CN224111365U - A double-layer circuit single-sided soldered high thermal conductivity aluminum substrate - Google Patents
A double-layer circuit single-sided soldered high thermal conductivity aluminum substrateInfo
- Publication number
- CN224111365U CN224111365U CN202520628347.4U CN202520628347U CN224111365U CN 224111365 U CN224111365 U CN 224111365U CN 202520628347 U CN202520628347 U CN 202520628347U CN 224111365 U CN224111365 U CN 224111365U
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- layer
- circuit
- insulating layer
- circuit layer
- solder paste
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Abstract
A double-layer circuit single-sided welding high-heat-conductivity aluminum substrate comprises an aluminum sheet, a first insulating layer, a second insulating layer, a circuit layer, a through hole, solder paste and a solder mask layer, wherein the first insulating layer is arranged on the aluminum sheet, the circuit layer is arranged on the first insulating layer and the second insulating layer, the through hole penetrates through the first insulating layer, the second insulating layer and the circuit layer, the solder paste is arranged in the through hole, and the solder mask layer is arranged above the circuit layer. The circuit layer comprises a first circuit layer, a second circuit layer and a third circuit layer. Compared with the prior art, the utility model omits the traditional copper plating structure, shortens the production period and the cost, and realizes the high heat conduction effect by the way that the insulating layer and the solder paste are transferred to the aluminum sheet.
Description
Technical Field
The utility model relates to the technical field of electronics, in particular to a double-layer circuit single-sided welding high-heat-conductivity aluminum substrate.
Background
With the continuous development of high performance and miniaturization of electronic devices, the integration level and power density of electronic components are greatly increased, and the heat generated in unit volume is rapidly increased. The traditional single-layer circuit board can not meet the requirement of high-density wiring, has limited heat dissipation capacity, is difficult to meet the heat dissipation requirement of a high-power device, and easily causes the device to have overhigh temperature so as to influence the performance, the reliability and the service life of the device. The double-layer aluminum substrate has good heat dissipation performance, so that the problems of high-density wiring and heat dissipation of the high-power electronic device can be effectively solved. The existing double-layer aluminum substrate basically adopts the processes of copper-clad plate drilling, copper plating, circuit manufacturing, laminating and the like, and has the defects of complex process, high cost, long period and difficulty in adapting to market demands.
To solve the above problems, we have made a series of improvements.
Disclosure of utility model
The utility model aims to provide a double-layer circuit single-sided welding high-heat-conductivity aluminum substrate so as to overcome the defects and the shortcomings in the prior art.
The double-layer circuit single-sided welding high-heat-conductivity aluminum substrate comprises an aluminum sheet, a first insulating layer, a second insulating layer, a circuit layer, a through hole, solder paste and a solder mask, wherein the first insulating layer is arranged on the aluminum sheet;
The circuit layer comprises a first circuit layer, a second circuit layer and a third circuit layer, wherein a solder mask layer is arranged above an upper layer structure of the first circuit layer, the upper layer structure of the first circuit layer is connected with solder paste, one side of a lower layer structure of the first circuit layer is connected with a first insulating layer, the upper layer structure of the second circuit layer is covered by the solder mask layer, one side of the lower layer structure of the second circuit layer is connected with the first insulating layer, the upper layer structure of the third circuit layer is covered by the solder mask layer, and the lower layer structure of the third circuit layer is connected with the solder paste.
The utility model has the beneficial effects that:
Compared with the prior art, the utility model omits the traditional copper plating structure, shortens the production period and the cost, and realizes the high heat conduction effect by the way that the insulating layer and the solder paste are transferred to the aluminum sheet.
Description of the drawings:
fig. 1 is a schematic structural view of the present utility model.
Reference numerals:
Aluminum sheet 100, first insulating layer 200, second insulating layer 300, wiring layer 400, via 500, solder paste 600, and solder resist layer 700.
A first wiring layer 410, a second wiring layer 420, and a third wiring layer 430.
Detailed Description
The utility model will now be further described with reference to specific examples. It should be understood that the following examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model.
Example 1
Fig. 1 is a schematic structural view of the present utility model.
As shown in FIG. 1, the double-layer circuit single-sided welding high heat conduction aluminum substrate comprises an aluminum sheet 100, a first insulating layer 200, a second insulating layer 300, a circuit layer 400, a through hole 500, solder paste 600 and a solder mask 700, wherein the first insulating layer 200 is arranged on the aluminum sheet 100, the circuit layer 400 is arranged on the first insulating layer 200 and the second insulating layer 300, the through hole 500 penetrates through the first insulating layer 200, the second insulating layer 300 and the circuit layer 400, the solder paste 600 is arranged in the through hole 500, and the solder mask 700 is arranged above the circuit layer 400.
The circuit layer 400 includes a first circuit layer 410, a second circuit layer 420 and a third circuit layer 430, wherein a solder mask 700 is disposed above an upper structure of the first circuit layer 410, the upper structure of the first circuit layer 410 is connected with the solder paste 600, one side of a lower structure of the first circuit layer 410 is connected with the first insulating layer 200, the upper structure of the second circuit layer 420 is covered by the solder mask 700, one side of the lower structure of the second circuit layer 420 is connected with the first insulating layer 200, the upper structure of the third circuit layer 430 is covered by the solder mask 700, and the lower structure of the third circuit layer 430 is connected with the solder paste 600.
The innovation of the present utility model is that the solder mask 700 and the insulating layer are utilized to maintain the electrical isolation property, and the circuit layer 400, the aluminum sheet 100 and the solder paste 600 have good electrical conductivity. This structural design allows the first wiring layer 410 to form an electrical path with the aluminum sheet 100 through precisely located solder paste connection points, thereby achieving reliable electrical interconnection with the third wiring layer 430. The innovative structure successfully realizes perfect combination of double-layer circuit layout and single-sided component welding. Specifically, the solder paste 600 connects the upper structure of the first circuit layer 410 and the aluminum sheet 100, and the aluminum sheet 100 is insulated from the lower structure of the third circuit layer 430 through the solder paste 600, and the lower structure of the first circuit layer 410, all the structures of the second circuit layer 420 and the upper structure of the third circuit layer 430 through the solder mask 700, the first insulating layer 200 and the second insulating layer 300. Therefore, even if the covering link is omitted, the conduction of the local circuit can be realized by fully utilizing the solder paste which is needed to be done originally.
In terms of thermal management, the present utility model does not degrade high thermal conductivity due to such a structure. The utility model constructs a double heat dissipation channel, wherein on one hand, heat generated by components is transferred to the aluminum base plate through RCC insulating materials with high heat conduction performance, namely, the first insulating layer 200 and the second insulating layer 300, and on the other hand, a rapid channel for heat to reach the aluminum base plate is formed by virtue of excellent heat conduction characteristics of solder paste connection points. The multi-path heat radiation structure remarkably improves the overall heat radiation efficiency and effectively solves the difficult problem of heat management of high-power electronic equipment.
Compared with the prior art, the utility model omits the traditional copper plating structure, shortens the production period and the cost, and realizes the high heat conduction effect by the way that the insulating layer and the solder paste are transferred to the aluminum sheet.
The present utility model has been described in detail with reference to the embodiments, but the present utility model is not limited thereto, and various modifications may be made without departing from the spirit of the present utility model.
Claims (1)
1. The double-layer circuit single-sided welding high-heat-conductivity aluminum substrate is characterized by comprising an aluminum sheet (100), a first insulating layer (200), a second insulating layer (300), a circuit layer (400), a through hole (500), solder paste (600) and a solder mask layer (700), wherein the first insulating layer (200) is arranged on the aluminum sheet (100), the circuit layer (400) is arranged on the first insulating layer (200) and the second insulating layer (300), the through hole (500) penetrates through the first insulating layer (200), the second insulating layer (300) and the circuit layer (400), the solder paste (600) is arranged in the through hole (500), and the solder mask layer (700) is arranged above the circuit layer (400);
The circuit layer (400) comprises a first circuit layer (410), a second circuit layer (420) and a third circuit layer (430), wherein a solder mask layer (700) is arranged above an upper layer structure of the first circuit layer (410), the upper layer structure of the first circuit layer (410) is connected with solder paste (600), one side of a lower layer structure of the first circuit layer (410) is connected with the first insulating layer (200), the upper layer structure of the second circuit layer (420) is covered by the solder mask layer (700), one side of the lower layer structure of the second circuit layer (420) is connected with the first insulating layer (200), the upper layer structure of the third circuit layer (430) is covered by the solder mask layer (700), and the lower layer structure of the third circuit layer (430) is connected with the solder paste (600).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520628347.4U CN224111365U (en) | 2025-04-03 | 2025-04-03 | A double-layer circuit single-sided soldered high thermal conductivity aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520628347.4U CN224111365U (en) | 2025-04-03 | 2025-04-03 | A double-layer circuit single-sided soldered high thermal conductivity aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN224111365U true CN224111365U (en) | 2026-04-10 |
Family
ID=99348632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520628347.4U Active CN224111365U (en) | 2025-04-03 | 2025-04-03 | A double-layer circuit single-sided soldered high thermal conductivity aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN224111365U (en) |
-
2025
- 2025-04-03 CN CN202520628347.4U patent/CN224111365U/en active Active
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