CN223815646U - Memory with automatic heat dissipation function - Google Patents

Abstract

The application discloses a memory with an automatic heat dissipation function. The storage comprises a shell, a main board, a storage element and a cooling fan, wherein a containing cavity is formed by surrounding the shell, an air inlet hole and an air outlet hole are respectively formed in the left side of the shell and the right side of the shell, the air inlet hole and the air outlet hole are communicated with the containing cavity, the main board is arranged in the containing cavity, the storage element is arranged in the containing cavity and is electrically connected with the main board, the cooling fan is arranged in the containing cavity and is electrically connected with the main board, and the cooling fan is used for sucking air outside the shell through the air inlet hole and flowing out through the air outlet hole to take away heat in the containing cavity. Therefore, the heat generated during the operation of the main board and the storage element in the accommodating cavity can be taken away by the memory through the cooling fan, the temperature in the accommodating cavity is effectively reduced, the condition that the efficiency is influenced and even the damage is caused by the overhigh temperature of the main board and the storage element is avoided, and the high speed and the safety of data storage are improved.

Description

Memory with automatic heat dissipation function

Technical Field

The present application relates to the field of electronic devices, and in particular, to a memory with an automatic heat dissipation function.

Background

The rapid development of electronic technology makes the functions of electronic devices more and more abundant, and further, causes more and more data stored in the electronic devices. In order to reduce the influence of excessive data on the processing speed of the electronic equipment, partial data can be stored in the portable memory for storage, so that the influence of excessive stored data in the electronic equipment on the processing speed can be reduced, and the portable electronic equipment is convenient to carry and use. Portable memories are therefore becoming increasingly popular.

In the prior art, in order to reduce the volume of the portable memory, only a housing is generally arranged outside the memory, so that more heat can be generated when the memory exchanges data for a long time, the speed of data exchange can be influenced, and even the memory can be burnt out when serious, thereby causing data loss and influencing the use of users.

Disclosure of utility model

The embodiment of the application provides a memory with an automatic heat dissipation function, which can reduce the influence caused by poor heat dissipation when a portable memory is used for a long time.

The memory with the automatic heat dissipation function comprises a shell, a main board, a storage element and a heat dissipation fan, wherein a containing cavity is formed by surrounding the shell, an air inlet hole and an air outlet hole are respectively formed in the left side of the shell and the right side of the shell, the air inlet hole and the air outlet hole are communicated with the containing cavity, the main board is arranged in the containing cavity, the storage element is arranged in the containing cavity and is electrically connected with the main board, the heat dissipation fan is arranged in the containing cavity and is electrically connected with the main board, and the heat dissipation fan is used for sucking air outside the shell through the air inlet hole and flowing out through the air outlet hole to take away heat in the containing cavity.

In the memory with the automatic heat dissipation function, the air outside the shell can be sucked by the air inlet hole and flows out of the air outlet hole through the heat dissipation fan, so that heat generated when the main board and the storage element in the accommodating cavity work is taken away, the temperature in the accommodating cavity is effectively reduced, the condition that the efficiency is influenced and even damaged due to overhigh temperature of the main board and the storage element is avoided, and the high speed and the safety of data storage are improved.

In some embodiments, an air inlet plug is arranged on the left side of the shell, the air inlet hole is arranged on the air inlet plug, an air outlet plug is arranged on the right side of the shell, and the air outlet hole is arranged on the air outlet plug.

In some embodiments, the air inlet plug is formed with a channel structure towards the direction of the accommodating cavity, the cooling fan is provided with an air inlet opening, the channel structure is relatively communicated with the air inlet opening to form an air inlet channel, the cooling fan is provided with an air outlet opening, and the air outlet opening is communicated with the accommodating cavity.

In some embodiments, a limiting protrusion is formed on a side, facing the accommodating cavity, of the air outlet plug, and the limiting protrusion is used for limiting the main board.

In some embodiments, the memory further comprises a magnetic attraction piece, wherein the magnetic attraction piece is attached to the bottom of the shell and used for attracting external equipment.

In some embodiments, the memory further comprises at least one data interface male and one data interface female, the data interface male and the data interface female being electrically connected to the motherboard.

In some embodiments, the memory further includes a data line, one end of the data line is electrically connected to the data interface male head when the external device is attracted to the magnetic attraction member at the bottom of the housing, and the other end of the data line is used for being connected to the external device.

In some embodiments, the shell comprises a main body and a bottom cover detachably connected with the main body, wherein a mounting position is arranged on the bottom cover, and the magnetic attraction piece is mounted on the mounting position.

In some embodiments, the memory further comprises a display screen, a supporting frame is arranged inside the shell, the display screen is fixed on the supporting frame and electrically connected with the main board, and at least part of the top of the shell is light-transmitting.

In some embodiments, the housing includes a main body and a top cover detachably connected to the main body, the top cover being at least partially light transmissive.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic perspective view of a memory according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of the memory of FIG. 1 taken along the A-A direction;

FIG. 3 is a schematic diagram of an exploded structure of a memory in an embodiment of the application;

Fig. 4 is a schematic perspective view of a cooling fan according to an embodiment of the present application;

FIG. 5 is a schematic perspective view of another angle of the memory according to the embodiment of the application;

FIG. 6 is a schematic diagram of the connection between the memory and the data line according to the embodiment of the application.

Description of main reference numerals:

a memory 100;

The shell 10, the accommodating cavity 11, the air inlet plug 12, the air inlet hole 121, the channel structure 122, the air outlet plug 13, the air outlet hole 131, the limiting boss 132, the supporting boss 133, the bottom cover 14, the mounting position 141, the main body 15, the top cover 16 and the supporting frame 17;

a main board 20;

a memory element 30;

a heat radiation fan 40, an air inlet opening 41, and an air outlet opening 42;

the magnetic attraction piece 50, the display screen 60, the data interface male head 61, the data interface female head 62, the data wire 70, the first end 71, the wire body 72, the connecting arm 73 and the second end 74.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, or communicable with each other, directly connected, indirectly connected via an intermediary, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to fig. 1-3, a memory 100 with an automatic heat dissipation function according to an embodiment of the present application includes a housing 10, a motherboard 20, a storage element 30 and a heat dissipation fan 40, wherein the housing 10 encloses a housing cavity 11, an air inlet 121 and an air outlet 131 are respectively provided on a left side of the housing 10 and a right side of the housing 10, the air inlet 121 and the air outlet 131 are both in communication with the housing cavity 11, the motherboard 20 is mounted in the housing cavity 11, the storage element 30 is mounted in the housing cavity 11 and electrically connected with the motherboard 20, the heat dissipation fan 40 is mounted in the housing cavity 11 and electrically connected with the motherboard 20, and the heat dissipation fan 40 is used for sucking air outside the housing 10 through the air inlet 121 and discharging the air from the air outlet 131 to take away heat in the housing cavity 11.

In the memory 100 with the automatic heat dissipation function according to the embodiment of the present application, the memory 100 can suck the air outside the housing 10 through the heat dissipation fan 40 through the air inlet 121 and flow out through the air outlet 131, so as to take away the heat generated during the operation of the motherboard 20 and the storage element 30 in the accommodating cavity 11, effectively reduce the temperature inside the accommodating cavity 11, avoid the situation that the motherboard 20 and the storage element 30 are too high in temperature to affect the efficiency or even damage, and improve the high speed and the safety of data storage.

Specifically, the housing 10 may have a generally rectangular structure, and an accommodating chamber 11 is formed in the interior thereof for accommodating the mounting motherboard 20, the memory element 30, the heat radiation fan 40, and the like. The housing 10 is mainly used for protecting the internal components, and the housing 10 can be made of metal material, such as aluminum alloy material, with better compression resistance and heat dissipation. Of course, the shape and material of the housing 10 are not limited in the present application.

Motherboard 20 may be a printed circuit board, and is primarily used to electrically connect various components in the circuit of memory 100, so that the entire circuit can operate normally. The main board 20 is fixedly installed in the accommodating cavity 11, and can be fixed by means of screws, clamping pieces and the like, and the fixing mode of the main board 20 in the accommodating cavity 11 is not limited.

The memory element 30 may be a chip for memory. The storage element 30 is also fixedly installed in the accommodating cavity 11 and electrically connected with the motherboard 20, so that data can be input into or output from the storage element 30 through the motherboard 20. Further, the memory element 30 may be electrically connected to the motherboard 20 by soldering, etc., which is not limited in the present application.

The structure of the memory 100 will be specifically described based on the azimuth angle shown in fig. 1, and the left and right sides of the housing 10 are respectively formed with an air inlet hole 121 and an air outlet hole 131, and the air inlet hole 121 and the air outlet hole 131 may be formed in plurality, which is not particularly limited in the present application. The heat radiation fan 40 is fixedly installed in the accommodating chamber 11. Preferably, the cooling fan 40 may be disposed at a side of the accommodating cavity 11 near the air inlet 121, so that the cooling fan 40 can better suck air through the air inlet 121 to accelerate the air circulation in the accommodating cavity 11.

When the memory 100 starts to operate, the cooling fan 40 also starts to operate, the cooling fan 40 can suck external air through the air inlet 121 and discharge internal hot air through the air outlet 131, so as to realize air exchange between the accommodating cavity 11 and the outside of the housing 10, and bring heat generated by the main board 20 and other elements in the accommodating cavity 11 out of the accommodating cavity 11, thereby achieving the effect of effectively dissipating heat of the elements in the accommodating cavity 11 and avoiding the overheating of the elements.

Referring to fig. 2 and 3, in some embodiments, an air inlet plug 12 is disposed on the left side of the housing 10, an air inlet 121 is disposed on the air inlet plug 12, an air outlet plug 13 is disposed on the right side of the housing 10, and an air outlet 131 is disposed on the air outlet plug 13.

Therefore, a user can change different air inlet plugs 12 or air outlet plugs 13 according to different use situations to adjust air quantity or air inlet angles and the like, and meanwhile, corresponding structures can be arranged on the plugs on two sides to be matched with the installation, fixation and operation of each element in the accommodating cavity 11.

Specifically, a mounting hole position with a shape matched with that of the air inlet plug 12 may be formed on the left side of the housing 10, the air inlet plug 12 may be detachably disposed on the left side of the housing 10, and the air inlet hole 121 is formed on the air inlet plug 12. The right side of the shell 10 can be provided with a mounting hole position matched with the shape of the air outlet plug 13, the air outlet plug 13 can be detachably arranged on the right side of the shell 10, and the air outlet hole 131 is formed on the air outlet plug 13. The air inlet plug 12 and the air outlet plug 13 may be provided in a square, a round, or the like, which is not limited in the present application. Further, the air inlet plug 12 and the air outlet plug 13 are arranged to be of a split type structure with the shell 10, so that the open die manufacturing of the shell 10 can be facilitated, and the increase of manufacturing cost due to the excessively complex overall structure is avoided.

Referring to fig. 2-4, in some embodiments, a channel structure 122 is formed in the air inlet plug 12 toward the accommodating cavity 11, the heat dissipation fan 40 is provided with an air inlet opening 41, the channel structure 122 is relatively communicated with the air inlet opening 41 to form an air inlet channel, the heat dissipation fan 40 is provided with an air outlet opening 42, and the air outlet opening 42 is communicated with the accommodating cavity 11.

In this way, the cooling fan 40 can increase the air intake through the cooperation with the channel structure 122, so that the sucked air can better flow into the accommodating cavity 11 from the air outlet opening 42 of the cooling fan 40, and the heat dissipation effect of the cooling fan 40 is improved.

Specifically, the air inlet opening 41 is formed on one side of the cooling fan 40 facing the air inlet hole 121, the air inlet plug 12 is provided with the channel structure 122 facing the inside of the accommodating cavity 11, the channel structure 122 extends inwards to correspond to the air inlet opening 41, and then an air inlet channel is formed, the air inlet channel can play a role in guiding air flow, so that the inhaled air quantity is more sufficient when the cooling fan 40 operates, and the heat dissipation effect of the cooling fan 40 is improved.

Preferably, the air inlet hole 121 can be formed in a region corresponding to the channel structure 122 on the air inlet plug 12, so that the air flow formed by the cooling fan 40 can be sucked only through the air inlet channel and then discharged from the air outlet 131, the sucked air is not discharged from the air inlet plug 12 side, the sucked air is sucked from the left side of the accommodating cavity 11 and then discharged from the right side of the accommodating cavity 11, the internal original paper can be better cooled, the phenomenon that the sucked air is sucked from the left side and then discharged from the left side is avoided, and the cooling effect is weakened.

Of course, in some other embodiments, the channel structure 122 may also be configured to extend from the air outlet opening 42 of the radiator fan 40 toward the air inlet plug 12, and form an air inlet channel corresponding to the air inlet hole 121 on the air inlet plug 12, which is not limited in the present application.

Referring to fig. 2, in some embodiments, a limiting protrusion 132 is formed on a side of the air outlet plug 13 facing the accommodating cavity 11, and the limiting protrusion 132 is used for limiting the motherboard 20.

Therefore, the main board 20 installed in the accommodating cavity 11 is fixed more firmly, so that the condition that the internal main board 20 shakes due to the careless falling of the memory 100 is avoided, and the stability of the whole structure of the memory 100 is improved.

Specifically, the limiting protrusion 132 can extend from the inner wall of the air outlet plug 13 to the inner side of the accommodating cavity 11, when the air outlet plug 13 is installed in place, the limiting protrusion 132 can be clamped on the upper side of the main board 20 to have a certain limiting effect on the main board 20, so that the main board 20 is prevented from shaking up and down in the accommodating cavity 11, and the stability of the internal elements of the accommodating cavity 11 is improved.

Referring to fig. 2 and 3, in some embodiments, the memory 100 further includes a magnetic attraction member 50, where the magnetic attraction member 50 is attached to the bottom of the housing 10 for attracting the external device.

Thus, when the user uses the memory 100, the memory 100 can be adsorbed on the external device through the magnetic attraction piece 50 at the bottom of the memory 100, so that the risk of unstable connection and even falling off caused by shaking caused by movement of the external device is avoided, and the use of the user is affected.

Specifically, the magnetic attraction member 50 may include a magnetic member such as a magnet, and the magnetic attraction member 50 may be fixedly installed at the bottom of the housing 10. When the memory 100 is connected to a mobile external device such as a mobile phone, a tablet or a notebook computer, the memory 100 is inevitably used in a mobile state, and the memory 100 may shake along with the movement of the external device during the movement, so that the data line 70 may be separated from the external device or the memory 100 may be separated from the data line 70, which affects the data transmission of the user. Therefore, the memory 100 is attracted to the external device by the magnetic attraction member 50, which can avoid the occurrence of the above-described situation, and the data security of using the memory 100 during the movement can be improved, and the memory 100 can be prevented from being broken due to the falling-off.

Referring to fig. 3 and 5, in some embodiments, the memory 100 further includes at least one data interface male head 61 and one data interface female head 62, and the data interface male head 61 and the data interface female head 62 are electrically connected to the motherboard 20.

In this way, the memory 100 can be connected with external devices through the data interface male head 61 or the data interface female head 62, and the two interfaces enable the memory 100 to adapt to different external devices, so as to improve the adaptability of the memory 100.

Specifically, the housing 10 may be provided with an opening adapted to and corresponding to the data interface male head 61 and the data interface female head 62. One end of the data interface male head 61 is electrically connected with the main board 20, and the other end extends out of the casing 10 from the opening so as to be connected with external equipment, and in some embodiments, the memory 100 further includes a wire end bracket, where the wire end bracket is fixed at the opening for supporting the data interface male head 61, so as to improve stability of the data interface male head 61. One end of the data interface female 62 is electrically connected with the motherboard 20, and the other end faces the corresponding opening, and the male end on the external data line 70 can be connected with the data interface female 62 to realize connection with external equipment.

Of course, the memory 100 may be provided with only the data interface male head 61, only the data interface female head 62, or both the data interface male head 61 and the data interface female head 62, which is not particularly limited in the present application.

Referring to fig. 3 and 6, in some embodiments, the memory 100 further includes a data line 70, where one end of the data line 70 is electrically connected to the data interface male 61 and the other end is used for connection to an external device when the external device is attracted to the magnetic attraction member 50 at the bottom of the housing 10.

Specifically, the specific structure of the data line 70 may include a first end 71, a line body 72, a connection arm 73, and a second end 74 connected in sequence, the first end 71 being used to connect with the data interface male head 61 or the data interface female head 62, the second end 74 being used to connect with an external device, one end of the connection arm 73 being connected with the second end 74, and the other end being connected with the line body 72 such that the orientations of the first end 71 and the second end 74 are identical. When the memory 100 is connected to an external device through the data line 70 and the memory 100 is adsorbed on the external device, the data line 70 can be more closely located at the back of the electronic device, so as to avoid the influence of the extension of the connection end of the data line 70 and the external device.

Referring to fig. 2 and 3, in some embodiments, the housing 10 includes a main body 15 and a bottom cover 14 detachably connected to the main body 15, a mounting location 141 is provided on the bottom cover 14, and the magnetic attraction member 50 is mounted on the mounting location 141.

In this way, the detachable arrangement of the bottom cover 14 and the main body 15 enables the accommodating cavity 11 to be opened relative to the outside, so that the installation or replacement of the magnetic attraction piece 50 is facilitated, and the installation position 141 on the bottom cover 14 can limit the position of the magnetic attraction piece 50, so as to promote the stability of the magnetic attraction piece 50.

Specifically, the bottom cover 14 may include the bottom of the entire housing 10, and the bottom cover 14 and the main body 15 enclose the accommodating chamber 11. Of course, the bottom cover 14 may include only a part of the bottom of the housing 10, and may be detachable from the main body 15 to facilitate the installation or replacement of the magnetic attraction member 50.

The bottom cover 14 may be formed with a mounting location 141 that is adapted to the shape of the magnetic attraction piece 50, and the magnetic attraction piece 50 may be fixed at the mounting location 141 by bonding, embedding or other means to limit the magnetic attraction piece 50, so that the magnetic attraction piece 50 can be fixed on the bottom cover 14. The mounting location 141 may be disposed inside the bottom cover 14 or outside the bottom cover 14, or the mounting location 141 may be in a hole shape, and the magnetic attraction member 50 is fitted in the hole, which is not particularly limited in the present application.

Referring to fig. 2 and 3, in some embodiments, the memory 100 further includes a display screen 60, a supporting frame 17 is disposed inside the housing 10, the display screen 60 is fixed on the supporting frame 17 and electrically connected to the motherboard 20, and at least a portion of the top of the housing 10 is transparent.

In this way, the memory 100 can display the information such as the current storage space through the display screen 60, so that the user can more intuitively understand the current state of the memory 100.

In particular, the display screen 60 may include a small LED screen. The supporting frame 17 may be installed in the accommodating cavity 11 in a plate-shaped structure, the display screen 60 may be fixed at the top of the supporting frame 17, a through hole through which a flat cable passes may be formed in the supporting frame 17, and the flat cable of the display screen 60 may pass through the through hole to be electrically connected with the main board 20. The region of the top of the housing 10 corresponding to the display screen 60 may be light-transmissive so that the display contents on the display screen 60 can be seen from the outside.

Further, two sides of the supporting frame 17 may be respectively lapped on the left and right air inlet plugs 12 and the air outlet plugs 13, and supporting protrusions 133 may be disposed on the inner sides of the air inlet plugs 12 and the air outlet plugs 13, so as to support and fix the supporting frame 17. Of course, since the channel structure 122 is formed inside the air inlet plug 12, the supporting frame 17 may be fixed on the channel structure 122. The application is not limited to the way in which the supporting frame 17 is fixed in the housing 11.

Referring to fig. 2 and 3, in some embodiments, the housing 10 includes a main body 15 and a top cover 16 detachably connected to the main body 15, and the top cover 16 is at least partially transparent.

Specifically, the top cover 16 may be entirely made of a material having light transmittance such as glass or plastic, or may be partially made of a material having light transmittance, and thus may have not only a certain rigidity but also display the contents on the display screen 60 to the outside. The material of the top cover 16 is not limited in the present application.

Further, the removable arrangement of the top cover 16 and the main body 15 enables the housing chamber 11 to be opened with respect to the outside, facilitating the installation of the respective elements inside the housing chamber 11. After the top cover 16 is opened, the components can be installed in the accommodating cavity 11 through the upper direction of the main body 15, and the components can be replaced conveniently in the later damage process.

In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims (9)

1. A memory with automatic heat dissipation function, comprising:

The shell is surrounded to form a containing cavity, an air inlet hole and an air outlet hole are respectively formed in the left side of the shell and the right side of the shell, and the air inlet hole and the air outlet hole are communicated with the containing cavity;

The main board is arranged in the accommodating cavity;

A memory element mounted in the housing cavity and electrically connected to the motherboard, and

The cooling fan is arranged in the accommodating cavity and is electrically connected with the main board, and the cooling fan is used for sucking air outside the shell through the air inlet hole and flowing out through the air outlet hole so as to take away heat in the accommodating cavity;

The air inlet plug is arranged on the left side of the shell, the air inlet hole is formed in the air inlet plug, the air outlet plug is arranged on the right side of the shell, and the air outlet hole is formed in the air outlet plug.

2. The memory with automatic heat dissipation function according to claim 1, wherein the air inlet plug is provided with a channel structure towards the direction of the accommodating cavity, the heat dissipation fan is provided with an air inlet opening, the channel structure is communicated with the air inlet opening relatively to form an air inlet channel, the heat dissipation fan is provided with an air outlet opening, and the air outlet opening is communicated with the accommodating cavity.

3. The memory with the automatic heat dissipation function according to claim 1, wherein a limiting protrusion is formed on one side of the air outlet plug facing the accommodating cavity, and the limiting protrusion is used for limiting the main board.

4. The memory with automatic heat dissipation function according to claim 1, further comprising a magnetic attraction member attached to the bottom of the housing for attracting an external device.

5. The memory with auto-thermal function of claim 4, further comprising at least one data interface male and one data interface female, the data interface male and the data interface female electrically connected to the motherboard.

6. The memory with automatic heat dissipation function according to claim 5, further comprising a data line, wherein one end of the data line is electrically connected to the data interface male head and the other end is connected to an external device when the external device is adsorbed to the magnetic attraction member at the bottom of the housing.

7. The memory with automatic heat dissipation function according to claim 4, wherein the housing comprises a main body and a bottom cover detachably connected with the main body, a mounting position is provided on the bottom cover, and the magnetic attraction piece is mounted on the mounting position.

8. The memory with automatic heat dissipation function according to claim 1, further comprising a display screen, wherein a supporting frame is arranged inside the housing, the display screen is fixed on the supporting frame and electrically connected with the main board, and the top of the housing is at least partially transparent.

9. The memory with automatic heat dissipation function according to claim 8, wherein the housing comprises a main body and a top cover detachably connected to the main body, and the top cover is at least partially light-transmitting.