CN224126781U

CN224126781U - A drainage device for semiconductor cutting equipment

Info

Publication number: CN224126781U
Application number: CN202520514873.8U
Authority: CN
Inventors: 闫亚萍; 张毅
Original assignee: Suzhou Nianhe Machinery Technology Co ltd
Current assignee: Suzhou Nianhe Machinery Technology Co ltd
Priority date: 2025-03-24
Filing date: 2025-03-24
Publication date: 2026-04-17
Anticipated expiration: 2035-03-24

Abstract

This utility model discloses a drainage device for semiconductor cutting equipment, including a drainage chamber. A clamp is fixedly installed on the inner wall of the drainage chamber, and a filter plate is inserted and connected to the inner wall of the clamp. A filter element is detachably installed on the inner wall of the filter plate. The inner wall of the drainage chamber is provided with a slope. A drainage assembly is fixedly installed on the outer wall of the bottom left side of the drainage chamber. The drainage assembly includes a first self-priming pump, and the output shaft of the first self-priming pump is connected to a filter through a first conduit. Several filters are provided. This relates to the field of semiconductor cutting equipment technology. By setting up a drainage assembly and installing a first self-priming pump in the drainage assembly, the sewage in the drainage chamber can be accelerated to be sucked into multiple filters when draining. This facilitates the step-by-step filtration of sewage generated for cooling semiconductor cutting equipment through multiple filters, thereby achieving the standard for reuse and improving the water-saving effect of the equipment.

Description

Drainage device of semiconductor cutting equipment

Technical Field

The utility model relates to the technical field of semiconductor cutting equipment, in particular to a drainage device of semiconductor cutting equipment.

Background

Dicing is an important process in semiconductor manufacturing. In operation, semiconductor cutting equipment typically requires cooling and lubrication of the cutting site with a cooling fluid to ensure accuracy and quality of the cut. However, a large amount of coolant wastewater is generated in the cutting process, and the wastewater needs to be discharged in time, otherwise, the normal operation of equipment is affected, even the semiconductor device is possibly damaged, when the wastewater is inconvenient to drain, the wastewater is filtered and reused, so that a large amount of water resources are wasted, and the energy conservation and the environmental protection are not facilitated.

Disclosure of utility model

The present utility model is directed to a drainage device of a semiconductor cutting apparatus, so as to solve the above-mentioned problems in the related art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The utility model provides a drainage device of semiconductor cutting equipment, includes the drainage storehouse, the inner wall fixed mounting splint of drainage storehouse, splint inner wall grafting connection filter, filter inner wall demountable installation filter core, drainage storehouse inner wall is equipped with the slope, drainage storehouse left side bottom outer wall fixed mounting drainage subassembly, drainage subassembly includes first self priming pump, the output shaft of first self priming pump is through first pipe connection filter, the filter is equipped with a plurality of, and terminal filter's output passes through second pipe connection filtration water sump.

In a preferred embodiment of the utility model, the four corners of the bottom end of the drainage bin are fixedly provided with the supporting legs, the first self-priming pump is fixedly arranged on the outer wall of the bottom of the drainage bin, and the input end of the first self-priming pump is fixedly connected with the inner wall of the bottom of the drainage bin in a matched manner through the drainage pipe.

In a preferred embodiment of the utility model, the inner wall of the filter is filled with sand, the filter screen is detachably arranged on the inner wall of the bottom end of the inner wall of the filter, the filter screen is used for limiting sand, the sand diameters in a plurality of filters are distributed from large to small, and the support frame is fixedly arranged on the outer wall of the bottom of the drainage bin.

In a preferred embodiment of the utility model, the outer walls of the supporting frames are welded and connected with arc frames, two arc frames are arranged up and down, and the top and bottom outer walls of the filter are respectively matched and clamped with the upper arc frame and the lower arc frame.

In a preferred embodiment of the utility model, the top of the filtering water bin is fixedly arranged at the top of the drainage bin through a supporting rod, and the outer wall of the front end of the filtering water bin is fixedly provided with a visual window.

In a preferred embodiment of the utility model, a second self-priming pump is fixedly arranged on the outer wall of the bottom end of the filtering water sump, and the input end of the second self-priming pump is connected with the inner wall of the filtering water sump.

In a preferred embodiment of the utility model, the output end of the second self-priming pump is fixedly connected with a water return pipe, and the output end of the water return pipe carries out supplementary spray cooling on the semiconductor cutting position through a spray head.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

1. By arranging the drainage assembly, when the first self-priming pump is arranged in the drainage assembly to drain the sewage in the drainage bin, the sewage in the drainage bin can be accelerated to be sucked into the plurality of filters, so that the sewage after the semiconductor cutting equipment is cooled is filtered step by step through the plurality of filters, the reuse standard is achieved, and the water saving effect of the equipment is improved conveniently;

2. Through setting up the grit of different diameters as the material of filtration sewage to can not produce the consumptive material, use the back to the grit, can wash the back to the grit, can reuse, not produce the consumptive material, improve practicality and the economic nature that equipment used.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic view showing a front view of a drain device of a semiconductor cutting apparatus;

FIG. 2 is a schematic top view of a drain of a semiconductor cutting apparatus;

FIG. 3 is a schematic view of a coarse filter plate in a drain of a semiconductor cutting apparatus;

Fig. 4 is a schematic view showing a bottom view of a drain device of a semiconductor cutting apparatus;

FIG. 5 is a schematic view showing a structure of a drain assembly in a drain device of a semiconductor cutting apparatus;

fig. 6 is a schematic view of a structure of a filtering sump in a drain of a semiconductor cutting apparatus.

In the figure, a drainage bin 100, a clamping plate 110, a filter plate 120, a filter element 130, supporting legs 140,

The drainage assembly, the first self priming pump 200, the drainage pipe 210, the first conduit 220, the support frame 230, the arc-shaped frame 231, the filter 240, the filtration sump 300, the second conduit 310, the support rod 320, the visual window 330, the second self priming pump 340 and the return pipe 341.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

1, As shown in fig. 1-4, the filter plate filter comprises a drainage bin 100, clamping plates 110 are fixedly arranged on the inner wall of the drainage bin 100, the inner wall of each clamping plate 110 is connected with a filter plate 120 in an inserting mode, filter elements 130 are detachably arranged on the inner wall of each filter plate 120, slopes are arranged on the inner wall of the drainage bin 100, a drainage assembly is fixedly arranged on the outer wall of the left bottom of the drainage bin 100, the drainage assembly comprises a first self-priming pump 200, an output shaft of the first self-priming pump 200 is connected with a plurality of filters 240 through a first guide pipe 220, and the output ends of the end filters 240 are connected with a filter water bin 300 through second guide pipes 310.

The concrete use scene of this embodiment is that through setting up the drainage subassembly, set up the sewage in the drainage subassembly to drainage storehouse 100 in first self priming pump 200, can accelerate the sewage in drainage storehouse 100 to be inhaled into a plurality of filters 240, thereby conveniently make the sewage after the semiconductor cutting equipment cooling use filter step by step through a plurality of filters 240, thereby reach the standard of reuse, the water-saving effect of convenient improvement equipment, through setting up the grit of different diameters as the material of filtering sewage, thereby can not produce the consumptive material, after using the grit, can wash the back to the grit, can reuse, do not produce the consumptive material, practicality and the economic nature of equipment use have been improved.

In embodiment 2, as shown in fig. 1 and 4, the four corners of the bottom end of the drainage bin 100 are fixedly provided with the supporting legs 140, the first self-priming pump 200 is fixedly arranged on the outer wall of the bottom of the drainage bin 100, the input end of the first self-priming pump 200 is fixedly connected with the inner wall of the bottom of the drainage bin 100 through the drain pipe 210, the inner wall of the filter 240 is filled with sand, the inner wall of the bottom end of the inner wall of the filter 240 is detachably provided with the filter screen, the filter screen is used for limiting the sand, the diameters of the sand in the plurality of filters 240 are distributed from large to small, the outer wall of the bottom of the drainage bin 100 is fixedly provided with the supporting frame 230, the outer wall of the supporting frame 230 is welded and connected with the arc-shaped frame 231, the two arc-shaped frames 231 are arranged up and down, and the top and the outer wall of the bottom end of the filter 240 are respectively clamped with the upper arc-shaped frame 231 and the lower arc-shaped frame 231 in a matched manner.

The specific use scenario of the embodiment is that by starting the first self-priming pump 200, the sewage after being filtered by the filter element 130 is conveyed to the filter 240 at the initial end by the first self-priming pump 200, the sand in the filter 240 is further filtered, the large-particle semiconductor cutting impurities are filtered, when the sewage sequentially passes through the plurality of filters 240, the sand with different thicknesses is subjected to graded filtration, and the filtered sewage can be reused, so that the effect of saving water is conveniently achieved, and the semiconductor cutting equipment can be kept to work when the water is stopped for a short time.

In embodiment 3, as shown in fig. 4 and 5, the top of the filtration sump 300 is fixedly installed at the top of the drainage sump 100 through a supporting rod 320, a visual window 330 is fixedly installed on the outer wall of the front end of the filtration sump 300, a second self-priming pump 340 is fixedly installed on the outer wall of the bottom end of the filtration sump 300, the input end of the second self-priming pump 340 is connected with the inner wall of the filtration sump 300, the output end of the second self-priming pump 340 is fixedly connected with a water return pipe 341, and the output end of the water return pipe 341 carries out supplementary spray cooling on a semiconductor cutting position through a spray head.

The specific use scene of the embodiment is that the cleanliness of the filtered water in the filtered water bin 300 is checked through the visual window 330, and then the water in the filtered water bin 300 is conveyed to the semiconductor cutting part for spraying by starting the second self-priming pump 340, so that the cooling and heat dissipation of the cutting sheets are performed.

The working principle of the utility model is that when a person skilled in the art uses the utility model, spray water for cooling the semiconductor cutting equipment is guided into the drain bin 100, sewage flows to the filter plate 120 under the action of gravity through a ramp, after being filtered through the filter element 130, the first self-priming pump 200 is started to enable the first self-priming pump 200 to filter the sewage after the filter element 130, the sewage is conveyed into the filter 240 at the initial end, sand and stone in the filter 240 are further filtered, when the sewage sequentially passes through a plurality of filters 240, the sand and stone with different thicknesses are subjected to graded filtration, so that the filtered sewage can be reused, the filtered water is conveyed into the filter water bin 300, the filtered water in the filter water bin 300 is checked for cleanliness through the visual window 330, and then the water in the filter water bin 300 is conveyed to the semiconductor cutting part to cool the cutting piece through the second self-priming pump 340.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims

1. A drainage device for a semiconductor cutting equipment, comprising a drainage chamber (100), wherein a clamping plate (110) is fixedly installed on the inner wall of the drainage chamber (100), and a filter plate (120) is inserted and connected to the inner wall of the clamping plate (110), characterized in that a filter element (130) is detachably installed on the inner wall of the filter plate (120), the inner wall of the drainage chamber (100) is provided with a slope, and a drainage assembly is fixedly installed on the outer wall of the bottom left side of the drainage chamber (100), the drainage assembly comprising a first self-priming pump (200), the output shaft of the first self-priming pump (200) being connected to a filter (240) through a first conduit (220), the filter (240) being provided with a plurality of filters, and the output end of the end filter (240) being connected to a filter water chamber (300) through a second conduit (310).

2. The drainage device of a semiconductor cutting equipment according to claim 1, characterized in that, support legs (140) are fixedly installed at the four corners of the bottom of the drainage chamber (100), the first self-priming pump (200) is fixedly installed on the bottom outer wall of the drainage chamber (100), and the input end of the first self-priming pump (200) is fixedly connected to the bottom inner wall of the drainage chamber (100) through a drainage pipe (210).

3. A drainage device for a semiconductor cutting equipment according to claim 2, characterized in that the inner wall of the filter (240) is filled with sand and gravel, a filter screen is detachably installed on the bottom inner wall of the filter (240), the filter screen is used to limit the sand and gravel, the diameter of the sand and gravel in the plurality of filters (240) is distributed from large to small, and a support frame (230) is fixedly installed on the bottom outer wall of the drainage chamber (100).

4. A drainage device for a semiconductor cutting equipment according to claim 3, characterized in that an arc-shaped frame (231) is welded to the outer wall of the support frame (230), and two arc-shaped frames (231) are provided at the top and bottom, respectively, and the top and bottom outer walls of the filter (240) are respectively engaged with the upper and lower arc-shaped frames (231).

5. A drainage device for a semiconductor cutting equipment according to claim 1, characterized in that the top of the filter water tank (300) is fixedly installed on the top of the drainage tank (100) by a support rod (320), and a viewing window (330) is fixedly installed on the outer wall of the front end of the filter water tank (300).

6. A drainage device for a semiconductor cutting equipment according to claim 5, characterized in that a second self-priming pump (340) is fixedly installed on the bottom outer wall of the filter water tank (300), and the input end of the second self-priming pump (340) is connected to the inner wall of the filter water tank (300).

7. A drainage device for a semiconductor cutting equipment according to claim 6, characterized in that the output end of the second self-priming pump (340) is fixedly connected to a return water pipe (341), and the output end of the return water pipe (341) provides supplementary spray cooling to the semiconductor cutting area through a nozzle.