and the functional module (1) so as to conduct heat generated by the functional module (1) to the heat dissipation module (3);

The heat dissipation module (3) and the functional module (1) are further provided with an insulating heat conduction piece therebetween, the insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium (21) facing the heat dissipation module (3), and/or the insulating heat conduction piece is arranged on one side of the electric conduction heat conduction medium (21) facing the functional module (1), so that the heat dissipation module (3) and the functional module (1) are connected in an insulating manner.

18. The electrical connection assembly of claim 17, wherein the insulating and thermally conductive member comprises an insulating layer and a thermally conductive layer laminated to one side of the insulating layer;

The insulating layer is arranged between the heat conducting layer and the electric conduction heat conducting medium (21), or the heat conducting layer is arranged between the insulating layer and the electric conduction heat conducting medium (21).

19. The electrical connection assembly of claim 18, wherein the thermally conductive layer comprises at least one of a graphite layer, a boron nitride layer, and a metal layer.

20. The electrical connection assembly of claim 18 or 19, wherein the insulating layer comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, a polyvinyl chloride layer.

21. The electrical connection assembly according to any one of claims 17-20, wherein the electrically and thermally conductive medium (21) comprises a gel having at least one of liquid metal, metal particles, carbon particles disposed therein, or,

The electric and heat conducting medium (21) is liquid metal.

22. The electrical connection assembly of claim 21, wherein the liquid metal comprises a gallium-based alloy and/or a sodium-potassium alloy.

23. The electrical connection assembly according to any one of claims 17-22, further comprising an insulating spacing portion (4) surrounding the electrically and thermally conductive medium (21), wherein the end portions of the insulating spacing portion (4) are respectively in contact with the functional module (1) and the heat dissipation module (3), and the electrically and thermally conductive medium (21) is located in a central empty area of the insulating spacing portion (4).

24. The electrical connection assembly of claim 23, wherein the insulating restraining portion is a foam, a fiberglass foam, or a ceramic foam.

25. The electrical connection assembly according to any of claims 17-24, wherein the functional module (1) comprises a circuit board (11) and components (12) arranged on the circuit board (11), the electrically and thermally conductive medium (21) being in contact with a side of the components (12) facing away from the circuit board (11).

26. The electrical connection assembly according to claim 25, wherein a shielding member (13) is further provided on the circuit board (11), the component (12) is located in a shielding region (133) of the shielding member (13), and the electrically and thermally conductive medium (21) is in contact with the component (12) through the shielding member (13).

27. The electrical connection assembly according to claim 26, wherein the shielding member (13) comprises a frame body (131) and a plate body (132), the frame body (131) and the plate body (132) are connected and enclose to form the shielding region (133), a side of the frame body (131) facing away from the plate body (132) is connected with the circuit board (11), and the electrically and thermally conductive medium (21) contacts a side of the plate body (132) facing away from the component (12).