CN224069010U - electronic devices - Google Patents

Abstract

The application discloses electronic equipment, which belongs to the technical field of electronic equipment and comprises a frame body, a main board component, a screen component and a heat dissipation component. The mainboard subassembly sets up in the framework, and the mainboard subassembly includes mainboard and treater, and the treater is located on the mainboard. The screen assembly is arranged on the frame body, a heat dissipation cavity is arranged between the screen assembly and the main board assembly, and the processor is arranged on one side of the main board facing the screen assembly. The heat dissipation assembly is positioned in the frame body and used for sucking air outside the electronic equipment into the heat dissipation cavity and discharging the air in the heat dissipation cavity to the outside of the electronic equipment.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

In order to further develop the performance of the mobile phone processor, an active heat dissipation measure needs to be added to the mobile phone to dissipate the heat of the processor to the external environment. At present, part of manufacturers add an aluminum alloy air duct on the back of a battery cover, air flow is led into the aluminum alloy air duct through a centrifugal fan, and the air flow in the aluminum alloy air duct is used for taking away the heat of a processor.

Under the condition that an aluminum alloy air duct is independently added in the mobile phone, the thickness of the mobile phone can be increased, so that the thickness of the mobile phone is difficult to further reduce, and the mobile phone is greatly limited in order to achieve miniaturization.

Disclosure of utility model

The application aims to provide electronic equipment, which at least solves the problem that an aluminum alloy air duct occupies the space in the thickness direction of a mobile phone under the condition that the aluminum alloy air duct for circulating heat dissipation air flow is arranged in the mobile phone in the related technology.

In order to solve the technical problems, the application is realized as follows:

An embodiment of the present application provides an electronic device, including:

A frame;

the main board assembly is arranged in the frame body and comprises a main board and a processor, and the processor is arranged on the main board;

The screen component is arranged on the frame body, a heat dissipation cavity is arranged between the screen component and the main board component, and the processor is arranged on one side of the main board facing the screen component;

The heat dissipation assembly is positioned in the frame body and used for sucking air outside the electronic equipment into the heat dissipation cavity and discharging the air in the heat dissipation cavity to the outside of the electronic equipment.

In the embodiment of the application, a part of heat generated by the processor is transferred to the direction of the screen assembly, and the other part of heat generated by the processor is transferred to the back of the electronic equipment through the back of the main board, and according to the simulation result, the heat transferred to the direction of the screen assembly accounts for 75% of the heat of the whole mobile phone, and the part of heat is three times of the heat transferred to the back of the electronic equipment, so that the heat dissipation structure is arranged between the main board assembly and the screen assembly, and the heat dissipation efficiency is greatly improved. The heat dissipation assembly is a power device of the whole system, suction is formed when the heat dissipation assembly operates, external cold air enters the heat dissipation cavity under the action of the suction, the cold air and heat on the surface of the main board assembly are taken away to become hot air, and the hot air is discharged to the outside of the electronic equipment after passing through the heat dissipation assembly.

Because the processor is arranged on the front surface of the main board, the position of the heat dissipation cavity is also arranged on the front surface of the main board, the heat dissipation efficiency of the main board assembly is improved, the heat dissipation effect of the main board assembly is improved, and the running stability of the main board assembly is ensured. And the space between the main board component and the screen component is used as a heat dissipation channel, so that a metal air duct is not required to be additionally arranged in the electronic equipment, the occupied space of the metal air duct is saved, the thickness of the electronic equipment can be further reduced, and the limitation of the metal air duct to the miniaturization of the electronic equipment is avoided.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is an exploded view of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic structural view of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic view of a partial structure of an electronic device according to an embodiment of the present application;

Fig. 4 is a schematic view of an internal structure of an electronic device according to an embodiment of the present application;

Fig. 5 is a schematic view of an internal structure of an electronic device according to an embodiment of the present application;

FIG. 6 is a schematic view of a partial structure of an electronic device according to an embodiment of the present application;

fig. 7 is a schematic view of a partial structure of an electronic device according to an embodiment of the present application.

Reference numerals:

100 electronic equipment, 110 frame bodies, 111 enclosing frames, 112 air outlets, 113 brackets, 114 mounting parts, 115 bending parts, 116 frame plates, 120 main board assemblies, 121 main boards, 122 processors, 123 heat dissipation plates, 124 assembly vacancies, 130 screen assemblies, 141 heat dissipation cavities, 142 air inlet gaps, 143 gaps, 144 sealing cavities, 150 heat dissipation assemblies, 151 fan blades, 152 magnetic elements, 153 rotating shafts, 154 coils, 155 circuit boards, 160 first sealing elements, 161 first annular sealing parts, 162 second annular sealing parts, 163 slotting, 164 sealing areas, 170 electronic components and 180 second sealing elements.

Detailed Description

Reference will now be made in detail to the present embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the like or similar elements throughout or elements having the same or similar functions. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

An electronic device according to an embodiment of the present application is described below with reference to fig. 1 to 7.

Referring to fig. 1 and 2, an electronic device 100 according to some embodiments of the present application includes a housing 110, a main board assembly 120, a screen assembly 130, and a heat dissipation assembly 150. The main board assembly 120 is disposed in the frame 110, the main board assembly 120 includes a main board 121 and a processor 122, and the processor 122 is disposed on the main board 121. The screen assembly 130 is disposed on the frame 110, a heat dissipation cavity 141 is disposed between the screen assembly 130 and the motherboard assembly 120, and the processor 122 is disposed on a side of the motherboard 121 facing the screen assembly 130. The heat dissipation assembly 150 is located in the frame 110, and the heat dissipation assembly 150 is used for sucking air outside the electronic device 100 into the heat dissipation cavity 141 and exhausting air in the heat dissipation cavity 141 to the outside of the electronic device 100.

The main board assembly 120 and the screen assembly 130 are mounted on the frame 110, and the main board assembly 120 and the screen assembly 130 are disposed at a distance from each other with a space between the main board assembly 120 and the screen assembly 130 as a heat dissipation chamber 141. The heat dissipation assembly 150 is further installed in the frame 110, when the heat dissipation assembly 150 operates, the heat dissipation assembly 150 can suck air outside the electronic device 100 into the heat dissipation cavity 141 and discharge the air in the heat dissipation cavity 141 out of the heat dissipation cavity 141, so that flowing air flow can be formed in the heat dissipation cavity 141, and the flowing air flow can take away heat generated by the operation of the main board assembly 120, so that the heat dissipation function of the main board assembly 120 is realized.

The main board assembly 120 includes a main board 121 and a processor 122, the processor 122 is disposed on the main board 121, and the main board 121 is disposed on a side of the processor 122 facing the screen assembly 130, which is equivalent to the front side of the main board 121 where the processor 122 is disposed. In the use process of the electronic device 100, the processor 122 is the most dominant heat source of the electronic device 100, and the processor 122 is usually disposed on the front side of the main board 121, i.e., the processor 122 is mounted on the side of the main board 121 facing the screen assembly 130, so as to avoid heat of the processor 122 concentrating on the back of the electronic device 100, and when the user holds the electronic device 100, the hand contacts the back of the electronic device 100.

A part of heat generated by the processor 122 is transferred to the direction of the screen assembly 130, another part of heat generated by the processor 122 is transferred to the back of the electronic device 100 through the back of the main board 121, and according to the simulation result, the heat transferred to the direction of the screen assembly 130 accounts for 75% of the heat of the whole mobile phone, and the part of heat is three times of the heat transferred to the back of the electronic device 100, so that the heat dissipation structure is arranged between the main board assembly 120 and the screen assembly 130, and the heat dissipation efficiency is greatly improved. The heat dissipation assembly 150 is a power device of the whole system, when the heat dissipation assembly 150 operates, suction force is formed, external cold air enters the heat dissipation cavity 141 under the action of the suction force, the cold air and heat taken away from the surface of the main board assembly 120 become hot air, and the hot air is discharged to the outside of the electronic device 100 after passing through the heat dissipation assembly 150.

Because the processor 122 is disposed on the front surface of the motherboard 121, the position of the heat dissipation cavity 141 is also disposed on the front surface of the motherboard 121, which is favorable for improving the heat dissipation efficiency of the motherboard assembly 120, thereby improving the heat dissipation effect of the motherboard assembly 120 and ensuring the running stability of the motherboard assembly 120. Moreover, the space between the main board assembly 120 and the screen assembly 130 is used as a heat dissipation channel, so that no additional metal air duct is needed to be added in the electronic device 100, the occupied space of the metal air duct is saved, the thickness of the electronic device 100 can be further reduced, and the limitation of the metal air duct on the miniaturization of the electronic device 100 is avoided.

In the operation process of the electronic device 100, the processor 122 generates a lot of energy, and of course, other components except the processor 122 on the motherboard 121 also generate heat, and the heat dissipation path of the other components generating heat is the same as that of the processor 122 and will not be described here.

Illustratively, the screen assembly 130 may be an LCD (Liquid CRYSTAL DISPLAY) screen.

As shown in conjunction with fig. 1 and 2, in some embodiments, the motherboard assembly 120 optionally further includes a heat dissipation plate 123, the heat dissipation plate 123 being disposed on a side of the processor 122 facing the screen assembly 130, and a heat dissipation cavity 141 being disposed between the screen assembly 130 and the heat dissipation plate 123.

A heat dissipation plate 123 is disposed at a side of the processor 122 facing the screen assembly 130, the heat dissipation plate 123 and the screen assembly 130 are spaced apart, and a space between the heat dissipation plate 123 and the screen assembly 130 is used as a heat dissipation chamber 141.

The processor 122 is located between the main board 121 and the heat dissipation plate 123, the heat of the processor 122 can be transferred into the heat dissipation cavity 141, and the heat dissipation plate 123 can be made of a material with higher heat conduction efficiency, so that the heat of the processor 122 can be quickly transferred to the heat dissipation plate 123, and the heat dissipation plate 123 and the air flow of the heat dissipation cavity 141 have a larger contact area, thereby being beneficial to improving the heat dissipation effect of the processor 122.

Illustratively, the heat dissipating plate 123 may be a Vapor Chamber (VX).

As shown in connection with fig. 1 and 2, in some embodiments, optionally, the frame 110 includes a frame plate 116 and a surrounding frame 111 that are connected to each other, the surrounding frame 111 is disposed around the frame plate 116, an air intake gap 142 is disposed between the surrounding frame 111 and the screen assembly 130, and the air intake gap 142 is in communication with the heat dissipation chamber 141.

The surrounding frame 111 surrounds the chassis 116, the surrounding frame 111 is distributed along the circumferential direction of the chassis 116, and an air intake gap 142 is provided at the splice position between the surrounding frame 111 and the screen assembly 130, that is, the air intake gap 142 is provided at the edge position of the frame body 110. In the circumferential direction of the screen assembly 130, not everywhere of the screen assembly 130 is closely attached to the peripheral frame 111, but an air intake gap 142 is left between a portion of the edge of the screen assembly 130 and the peripheral frame 111, and external air may be sucked into the heat dissipation chamber 141 through the air intake gap 142.

By providing the air inlet gap 142 between the enclosure frame 111 and the screen assembly 130, there is no need to provide an air inlet hole on the frame 110, so as to avoid damaging the appearance integrity of the electronic device 100, and the air inlet gap 142 will not affect the layout of the traditional side key positions.

In some embodiments, optionally, the enclosure 111 is provided with an air outlet 112, and the air inlet gap 142 and the air outlet 112 are communicated through the heat dissipation cavity 141.

The air outlet 112 is arranged on the surrounding frame 111, air flows into the heat dissipation cavity 141 from the air inlet gap 142, and the air in the heat dissipation cavity 141 is discharged outwards through the air outlet 112, so that flowing air flow is formed in the heat dissipation cavity 141, and the flowing air flow can rapidly take away heat in the heat dissipation cavity 141, so that rapid heat dissipation of the processor 122 is realized.

As shown in connection with fig. 1 and 2, in some embodiments, the air intake gap 142 and the heat sink assembly 150 may alternatively be located on opposite sides of the processor 122.

External air is sucked into the heat dissipation chamber 141 through the air intake gap 142, and air of the heat dissipation chamber 141 is discharged out of the electronic device 100 through the heat dissipation assembly 150. In this embodiment, the air inlet gap 142 and the heat dissipation assembly 150 are disposed on two opposite sides of the processor 122, so that it is ensured that the air flowing into the heat dissipation cavity 141 can pass through the processor 122, and when a large amount of air flows through the processor 122, the air flows can efficiently take away the heat of the processor 122, which is beneficial to improving the heat dissipation speed of the processor 122.

As shown in connection with fig. 1, 2 and 4, in some embodiments, the electronic device 100 may optionally further include a first sealing member 160, where the first sealing member 160 is located between the frame plate 116 and the screen assembly 130, and a slot 163 is provided on the first sealing member 160, and the air intake gap 142 and the heat dissipation chamber 141 are communicated through the slot 163.

A first sealing member 160 is installed between the shelf 116 and the screen assembly 130, and the first sealing member 160 seals between the shelf 116 and the screen assembly 130, thereby increasing the difficulty of external water and foreign substances entering the inside of the electronic device 100.

In order to enable air to be introduced into the heat dissipation chamber 141, an air-in gap 142 is provided at a portion of the edge between the peripheral frame 111 and the screen assembly 130, and the other edge between the peripheral frame 111 and the screen assembly 130 is sealed by a first seal 160.

In order to avoid the first sealing member 160 closing the air intake gap 142, in this embodiment, a slot 163 is provided at a part of the structure of the first sealing member 160, the slot 163 is in communication with the air intake gap 142, and external air flows into the heat dissipation chamber 141 through the air intake gap 142 and the slot 163 in sequence. The slot 163 communicates the air intake gap 142 with the heat dissipation chamber 141, ensuring that the outside air can flow into the heat dissipation chamber 141.

As shown in connection with fig. 1, 2, 4, and 5, in some embodiments, the electronic device 100 optionally further includes an electronic component 170. The first seal 160 includes a first annular seal portion 161 and a second annular seal portion 162, the first annular seal portion 161 having a slot 163 formed therein, the second annular seal portion 162 being coupled to the first annular seal portion 161, a seal area 164 being formed between the frame plate 116, the screen assembly 130, and the second annular seal portion 162, and at least a portion of the electronic component 170 being located within the seal area 164.

The first annular sealing portion 161 and the second annular sealing portion 162 are both of annular structures, and the slot 163 is provided in the first annular sealing portion 161, so that the first annular sealing portion 161 is located in the heat dissipation chamber 141, and the structures of the first annular sealing portion 161 except the slot 163 are all of complete continuous structures, so that the gas in the heat dissipation chamber 141 can only flow in through the air inlet gap 142, and the gas flowing into the heat dissipation chamber 141 can only flow to the heat dissipation assembly 150, and the airflow direction in the heat dissipation chamber 141 is fixed, so that the stable heat dissipation of the processor 122 by the airflow is ensured.

The sealing area 164 is formed among the frame plate 116, the screen assembly 130 and the second annular sealing part 162, and since the groove 163 is not formed in the second annular sealing part 162, external air and impurities are not easy to enter the sealing area 164, the sealing area 164 is a relatively sealed environment, at least a part of the electronic components 170 in the electronic equipment 100 are arranged in the sealing area 164, the sealing environment of the sealing area 164 plays a role in preventing water and dust on the electronic components 170, so that the electronic components 170 are not easy to contact with external water and dust, damage to the electronic components 170 is reduced, and stable operation of the electronic components 170 is ensured.

As shown in fig. 1, 2, 3 and 6, in some embodiments, optionally, the frame 110 further includes a support 113, where the support 113 is connected to the frame plate 116, a gap 143 is provided between the support 113 and the screen assembly 130, the heat dissipation cavity 141 and the air outlet 112 are in communication with each other through the gap 143, the heat dissipation assembly 150 is connected to the support 113, and at least a portion of the heat dissipation assembly 150 is located in the gap 143.

The heat dissipation assembly 150 is mounted on the bracket 113, the bracket 113 and the screen assembly 130 are arranged at intervals, so that a gap 143 is arranged between the bracket 113 and the screen assembly 130, at least a part of the heat dissipation assembly 150 is positioned in the gap 143, the heat dissipation cavity 141 is communicated with the gap 143, the air flow in the heat dissipation cavity 141 flows into the gap 143 under the driving of the heat dissipation assembly 150, the gap 143 is communicated with the air outlet 112, and the air flow in the gap 143 is discharged to the outside of the electronic device 100 through the air outlet 112. As shown in connection with fig. 1, 2, 3 and 6, in some embodiments, optionally, the frame 110 further includes a second seal 180, a first side of the support 113 faces the gap 143, a second side of the support 113 is provided with a seal cavity 144, the second seal 180 is located between the support 113 and the frame plate 116, and the second seal 180 is used to seal the seal cavity 144.

The void 143 is located on a first side of the bracket 113 and the air flow may pass through the first side of the bracket 113. A portion of the sealed cavity 144 within the electronic device 100 is located on the second side of the stand 113, and a portion of the electrical components requiring waterproofing is mounted within the sealed cavity 144.

A second sealing member 180 is installed between the bracket 113 and the shelf 116, and a gap between the bracket 113 and the shelf 116 is sealed from the second sealing member 180, thereby sealing the sealing chamber 144, and preventing water, impurities and air flow in the gap 143 from flowing into the sealing chamber 144, thereby preventing the electric devices in the sealing chamber 144 from being affected.

As shown in connection with fig. 1, 2, 3 and 6, in some embodiments, optionally, the heat dissipation assembly 150 includes a fan blade 151, a magnetic member 152, a rotating shaft 153, a coil 154 and a circuit board 155, where the fan blade 151 and the magnetic member 152 are located in the gap 143, the rotating shaft 153 is connected to the fan blade 151, and two ends of the rotating shaft 153 are located in the gap 143 and the sealing cavity 144, respectively. The coil 154 and the circuit board 155 are positioned in the sealed cavity 144, the circuit board 155 is electrically connected with the coil 154, and when the coil 154 is electrified, the magnetic field generated by the coil 154 interacts with the magnetic field of the magnetic member 152 to enable the coil 154 to drive the rotating shaft 153 to rotate.

After the circuit board 155 is connected to the power supply, the current passes through the coil 154, the energizing coil 154 generates a magnetic field according to the electromagnetic induction principle, the magnetic member 152 generates a fixed magnetic field, and the magnetic field of the magnetic member 152 interacts with the magnetic field generated by the energizing coil 154 to generate a force for operating the coil 154. The coil 154 is typically wound around a frame that is coupled to the shaft 153, and when the coil 154 is rotated by a magnetic force, the coil 154 rotates the shaft 153. The fan blade 151 is mounted on the rotating shaft 153, so that the rotating shaft 153 can drive the fan blade 151 to rotate, and the fan blade 151 drives the airflow to flow.

The fan blade 151 and the magnetic member 152 do not need to be waterproofed, and therefore, the fan blade 151 and the magnetic member 152 may be disposed in the space 143. The circuit board 155 and the coil 154 need to be waterproof, so the circuit board 155 and the coil 154 may be disposed within the sealed cavity 144. Through the mode, the stable operation of the heat dissipation assembly 150 is ensured, and the damage rate of the heat dissipation assembly 150 is reduced.

As shown in fig. 1, 2, 3, 6 and 7, in some embodiments, optionally, the bracket 113 includes a mounting portion 114 and a bending portion 115, where the mounting portion 114 is connected to the heat dissipating component 150, the bending portion 115 is connected to the mounting portion 114 and the frame plate 116, and the bending portion 115 bends relative to the mounting portion 114, and a maximum distance between the mounting portion 114 and the screen component 130 is smaller than a maximum distance between the bending portion 115 and the screen component 130.

The maximum distance between the mounting portion 114 and the screen assembly 130 is H1, and the maximum distance between the bending portion 115 and the screen assembly 130 is H2.

The mounting portion 114 is connected to the bending portion 115, and the bending portion 115 is connected to the frame plate 116, and the bending portion 115 is bent compared to the mounting portion 114.

The fan blade 151 and the magnetic member 152 are located on one side of the bracket 113, the circuit board 155 and the coil 154 are located on the other side of the bracket 113, and a part of the structure of the heat dissipation assembly 150 is disposed on both sides of the bracket 113, so that the bracket 113 cannot be too close to the screen assembly 130 or too far from the screen assembly 130, but the bracket 113 needs to be centrally disposed in the frame plate 116. If the centrally disposed bracket 113 extends along a direction, the bracket 113 will affect the arrangement position of the air outlet 112, in this embodiment, the bending portion 115 is bent compared with the mounting portion 114, and the bending portion 115 can bend towards a direction away from the screen assembly 130, so that a space is reserved for the arrangement of the air outlet 112, and the air outlet 112 is conveniently formed on the enclosure 111.

In this embodiment, the mounting portion 114 and the bending portion 115 are integrally formed, and in other embodiments, the mounting portion 114 and the bending portion 115 may be connected to each other by bonding, welding, screw locking, or the like.

In the related art, at present, heat of a processor is fully diffused through soaking measures such as a soaking plate and a graphite radiating fin and then is radiated through the outer surface of electronic equipment, the natural radiating capacity of the electronic equipment is set to an engineering limit, the power consumption of the processor cannot be increased any more, and accordingly, the game performance, the image performance and the like of the electronic equipment cannot be improved. To further develop the performance of the processor, active heat dissipation measures are added to dissipate the heat of the processor directly to the external environment by forced convection or other means.

The existing air cooling heat dissipation scheme is characterized in that a centrifugal fan is required to be arranged in a sealed metal air duct, an aluminum alloy air duct is arranged in the direction of a battery cover of a main board, in order to ensure the ventilation quantity, the height of the metal air duct is at least more than 2mm, the areas of an air inlet and an air outlet are required to be ensured, the requirements on the design environment of a complete machine are severe, meanwhile, the thickness of electronic equipment is greatly limited, in addition, air cooling can only conduct heat exchange on the heat on the back of the main board of the electronic equipment, a processor of the electronic equipment is arranged on the front of the main board, only 25% of heat is generated on the back of the main board, and the front of the main board can transfer 75% of the heat dissipation of the complete machine, so that the traditional air cooling heat dissipation effect is poor.

After the miniature fan is added, the air inlet and the air outlet are required to be opened on the electronic equipment, damage is caused to the overall simple design of the appearance, and meanwhile, the layout of the air inlet and the air outlet also can influence the layout of the traditional side key positions, so that the user experience is influenced.

The present embodiment provides a new active air-cooling heat dissipation scheme, which improves the heat dissipation capability of the front side of the motherboard 121 of the electronic device 100 with high efficiency, meanwhile, eliminates the aluminum alloy air duct of the back side of the motherboard in the conventional scheme, solves the bottleneck problem of the thickness of the whole motherboard 121, and reduces the cost.

The improvement of this embodiment is that the air cooling takes away 3 times the heat from the side of the screen assembly 130 than the conventional air cooling takes away the heat from the side of the battery cover. The traditional air-cooled radiating metal air duct is canceled, the original space between the screen assembly 130 and the radiating plate 123 is utilized to replace, the heat exchange efficiency is improved, the heat exchange area is enlarged, the thickness limit of the metal air duct to the whole machine stack is reduced, and meanwhile, the cost of the aluminum alloy air duct and the weight of the whole machine are saved.

The screen assembly 130 is assembled on the frame body 110 through the annular foam rubber to form a heat dissipation cavity 141, the heat dissipation plate 123 is assembled on the frame body 110 through the double faced adhesive tape, one side of the heat dissipation cavity 141 is the screen assembly 130, the other side is the heat dissipation plate 123, a hole is formed in the middle of the frame body 110, the processor 122 is assembled at a corresponding position, an assembly vacancy 124 of the heat dissipation assembly 150 is reserved for the heat dissipation plate 123, the heat dissipation assembly 150 is assembled on the assembly vacancy 124, the heat dissipation assembly 150 in the embodiment can be a centrifugal fan, a centrifugal fan shell is added in the direction of a battery cover of the frame body 110, and the frame plate 116 is sealed.

The conventional heat dissipation plate is directly arranged at the position closest to the processor, one part of heat generated by the processor is directly transferred to the direction of the screen component where the heat dissipation plate is positioned through the heat conducting gel, the other part of the heat is transferred to the direction of the battery cover through the back of the main board, and according to the simulation result, the heat in the direction of the screen component where the heat dissipation plate is positioned is 75% of the heat of the whole electronic equipment and is three times of the heat in the direction of the battery cover. Therefore, the heat dissipation system is arranged in the direction of the screen assembly 130 in the present embodiment, so that the heat dissipation efficiency is greatly improved. The centrifugal fan is a power device of the whole system, the wind pressure generated when the fan rotates forms suction force, cold air enters into a heat dissipation cavity 141 formed by the screen assembly 130 and the frame 110 through the micro-gap position of the screen assembly 130, the cold air fully contacts with the surface of the heat dissipation plate 123 and then takes away the heat on the surface of the heat dissipation plate to become hot air, and the hot air is discharged through the air outlet 112 on the other side after passing through the centrifugal fan and the assembly empty space 124 on the heat dissipation plate 123.

The first sealing member 160 may be a foam rubber by which the screen assembly 130 is fixed to the frame 110 while sealing a non-watertight location using an annular foam rubber shape.

The bracket 113 is sealed with the frame plate 116 by a second sealing member 180, the second sealing member 180 may be foam rubber, the circuit board 155 needing to be waterproof is arranged inside the whole machine, and the fan blade 151, the magnetic member 152 and the like which are waterproof are arranged outside. The waterproof problem of the whole machine caused by adding the centrifugal fan is solved through the mode.

The electronic device 100 in this embodiment may be a mobile phone, a tablet computer, an electronic book, a smart watch, a music player, etc.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims (10)

1. An electronic device, characterized in that it comprises: Frame; A motherboard assembly is disposed within the frame, the motherboard assembly including a motherboard and a processor, the processor being disposed on the motherboard; A screen assembly is disposed on the frame, and a heat dissipation cavity is provided between the screen assembly and the motherboard assembly. The processor is disposed on the side of the motherboard facing the screen assembly. A heat dissipation assembly is located within the frame. The heat dissipation assembly is used to draw gas from outside the electronic device into the heat dissipation cavity and to discharge gas from inside the heat dissipation cavity to the outside of the electronic device. 2. The electronic device according to claim 1, wherein the motherboard assembly further comprises: A heat sink is disposed on the side of the processor facing the screen assembly, and a heat dissipation cavity is provided between the screen assembly and the heat sink. 3. The electronic device according to claim 1, wherein the frame comprises a frame plate and a surrounding frame connected to each other, the surrounding frame is arranged around the frame plate, an air intake gap is provided between the surrounding frame and the screen assembly, and the air intake gap is connected to the heat dissipation cavity. 4. The electronic device according to claim 3, wherein the frame is provided with an air outlet, and the air inlet gap and the air outlet are connected through the heat dissipation cavity. 5. The electronic device according to claim 3, characterized in that the electronic device further comprises: A first sealing element is located between the frame plate and the screen assembly. The first sealing element has a slot, and the air intake gap and the heat dissipation cavity are connected through the slot. 6. The electronic device according to claim 5, wherein the electronic device further comprises: electronic components; The first seal includes: A first annular sealing portion, wherein the groove is provided on the first annular sealing portion; The second annular sealing part is connected to the first annular sealing part, and a sealing area is formed between the frame plate, the screen assembly and the second annular sealing part, with at least a portion of the electronic components located within the sealing area. 7. The electronic device according to claim 4, wherein the frame further comprises: a bracket connected to the frame plate, a gap being provided between the bracket and the screen assembly, the heat dissipation cavity and the air outlet being connected through the gap, the heat dissipation assembly being connected to the bracket, and at least a portion of the heat dissipation assembly being located within the gap. 8. The electronic device according to claim 7, wherein the frame further comprises: The second sealing element is located between the bracket and the frame plate, with the first side of the bracket facing the gap and the second side of the bracket having a sealing cavity. The second sealing element is used to seal the sealing cavity. 9. The electronic device according to claim 8, wherein the heat dissipation component comprises: The fan blades and magnetic components are located within the gap; A rotating shaft is connected to the fan blades, with its two ends located in the gap and the sealed cavity, respectively. A coil and a circuit board are located inside the sealed cavity. The circuit board is electrically connected to the coil. When the coil is energized, the magnetic field generated by the coil interacts with the magnetic field of the magnetic component, thereby causing the coil to drive the rotating shaft to rotate. 10. The electronic device according to claim 7, wherein the bracket comprises: The mounting part is connected to the heat dissipation assembly; The bent portion is connected to the mounting portion and the frame plate. The bent portion is bent relative to the mounting portion. The maximum distance between the mounting portion and the screen assembly is smaller than the maximum distance between the bent portion and the screen assembly.