CN224035859U - A display control motherboard with heat dissipation function - Google Patents

Abstract

The utility model relates to the technical field of control mainboards, in particular to a display control mainboard with a heat dissipation function, which comprises an equipment shell, wherein a main control chip, an image processor and a power management IC (integrated circuit) are sequentially welded on the surface of the main board body, a heat dissipation assembly is arranged on the side surface of the main board body and comprises a heat dissipation box, a brushless fan, an air inlet groove, an air exhaust groove, a heat homogenizing plate, heat dissipation fins and a phase change heat storage unit, heat generated by the main control chip, the image processor and the power management IC is conducted to the heat homogenizing plate through heat conduction silicone grease, the heat homogenizing plate diffuses the heat into a plurality of groups of heat dissipation fins, the groups of brushless fans extend to the heat dissipation fins to blow out a three-dimensional air flue, the heat on the surface of the heat homogenizing plate is quickly blown away, when the instantaneous heat generation is large, the phase change heat storage unit absorbs the redundant heat, the heat is gradually released after the load is reduced, the heat dissipation performance of the main board body is effectively improved, and the use safety of the equipment is improved.

Description

Display control main board with heat dissipation function

Technical Field

The utility model relates to the technical field of control mainboards, in particular to a display control mainboard with a heat dissipation function.

Background

The motherboard is also called as a motherboard, and is the largest circuit board in a computer system, and is divided into two types, namely a commercial motherboard and an industrial motherboard. The main circuit system of the computer is generally a rectangular circuit board, the main circuit system is installed on the rectangular circuit board, the main circuit system is generally provided with elements such as a BIOS chip, an I/O control chip, a key and panel control switch interface, an indicator light plug-in unit, an expansion slot, a main board, a direct current power supply plug-in unit of a plug-in card and the like, a series of joints can be provided for the joint of a processor, a display card, an acoustic card, a hard disk, a memory, external equipment and the like, the type and grade of the main board determine the type and grade of the whole microcomputer system, and the performance of the main board influences the performance of the whole microcomputer system.

Along with the popularization of digital display equipment, the performance stability of the control main board as a core component directly influences the display effect, and at present, the display control main board generally has a heating problem in high-load operation, so that the performance is reduced and even hardware is damaged.

Therefore, it is necessary to provide a display control motherboard with heat dissipation function to solve the above problems.

Disclosure of utility model

The utility model aims to provide a display control main board with a heat dissipation function, which aims to solve the problem that the display control main board in the prior art generally has heating problems during high-load operation, so that the performance is reduced and even hardware is damaged.

In order to achieve the above purpose, the display control main board with the heat dissipation function comprises a device shell, wherein a main board body is arranged in the device shell, a main control chip, an image processor and a power management IC are sequentially welded on the surface of the main board body, a heat dissipation assembly is arranged on the side face of the main board body and comprises a heat dissipation box, a brushless fan, an air inlet groove, an air exhaust groove, a heat dissipation plate, heat dissipation fins and a phase change heat storage unit, the heat dissipation plate is arranged on the upper side of the main board body, and a plurality of groups of inclined heat dissipation fins are fixedly connected to the surface of the heat dissipation plate.

Through adopting above-mentioned technical scheme, TG-4600 heat conduction silicone grease after all having paintd between even hot plate and main control chip, image processor and the power management IC, main control chip, the heat that image processor and power management IC produced is through heat conduction silicone grease conduction to even hot plate, even hot plate diffuses the heat to multiunit fin in, multiunit brushless fan extends slant fin and blows out three-dimensional wind channel, with even hot plate surface's heat fast blow off, when instantaneous calorific capacity is great, the phase change material absorbs unnecessary heat, gradually release heat after the load reduces, effectively improve the heat dispersion of mainboard body, improve equipment safety in utilization.

Optionally, the interior bottom wall fixedly connected with four sets of installation pieces of equipment casing, the screw hole has been seted up to the upper end of installation piece, the inside threaded connection of screw hole has the fixed screw.

Optionally, two groups of first connecting blocks are fixedly connected to the left end and the right end of the main board body, and a first clamping groove is formed in the surface of each first connecting block.

Optionally, both ends are all fixedly connected with two sets of second connecting blocks about the even hot plate, the second joint groove has been seted up on the surface of second connecting block, the upper end of installation piece is blocked in the inside of first joint groove and second joint groove respectively.

Through adopting above-mentioned technical scheme, first connecting block and second connecting block are respectively through first joint groove and second joint groove card at the surface of installation piece to through the fixed screw with first connecting block and second connecting block locking fixedly, and then carry out locking fixedly with mainboard body and even hot plate.

Optionally, the mounting groove has been seted up to equipment housing in mainboard body rear side position, heat dissipation box fixed mounting is in the inside of mounting groove, the front wall fixed mounting of heat dissipation box has four brushless fans that incline to set up.

Through adopting above-mentioned technical scheme, the radiating box passes through the screw fixation in the inside of mounting groove, and brushless fan diameter is 15 mm's miniature vortex fan, and inclination is 45.

Optionally, the rear wall of the heat dissipation box is provided with a plurality of groups of air inlet grooves, and one end of the inner side of each air inlet groove is fixedly connected with a dust screen.

Through adopting above-mentioned technical scheme, the air inlet tank is used for leading in outside cold wind inside equipment to filter the dust in the wind stream through the dust screen.

Optionally, a plurality of groups of exhaust grooves are formed in the positions of the rear wall of the equipment shell, which are positioned on the left side and the right side of the radiating box.

By adopting the technical scheme, the heat on the surface of the even heating plate is discharged outwards through the exhaust grooves on the two sides.

Optionally, the phase change heat storage unit is filled between the main board body and the inner bottom wall of the equipment shell.

By adopting the technical scheme, the phase-change heat storage unit contains paraffin-based phase-change materials.

In the technical scheme, the utility model has the technical effects and advantages that:

1. According to the utility model, heat generated by the main control chip, the image processor and the power management IC is conducted to the even heat plate through the heat conduction silicone grease, the even heat plate diffuses the heat into a plurality of groups of radiating fins, a plurality of groups of brushless fans extend to the inclined radiating fins to blow out the three-dimensional air duct, the heat on the surface of the even heat plate is quickly blown away, when the instantaneous heating value is large, the phase-change heat storage unit absorbs the redundant heat, and gradually releases the heat after the load is reduced, so that the heat dissipation performance of the main board body is effectively improved, and the use safety of equipment is improved;

2. According to the utility model, the radiating box is fixed in the mounting groove by utilizing the screw, so that the radiating box can be quickly taken out when the continuous use time is long, the dust screen in the radiating box is replaced, and the brushless fan can be quickly overhauled and replaced when the brushless motor fails in the long-time use process, so that the influence on the use of equipment is avoided.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a heat dissipation case according to the present utility model;

FIG. 3 is a schematic view of a structure of a vapor chamber of the present utility model;

fig. 4 is a schematic diagram of a main board body structure according to the present utility model.

Reference numerals illustrate:

1. The device comprises a device shell, 11 parts of a heat dissipation box, 12 parts of a brushless fan, 13 parts of an air inlet groove, 14 parts of a dust screen, 15 parts of an air exhaust groove, 16 parts of an installation block, 17 parts of a threaded hole, 18 parts of a fixing screw, 2 parts of a main board body, 21 parts of a main control chip, 22 parts of an image processor, 23 parts of a power supply management IC, 24 parts of a first connection block, 25 parts of a first clamping groove, 3 parts of a heat balancing plate, 31 parts of a heat dissipation fin, 32 parts of a second connection block, 33 parts of a second clamping groove, and 4 parts of a phase change heat storage unit.

Detailed Description

In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.

The utility model provides a display control main board with a heat dissipation function as shown in fig. 1 to 4, which comprises an equipment shell 1, wherein a main board body 2 is arranged in the equipment shell 1, a main control chip 21, an image processor 22 and a power management IC23 are sequentially welded on the surface of the main board body 2, a heat dissipation component is arranged on the side surface of the main board body 2, the heat dissipation component comprises a heat dissipation box 11, a brushless fan 12, an air inlet groove 13, an air exhaust groove 15, a heat homogenizing plate 3, heat dissipation fins 31 and a phase change heat storage unit 4, the heat homogenizing plate 3 is arranged on the upper side of the main board body 2, and a plurality of groups of inclined heat dissipation fins 31 are fixedly connected on the surface of the heat homogenizing plate 3.

Wherein, the main control chip 21, the image processor 22 and the power management IC23 are heating elements, during the installation, the surface of the main board body 2 is cleaned first, then the surface of the heating elements is uniformly coated with heat-conducting silicone grease with the thickness of 0.2mm, then the heat-homogenizing board 3 is pressed against the position of the heating elements, and the wiring of the brushless fan 12 is connected to the main board PWM control interface.

In the use process, the brushless fan 12, the even heating plate 3, the radiating fins 31 and the phase change heat storage unit 4 are matched to perform heat dissipation treatment on the main board body 2, so that the heat dissipation effect is effectively improved.

Referring to fig. 1 and 2, an installation groove is formed in a position of the rear side of the main board body 2 of the device housing 1, a heat dissipation box 11 is fixedly installed in the installation groove, four groups of brushless fans 12 which are obliquely arranged are fixedly installed on the front wall of the heat dissipation box 11, a plurality of groups of air inlet grooves 13 are formed in the rear wall of the heat dissipation box 11, a dust screen 14 is fixedly connected to one end of the inner side of the air inlet groove 13, a plurality of groups of air exhaust grooves 15 are formed in positions of the rear wall of the device housing 1, which are located on the left side and the right side of the heat dissipation box 11, and a phase change heat storage unit 4 is filled between the main board body 2 and the inner bottom wall of the device housing 1.

Specifically, in the use, the heat that the heating element produced on the surface of the main board body 2 is conducted to the surface of the even hot plate 3 through the heat conduction silica gel, and the even hot plate 3 rapidly disperses the heat to the inside of the multi-group radiating fins 31, and at this moment, the multi-group brushless fan 12 blows out the three-dimensional air channel, and rapidly blows out the heat on the surface of the radiating fins 31.

In addition, when equipment is used in the great environment of dust, accessible dismantles the screw after using a period, and then take out radiating box 11 outside, and then be convenient for change inside dust screen 14, when brushless fan 12 breaks down simultaneously, also can change brushless fan 12 fast, makes equipment can put into use fast, avoids producing the influence to the product show.

Referring to fig. 2 to 4, four sets of mounting blocks 16 are fixedly connected to the inner bottom wall of the equipment housing 1, threaded holes 17 are formed in the upper ends of the mounting blocks 16, fixing screws 18 are connected to the inner threads of the threaded holes 17, two sets of first connecting blocks 24 are fixedly connected to the left and right ends of the main board body 2, first clamping grooves 25 are formed in the surfaces of the first connecting blocks 24, two sets of second connecting blocks 32 are fixedly connected to the left and right ends of the heat homogenizing board 3, second clamping grooves 33 are formed in the surfaces of the second connecting blocks 32, and the upper ends of the mounting blocks 16 are respectively clamped inside the first clamping grooves 25 and the second clamping grooves 33.

It should be added that, in the process of installing the main board body 2 and the heat equalizing plate 3, the first connection blocks 24 at two ends of the main board body 2 are clamped at the upper ends of the installation blocks 16 through the first clamping grooves 25, then the second connection blocks 32 at two ends of the heat equalizing plate 3 are clamped at the upper ends of the installation blocks 16 through the second clamping grooves 33, the second connection blocks 32 are pressed on the upper sides of the first connection blocks 24, then the fixing screws 18 are in threaded connection with the threaded holes 17, the first connection blocks 24 and the second connection blocks 32 are pressed and fixed, further the main board body 2 and the heat equalizing plate 3 are locked and fixed, and then the phase-change heat storage unit 4 is filled in a gap between the main board body 2 and the equipment shell 1.

The utility model has the working principle that heat generated by a main control chip 21, an image processor 22 and a power management IC23 is conducted to a heat homogenizing plate 3 through heat conduction silicone grease, the heat homogenizing plate 3 diffuses the heat into a plurality of groups of radiating fins 31, a plurality of groups of brushless fans 12 extend to incline the radiating fins 31 to blow out a three-dimensional air duct, the heat on the surface of the heat homogenizing plate 3 is quickly blown away, when the instantaneous heating value is large, the phase-change heat storage unit 4 absorbs redundant heat, the heat is gradually released after the load is reduced, the heat radiation performance of the main board body 2 is effectively improved, the use safety of equipment is improved, meanwhile, the heat radiating box 11 is fixed in the mounting groove by utilizing screws, when the continuous use time is long, the heat radiating box 11 can be quickly taken out, the dust screen 14 in the heat homogenizing plate is replaced, and the brushless fans 12 can be quickly overhauled and replaced, and the use of the equipment is prevented from being influenced.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed.

Claims (8)

1. The display control main board with the heat dissipation function comprises an equipment shell (1) and is characterized in that a main board body (2) is arranged in the equipment shell (1), a main control chip (21), an image processor (22) and a power management IC (23) are sequentially welded on the surface of the main board body (2), a heat dissipation assembly is arranged on the side face of the main board body (2), the heat dissipation assembly comprises a heat dissipation box (11), a brushless fan (12), an air inlet groove (13), an air exhaust groove (15), a heat homogenizing plate (3), heat dissipation fins (31) and a phase change heat storage unit (4), the heat homogenizing plate (3) is arranged on the upper side of the main board body (2), and a plurality of groups of inclined heat dissipation fins (31) are fixedly connected to the surface of the heat homogenizing plate (3).

2. The display control main board with the heat dissipation function according to claim 1, wherein four groups of installation blocks (16) are fixedly connected to the inner bottom wall of the equipment shell (1), threaded holes (17) are formed in the upper ends of the installation blocks (16), and fixing screws (18) are connected to the inner threads of the threaded holes (17).

3. The display control main board with the heat dissipation function as set forth in claim 2, wherein two groups of first connecting blocks (24) are fixedly connected to the left end and the right end of the main board body (2), and a first clamping groove (25) is formed in the surface of each first connecting block (24).

4. The display control main board with the heat dissipation function according to claim 3, wherein two groups of second connecting blocks (32) are fixedly connected to the left end and the right end of the heat homogenizing board (3), second clamping grooves (33) are formed in the surfaces of the second connecting blocks (32), and the upper ends of the mounting blocks (16) are respectively clamped in the first clamping grooves (25) and the second clamping grooves (33).

5. The display control main board with the heat dissipation function as set forth in claim 1, wherein the device housing (1) is provided with a mounting groove at a rear side of the main board body (2), the heat dissipation box (11) is fixedly mounted in the mounting groove, and four groups of obliquely arranged brushless fans (12) are fixedly mounted on a front wall of the heat dissipation box (11).

6. The display control main board with the heat dissipation function according to claim 5, wherein a plurality of groups of air inlet grooves (13) are formed in the rear wall of the heat dissipation box (11), and a dust screen (14) is fixedly connected to one end of the inner side of the air inlet grooves (13).

7. The display control main board with the heat dissipation function as set forth in claim 1, wherein a plurality of groups of exhaust grooves (15) are formed in the rear wall of the equipment housing (1) at the left side and the right side of the heat dissipation box (11).

8. The display control main board with the heat dissipation function as set forth in claim 1, wherein the phase change heat storage unit (4) is filled between the main board body (2) and the inner bottom wall of the equipment shell (1).