CN223829532U - Device for cooling output materials - Google Patents

Abstract

The utility model relates to a device for cooling output materials, which comprises a carrier plate, wherein the middle part of the top wall of the carrier plate is fixedly connected with an outer shell, the rear side of the top wall of the outer shell is fixedly connected with two rotating shafts, the front sides of the two rotating shafts are fixedly connected with sealing covers, the middle upper part of the inner wall of the outer shell is fixedly connected with a baffle plate, the inner bottom wall of the outer shell is fixedly connected with a heat dissipation hollow plate, the top wall of the heat dissipation hollow plate is provided with a plurality of positioning grooves at equal intervals, and the bottom end of the right side of the outer shell is fixedly connected with a heat exchanger. In the utility model, the shell body provides a closed space for the PCBA board, the heat exchanger, the radiating water tank and the radiating hollow board form a circulation loop, the cooling liquid flows to take away heat, and the radiating fins are added to enhance the heat radiation, so that the PCBA board is efficiently cooled, and the cooling efficiency of the PCBA board is greatly improved.

Description

A device for cooling output materials.

Technical Field

This utility model relates to a device for cooling output materials, and more particularly to a device for cooling output materials.

Background Technology

PCBA board cooling devices are important components for ensuring the stable operation of electronic equipment. They are mainly used in the field of electronic equipment manufacturing to prevent PCBA boards from overheating and being damaged, while improving product reliability and stability and ensuring the stable performance of electronic components.

A search revealed Chinese patent publication number CN218284057U, entitled "A Cooling Device for PCBA Circuit Boards After Reflow Soldering," belonging to the field of reflow soldering cooling devices. The device includes a frame, conveyor belts, guide plates, a cooling box, a cold air box, and an air inlet duct. Multiple conveyor belts are slidably mounted on the frame, which is equipped with a drive mechanism for moving the conveyor belts. Guide plates are slidably mounted on the frame, located at the upper end of the conveyor belts and slidably connected to them. A pushing mechanism for moving the guide plates is also provided on the frame. The cooling box is mounted on the frame, with the conveyor belts located below it. The cold air box is mounted on the cooling box, and the air inlet duct is mounted on the cold air box. This invention can conveniently cool PCBA circuit boards, thus cooling the solder joints. However, this device relies solely on the conveyor belts to transport the PCBA circuit boards to the bottom of the cooling box, where they are cooled via the cold air box and air inlet duct. This heat dissipation method is relatively simple, and the combination of the conveyor belts and guide plates affects airflow, making it difficult to quickly reduce the temperature of the circuit boards, resulting in slow heat dissipation.

Utility Model Content

To overcome the above shortcomings, this utility model provides a device for cooling output materials, aiming to improve the problem that the combination of conveyor belt and guide plate in PCBA circuit boards affects air circulation, making it difficult to quickly reduce the temperature of the circuit boards and resulting in slow heat dissipation.

To achieve the above objectives, the present invention adopts the following technical solution: a device for cooling output materials, comprising a carrier plate, an outer shell fixedly connected to the middle of the top wall of the carrier plate, two rotating shafts fixedly connected to the rear side of the top wall of the outer shell, a sealing cover fixedly connected to the front side of each of the two rotating shafts, a baffle fixedly connected to the upper middle part of the inner wall of the outer shell, a heat dissipation hollow plate fixedly connected to the inner bottom wall of the outer shell, a plurality of positioning grooves equidistantly formed on the top wall of the heat dissipation hollow plate, a heat exchanger fixedly connected to the bottom right side of the outer shell, the top front side of the heat exchanger communicating with the right side of the heat dissipation hollow plate via a pipe, a heat dissipation water tank fixedly connected to the middle of the bottom wall of the carrier plate, the bottom front side of the heat exchanger communicating with the right side of the heat dissipation water tank via a pipe, the left side of the heat dissipation water tank communicating with the left side of the heat dissipation hollow plate, a plurality of heat dissipation fins penetrating and fixedly connected to the bottom of the heat dissipation water tank, and a fixed-point heat dissipation mechanism provided on the front side of the outer shell.

The above technical solution provides a closed space for the PCBA board through the outer shell, and the heat exchanger, heat sink and heat dissipation hollow plate form a circulation loop. The coolant flow carries away the heat, and the heat sink enhances the heat dissipation, thus achieving efficient cooling of the PCBA board and greatly improving the cooling efficiency of the PCBA board.

As a further description of the above technical solution:

The fixed-point heat dissipation mechanism includes multiple intake fans, which are equidistantly fixedly installed on the front inner wall of the outer casing. Multiple filters are fixedly connected to the front of the outer casing. A flow channel is fixedly connected to the front inner wall of the outer casing. Multiple flow guide holes are opened on the top wall of the flow channel. A wind box is fixedly connected to the bottom wall of the sealing cover. Multiple air guide pipes are connected to the front of the wind box. The multiple air guide pipes are respectively engaged with the multiple flow guide holes. Multiple fixed-point air outlet holes are equidistantly opened on the bottom wall of the wind box. The multiple fixed-point air outlet holes are respectively located directly above the multiple positioning slots. An exhaust fan is fixedly installed equidistantly on the rear inner wall of the outer casing.

The above technical solution involves using an intake fan to draw external air into the air box, which is then exhausted through a fixed-point exhaust port. Since the fixed-point exhaust port is located directly above the positioning slot, the air can directly blow air onto the PCBA board for heat dissipation, achieving efficient heat dissipation of the PCBA board and reducing the total energy consumption.

As a further description of the above technical solution:

A control console is fixedly connected to the front side of the top wall of the carrier plate, and multiple control panels are fixedly installed on the top wall of the control console.

The above technical solution provides an installation location for the control panel, which can adjust the speed of the intake and exhaust fans and control the working status of the heat exchanger, thereby enabling parameter setting and operation control of the entire cooling device.

As a further description of the above technical solution:

A tachometer is fixedly connected to the front left end of the outer casing, and the tachometer is electrically connected to multiple air intake fans.

The above technical solution involves electrically connecting the tachometer to multiple intake fans, which allows the intake fan speed to be displayed in real time. This enables operators to understand the working status of the intake fans and make timely adjustments or repairs when the speed is abnormal, ensuring the normal operation of the fixed-point heat dissipation mechanism.

As a further description of the above technical solution:

The bottom wall of the carrier plate is fixedly connected to four corners with legs, and the bottom ends of the legs are fixedly connected to anti-slip pads.

Through the above technical solution: the outriggers support the entire cooling device, enabling the device to be placed stably in the workplace, and the anti-slip mats increase the friction between the outriggers and the ground, preventing the device from sliding during operation.

As a further description of the above technical solution:

The sealing cover has a hidden groove on the front side of its top wall, and a handle is fixedly connected to the bottom wall of the hidden groove.

The above technical solution allows for the placement of a handle in the hidden slot. When the sealing cover needs to be opened, the operator can easily lift the cover using the handle to insert or remove the PCBA board, thus improving operational convenience.

As a further description of the above technical solution:

A sealing ring is fixedly connected to the outer side of the bottom wall of the sealing cover, and a sealing groove is provided on the top wall of the baffle. The sealing ring and the sealing groove are engaged with each other.

The above technical solution allows the sealing ring and sealing groove to engage when the sealing cover is closed, creating a good sealing effect. This prevents external dust and impurities from entering the housing and affecting the cooling effect. It also avoids heat loss during the cooling process and improves cooling efficiency.

As a further description of the above technical solution:

The heat sinks are arranged in an equidistant row and are fixedly connected to each other in a cross manner.

The above technical solution involves heat sinks arranged in an equidistant, interlocking pattern, which increases the contact area with air and improves heat dissipation efficiency. The heat in the water tank is quickly dissipated into the surrounding air through the heat sinks, thus ensuring that the coolant can continuously and effectively absorb the heat generated by the PCBA board during circulation.

This utility model has the following beneficial effects:

1. In this utility model, the outer shell provides a closed space for the PCBA board, and the heat exchanger, heat sink and heat dissipation hollow plate form a circulation loop. The coolant flow carries away the heat, and the heat sink enhances the heat dissipation, thus achieving efficient cooling of the PCBA board and greatly improving the cooling efficiency of the PCBA board.

2. In this utility model, external air is introduced into the air box by an intake fan and then discharged from the fixed air outlet. Since the fixed air outlet is opened directly above the positioning groove, the air can directly blow air onto the PCBA board for heat dissipation, thereby achieving efficient heat dissipation of the PCBA board and reducing the total energy consumption.

Attached Figure Description

Figure 1 is a perspective view of a device for cooling output materials according to the present invention;

Figure 2 is a front view of a device for cooling output materials according to the present invention;

Figure 3 is a schematic diagram of the fixed-point heat dissipation mechanism of the device for cooling output materials proposed in this utility model.

Figure 4 is a side view of a device for cooling output materials according to the present invention;

Figure 5 is a schematic diagram of the air intake fan of a device for cooling output materials proposed in this utility model.

Legend:

1. Carrier plate; 2. Fixed-point heat dissipation mechanism; 201. Intake fan; 202. Filter screen; 203. Drainage channel; 204. Guide hole; 205. Air box; 206. Air duct; 207. Fixed-point air outlet; 208. Exhaust fan; 3. Outer shell; 4. Shaft; 5. Sealing cover; 6. Baffle; 7. Heat dissipation hollow plate; 8. Positioning groove; 9. Heat exchanger; 10. Cooling water tank; 11. Heat sink; 12. Control console; 13. Control panel; 14. Tachometer; 15. Support leg; 16. Anti-slip pad; 17. Concealed groove; 18. Handle; 19. Sealing ring; 20. Sealing groove.

Detailed Implementation

The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

Referring to Figures 1, 3, and 4, one embodiment of this utility model provides a device for cooling output materials, including a carrier plate 1. A housing 3 is fixedly connected to the middle of the top wall of the carrier plate 1. The housing 3 provides a relatively enclosed space for the entire cooling device, ensuring the stability of the cooling process and providing installation and protection space for other components, ensuring that the cooling operation takes place in a relatively stable environment. Two rotating shafts 4 are fixedly connected to the rear side of the top wall of the housing 3. Sealing covers 5 are fixedly connected to the front side of each of the two rotating shafts 4. The sealing covers 5 can be opened or closed through the rotating shafts 4, facilitating the insertion or removal of PCBA boards, simplifying operation, and improving the ease of use of the device. A baffle 6 is fixedly connected to the upper middle part of the inner wall of the housing 3. The baffle 6 provides a certain degree of separation and protection, dividing the internal structure and increasing the safety and stability of the device. A heat dissipation hollow plate 7 is fixedly connected to the inner bottom wall of the housing 3. The heat dissipation hollow plate 7 provides a direct heat dissipation contact area for the PCBA boards, improving cooling efficiency. Multiple positioning slots 8 are equidistantly provided on the top wall of the 7. The positioning slots 8 can conveniently place the PCBA board and make it fully contact the heat dissipation hollow plate 7, ensuring the stability of the PCBA board during the cooling process and improving the cooling effect. A heat exchanger 9 is fixedly connected to the bottom right side of the outer shell 3. The heat exchanger 9 exchanges the heat absorbed from the heat dissipation hollow plate 7 to achieve efficient heat transfer and ensure the continuous cooling cycle. The top front side of the heat exchanger 9 is connected to the right side of the heat dissipation hollow plate 7 through a pipe. A heat dissipation water tank 10 is fixedly connected to the middle of the bottom wall of the carrier plate 1. The bottom front side of the heat exchanger 9 is connected to the right side of the heat dissipation water tank 10 through a pipe. The left side of the heat dissipation water tank 10 is connected to the left side of the heat dissipation hollow plate 7, so that the coolant continuously circulates in this loop, carrying away the heat generated by the PCBA board. By constructing a cooling circulation system, the PCBA board is continuously cooled. Multiple heat sinks 11 are connected through and fixedly connected to the bottom of the heat dissipation water tank 10. The heat sinks 11 can further enhance the heat dissipation effect.

Specifically, the carrier plate 1 supports the entire device. The outer shell 3, fixedly connected to the middle of the top wall of the carrier plate 1, provides a relatively enclosed space for the cooling process. Two rotating shafts 4, fixedly connected to the rear side of the top wall of the outer shell 3, and a sealing cover 5 fixedly connected to the front side of the rotating shafts 4, can be opened or closed as needed to insert or remove PCBA boards. The baffle 6, fixedly connected to the upper part of the inner wall of the outer shell 3, provides a certain degree of separation and protection. The top wall of the heat dissipation hollow plate 7, fixedly connected to the bottom inner wall of the outer shell 3, has multiple positioning grooves 8 evenly spaced, which facilitates the placement of PCBA boards, ensuring full contact between them and the heat dissipation hollow plate 7, thus improving the cooling effect. The heat exchanger 9, fixedly connected to the bottom right side of the outer shell 3, is connected via pipes. The heat exchanger 9 is connected to the right side of the heat dissipation hollow plate 7. When the device is working, the heat exchanger 9 will exchange the heat absorbed from the heat dissipation hollow plate 7. The heat dissipation water tank 10, which is fixedly connected to the middle of the bottom wall of the carrier plate 1, forms a circulation loop with the heat exchanger 9 and the heat dissipation hollow plate 7 through pipes. The bottom front end of the heat exchanger 9 is connected to the right side of the heat dissipation water tank 10 through pipes. The left side of the heat dissipation water tank 10 is connected to the left side of the heat dissipation hollow plate 7, so that the coolant continuously circulates in this loop, carrying away the heat generated by the PCBA board. Multiple heat sinks 11 are connected through and fixedly connected to the bottom end of the heat dissipation water tank 10, which can further enhance the heat dissipation effect, greatly improve the cooling efficiency of the PCBA board, and thus shorten the overall production line cycle time.

Referring to Figures 2, 3, and 5, the fixed-point heat dissipation mechanism 2 includes multiple intake fans 201, which are equidistantly fixedly installed on the front inner wall of the outer casing 3. The intake fans 201 draw outside air into the device. Multiple filters 202 are fixedly connected to the front of the outer casing 3 to filter the intake air. A guide channel 203 is fixedly connected to the front inner wall of the outer casing 3 to guide the air drawn in by the intake fans 201. Multiple guide holes 204 are provided on the top wall of the guide channel 203 to guide the air in the guide channel 203 to the air box 205. The bottom wall of the sealing cover 5 is fixedly connected to... The air box 205 can temporarily store and distribute air. The front side of the air box 205 is connected to multiple air guide pipes 206, which are respectively engaged with multiple guide holes 204. The air guide pipes 206 can guide air from the guide holes 204 into the air box 205. The bottom wall of the air box 205 is provided with multiple fixed-point air outlet holes 207 at equal intervals. The multiple fixed-point air outlet holes 207 are respectively set directly above multiple positioning slots 8. The fixed-point air outlet holes 207 can blow air directly onto the PCBA board for fixed-point heat dissipation. The rear inner wall of the outer casing 3 is fixedly installed with an exhaust fan 208 at equal intervals. The exhaust fan 208 can exhaust the hot air after passing through the PCBA board.

Specifically, multiple intake fans 201 are equidistantly fixedly installed on the front inner wall of the outer casing 3. When the intake fans 201 are working, they draw outside air into the outer casing 3. Multiple filters 202 are fixedly connected to the front of the outer casing 3 to filter the intake air and prevent dust and other impurities from entering the device. A guide channel 203 is fixedly connected to the front inner wall of the outer casing 3 to guide the air drawn in by the intake fans 201. Multiple guide holes 204 are provided on the top wall of the guide channel 203. A wind box 205 is fixedly connected to the bottom wall of the sealing cover 5. Multiple air guide pipes 206 are connected to the front of the wind box 205. The multiple air guide pipes 206 are respectively engaged with the multiple guide holes 204. Air in the sample drainage channel 203 can enter the air box 205 through the guide hole 204 and the air duct 206. The bottom wall of the air box 205 is provided with multiple fixed-point air outlet holes 207 at equal intervals. The multiple fixed-point air outlet holes 207 are respectively set directly above the multiple positioning slots 8, so that the air can be blown directly onto the PCBA board placed in the positioning slot 8 for fixed-point heat dissipation. The rear inner wall of the outer shell 3 is fixedly installed with an exhaust fan 208 at equal intervals. The exhaust fan 208 can exhaust the hot air after passing through the PCBA board to the outer shell 3. Through such air circulation, efficient fixed-point heat dissipation of the PCBA board is achieved. At the same time, because this heat dissipation method is more precise, the total energy consumption is reduced, which helps to achieve the goal of energy conservation and emission reduction.

Referring to Figure 1, a control console 12 is fixedly connected to the front side of the top wall of the carrier plate 1. The control console 12 provides a centralized position for the operation and control of the entire device. Multiple control panels 13 are fixedly installed on the top wall of the control console 12. The control panels 13 are used to set and adjust the operating parameters of the device. A tachometer 14 is fixedly connected to the front left end of the outer casing 3. The tachometer 14 is used to display the speed of the air intake fan 201 in real time. The tachometer 14 is electrically connected to multiple air intake fans 201. Support legs 15 are fixedly connected to the four corners of the bottom wall of the carrier plate 1. The support legs 15 support the entire device. Anti-slip pads 16 are fixedly connected to the bottom of multiple support legs 15. The anti-slip pads 16 can increase the friction between the device and the placement surface and prevent the device from sliding.

Specifically, the control console 12 provides an installation location for the control panel 13. The control panel 13 can adjust the speed of the intake fan 201 and the exhaust fan 208 and control the working status of the heat exchanger 9, realizing parameter setting and operation control of the entire cooling device. The tachometer 14 is electrically connected to multiple intake fans 201 and can display the speed of the intake fans 201 in real time, so that the operator can understand the working status of the intake fans 201 and make timely adjustments or repairs when the speed is abnormal, ensuring the normal operation of the fixed-point heat dissipation mechanism 2. The support legs 15 provide support for the entire cooling device, so that the device can be placed stably in the workplace. The anti-slip pads 16 can increase the friction between the support legs 15 and the ground and prevent the device from sliding during operation.

Referring to Figures 1, 2, and 3, a hidden groove 17 is provided on the front side of the top wall of the sealing cover 5. The hidden groove 17 is used to place the handle 18. The handle 18 is fixedly connected to the inner bottom wall of the hidden groove 17. The handle 18 makes it easy to open the sealing cover 5. A sealing ring 19 is fixedly connected to the outer side of the bottom wall of the sealing cover 5. The sealing ring 19 plays a sealing role. A sealing groove 20 is provided on the top wall of the baffle 6. The sealing groove 20 cooperates with the sealing ring 19 to achieve a seal. The sealing ring 19 and the sealing groove 20 are interlocked. Multiple heat sinks 11 are arranged in an equidistant row. The equidistant row arrangement of heat sinks 11 is conducive to heat dissipation. Multiple heat sinks 11 are fixedly connected to each other in a cross manner. The cross-fixed connection enhances the stability of the heat sinks 11.

Specifically, the hidden groove 17 is used to house the handle 18. When it is necessary to open the sealing cover 5, the operator can easily lift the sealing cover 5 through the handle 18 to facilitate the insertion or removal of the PCBA board, thus improving the convenience of operation. When the sealing cover 5 is closed, the sealing ring 19 and the sealing groove 20 engage with each other to form a good sealing effect, preventing external dust and impurities from entering the interior of the outer casing 3 and affecting the cooling effect. At the same time, it can also prevent heat loss during the cooling process and improve the cooling efficiency. The heat sink 11 is arranged in an equidistant row and is fixedly connected to each other in a cross manner, which can increase the contact area with the air and improve the heat dissipation efficiency. The heat in the heat sink 10 is quickly dissipated into the surrounding air through the heat sink 11, thereby ensuring that the coolant can continuously and effectively absorb the heat generated by the PCBA board during the circulation process and maintain the stable operation of the cooling device.

Working Principle: The carrier plate 1 supports the entire device. The outer shell 3, fixedly connected to the middle of the top wall of the carrier plate 1, provides a relatively enclosed space for the cooling process. Two rotating shafts 4, fixedly connected to the rear side of the top wall of the outer shell 3, and a sealing cover 5 fixedly connected to the front side of the rotating shafts 4, can be opened or closed as needed to insert or remove PCBA boards. The baffle 6, fixedly connected to the upper middle part of the inner wall of the outer shell 3, provides a certain degree of separation and protection. The top wall of the heat dissipation hollow plate 7, fixedly connected to the bottom inner wall of the outer shell 3, has multiple positioning grooves 8 evenly spaced, which facilitates the placement of PCBA boards, ensuring full contact with the heat dissipation hollow plate 7 and improving the cooling effect. The bottom right side of the outer shell 3... The heat exchanger 9, which is fixedly connected to the end, is interconnected with the right side of the heat dissipation hollow plate 7 through a pipe. When the device is working, the heat exchanger 9 exchanges the heat absorbed from the heat dissipation hollow plate 7. The heat dissipation water tank 10, which is fixedly connected to the middle of the bottom wall of the carrier plate 1, forms a circulation loop with the heat exchanger 9 and the heat dissipation hollow plate 7 through a pipe. The front bottom end of the heat exchanger 9 is connected to the right side of the heat dissipation water tank 10 through a pipe. The left side of the heat dissipation water tank 10 is interconnected with the left side of the heat dissipation hollow plate 7, so that the coolant continuously circulates in this loop, carrying away the heat generated by the PCBA board. Multiple heat sinks 11 are connected through and fixedly connected to the bottom end of the heat dissipation water tank 10, which can further enhance the heat dissipation effect.

Furthermore, multiple intake fans 201 are equidistantly fixedly installed on the front inner wall of the outer casing 3. When the intake fans 201 are working, they draw outside air into the outer casing 3. Multiple filters 202 are fixedly connected to the front of the outer casing 3 to filter the intake air and prevent dust and other impurities from entering the device. A guide channel 203 is fixedly connected to the front of the inner wall of the outer casing 3 to guide the air drawn in by the intake fans 201. Multiple guide holes 204 are opened on the top wall of the guide channel 203. A wind box 205 is fixedly connected to the bottom wall of the sealing cover 5. The front of the wind box 205 is connected to multiple guide holes. The air duct 206 and multiple air guide ducts 206 are respectively engaged with multiple air guide holes 204, so that the air in the air guide groove 203 can enter the air box 205 through the air guide holes 204 and air guide ducts 206. Multiple fixed-point air outlet holes 207 are equally spaced on the bottom wall of the air box 205. The multiple fixed-point air outlet holes 207 are respectively set directly above the multiple positioning slots 8, so that the air can be blown directly onto the PCBA board placed in the positioning slot 8 for fixed-point heat dissipation. The exhaust fan 208 is fixedly installed at equal intervals on the rear inner wall of the outer shell 3. The exhaust fan 208 can exhaust the hot air after passing through the PCBA board to the outer shell 3.

Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims (8)

1. A device for cooling output materials, comprising a carrier plate (1), characterized in that: an outer shell (3) is fixedly connected to the middle of the top wall of the carrier plate (1), two rotating shafts (4) are fixedly connected to the rear side of the top wall of the outer shell (3), and a sealing cover (5) is fixedly connected to the front side of each of the two rotating shafts (4), a baffle (6) is fixedly connected to the upper middle part of the inner wall of the outer shell (3), a heat dissipation hollow plate (7) is fixedly connected to the inner bottom wall of the outer shell (3), and a plurality of positioning grooves (8) are equidistantly opened on the top wall of the heat dissipation hollow plate (7), and the right side of the outer shell (3) is... A heat exchanger (9) is fixedly connected to the bottom side. The top front end of the heat exchanger (9) is connected to the right side of the heat dissipation hollow plate (7) through a pipe. A heat dissipation water tank (10) is fixedly connected to the middle of the bottom wall of the carrier plate (1). The bottom front end of the heat exchanger (9) is connected to the right side of the heat dissipation water tank (10) through a pipe. The left side of the heat dissipation water tank (10) is connected to the left side of the heat dissipation hollow plate (7). A plurality of heat dissipation fins (11) are fixedly connected to the bottom end of the heat dissipation water tank (10). A fixed-point heat dissipation mechanism (2) is provided on the front side of the outer shell (3). 2. The device for cooling output materials according to claim 1, characterized in that: the fixed-point heat dissipation mechanism (2) includes a plurality of air intake fans (201), the plurality of air intake fans (201) are all fixedly installed at equal intervals on the front inner wall of the outer casing (3), a plurality of filters (202) are fixedly connected to the front side of the outer casing (3), a flow guide groove (203) is fixedly connected to the front side of the inner wall of the outer casing (3), and a plurality of flow guide holes (204) are opened on the top wall of the flow guide groove (203). A bellows (205) is fixedly connected to the bottom wall of the sealing cover (5). A plurality of air guide pipes (206) are connected to the front side of the bellows (205). The plurality of air guide pipes (206) are respectively engaged with a plurality of flow guide holes (204). A plurality of fixed-point air outlet holes (207) are equidistantly opened on the bottom wall of the bellows (205). The plurality of fixed-point air outlet holes (207) are respectively located directly above a plurality of positioning grooves (8). An exhaust fan (208) is fixedly installed equidistantly on the rear inner wall of the outer shell (3). 3. The device for cooling output materials according to claim 1, characterized in that: a control console (12) is fixedly connected to the front side of the top wall of the carrier plate (1), and a plurality of control panels (13) are fixedly installed on the top wall of the control console (12). 4. The device for cooling output materials according to claim 1, characterized in that: a tachometer (14) is fixedly connected to the front left end of the outer shell (3), and the tachometer (14) is electrically connected to a plurality of air intake fans (201). 5. The device for cooling output materials according to claim 1, characterized in that: a support leg (15) is fixedly connected to each of the four corners of the bottom wall of the carrier plate (1), and an anti-slip pad (16) is fixedly connected to the bottom end of each of the multiple support legs (15). 6. The device for cooling output materials according to claim 1, characterized in that: a hidden groove (17) is provided on the front side of the top wall of the sealing cover (5), and a handle (18) is fixedly connected to the inner bottom wall of the hidden groove (17). 7. The device for cooling output materials according to claim 1, characterized in that: a sealing ring (19) is fixedly connected to the outer side of the bottom wall of the sealing cover (5), and a sealing groove (20) is provided on the top wall of the baffle (6), and the sealing ring (19) and the sealing groove (20) engage with each other. 8. The apparatus for cooling output materials according to claim 1, characterized in that: the plurality of heat sinks (11) are arranged in an equidistant row, and the plurality of heat sinks (11) are fixedly connected to each other in a cross manner.