CN224037677U - A heat dissipation component for a small multilayer PCB board - Google Patents
A heat dissipation component for a small multilayer PCB boardInfo
- Publication number
- CN224037677U CN224037677U CN202520252627.XU CN202520252627U CN224037677U CN 224037677 U CN224037677 U CN 224037677U CN 202520252627 U CN202520252627 U CN 202520252627U CN 224037677 U CN224037677 U CN 224037677U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- assembly
- pcb board
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of heat dissipation of PCB boards, in particular to a heat dissipation assembly of a small laminated PCB board, which comprises a heat conduction assembly, a connecting frame, a first micro fan and a second micro fan; when the heat dissipation assembly is used, the heat dissipation assembly formed by the heat conduction assembly, the connecting frame, the first micro fan and the second micro fan can absorb and conduct heat generated by the upper and lower laminated PCB boards when in operation under the action of the first heat conduction plate and the second heat conduction plate at the upper and lower ends of the heat conduction assembly, the heat is guided to the long heat dissipation plate and the short heat dissipation plate, the long heat dissipation plate and the short heat dissipation plate are used for dissipating heat, and the first micro fan and the second micro fan for exhausting air are arranged on the connecting frame at the left and right ends of the heat conduction assembly, so that the circulation of air between the heat dissipation plates can be accelerated, a better heat dissipation effect is achieved, and the heat conduction assembly, the connecting frame, the first micro fan and the second micro fan are connected in a detachable design, so that the heat dissipation assembly is convenient to maintain.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of Printed Circuit Boards (PCB), in particular to a heat dissipation assembly of a small laminated PCB.
Background
The PCB, also called a printed circuit board, is a support for electronic components and is a carrier for electrical interconnection of the electronic components. The electronic circuit board is manufactured by adopting an electronic printing technology, and electronic elements are etched on the surface of an insulating and non-adhesive copper-clad pressure plate to form a small circuit network, so that various electronic elements can form preset circuit connection, and a relay transmission function among the electronic elements is realized.
At present, the existing PCB board needs to be smaller and smaller in some applications, and needs to laminate two boards, and the existing lamination mode generally uses bonding and hot pressing to make two groups of circuit boards together, so that if the two groups of circuit boards are heat-dissipated through the PCB board or directly added with metal structural members, heat dissipation is difficult, and when one group of circuit boards is damaged, the two groups of circuit boards are not easy to separate.
Based on the above, the utility model designs a heat dissipation assembly of a small laminated PCB board to solve the above problems.
Disclosure of utility model
The utility model aims to solve the defects in the prior art and provides a heat dissipation assembly of a small laminated PCB.
The heat dissipation assembly comprises a heat conduction assembly, a connecting frame, first micro fans, second micro fans, a first PCB, a second PCB, first fastening screws, second fastening screws and third fastening screws, wherein the left end and the right end of the heat conduction assembly are fixedly connected with the connecting frame through the second fastening screws, the left side of the heat conduction assembly is fixedly provided with the two first micro fans through the third fastening screws, the right side of the heat conduction assembly is fixedly provided with the two second micro fans through the third fastening screws, the two first micro fans are exhaust fans, the two second micro fans are suction fans, the upper end of the heat conduction assembly is fixedly connected with the first PCB through the first fastening screws, and the lower end of the heat conduction assembly is fixedly connected with the second PCB through the first fastening screws.
As a preferable technical scheme of the utility model, the heat conduction assembly comprises a first heat conduction plate, a second heat conduction plate, connecting columns, vent holes, long radiating fins and short radiating plates, wherein the first heat conduction plate and the second heat conduction plate are fixedly connected through four connecting columns, the vent holes are formed in the connecting columns, and a plurality of long radiating fins and short radiating plates are arranged between the first heat conduction plate and the second heat conduction plate.
As a preferable technical scheme of the utility model, the first PCB is fixedly connected to the upper end of the first heat conducting plate, and the second PCB is fixedly connected to the lower end of the second heat conducting plate.
As a preferable technical scheme of the utility model, the connecting frame comprises a frame body, circular through holes and mounting plates, wherein two mounting plates are symmetrically and fixedly connected to the left side and the right side of the frame body, and two circular through holes are symmetrically formed in the frame body.
As a preferable technical scheme of the utility model, the two mounting plates at the upper end of the frame body are fixedly connected with the first heat conducting plate of the heat conducting component through the second fastening screw.
As a preferable technical scheme of the utility model, the two mounting plates at the lower end of the frame body are fixedly connected with the second heat conducting plate of the heat conducting component through second fastening screws.
As a preferable technical scheme of the utility model, the left two first micro fans are respectively and fixedly arranged at the two circular through holes on the left connecting frame through third fastening screws.
As a preferable technical scheme of the utility model, the two second micro fans on the right side are respectively and fixedly arranged at the two circular through holes on the right side connecting frame through third fastening screws.
Compared with the prior art, the utility model has the beneficial effects that:
1. When the heat dissipation device is used, the heat dissipation assembly formed by the heat conduction assembly, the connecting frame, the first micro fan and the second micro fan can absorb and conduct heat generated by the upper and lower laminated PCB boards when in operation under the action of the first heat conduction plate and the second heat conduction plate at the upper and lower ends of the heat conduction assembly, the heat is guided to the long heat dissipation plate and the short heat dissipation plate, the long heat dissipation plate and the short heat dissipation plate are used for dissipating heat, and the first micro fan of exhaust air and the second micro fan of suction air are arranged on the connecting frame at the left and right ends of the heat conduction assembly, so that the circulation of air between the heat dissipation plates can be accelerated, a better heat dissipation effect is achieved, and the heat conduction assembly, the connecting frame, the first micro fan and the second micro fan are connected in a detachable design, so that the heat dissipation assembly is convenient to maintain;
2. When the heat-conducting assembly is used, the first PCB is fixedly arranged at the upper end of the heat-conducting assembly through the first fastening screw, the second PCB is fixedly arranged at the lower end of the heat-conducting assembly through the first fastening screw, the lamination of the first PCB and the second PCB is realized, and through the non-thermal-compression bonding design, when one group of circuit boards is damaged, the heat-conducting assembly is convenient to detach and overhaul, and is convenient to install with the heat-radiating assembly.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the overall left-view structure of the present utility model;
FIG. 3 is a schematic diagram of the overall right-view structure of the present utility model;
FIG. 4 is a schematic view of a partially enlarged structure of the present utility model;
FIG. 5 is a schematic diagram of the overall explosive structure of the present utility model;
FIG. 6 is a schematic view of a heat conducting component according to the present utility model;
fig. 7 is a schematic view of a connection frame structure of the present utility model.
In the figure, 1, a heat conduction assembly, 101, a first heat conduction plate, 102, a second heat conduction plate, 103, a connecting column, 104, a through hole, 105, a long radiating fin, 106, a short radiating plate, 2, a connecting frame, 201, a frame body, 202, a round through hole, 203, a mounting plate, 3, a first micro fan, 4, a second micro fan, 5, a first PCB, 6, a second PCB, 7, a first fastening screw, 8, a second fastening screw and 9, a third fastening screw.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to fig. 1 to 7 in the embodiments of the present utility model, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-7, the present utility model provides a heat dissipation assembly of a small laminated PCB board, which comprises a heat conduction assembly 1, a connection frame 2, a first micro fan 3, a second micro fan 4, a first PCB board 5, a second PCB board 6, a first fastening screw 7, a second fastening screw 8 and a third fastening screw 9, wherein the left and right ends of the heat conduction assembly 1 are fixedly connected with the connection frame 2 through the second fastening screw 8, the left connection frame 2 is fixedly provided with two first micro fans 3 through the third fastening screw 9, the right connection frame 2 is fixedly provided with two second micro fans 4 through the third fastening screw 9, the two first micro fans 3 are exhaust fans, the two second micro fans 4 are suction fans, the upper end of the heat conduction assembly 1 is fixedly connected with the first PCB board 5 through the first fastening screw 7, and the lower end of the heat conduction assembly 1 is fixedly connected with the second PCB board 6 through the first fastening screw 7.
The heat conduction assembly 1 comprises a first heat conduction plate 101, a second heat conduction plate 102, a connecting column 103, a vent hole 104, long radiating fins 105 and a short radiating plate 106, wherein the first heat conduction plate 101 and the second heat conduction plate 102 are fixedly connected through the four connecting columns 103, the vent hole 104 is formed in each connecting column 103, and a plurality of long radiating fins 105 and short radiating plates 106 are arranged between the first heat conduction plate 101 and the second heat conduction plate 102.
The first PCB 5 is fixedly connected to the upper end of the first heat conducting plate 101, and the second PCB 6 is fixedly connected to the lower end of the second heat conducting plate 102.
The connecting frame 2 comprises a frame 201, circular through holes 202 and mounting plates 203, wherein two mounting plates 203 are symmetrically and fixedly connected to the left side and the right side of the frame 201, and two circular through holes 202 are symmetrically formed in the frame 201.
The two mounting plates 203 at the upper end of the frame 201 are fixedly connected with the first heat conducting plate 101 of the heat conducting assembly 1 through the second fastening screws 8.
The two mounting plates 203 at the lower end of the frame 201 are fixedly connected with the second heat conducting plate 102 of the heat conducting assembly 1 through the second fastening screws 8.
The above-mentioned first PCB board 5 and second PCB board 6 adopt detachable structural design with the lamination design of heat conduction subassembly 1, have replaced traditional hot pressing bonding technology, and the installation is dismantled more conveniently, when damage takes place for one of them a set of circuit board, is convenient for dismantle change or maintenance.
The left two first micro fans 3 are fixedly installed at the two circular through holes 202 on the left connecting frame 2 by the third fastening screws 9, respectively.
The right two second micro fans 4 are fixedly installed at the two circular through holes 202 on the right connecting frame 2 by the third fastening screws 9, respectively.
The two first micro fans 3 are exhaust type cooling fans, the two second micro fans 4 are suction type cooling fans, and the air in the heat conduction assembly 1 is enabled to flow rapidly through one row of one suction type arrangement, so that the heat dissipation efficiency of the heat conduction assembly 1 is improved.
When the heat-conducting assembly is specifically used, the heat-conducting assembly 1, the connecting frame 2, the first micro fan 3 and the second micro fan 4 are connected to form the heat-radiating assembly, the first PCB 5 and the second PCB 6 are respectively and fixedly arranged on the first heat-conducting plate 101 and the second heat-conducting plate 102 at the upper end and the lower end of the heat-conducting assembly 1, when the PCB works, the heat generated by the PCB can be absorbed and conducted through the first heat-conducting plate 101 and the second heat-conducting plate 102, the heat is transferred to the long heat-radiating fin 105 and the short heat-radiating plate 106, the heat is radiated through the long heat-radiating fin 105 and the short heat-radiating plate 106 by utilizing air circulation, the circulation of air can be quickened by simultaneously starting the first micro fan 3 and the second micro fan 4, the heat is quickened, the heat radiation effect is improved, and when one circuit board breaks down, the circuit board is convenient to overhaul.
It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present utility model, and the present utility model is not limited thereto, but may be modified or substituted for some of the technical features thereof by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520252627.XU CN224037677U (en) | 2025-02-18 | 2025-02-18 | A heat dissipation component for a small multilayer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520252627.XU CN224037677U (en) | 2025-02-18 | 2025-02-18 | A heat dissipation component for a small multilayer PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN224037677U true CN224037677U (en) | 2026-03-24 |
Family
ID=99135734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520252627.XU Active CN224037677U (en) | 2025-02-18 | 2025-02-18 | A heat dissipation component for a small multilayer PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN224037677U (en) |
-
2025
- 2025-02-18 CN CN202520252627.XU patent/CN224037677U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212786443U (en) | Independent air duct structure of servo driver | |
| CN224037677U (en) | A heat dissipation component for a small multilayer PCB board | |
| CN219437215U (en) | Intelligent heat dissipation multilayer circuit board | |
| CN211857369U (en) | High-efficient heat dissipation machine case | |
| CN113410193B (en) | 8+1 Stacked chip packaging device | |
| CN210899817U (en) | Circuit board module with high-efficiency heat dissipation | |
| CN115835475A (en) | High heat dissipation PCB circuit board | |
| CN223125174U (en) | Heat conduction structure of MOS tube of power plate of electronic speed regulator | |
| CN223798412U (en) | Multilayer PCB embedded power module | |
| CN219437213U (en) | Multilayer lug lamination circuit board | |
| CN219164976U (en) | Multilayer high-density circuit board | |
| CN221151622U (en) | Porous heat dissipation circuit board structure | |
| CN213718289U (en) | Circuit board convenient to heat dissipation | |
| CN213280465U (en) | Efficient cooling ring for copper clad laminates | |
| CN219269148U (en) | Spliced PCB circuit board | |
| CN223207437U (en) | A low-power amplifier | |
| CN220108516U (en) | Mainboard heat dissipation mechanism for intelligent voice interaction equipment | |
| CN221948650U (en) | A circuit board that is easy to dissipate heat | |
| CN213280197U (en) | Multilayer PCB substrate with optimized thermal conductivity and electrical connection | |
| CN224097901U (en) | Hollowed-out circuit board convenient for heat dissipation | |
| CN214960706U (en) | Laminated bus assembly with heat dissipation function | |
| CN222916403U (en) | A new type of high heat dissipation circuit board | |
| CN222674573U (en) | Driving and controlling all-in-one machine with heat dissipation structure | |
| CN222089820U (en) | Efficient heat dissipation type PCBA board | |
| CN219536389U (en) | A heat dissipation structure of an integrated circuit module for aerospace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |