CN224068853U - Intelligent screen main board heat radiation structure - Google Patents
Intelligent screen main board heat radiation structureInfo
- Publication number
- CN224068853U CN224068853U CN202520298171.0U CN202520298171U CN224068853U CN 224068853 U CN224068853 U CN 224068853U CN 202520298171 U CN202520298171 U CN 202520298171U CN 224068853 U CN224068853 U CN 224068853U
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- Prior art keywords
- radiating
- heat dissipation
- intelligent screen
- main board
- screen main
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Abstract
本实用新型公开了一种智能屏主板散热结构，具体包括：依次连接的散热板、散热架以及散热风扇，散热架上安装有水冷管。通过散热风扇对智能屏主板进行抽风散热，使智能屏主板产生的热量通过通风孔、散热风道以及水冷管进行散热，提升了散热效果。因此，本实用新型提供的一种智能屏主板散热结构，解决了智能屏主板散热效果不佳的技术问题。
This utility model discloses a heat dissipation structure for a smart screen motherboard, specifically comprising: a heat sink, a heat sink frame, and a cooling fan connected in sequence, with water-cooling pipes installed on the heat sink frame. The cooling fan draws air from the smart screen motherboard to dissipate heat, allowing the heat generated by the motherboard to be dissipated through ventilation holes, heat dissipation channels, and water-cooling pipes, thus improving the heat dissipation effect. Therefore, the heat dissipation structure for a smart screen motherboard provided by this utility model solves the technical problem of poor heat dissipation performance of smart screen motherboards.
Description
Technical Field
The utility model relates to the technical field of motherboard heat dissipation, in particular to an intelligent screen motherboard heat dissipation structure.
Background
Along with the continuous development of technology, the intelligent screen is more and more widely applied. The intelligent screen is a multifunctional integrated screen, and can realize various information display and intelligent control.
In the prior art, intelligent screen includes casing, mainboard and display screen. And more electronic components are arranged on the main board, and a large amount of heat can be generated on the main board after the intelligent screen works for a long time. However, be limited by the structure of traditional intelligent screen, only dispel the heat through casing and louvre, lead to its radiating effect not good, influence the life of components and parts on the mainboard, and then influence the normal use of intelligent screen.
Disclosure of utility model
The utility model aims to provide an intelligent screen main board radiating structure, which solves the technical problem of poor radiating effect of an intelligent screen main board.
To achieve the purpose, the utility model adopts the following technical scheme:
The intelligent screen main board radiating structure comprises a radiating plate, a radiating frame and a radiating fan which are connected in sequence, wherein a vent hole is formed in the radiating plate, a radiating air channel corresponding to the vent hole is formed in the radiating frame, and a water cooling pipe is arranged on the radiating frame;
The intelligent screen main board comprises a vent hole, a heat dissipation air duct, a water cooling pipe and a heat dissipation fan, wherein the heat dissipation plate is connected with the intelligent screen main board, and the heat dissipation fan is used for exhausting and dissipating heat to the intelligent screen main board so that heat generated by the intelligent screen main board can be dissipated through the vent hole, the heat dissipation air duct and the water cooling pipe.
Optionally, at least one heat dissipation copper column is installed on the heat dissipation plate.
Optionally, the heat dissipation plate comprises a first plate and a second plate which are vertically connected, a plurality of first mounting holes are formed in the first plate, and a plurality of second mounting holes are formed in the second plate.
Optionally, four positioning grooves are formed in the first plate, and the heat dissipation frame is inserted into the positioning grooves in a positioning mode.
Optionally, the heat dissipation frame includes two heat dissipation diaphragms that set up relatively, two be connected with a plurality of heat dissipation riser between the heat dissipation diaphragm, the heat dissipation diaphragm with the heat dissipation riser encloses and closes and form the heat dissipation wind channel.
Optionally, the heat dissipation vertical plate is provided with a wave-shaped heat dissipation contact surface.
Optionally, the water cooling pipe comprises a pipe main body arranged in a serpentine shape, and the pipe main body passes through the heat dissipation air duct back and forth;
one end of the pipe main body is a water inlet end, the other end of the pipe main body is a water outlet end, and the water inlet end and the water outlet end are both positioned on the same side of the heat dissipation frame.
Optionally, the heat dissipation plate and the heat dissipation frame are both made of aluminum alloy materials.
Compared with the prior art, the utility model has the following beneficial effects:
The utility model provides an intelligent screen main board radiating structure which comprises a radiating plate, a radiating frame and a radiating fan which are connected in sequence, wherein a water cooling pipe is arranged on the radiating frame. The intelligent screen main board is subjected to air draft and heat dissipation through the heat dissipation fan, so that heat generated by the intelligent screen main board is dissipated through the vent hole, the heat dissipation air duct and the water cooling pipe, and the heat dissipation effect is improved. Therefore, the intelligent screen main board radiating structure provided by the utility model solves the technical problem of poor radiating effect of the intelligent screen main board.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the utility model, without affecting the effect or achievement of the objective.
Fig. 1 is a schematic perspective view of a heat dissipation structure of an intelligent screen motherboard according to an embodiment of the present utility model;
Fig. 2 is an exploded schematic view of a heat dissipation structure of a motherboard of an intelligent screen according to an embodiment of the present utility model;
fig. 3 is a schematic diagram of a partial top view structure of a heat dissipation structure of an intelligent screen motherboard according to an embodiment of the present utility model;
FIG. 4 is a schematic view of the cross-sectional structure A-A of FIG. 3;
Fig. 5 is a schematic diagram of a connection structure between a heat dissipating plate and a heat dissipating copper pillar in an intelligent screen motherboard heat dissipating structure according to an embodiment of the present utility model.
Illustration of:
10. the heat dissipation plate comprises a heat dissipation plate body, 11 parts of a first plate, 111 parts of a first mounting hole, 112 parts of a vent hole, 113 parts of a positioning groove, 12 parts of a second plate, 121 parts of a second mounting hole, 20 parts of a heat dissipation frame, 21 parts of a heat dissipation transverse plate, 22 parts of a heat dissipation vertical plate, 221 parts of a heat dissipation contact surface, 30 parts of a heat dissipation fan, 40 parts of a water cooling pipe, 41 parts of a pipe body, 42 parts of a water inlet end, 43 parts of a water outlet end and 50 parts of a heat dissipation copper column.
Detailed Description
In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the utility model provides an intelligent screen main board radiating structure, which is shown in figures 1-5, and comprises a radiating plate 10, a radiating frame 20 and a radiating fan 30 which are sequentially connected, wherein a vent 112 is arranged on the radiating plate 10, a radiating air channel corresponding to the vent 112 is arranged in the radiating frame 20, a water cooling pipe 40 is arranged on the radiating frame 20, in the embodiment, stable cooling liquid circulation is provided through the use of the water cooling pipe 40, and the low-temperature running state of the main board can be maintained even under long-time high-load running, so that the reduction of the radiating performance is avoided.
The heat dissipation plate 10 is connected to the intelligent screen motherboard, and the heat dissipation fan 30 is used for exhausting and dissipating heat to the intelligent screen motherboard, so that heat generated by the intelligent screen motherboard dissipates heat through the vent 112, the heat dissipation air channel and the water cooling pipe 40. In this embodiment, the heat generated by the motherboard can be quickly conducted and dissipated through the multi-stage heat dissipation design of the ventilation hole 112, the heat dissipation air duct and the water cooling pipe 40, and compared with the traditional passive heat dissipation, the heat exchange efficiency is remarkably improved. The efficient heat radiation structure effectively reduces the running temperature of the intelligent screen main board, and avoids the performance reduction or damage of electronic components caused by overheating, thereby prolonging the service lives of the main board and the whole machine. The scheme organically combines the heat radiating plate 10, the heat radiating frame 20, the water cooling pipe 40 and the heat radiating fan 30 together to form a compact heat radiating system. The modularized design is suitable for intelligent screen mainboards with various specifications, and has stronger compatibility.
It should be noted that the heat dissipation structure of the intelligent screen main board provided by the utility model specifically comprises a heat dissipation plate 10, a heat dissipation frame 20 and a heat dissipation fan 30 which are sequentially connected, wherein a water cooling pipe 40 is installed on the heat dissipation frame 20. The intelligent screen main board is subjected to air draft and heat dissipation through the heat dissipation fan 30, so that heat generated by the intelligent screen main board is dissipated through the vent 112, the heat dissipation air duct and the water cooling pipe 40, and the heat dissipation effect is improved. Therefore, the intelligent screen main board radiating structure provided by the utility model solves the technical problem of poor radiating effect of the intelligent screen main board.
As shown in fig. 1 to 5, at least one heat dissipating copper pillar 50 is mounted on the heat dissipating plate 10. In this embodiment, four heat dissipation copper pillars 50 are mounted on the heat dissipation plate 10, and the heat dissipation copper pillars 50 directly contact the high temperature area of the smart screen motherboard. The heat generated by the main board is firstly conducted to the heat dissipation plate 10 through the heat dissipation copper columns 50, and the heat is quickly transferred by utilizing the excellent heat conduction performance of the copper columns. The design can effectively avoid local overheating and improve the heat dissipation efficiency.
As shown in fig. 3 and 4, the heat dissipation plate 10 includes a first plate 11 and a second plate 12 vertically connected, a plurality of first mounting holes 111 are provided on the first plate 11, and a plurality of second mounting holes 121 are provided on the second plate 12. In this embodiment, the second plate 12 is connected to other heat dissipating components through the second mounting holes 121, so that heat is uniformly distributed between the two plates and transferred to the subsequent heat dissipating channels.
As shown in fig. 3 and 4, the first plate 11 is provided with four positioning grooves 113, and the heat dissipation frame 20 is positioned and inserted into the positioning grooves 113. It should be noted that, because the first plate 11 is designed with four positioning slots 113, the heat dissipation frame 20 is fixed by inserting through the positioning slots 113, so as to form a reliable integral structure.
As shown in fig. 3 and 4, the heat dissipation frame 20 includes two heat dissipation transverse plates 21 that are oppositely arranged, a plurality of heat dissipation risers 22 are connected between the two heat dissipation transverse plates 21, and the heat dissipation transverse plates 21 and the heat dissipation risers 22 enclose to form a heat dissipation air channel. In this embodiment, the heat dissipation frame 20 includes a heat dissipation air channel formed by enclosing the heat dissipation transverse plate 21 and the heat dissipation vertical plate 22, and uses the air suction effect of the heat dissipation fan 30 to realize rapid heat dissipation.
As shown in fig. 3 and 4, the heat radiation riser 22 is provided with a heat radiation contact surface 221 having a wavy shape. It should be noted that, the wave-shaped contact surface of the heat dissipation vertical plate 22 further increases the contact area between the air and the heat dissipation frame 20, improves the heat exchange area, and the combined action of the heat dissipation air duct and the water cooling tube 40 enhances the heat conduction capability of the air and the liquid, so that the heat of the main board is rapidly dissipated to the external environment.
As shown in fig. 3 and 4, the water cooling pipe 40 includes a pipe body 41 arranged in a serpentine shape, and the pipe body 41 passes back and forth through the heat dissipation air duct;
Wherein, one end of the tube main body 41 is a water inlet end 42, the other end of the tube main body 41 is a water outlet end 43, and the water inlet end 42 and the water outlet end 43 are both positioned on the same side of the heat dissipation frame 20. Because the water inlet end 42 and the water outlet end 43 of the water cooling pipe 40 are positioned on the same side of the heat dissipation frame 20, the pipeline arrangement and the circulation operation of the cooling liquid are convenient, and the serpentine pipe body 41 is uniformly distributed, so that the local overheating is effectively avoided. The intelligent screen main board has a compact overall structure and can adapt to intelligent screen main boards of different specifications.
In this embodiment, the cooling fan 30 discharges hot air from the cooling air duct by exhausting, and continuously introduces cold air, and meanwhile, the water cooling pipe 40 is arranged in the cooling air duct in a serpentine shape, so that the contact area between the water cooling pipe 40 and the hot air of the cooling air duct is increased, more efficient heat exchange is ensured, and the cooling liquid circulates in the pipe to take heat away from the cooling air duct. The dual heat dissipation mechanism of the hot air and water cooled tube 40 further improves the heat dissipation capability.
As shown in fig. 1 to 5, the heat dissipation plate 10 and the heat dissipation frame 20 are made of aluminum alloy materials. In this embodiment, the high thermal conductivity and corrosion resistance of the aluminum alloy allows the heat dissipation system to operate stably in various environments. The dual heat dissipation mechanism of the water cooling pipe 40 and the heat dissipation fan 30 reduces the temperature of the intelligent screen main board, prevents the damage of elements caused by overheating, and prolongs the service life of the device.
The heat dissipation plate 10 and the heat dissipation frame 20 are made of aluminum alloy. The aluminum alloy has excellent thermal conductivity and lighter weight, and can rapidly absorb and conduct heat while reducing the weight burden of the overall heat dissipating assembly. Through the application of aluminum alloy material, the heat is conducted to heat radiation structure's process from intelligent screen mainboard more high-efficient.
The intelligent screen main board radiating structure comprises a radiating plate 10, a radiating frame 20 and a radiating fan 30 which are connected in sequence, wherein a water cooling pipe 40 is arranged on the radiating frame 20. Exhausting and radiating the intelligent screen main board through the radiating fan 30, discharging hot air from the radiating air duct, and continuously introducing cold air;
Meanwhile, the water cooling pipes 40 are arranged in the heat dissipation air duct in a serpentine shape, so that the contact area between the water cooling pipes 40 and hot air in the heat dissipation air duct is increased, more efficient heat exchange is ensured, and cooling liquid circulates in the pipes to take heat away from the heat dissipation air duct. The dual heat dissipation mechanism of the hot air and the water cooling pipe 40 improves the heat dissipation effect. Therefore, the intelligent screen main board radiating structure provided by the utility model forms a high-efficiency and stable radiating solution by combining the snakelike water cooling pipe, the aluminum alloy radiating plate, the radiating frame and the radiating fan, obviously improves the radiating capacity of the intelligent screen main board and solves the technical problem of poor radiating effect of the intelligent screen main board.
While the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modifications or substitutions do not depart from the spirit and scope of the embodiments of the utility model.
Claims (8)
1. The intelligent screen main board radiating structure is characterized by comprising a radiating plate (10), a radiating frame (20) and a radiating fan (30) which are connected in sequence, wherein a vent hole (112) is formed in the radiating plate (10), a radiating air channel corresponding to the vent hole (112) is formed in the radiating frame (20), and a water cooling pipe (40) is arranged on the radiating frame (20);
The intelligent screen main board comprises a cooling plate (10) and a water cooling pipe (40), wherein the cooling plate (10) is connected with the intelligent screen main board, and the cooling fan (30) is used for exhausting and cooling the intelligent screen main board, so that heat generated by the intelligent screen main board is radiated through the ventilation hole (112), the cooling air channel and the water cooling pipe (40).
2. The intelligent screen main board radiating structure according to claim 1, wherein at least one radiating copper column (50) is installed on the radiating board (10).
3. The intelligent screen main board radiating structure according to claim 1 or 2, wherein the radiating board (10) comprises a first board (11) and a second board (12) which are vertically connected, a plurality of first mounting holes (111) are formed in the first board (11), and a plurality of second mounting holes (121) are formed in the second board (12).
4. The intelligent screen main board radiating structure according to claim 3, wherein the first board (11) is provided with four positioning grooves (113), and the radiating frame (20) is positioned and inserted into the positioning grooves (113).
5. The intelligent screen main board radiating structure according to claim 1 or 2, wherein the radiating frame (20) comprises two radiating transverse plates (21) which are oppositely arranged, a plurality of radiating vertical plates (22) are connected between the two radiating transverse plates (21), and the radiating transverse plates (21) and the radiating vertical plates (22) are enclosed to form the radiating air duct.
6. The intelligent screen main board radiating structure according to claim 5, wherein the radiating vertical board (22) is provided with a wavy radiating contact surface (221).
7. The intelligent screen motherboard heat dissipation structure as recited in claim 5, wherein the water-cooled tube (40) comprises a tube body (41) arranged in a serpentine shape, the tube body (41) passing back and forth through the heat dissipation air channel;
One end of the pipe main body (41) is a water inlet end (42), the other end of the pipe main body (41) is a water outlet end (43), and the water inlet end (42) and the water outlet end (43) are both positioned on the same side of the heat dissipation frame (20).
8. The intelligent screen main board radiating structure according to claim 1 or 2, wherein the radiating plate (10) and the radiating frame (20) are made of aluminum alloy materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520298171.0U CN224068853U (en) | 2025-02-24 | 2025-02-24 | Intelligent screen main board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520298171.0U CN224068853U (en) | 2025-02-24 | 2025-02-24 | Intelligent screen main board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN224068853U true CN224068853U (en) | 2026-03-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520298171.0U Active CN224068853U (en) | 2025-02-24 | 2025-02-24 | Intelligent screen main board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN224068853U (en) |
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2025
- 2025-02-24 CN CN202520298171.0U patent/CN224068853U/en active Active
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