CN223798412U

CN223798412U - Multilayer PCB embedded power module

Info

Publication number: CN223798412U
Application number: CN202520156670.6U
Authority: CN
Inventors: 陈绪奇; 贾民鹏; 巩俊成
Original assignee: Jiangsu Xinhuarui Microelectronics Co ltd
Current assignee: Jiangsu Xinhuarui Microelectronics Co ltd
Priority date: 2025-01-23
Filing date: 2025-01-23
Publication date: 2026-01-13
Anticipated expiration: 2035-01-23

Abstract

This utility model relates to the field of PCB board technology, specifically to a multi-layer PCB embedded power module, including a PCB board body, on which a power module body is embedded and mounted. The power module body has several heat-conducting strips mounted on it, extending onto the PCB board body. Each heat-conducting strip includes a ceramic sheet at the bottom and a copper sheet at the top. This utility model achieves efficient heat conduction by designing a PCB board body, a power module body embedded and mounted on the PCB board body, and several heat-conducting strips mounted on the power module body. These heat-conducting strips extend onto the PCB board body and include a ceramic sheet at the bottom and a copper sheet at the top. Simultaneously, a heat dissipation assembly is provided above the heat-conducting strips that are in contact with the PCB board body. This heat dissipation assembly includes a mounting plate and multiple air-blowing components located inside the mounting plate. The mounting plate is fixedly connected to the PCB, thus forming an active cooling system.

Description

Multilayer PCB embedded power module

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a multilayer PCB embedded power module.

Background

In the current electronic technology field, a PCB (Printed Circuit Board, i.e., a printed circuit board) is used as a base component of an electronic device to carry various electronic components and to realize electrical connection therebetween. With the continuous development of electronic technology, the density of components on a PCB is higher and higher, and the heat dissipation problem of a power module as an important component thereof is increasingly prominent.

Conventional heat dissipation methods for power modules often rely on natural heat dissipation or simple heat sink designs, which are not desirable in the face of high density, high power components. Particularly, in some application fields with extremely high requirements on heat dissipation, such as industrial control, automotive electronics, communication equipment and the like, the heat dissipation problem of the power module is directly related to the stability and reliability of the whole equipment.

The power module can generate a large amount of heat during operation, and if the heat cannot be timely emitted, the temperature of the module can be increased, so that the performance and the service life of the module are affected. In severe cases, even the modules burn out, causing equipment failure. Therefore, how to effectively solve the heat dissipation problem of the power module is a technical problem to be solved in the current PCB design field. In view of this, we propose a multi-layer PCB embedded power module.

Disclosure of utility model

In order to make up for the defects, the utility model provides a multilayer PCB embedded power module.

The technical scheme of the utility model is as follows:

The utility model provides a embedded power module of multilayer PCB, includes the PCB plate body, the power module body is installed to the embedding on the PCB plate body, install a plurality of heat conduction strip on the power module body, the heat conduction strip extends to on the PCB plate body, the heat conduction strip is including the potsherd that is located the lower part and the copper sheet that is located upper portion, with PCB plate body laminating heat conduction strip top is equipped with radiator unit, radiator unit includes the mounting panel and locates the inside a plurality of subassemblies of blowing of mounting panel, the mounting panel with PCB plate body fixed connection, with the heat dissipation groove that a plurality of equidistant setting has been seted up at the heat conduction strip top of power module body laminating.

As the preferable technical scheme, a plurality of ventilation holes are formed in the mounting plate, a transverse plate is fixedly connected in each ventilation hole, and the air blowing component is mounted on the transverse plate.

As a preferable technical scheme, the blowing component comprises a driving motor fixed on the transverse plate and fan blades coaxially fixed with an output shaft of the driving motor.

As an optimal technical scheme, an upper protective net and a lower protective net are respectively and fixedly arranged at the top and the bottom of the mounting plate.

As the preferable technical scheme, the four corners of the bottom of the mounting plate are uniformly formed with one supporting leg, each supporting leg is provided with a fixing screw, and the fixing screws are fixedly connected with the PCB body.

As the preferable technical scheme, the height of the supporting leg is equal to the thickness of the heat conducting strip, and when the fixing screw is screwed on the PCB body, the bottom of the mounting plate is attached to the top of the heat conducting strip.

As the preferable technical scheme, the top of the mounting plate is flush with the top of the power module body, and the width of the mounting plate is equal to the width of the power module body.

As an optimal technical scheme, the radiating groove is of a V-shaped or U-shaped structure, and a plurality of tiny convex points or grooves are formed in the groove bottom.

Compared with the prior art, the utility model has the beneficial effects that:

The utility model realizes high-efficiency heat conduction by designing the PCB body, the power module body embedded and installed on the PCB body and a plurality of heat conducting strips installed on the power module body, wherein the heat conducting strips extend to the PCB body and comprise a ceramic sheet positioned at the lower part and a copper sheet positioned at the upper part. Meanwhile, a heat radiation component is arranged above the heat conduction strip attached to the PCB body, the heat radiation component comprises a mounting plate and a plurality of blowing components arranged inside the mounting plate, and the mounting plate is fixedly connected with the PCB, so that an active heat radiation system is formed.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a portion of the structure of FIG. 1 according to the present utility model;

FIG. 3 is a second partial schematic view of the structure of FIG. 1 according to the present utility model;

FIG. 4 is a schematic view of a heat dissipating assembly according to the present utility model;

The meaning of each reference numeral in the figures is:

1. the PCB comprises a PCB body, 2 parts of a power module body, 3 parts of heat conducting strips, 30 parts of a heat dissipation groove, 4 parts of a mounting plate, 40 parts of a lower protective net, 41 parts of an upper protective net, 42 parts of air holes, 43 parts of a transverse plate, 44 parts of fan blades, 45 parts of a driving motor, 46 parts of a fixing screw, 47 parts of a supporting leg.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution:

The utility model provides a multilayer PCB embedded power module, including PCB plate body 1, power module body 2 is installed in the embedding on the PCB plate body 1, install a plurality of heat conduction strip 3 on the power module body 2, heat conduction strip 3 extends to on the PCB plate body 1, heat conduction strip 3 is equipped with radiator unit including the potsherd that is located the lower part and the copper sheet that is located upper portion, the heat conduction strip 3 top of laminating with PCB plate body 1, radiator unit includes mounting panel 4 and locates the inside a plurality of blast assemblies of mounting panel 4, mounting panel 4 and PCB fixed connection, the radiating groove 30 of a plurality of equidistant setting has been seted up at the heat conduction strip 3 top of laminating with power module body 2. Through the design including the PCB plate body 1, the embedding is installed the power module body 2 on the PCB plate body 1 and the last a plurality of heat conduction strip 3 of installing of power module body 2, these heat conduction strips 3 extend to on the PCB plate body 1 and including the potsherd that is located the lower part and the copper sheet that is located the upper portion, have realized efficient heat conduction. Meanwhile, a heat radiation component is arranged above the heat conduction strip 3 attached to the PCB body 1, the heat radiation component comprises a mounting plate 4 and a plurality of blowing components arranged inside the mounting plate 4, and the mounting plate 4 is fixedly connected with the PCB body 1, so that an active heat radiation system is formed.

As a preferred embodiment, a plurality of ventilation holes 42 are formed in the mounting plate 4, a transverse plate 43 is fixedly connected in each ventilation hole 42, and the air blowing component is mounted on the transverse plate 43. Through set up a plurality of bleeder vent 42 in mounting panel 4 to a diaphragm 43 of fixed connection in every bleeder vent 42, will blow the subassembly again and install on diaphragm 43, ensured to blow the subassembly and can work steadily, and blow the air current evenly to heat conduction strip 3 and heat dissipation groove 30, improved radiating homogeneity and efficiency.

Preferably, the blower assembly includes a drive motor 45 fixed to the cross plate 43 and a fan blade 44 coaxially fixed to an output shaft of the drive motor 45. Specifically, the structure of the blower assembly is described, comprising a driving motor 45 fixed on a cross plate 43 and a fan blade 44 coaxially fixed with the output shaft of the driving motor 45, which enables the blower assembly to generate sufficient wind force to effectively take heat away.

Preferably, the top and bottom of the mounting plate 4 are fixedly provided with an upper protective net 41 and a lower protective net 40, respectively. The upper protective net 41 and the lower protective net 40 are fixedly arranged at the top and the bottom of the mounting plate 4 respectively, so that the air blowing assembly is protected from being interfered by external foreign matters, meanwhile, dust and other impurities in air flow are prevented from entering the power module, and the cleanliness and the reliability of the module are improved.

Preferably, in this embodiment, a leg 47 is integrally formed at four corners of the bottom of the mounting board 4, and a fixing screw 46 is mounted at each leg 47, and the fixing screw 46 is fixedly connected with the PCB board 1. Through designing landing leg 47 in mounting panel 4 bottom four corners department to install set screw 46 in every landing leg 47 department, realized the stable connection of radiator unit and PCB plate body 1, ensured the stability of radiator unit in the course of the work.

Preferably, the height of the supporting leg 47 is equal to the thickness of the heat conducting strip 3, and when the fixing screw 46 is screwed on the PCB board 1, the bottom of the mounting board 4 is attached to the top of the heat conducting strip 3. The design that landing leg 47 height equals with heat conduction strip 3 thickness to and the requirement that mounting panel 4 bottom and heat conduction strip 3 top laminating when set screw 46 is screwed up on PCB plate body 1, guaranteed the close contact between radiator unit and the heat conduction strip 3, improved heat transfer's efficiency.

As a preference of this embodiment, the top of the mounting plate 4 is flush with the top of the power module body 2, and the width of the mounting plate 4 is equal to the width of the power module body 2. The top of the mounting plate 4 is flush with the top of the power module body 2, and the width of the mounting plate 4 is equal to the width of the power module body 2, so that the whole power module is tidier and more attractive in appearance.

Preferably, the heat dissipation groove 30 has a V-shaped or U-shaped structure, and the groove bottom is provided with a plurality of micro bumps or grooves. The heat dissipation groove 30 is designed into a V-shaped or U-shaped structure, and a plurality of tiny convex points or grooves are arranged at the groove bottom, so that the heat dissipation area and the turbulence effect during air flow are increased, the heat dissipation efficiency is further improved, and the power module can keep stable operation under a harsher working environment.

The multilayer PCB embedded power module of the utility model is used when:

When the power module body 2 starts to operate, it generates a large amount of heat. This heat is first conducted through the heat conducting strip 3. The heat conducting strip 3 is composed of a ceramic sheet at the lower part and a copper sheet at the upper part, and the ceramic sheet has good insulating property, so that the power module body 2 and the copper sheet can be prevented from being electrically connected.

A plurality of equally spaced heat dissipation grooves 30 are formed in the top of the heat conducting strip 3, and a channel is provided for further dissipation of heat. These heat sink grooves 30 increase the contact area of the heat conducting strip 3 with air so that heat can be more easily dissipated by means of air convection.

At the same time, the heat sink assembly begins to operate. The heat dissipation assembly comprises a mounting plate 4 and a plurality of air blowing assemblies arranged inside the mounting plate 4. The mounting plate 4 is fixedly connected with the PCB body 1 through the supporting legs 47 and the fixing screws 46, so that the stability and the reliability of the heat dissipation assembly are ensured. The blower assembly is composed of a drive motor 45 fixed to the cross plate 43 and fan blades 44 coaxially fixed to the output shaft of the drive motor 45. When the drive motor 45 is activated, it will rotate the fan blades 44, thereby creating a strong air flow.

In addition, the upper protective net 41 and the lower protective net 40 which are respectively and fixedly installed at the top and the bottom of the mounting plate 4 effectively protect the air blowing component from the interference of external foreign matters, prevent dust and other impurities in air flow from entering the power module, and keep the cleanliness and the reliability of the module.

In summary, the multi-layer PCB embedded power module of the present utility model realizes efficient heat conduction and heat dissipation effects through the cooperative work of the heat conducting strip 3, the heat dissipation groove 30 and the heat dissipation assembly. The design ensures that the power module can keep stable operation under high-load and long-time working environments, and the service life and the reliability of the power module are improved.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The multilayer PCB embedded power module is characterized by comprising a PCB body (1), wherein a power module body (2) is embedded and installed on the PCB body (1), a plurality of heat conducting strips (3) are installed on the power module body (2), the heat conducting strips (3) extend to the PCB body (1), the heat conducting strips (3) comprise ceramic plates positioned at the lower part and copper sheets positioned at the upper part, a heat radiating component is arranged above the heat conducting strips (3) attached to the PCB body (1), the heat radiating component comprises a mounting plate (4) and a plurality of air blowing components arranged in the mounting plate (4), the mounting plate (4) is fixedly connected with the PCB body (1), and a plurality of heat radiating grooves (30) which are arranged at equal intervals are formed in the tops of the heat conducting strips (3) attached to the power module body (2).

2. The multi-layer PCB embedded power module as set forth in claim 1, wherein a plurality of ventilation holes (42) are formed in the mounting plate (4), a transverse plate (43) is fixedly connected in each ventilation hole (42), and the air blowing component is mounted on the transverse plate (43).

3. The multi-layer PCB embedded power module as set forth in claim 2, wherein the blower assembly comprises a drive motor (45) secured to the cross plate (43) and a fan blade (44) secured coaxially with an output shaft of the drive motor (45).

4. The multi-layer PCB embedded power module of claim 3, wherein the top and bottom of the mounting board (4) are fixedly provided with an upper protective net (41) and a lower protective net (40), respectively.

5. The embedded power module of claim 4, wherein a leg (47) is integrally formed at four corners of the bottom of the mounting board (4), and a fixing screw (46) is installed at each leg (47), and the fixing screw (46) is fixedly connected with the PCB body (1).

6. The embedded power module of claim 5, wherein the legs (47) are equal in height to the heat conducting strips (3), and the bottom of the mounting plate (4) is attached to the top of the heat conducting strips (3) when the fixing screws (46) are screwed on the PCB body (1).

7. The embedded power module of claim 6, wherein the top of the mounting board (4) is flush with the top of the power module body (2), and the width of the mounting board (4) is equal to the width of the power module body (2).

8. The embedded power module of claim 7, wherein the heat sink (30) is of a V-shaped or U-shaped structure and the bottom of the heat sink is provided with a plurality of micro bumps or grooves.