CN223966881U - Memory bank heat dissipation module - Google Patents
Memory bank heat dissipation moduleInfo
- Publication number
- CN223966881U CN223966881U CN202520681034.5U CN202520681034U CN223966881U CN 223966881 U CN223966881 U CN 223966881U CN 202520681034 U CN202520681034 U CN 202520681034U CN 223966881 U CN223966881 U CN 223966881U
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- Prior art keywords
- memory
- heat dissipation
- connecting plate
- plate
- shell
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Abstract
本实用新型涉及内存条散热技术领域，具体为一种内存条散热模组，包括连接板、壳体和风机；连接板包裹在内存条的中部顶端并与内存槽的内侧贴合连接，连接板的侧面向另一个内存条的侧面延伸且端部向内存槽的端部处延伸，连接板与内存条一一对应布置；壳体设置在内存槽的一端并与连接板连接，壳体的侧面且靠近底端处设有多个用于在使用状态下向两个相邻内存条之间进行风力输送的排风孔。本实用新型通过连接板对两个内存条之间的顶部进行遮挡，并围合形成空气流道，使排风孔排出的冷空气在流道中与内存条和连接板换热，并将流道中的热空气向内存条的端部移动并排放，从而有效降低内存条及其周围环境的温度，提升散热效率。
This utility model relates to the field of memory module heat dissipation technology, specifically a memory module heat dissipation module, including a connecting plate, a housing, and a fan. The connecting plate wraps around the top of the middle of the memory module and is attached to the inner side of the memory slot. The side of the connecting plate extends towards the side of another memory module, and the end extends towards the end of the memory slot. The connecting plate and the memory modules are arranged in a one-to-one correspondence. The housing is located at one end of the memory slot and is connected to the connecting plate. The side of the housing, near the bottom, has multiple exhaust holes for airflow between two adjacent memory modules during use. This utility model uses the connecting plate to shield the top between two memory modules and form an airflow channel. The cool air discharged from the exhaust holes exchanges heat with the memory modules and the connecting plate in the channel, and moves the hot air in the channel towards the end of the memory module and discharges it, thereby effectively reducing the temperature of the memory module and its surrounding environment and improving heat dissipation efficiency.
Description
Technical Field
The utility model relates to the technical field of memory bank heat dissipation, in particular to a memory bank heat dissipation module.
Background
With the development of technology, the application of servers is becoming more and more widespread. The server is provided with a central processing unit and a memory bank, and the server can realize the required functions through the central processing unit and the memory bank. The memory bank generates heat during operation, which affects the performance of the memory bank, thereby requiring heat dissipation from the memory bank.
The Chinese patent document with the authorized bulletin number of CN217114372U discloses a memory bank heat radiation module, which comprises a radiator and a heat radiation side plate which can be attached to the side surface of the memory bank, wherein a groove capable of accommodating a convex part on the memory bank is arranged on the heat radiation side plate, a heat conduction gasket or heat conduction paste is arranged in the groove, and the heat radiation side plate is connected with the radiator through a heat conduction pipe.
But in above-mentioned scheme, on the heat that the memory strip produced was passed through heat dissipation curb plate, heat pipe conduction to the radiator, dispel the heat fast to the heat of conduction through the radiator, when using, the memory strip can continuously produce the heat and heat surrounding environment, leads to memory strip surrounding environment overall environment temperature higher, and memory strip and surrounding environment can directly heat dissipation curb plate and heat pipe, only dispel the heat to the heat pipe through the radiator, and the radiating efficiency is lower.
Disclosure of utility model
The utility model aims to solve the problems in the background technology and provides a memory bank heat dissipation module.
The technical scheme of the utility model is that the memory bank heat dissipation module comprises a connecting plate, a shell and a fan;
The connecting plates are wrapped at the top end of the middle part of the memory bar and are connected with the inner side of the memory slot in a bonding way, the side faces of the connecting plates extend to the side faces of the other memory bar, the end parts of the connecting plates extend to the end parts of the memory slot, and the connecting plates are arranged in a one-to-one correspondence with the memory bars;
the shell is arranged at one end of the memory slot and is connected with the connecting plate, and a plurality of exhaust holes for carrying out wind power transmission between two adjacent memory strips in a use state are arranged at the side surface of the shell and near the bottom end of the shell;
The quantity of fans is at least one, and the fans are installed on the top end of the shell and are arranged towards the shell, and the air outlets of the fans are communicated with the shell.
Preferably, the other end of the memory groove is connected with a connecting bar in a fitting way, and the side face of the connecting bar is connected with the side face end part of the connecting plate.
Preferably, an extension plate is arranged at the top end of the side face of the connecting plate and positioned between the two memory strips, two ends of the extension plate extend towards the end parts of the memory slots respectively and are connected with the connecting strip and the shell, and a gap is reserved between the side face of the extension plate and one side of the memory strips.
Preferably, a baffle is arranged on the other side of the connecting plate between the two memory strips and below the extension plate, a gap is formed between the top end of the baffle and the bottom end of the extension plate, and a gap is formed between the side surface of the baffle and the other side of the memory strips.
Preferably, the projection shape of the connecting plate is U-shaped, and a chamfer is arranged on the inner side of the opening of the connecting plate.
Preferably, a plurality of cooling fins are arranged at the top ends of the connecting plate and the extending plate and the bottom ends of the baffle plates, and gaps are reserved among the cooling fins.
Preferably, a partition is provided inside the housing at the end of the memory slot.
Compared with the prior art, the technical scheme provided by the utility model has the following beneficial technical effects:
According to the utility model, the top between the two memory strips is shielded by the connecting plate and is enclosed to form the air flow channel, so that cold air exhausted from the exhaust hole exchanges heat with the memory strips and the connecting plate in the flow channel, and hot air in the flow channel is moved to the end parts of the memory strips and is exhausted, thereby effectively reducing the temperature of the memory strips and the surrounding environment thereof and improving the heat dissipation efficiency.
Drawings
Figures 1-2 are perspective views of one embodiment of the present utility model.
Fig. 3 is a schematic structural diagram of a connection board according to an embodiment of the present utility model.
Fig. 4 is a schematic cross-sectional view of a connecting plate according to an embodiment of the present utility model.
Fig. 5 is a schematic cross-sectional view of a housing structure according to an embodiment of the present utility model.
The device comprises a reference numeral 1, a memory groove, a2, a memory bar, a 3, a connecting plate, a 4, a shell, a 5, a fan, a 6, radiating fins, a 7, a connecting bar, an 8, an extension plate, a 9, a baffle, a 10, an exhaust hole, a 11 and a baffle.
Detailed Description
Example 1
As shown in fig. 1-5, the memory bank heat dissipation module provided by the utility model comprises a connecting plate 3, a shell 4 and a fan 5;
The connecting plates 3 are wrapped at the top end of the middle part of the memory bar 2 and are connected with the inner side of the memory slot 1 in a bonding way, the side faces of the connecting plates 3 extend to the side faces of the other memory bar 2, the end parts of the connecting plates extend to the end parts of the memory slot 1, and the connecting plates 3 are arranged in a one-to-one correspondence with the memory bars 2;
The shell 4 is arranged at one end of the memory slot 1 and is connected with the connecting plate 3, and a plurality of exhaust holes 10 for carrying out wind power transmission between two adjacent memory strips 2 in a use state are arranged at the side surface of the shell 4 and near the bottom end;
The number of the fans 5 is at least one, the fans 5 are installed at the top end of the shell 4 and are arranged towards the shell 4, and air outlets of the fans 5 are communicated with the shell 4.
In an alternative embodiment, the other end of the memory slot 1 is connected with a connecting strip 7 in a fitting manner, the side surface of the connecting strip 7 is connected with the side surface end part of the connecting plate 3, the other ends of the connecting plates 3 are connected into a whole through the connecting strip 7, the connecting plate 3, the shell 4 and the connecting strip 7 are connected into a whole, and the installation stability of the connecting plate 3 is improved.
In an alternative embodiment, the projection shape of the connecting plate 3 is in a U shape, and a chamfer is arranged on the inner side of the opening of the connecting plate 3, so that the connecting plate 3 is smoothly connected with the memory bank 2 through the chamfer when the connecting plate 3 is connected with the memory bank 2.
In an alternative embodiment, a partition 11 is disposed at the end of the inner side of the housing 4 and located at the end of the memory slot 1, so that the space inside the housing 4 is reduced by the partition 11 in use, and the wind conveyed by the fan 5 moves directly to the exhaust hole 10, so as to improve the air outlet efficiency of the housing 4.
In this embodiment, the connecting plate 3 wraps the top end of the middle part of the memory bank 2 and extends to the other memory bank 2, so that the connecting plate 3 conducts heat to the memory bank 2 and simultaneously shields the top of the space between the two memory banks 2, and the side surface of the connecting plate 3 has a gap with the memory bank 2, so that the space between the two memory banks 2 is prevented from being completely shielded by the connecting plate 3, meanwhile, the fan 5 starts to convey cold air to the inner side of the shell 4, and the air at the inner side of the shell 4 is conveyed to the space between the two memory banks 2 through the exhaust hole 10, so that hot air between the two memory banks 2 is moved from one end to the other end and discharged, meanwhile, the cold air contacts the connecting plate 3 and the memory banks 2 in the moving process to exchange heat and synchronously discharges the heat exchanged air, and meanwhile, part of the cold air discharged through the exhaust hole 10 moves upwards through the gap after exchanging heat between the memory bank 2 and the connecting plate 3, so that the heat dissipation area between the memory banks 2 is increased, the heat dissipation efficiency of the memory banks 2 is ensured, and the heat dissipation efficiency of the memory banks 2 is improved.
Example two
As shown in fig. 3-4, in comparison with the first embodiment, the difference between the present embodiment and the first embodiment is that an extension board 8 is disposed between two memory banks 2 at the top end of the side surface of the connection board 3, two ends of the extension board 8 extend toward the end of the memory slot 1 and are connected to the connection board 7 and the housing 4, and a gap is formed between the side surface of the extension board 8 and one side of the memory bank 2.
In this embodiment, connect connecting plate 3, casing 4 and connecting strip 7 as an organic whole through the setting of extension board 8, strengthen the stability of connecting plate 3 installation, the clearance between extension board 8 and the memory strip 2 has increased air current area and efficiency simultaneously, has further promoted the radiating effect.
Example III
As shown in fig. 4, in the memory bank heat dissipation module according to the present utility model, compared with the first embodiment, the difference is that the other side of the connecting plate 3 is located between two memory banks 2 and the baffle 9 is disposed below the extension plate 8, the top end of the baffle 9 and the bottom end of the extension plate 8 have a gap, and the side surface of the baffle 9 and the other side of the memory banks 2 have a gap.
In this embodiment, by arranging the baffle plate 9 on the other side of the connecting plate 3, and making a gap between the baffle plate 9 and the extension plate 8 and between the baffle plate and the memory bank 2, the air exhausted from the exhaust hole 10 is subjected to heat exchange and blocking by the baffle plate 9, the air quantity of the air exhausted from the exhaust hole 10 and flowing upwards is reduced, and the heat dissipation effect of the connecting plate 3 is improved, so that the memory bank keeps a stable temperature during operation.
Example IV
As shown in fig. 4, in the memory bank heat dissipation module according to the present utility model, compared with the first embodiment, the difference is that the top ends of the connecting plate 3 and the extending plate 8 and the bottom end of the baffle 9 are respectively provided with a plurality of heat dissipation fins 6, and gaps are provided between the plurality of heat dissipation fins 6.
In this embodiment, the heat dissipation areas of the connecting plate 3 and the baffle plate 9 are increased by the heat dissipation fins 6, so that the heat dissipation efficiency of natural convection heat dissipation is improved at the top end of the connecting plate 3, the air contact area between the baffle plate 9 and the exhaust hole 10 is increased, the heat dissipation effect of the baffle plate 9 to the connecting plate 3 is improved, and the heat dissipation effect of the memory bank 2 is further improved.
According to the utility model, the top end of the middle part of the memory bank 2 is wrapped by the connecting plate 3, the top end is respectively arranged at one side of the connecting plate 3 through the extending plate 8 and the baffle plate 9, the extending plate 8 and the baffle plate 9 extend towards the end part of the memory bank 1, the shell 4 and the connecting bar 7 are arranged at the end part of the memory bank 1 and are connected with the connecting plate 3 into a whole, the plurality of radiating fins 6 are arranged on the connecting plate 3, the extending plate 8 and the baffle plate 9, the radiating area of the radiating fins 6 is increased, the top part of the space between the two memory banks 2 is shielded through the extending plate 8 and the baffle plate 9, the fan 5 is started, the fan 5 is used for conveying cold air to the inner side of the shell 4, the air inside the shell 4 is conveyed to the space between the two memory banks 2 through the exhaust hole 10, the hot air between the two memory banks 2 is enabled to move from one end to the other end, meanwhile, the cold air is enabled to be in contact with the connecting plate 3 and the memory bank 2 in the moving process and is enabled to be discharged synchronously, and gaps are formed among the extending plate 8, the extending plate 8 and the extending plate 9 and the baffle plate 9 are arranged on the connecting plate 2, the radiating plate is enabled to have the radiating effect, the space between the extending plate 8 and the extending plate 9 and the air flow path is enabled to form a radial contact with the moving direction, and the air flowing path is enabled to move, when the air and the air is enabled to move stably and the flowing in the moving process and the flowing path is enabled to move along the extending plate 8 and the flowing through the extending plate 9 and the extending plate and the air.
The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.
Claims (7)
1. The memory bank heat dissipation module is characterized by comprising a connecting plate (3), a shell (4) and a fan (5);
the connecting plates (3) are wrapped at the top ends of the middle parts of the memory strips (2) and are connected with the inner sides of the memory slots (1) in a bonding mode, the side faces of the connecting plates (3) extend towards the side faces of the other memory strips (2), the end portions of the connecting plates extend towards the end portions of the memory slots (1), and the connecting plates (3) are arranged in a one-to-one correspondence with the memory strips (2);
The shell (4) is arranged at one end of the memory slot (1) and is connected with the connecting plate (3), and a plurality of exhaust holes (10) for carrying out wind power transmission between two adjacent memory strips (2) in a use state are arranged at the side surface of the shell (4) and near the bottom end;
The number of the fans (5) is at least one, the fans (5) are arranged at the top end of the shell (4) and towards the shell (4), and the air outlets of the fans (5) are communicated with the shell (4).
2. The memory bar heat radiation module set as claimed in claim 1, wherein the other end of the memory slot (1) is connected with a connecting bar (7) in a fitting manner, and a side surface of the connecting bar (7) is connected with a side surface end part of the connecting plate (3).
3. The memory bar heat dissipation module as set forth in claim 2, wherein an extension plate (8) is disposed between the two memory bars (2) at the top end of the side surface of the connection plate (3), two ends of the extension plate (8) extend toward the end of the memory slot (1) and are connected to the connection bar (7) and the housing (4), and a gap is formed between the side surface of the extension plate (8) and one side of the memory bar (2).
4. A memory bank heat dissipation module according to claim 3, characterized in that the other side of the connecting plate (3) is located between two memory banks (2) and below the extension plate (8) is provided with a baffle (9), the top end of the baffle (9) and the bottom end of the extension plate (8) have a gap, and the side of the baffle (9) and the other side of the memory banks (2) have a gap.
5. The memory bank heat dissipation module as set forth in claim 1, wherein the projection shape of the connection board (3) is U-shaped, and a chamfer is provided on the inner side of the opening of the connection board (3).
6. The memory bank heat dissipation module as set forth in claim 4, wherein a plurality of heat dissipation fins (6) are provided at the top ends of the connection plate (3) and the extension plate (8) and at the bottom ends of the baffle plate (9), and gaps are provided between the plurality of heat dissipation fins (6).
7. A memory bank heat sink module according to claim 1, characterized in that a partition (11) is provided inside the housing (4) at the end of the memory slot (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520681034.5U CN223966881U (en) | 2025-04-11 | 2025-04-11 | Memory bank heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520681034.5U CN223966881U (en) | 2025-04-11 | 2025-04-11 | Memory bank heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223966881U true CN223966881U (en) | 2026-03-03 |
Family
ID=98887253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520681034.5U Active CN223966881U (en) | 2025-04-11 | 2025-04-11 | Memory bank heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223966881U (en) |
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2025
- 2025-04-11 CN CN202520681034.5U patent/CN223966881U/en active Active
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