CN223996444U

CN223996444U - Electronic component universal joint die bonding and gluing device and glue supply device

Info

Publication number: CN223996444U
Application number: CN202520080493.8U
Authority: CN
Inventors: 焦庆
Original assignee: Semtech Semiconductor Technology Dongguan Co Ltd
Current assignee: Semtech Semiconductor Technology Dongguan Co Ltd
Priority date: 2025-01-14
Filing date: 2025-01-14
Publication date: 2026-03-17
Anticipated expiration: 2035-01-14

Abstract

The utility model relates to the technical field of die bonding equipment, and particularly discloses a die bonding and gluing device for an electronic component universal joint, which comprises a container and a rotating shaft, wherein a stirring blade is arranged on a shaft section of the rotating shaft positioned in the container, the die bonding and gluing device comprises a frame and a rotating table, a first screw sleeve and a second screw sleeve are arranged on the rotating table, the first screw sleeve is in threaded connection with a first stud, a wafer suction head is arranged at the bottom of the first stud, the second screw sleeve is in threaded connection with a second stud, and a glue feeding head is arranged at the bottom of the second stud. When the wafer is pasted, the driving shaft controls the second screw sleeve to rotate through the rotation driving mechanism, the second screw sleeve is synchronously controlled in the rotation process of the rotating table, the wafer sucking head is moved to the position of the substrate where the glue is dispensed, and the glue supplying head is lifted, so that the wafer sucking head is synchronously lowered, the orderly performance of glue dispensing and die bonding operation is realized, and the die bonding efficiency of die bonding equipment is improved.

Description

Electronic component universal joint die bonding and gluing device and glue supply device

Technical Field

The utility model relates to the technical field of die bonding equipment, in particular to a die bonding and gluing device and a glue supplying device for an electronic component universal joint.

Background

The die bonder is also called a die bonder, a wafer bonding machine and a bonding chip machine. Is a mechanism for fixing a crystal and a semiconductor package. The device is mainly used for lead frame pressing plates of various gold wire ultrasonic welding equipment, various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, through pins, motors, carbon brushes, encoders, transmission belts of various chip mounting equipment, various parts of automatic equipment, instruments, meters and the like.

In the prior art, the die bonding equipment firstly utilizes the glue dispensing head to dispense glue on the substrate before the wafer is pasted, and then utilizes the swing arm to control the wafer suction head to move after the glue dispensing is finished, so that the wafer suction head finishes the procedures of wafer suction and wafer fixing.

Disclosure of utility model

The utility model aims to provide a die bonding and gluing device for an electronic component universal joint and a glue supply device, so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The die bonding and gluing device for the universal joint of the electronic component comprises a frame and a rotating table, wherein a driving shaft is rotatably installed on the frame, the rotating table is fixedly connected with the driving shaft, a first screw sleeve and a second screw sleeve are symmetrically arranged on the rotating table, the first screw sleeve and the second screw sleeve are rotatably connected with the rotating table, the first screw sleeve and the second screw sleeve are in transmission connection through a second synchronous belt, a first stud is connected with the inner side of the first screw sleeve through threads, a wafer suction head is arranged at the bottom of the first stud, a second stud is connected with the inner side of the second screw sleeve through threads, a glue supply head is arranged at the bottom of the second stud, and guide rods are installed on the first screw sleeve and the second screw sleeve and are in sliding connection with the rotating table.

The driving shaft is used for controlling the second screw sleeve to rotate through the rotation driving mechanism, the rotation driving mechanism comprises a first bevel gear, a second bevel gear, a third bevel gear and a fourth bevel gear, the first bevel gear is fixedly arranged on the driving shaft, the second bevel gear is rotatably arranged on the frame through a first rotating shaft, the third bevel gear is rotatably arranged on the rotating table through a second rotating shaft, the fourth bevel gear is fixedly arranged on the second screw sleeve, the first bevel gear is meshed with the second bevel gear, the third bevel gear is meshed with the fourth bevel gear, the first rotating shaft is connected with a connecting rod through a universal joint, and the connecting rod is connected with the second rotating shaft through a second universal joint.

As a still further scheme of the utility model, a top plate is arranged on the frame, a gear box and a driving motor are arranged on the top plate, the gear box is provided with an input shaft, a first output shaft and a second output shaft, the output end of the driving motor is connected with the input shaft, and the first output shaft of the gear box is connected with the driving shaft.

The utility model provides a glue feeding device, includes the container and rotates the rotation axis of installing on the container, the upper end of rotation axis through first synchronous area with the second output shaft of gear box is connected, and the rotation axis is located the inside axle section of container and is fixed mounting has stirring vane.

As a still further proposal of the utility model, two push plates are symmetrically and slidably arranged at the left side and the right side of the inside of the container, and the push plates are connected with the inner wall of the container through at least one connecting spring.

As a still further proposal of the utility model, a feeding hole is arranged on the container, a discharging hole is arranged at the bottom of the container, the feeding hole is connected with a push plate at one side through a connecting pipe, and the connecting pipe is in a hose structure.

As a still further proposal of the utility model, the discharge port of the container is connected with the dispensing head at the bottom of the second stud through a rubber supply pipe.

Compared with the prior art, the glue applying device has the advantages that the glue applying device is arranged on the die bonding equipment, the driving shaft rotates when the die is adhered, the driving shaft controls the rotating table to rotate, the driving shaft controls the second screw sleeve to rotate through the rotating driving mechanism with the universal joint structure, so that the second screw sleeve is synchronously controlled in the rotating process of the rotating table, the die sucking head is moved to the position of the substrate where glue is dispensed, the glue supplying head is lifted, the die sucking head is synchronously lowered, ordered glue dispensing and die bonding operation is realized, and the die bonding efficiency of the die bonding equipment is improved.

Drawings

Fig. 1 is a schematic structural diagram of a die bonding and adhesive bonding device for an electronic component universal joint.

Fig. 2 is a schematic diagram of a die bonding and adhesive bonding device for an electronic component gimbal.

Fig. 3 is a side view of the device for bonding and gluing the electronic component and the universal joint.

Fig. 4 is a front view of the device for bonding and gluing the electronic component and the universal joint.

Fig. 5 is a cross-sectional view of the adhesive supply device.

In the drawing, the device comprises a 10-frame, a 11-top plate, a 12-gear box, a 13-driving motor, a 14-first synchronous belt, a 15-driving shaft, a 151-first bevel gear, a 152-second bevel gear, a 16-connecting rod, a 161-third bevel gear, a 162-fourth bevel gear, a 20-glue supply device, a 21-container, a 211-feed inlet, a 212-discharge outlet, a 22-rotating shaft, a 221-stirring blade, a 23-push plate, a 24-connecting spring, a 25-connecting pipe, a 30-rotating table, a 31-first screw sleeve, a 32-first screw stud, a 33-second screw sleeve, a 34-second synchronous belt, a 35-second screw stud, a 36-guide rod and a 37-glue supply pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, in the embodiment of the present utility model, an electronic component universal joint die bonding and gluing device includes a frame 10, a glue supply device 20 and a rotating table 30, in this embodiment, the frame 10 is connected with a swing arm of a die bonding device, the swing arm has multiple degrees of freedom, in the use process of the gluing device, the swing arm is used for controlling the movement of the frame 10, a driving shaft 15 is rotatably mounted on the frame 10, the rotating table 30 is fixedly connected with the driving shaft 15, and the rotating table 30 is controlled to rotate when the driving shaft 15 is in a rotating state; the rotating table 30 is symmetrically provided with a first screw sleeve 31 and a second screw sleeve 33, the first screw sleeve 31 and the second screw sleeve 33 are both in rotary connection with the rotating table 30, the first screw sleeve 31 and the second screw sleeve 33 are respectively in transmission connection with the rotating table 30 through a second synchronous belt 34, the inner side of the first screw sleeve 31 is in threaded connection with a first stud 32, the bottom of the first stud 32 is provided with a wafer sucking head, the inner side of the second screw sleeve 33 is in threaded connection with a second stud 35, the bottom of the second stud 35 is provided with a glue supplying head, the first screw sleeve 31 and the second screw sleeve 33 are both provided with a guide rod 36, the guide rod 36 is in sliding connection with the rotating table 30, the first screw sleeve 31 and the second screw sleeve 33 respectively control the first stud 32 and the second stud 35 to move along the rotating table 30 at the moment, so that the first stud 32 drives the wafer sucking head to move up and down and the second stud 35 drives the glue supplying head to move up and down, as shown in fig. 1, when the second stud 35 drives the glue supplying head to move down and the wafer sucking head to the wafer, the wafer sucking head is driven by the first stud 32 to rotate up and the substrate to the first stud 30, the substrate is driven to rotate up and rotate the substrate 30, and the substrate to reach the position of the upper stud 15, subsequently, the first stud 32 drives the wafer suction head to move downward, fixing the wafer sucked on the wafer suction head on the substrate;

further, in the embodiment of the present application, the driving shaft 15 controls the second screw 33 to rotate through a rotation driving mechanism, the rotation driving mechanism includes a first bevel gear 151, a second bevel gear 152, a third bevel gear 161 and a fourth bevel gear 162, the first bevel gear 151 is fixedly installed on the driving shaft 15, the second bevel gear 152 is rotatably installed on the frame 10 through a first shaft, the third bevel gear 161 is rotatably installed on the rotating table 30 through a second shaft, the fourth bevel gear 162 is fixedly installed on the second screw 33, the first bevel gear 151 is engaged with the second bevel gear 152, the third bevel gear 161 and the fourth bevel gear 162 are engaged, the first shaft is connected with the connecting rod 16 through a universal joint, the connecting rod 16 is connected with the second shaft through a second universal joint, when the driving shaft 15 rotates, the driving shaft 15 controls the rotating table 30 to rotate, and the driving shaft 15 controls the second screw 33 through the rotation driving mechanism, thereby synchronously controlling the second screw 33 in the rotating process of the rotating table 30, that is, after the wafer carrier head rotates the substrate, the wafer carrier head is rotated to the second screw 31, and then the wafer carrier head is lifted, and the wafer carrier is moved to the second screw head is simultaneously lifted.

In the embodiment of the present application, a top plate 11 is installed on the frame 10, a gear box 12 and a driving motor 13 are installed on the top plate 11, the gear box 12 has an input shaft, a first output shaft and a second output shaft, an output end of the driving motor 13 is connected with the input shaft, the first output shaft of the gear box 12 is connected with the driving shaft 15, and the driving motor 13 controls the driving shaft 15 to rotate through the gear box 12.

As shown in fig. 1 and fig. 5, the embodiment of the application further discloses a glue supply device 20, the glue supply device 20 comprises a container 21 and a rotating shaft 22 rotatably installed on the container 21, the upper end of the rotating shaft 22 is connected with a second output shaft of the gear box 12 through a first synchronous belt 14, a driving motor 13 controls the rotating shaft 22 to rotate through the gear box 12, two pushing plates 23 are symmetrically and slidably installed on the left side and the right side of the interior of the container 21, the pushing plates 23 are connected with the inner wall of the container 21 through at least one connecting spring 24, stirring blades 221 are fixedly installed on a shaft section of the rotating shaft 22 positioned in the container 21, and when the rotating shaft 22 rotates, the rotating shaft 22 controls the stirring blades 221 to rotate, so that the stirring blades 221 stir glue solution in the container 21 to avoid glue solution solidification.

Further, in the embodiment of the present application, the container 21 is provided with a feeding port 211, the bottom of the container 21 is provided with a discharging port 212, the feeding port 211 is connected with a push plate 23 on one side through a connecting pipe 25, the connecting pipe 25 is in a hose structure, it can be understood that the feeding port 211 is used for adding glue solution, during the use of the glue supply device 20, the glue solution amount in the container 21 is continuously reduced, during the process, the push plate 23 moves to push the glue solution to be discharged from the discharging port 212, and the discharge efficiency of the glue solution is improved;

It should be further noted that, in the embodiment of the present application, the discharge port 212 of the container 21 is connected to the dispensing head at the bottom of the second stud 35 through the glue supply tube 37, and the glue supply tube 37 is used for supplying glue to the dispensing head.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The glue supply device is characterized by comprising a container (21) and a rotating shaft (22) rotatably mounted on the container (21), wherein the upper end of the rotating shaft (22) is connected with a second output shaft of a gear box (12) through a first synchronous belt (14), and stirring blades (221) are fixedly mounted on a shaft section of the rotating shaft (22) positioned in the container (21).

2. Glue supply device according to claim 1, characterized in that two push plates (23) are symmetrically and slidably mounted on the left and right sides of the interior of the container (21), and the push plates (23) are connected with the inner wall of the container (21) through at least one connecting spring (24).

3. Glue supply device according to claim 2, characterized in that the container (21) is provided with a feed inlet (211), the bottom of the container (21) is provided with a discharge outlet (212), the feed inlet (211) is connected with the push plate (23) on one side through a connecting pipe (25), and the connecting pipe (25) is of a hose structure.

4. A glue supply device according to claim 3, characterized in that the outlet (212) of the container (21) is provided with a glue supply tube (37), which glue supply tube (37) is used for connecting the glue heads.

5. The die bonding and gluing device for the electronic component universal joint comprises the die bonding and gluing device according to any one of claims 1-4 and is characterized by further comprising a frame (10) and a rotating table (30), wherein a driving shaft (15) is rotatably arranged on the frame (10), the rotating table (30) is fixedly connected with the driving shaft (15), a first screw sleeve (31) and a second screw sleeve (33) are symmetrically arranged on the rotating table (30), the first screw sleeve (31) and the second screw sleeve (33) are rotatably connected with the rotating table (30), the first screw sleeve (31) and the second screw sleeve (33) are in transmission connection through a second synchronous belt (34), a first stud (32) is in threaded connection with the inner side of the first screw sleeve (31), a wafer sucking head is arranged at the bottom of the first stud (32), a second stud (35) is in threaded connection with the inner side of the second screw sleeve (33), a glue feeding head is arranged at the bottom of the second stud (35), and the first screw sleeve (31) and the second screw sleeve (33) are connected with a guide rod (36) in a sliding mode.

6. The electronic component universal joint die bonding device according to claim 5, wherein the driving shaft (15) controls the second screw sleeve (33) to rotate through a rotation driving mechanism, the rotation driving mechanism comprises a first bevel gear (151), a second bevel gear (152), a third bevel gear (161) and a fourth bevel gear (162), the first bevel gear (151) is fixedly mounted on the driving shaft (15), the second bevel gear (152) is rotatably mounted on the frame (10) through a first rotating shaft, the third bevel gear (161) is rotatably mounted on the rotating table (30) through a second rotating shaft, the fourth bevel gear (162) is fixedly mounted on the second screw sleeve (33), the first bevel gear (151) is meshed with the second bevel gear (152), the third bevel gear (161) is meshed with the fourth bevel gear (162), the first rotating shaft is connected with the connecting rod (16) through a universal joint, and the connecting rod (16) is connected with the second rotating shaft through a second universal joint.

7. The die bonding and gluing device for the universal joint of the electronic component according to claim 5, characterized in that a top plate (11) is installed on the frame (10), a gear box (12) and a driving motor (13) are installed on the top plate (11), the gear box (12) is provided with an input shaft, a first output shaft and a second output shaft, the output end of the driving motor (13) is connected with the input shaft, and the first output shaft of the gear box (12) is connected with the driving shaft (15).