CN223790962U - A bottle cap mold cooling structure - Google Patents

Abstract

The utility model discloses a bottle cap mold cooling structure in the technical field of bottle cap molds, which comprises a groove seat, wherein the left side and the right side of the inner cavity wall of the groove seat are connected with a movable plate in a sliding manner, the top of the movable plate extends to the outer side of the groove seat, the right side of the movable plate is fixedly connected with a die sleeve on the upper side of the left side wall of the movable plate, the upper side of the right side wall of the movable plate is fixedly connected with a hollow die column on the left side of the movable plate, and a through hole is formed on the upper side of the left side wall of the movable plate and communicated with the hollow die column.

Description

Bottle lid mould cooling structure

Technical Field

The utility model relates to the technical field of bottle cap molds, in particular to a cooling structure of a bottle cap mold.

Background

The bottle cap is used for sealing a bottle, and has different shapes and different operation methods according to different functions, and is generally round and annular, an injection mold can be used when the bottle cap is manufactured, and when an injection molding product is processed by the injection mold, the injection molding product needs to be cooled to a certain temperature to eject the product, so that the injection molding product can be solidified and molded rapidly, and the existing bottle cap mold can be cooled for convenience.

The utility model discloses a bottle lid mould water route cooling structure is disclosed to current bulletin number CN221641688U, including U-shaped frame board, mould one and mould two set up respectively in the top left and right sides of U-shaped frame board, both ends fixedly connected with pneumatic cylinder about the outer wall of U-shaped frame board respectively, the right-hand member the output of pneumatic cylinder sets up the right-hand member at mould one, the left end the output of pneumatic cylinder sets up the left end at mould two, the right-hand member top fixedly connected with injection tube of mould one, the left end fixedly connected with inlet tube of mould two, the positive right side fixedly connected with drain pipe of mould two. According to the utility model, when the first die and the second die are connected, the clamping ring is extruded and attached to the outer wall of the clamping groove, cold water is injected from the water inlet pipe and flows spirally through the spiral pipe, and the backflow hot water is discharged through the water discharge pipe, so that the injection die in the model sleeve is rapidly subjected to cold cutting, and the cooling is more uniform.

The device cools down the cooling through the cold water that flows in the spiral pipe when using, but only dispel the heat to the surface of product and can't directly dispel the heat to inside effectual heat, only inside heat transfer to outside just can drop the temperature of inside after surface temperature drops for radiating efficiency is slower, leads to cooling efficiency to drop, and carry the cold water through the spiral pipe and cool down, heat need transfer first to the spiral pipe after can be absorbed by the cold water and then take away, the cold water can not directly absorb heat and make the heat exchange efficiency lower, thereby further lead to cooling efficiency to drop, for this reason we propose a bottle lid mould cooling structure.

Disclosure of utility model

The utility model aims to provide a bottle cap mold cooling structure, which aims to solve the problems that in the prior art, the existing device cools a mold through cold water flowing in a spiral pipe, but only the outer surface of a product is cooled, the inside cannot be directly cooled, the temperature of the inside can be reduced only after the temperature of the outer surface is reduced and the heat of the inside is transferred to the outside, so that the cooling efficiency is reduced, the cold water is conveyed by the spiral pipe to cool, the heat is required to be transferred to the spiral pipe and then absorbed by the cold water and then taken away, and the heat cannot be directly absorbed by the cold water, so that the heat exchange efficiency is lower, and the cooling efficiency is further reduced.

In order to achieve the purpose, the bottle cap mold cooling structure comprises a groove seat, wherein movable plates are connected to the left side and the right side of an inner cavity wall of the groove seat in a sliding mode, the top of each movable plate extends to the outer side of the groove seat, a mold sleeve is fixedly connected to the upper side of the left side wall of each movable plate, a hollow mold column is fixedly connected to the upper side of the right side wall of each movable plate, a through hole is formed in the upper side of the left side wall of each movable plate, the through hole is communicated with the hollow mold column, a hollow mounting plate is fixedly connected to the upper side of the left side wall of each movable plate through bolts, a cylinder body is fixedly connected to the middle of the right side wall of each hollow mounting plate, the right side wall of each cylinder body extends to the inner cavity of each hollow mounting plate and each hollow mold column, heat conducting rods are fixedly connected to the inner cavity of each hollow mold column, the number of the four heat conducting rods is four, the four heat conducting rods are distributed evenly from the left side wall to the inner cavity of each hollow mold column, the heat conducting rods are sequentially distributed on the left side wall of each heat conducting rod, the heat conducting rods are connected to the heat conducting rods, and the heat conducting rods are uniformly distributed on the inner cavity of the heat conducting rods, and the heat conducting rods are connected to the heat conducting rods, and the heat conducting rods are uniformly to the heat conducting rods.

As a further description of the above technical solution:

The inner cavity wall fixedly connected with heat dissipation fan of hollow mounting panel, the left side wall intermediate part fixedly connected with wind scooper of hollow mounting panel, the wind scooper with hollow mounting panel is linked together.

As a further description of the above technical solution:

The left side of the outer side wall of the hollow mold column is fixedly connected with a limiting plate, the right side wall of the limiting plate is positioned on the outer side of the hollow mold column and is fixedly connected with a circular ring, and the inner side wall of the circular ring is provided with a silicone rubber sealing ring.

As a further description of the above technical solution:

The inside of die sleeve is opened there is the cooling chamber, the inner chamber wall left and right sides fixedly connected with annular pipe of cooling chamber, the left side the right side wall and the right side of annular pipe the left side wall of annular pipe is opened there is the hole, just the hole is annular evenly distributed, the right side annular pipe intercommunication has the hose of intaking, the left side annular pipe intercommunication has the hose of outputting water.

As a further description of the above technical solution:

The inner cavity wall fixedly connected with spoiler of cooling chamber, just the spoiler is from left to right evenly distributed in proper order, the spoiler is located left and right sides between the inside wall of annular pipe, the lateral wall of spoiler is opened there is the circulation hole, just the circulation hole is annular evenly distributed.

As a further description of the above technical solution:

The left side wall and the right side wall of the groove seat are fixedly connected with electric telescopic rods, and the output ends of the two electric telescopic rods extend to the inner cavity of the groove seat and are respectively fixedly connected with the outer side walls of the movable plates at the left side and the right side.

Compared with the prior art, the utility model has the beneficial effects that:

this bottle lid mould cooling structure cools down the cooling through semiconductor refrigeration piece cooperation heat-conducting rod, barrel and hollow mounting panel hollow mould post to cool down the inside of injection molding, cool down the heat dissipation through heat-conducting rod cooperation fin, radiator fan, opening and wind scooper semiconductor refrigeration piece heating face when the semiconductor refrigeration piece uses, thereby promote the refrigeration efficiency of semiconductor refrigeration piece refrigeration face, can cool down the inside of product and cool down, the outside cooling of cooperation makes whole heat dissipation more even and high-efficient simultaneously, thereby promote the cooling rate of product.

This bottle lid mould cooling structure, through setting up cooling chamber circulation cooling water, carry cooling water through right side annular tube cooperation hole, take out water through left side annular tube cooperation hole, thereby make cooling water evenly flow at cooling intracavity portion, thereby heat on the die sleeve is taken away through the direct contact of cooling water, heat dissipation efficiency has not only been promoted and it is more even to make the heat dissipation cooling, make cooling water stay enough long time in cooling intracavity portion through spoiler cooperation flow through-hole, thereby there is sufficient time to absorb heat, the radiating effect has been promoted, can directly make cooling water act on the mould when the cooling and dispel the heat to the mould, need not intermediate medium and make heat exchange efficiency improve, thereby further promotion cooling efficiency.

Drawings

Fig. 1 is a schematic structural perspective view of a cooling structure for a bottle cap mold according to the present utility model;

Fig. 2 is a schematic diagram illustrating a front cross-sectional view of a cooling structure of a mold for bottle cap according to the present utility model;

FIG. 3 is a right side cross-sectional view of a structural hollow mold column of a cooling structure for a bottle cap mold according to the present utility model;

FIG. 4 is a schematic view of a structural spoiler of a cooling structure for a bottle cap mold according to the present utility model;

Fig. 5 is a schematic diagram illustrating the whole structure of a cooling structure of a mold for bottle cap according to the present utility model;

FIG. 6 is an enlarged view of the cooling structure of the mold for bottle cap shown in FIG. 2;

fig. 7 is an enlarged schematic view of the cooling structure of the mold for bottle cap according to fig. 2.

100 Parts of a groove seat, 110 parts of a movable plate, 111 parts of a die sleeve, 112 parts of a hollow die column, 113 parts of a through hole, 114 parts of a hollow mounting plate, 115 parts of a cylinder, 116 parts of a heat conducting rod, 117 parts of a semiconductor refrigerating sheet, 118 parts of a radiating sheet, 120 parts of a radiating fan, 121 parts of a wind guiding cover, 130 parts of a limiting plate, 131 parts of a circular ring, 140 parts of a cooling cavity, 141 parts of a circular ring pipe, 142 parts of a hole, 150 parts of a flow blocking plate, 151 parts of a flow hole, 160 parts of an electric telescopic rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The utility model provides a bottle cap mold cooling structure, which can cool the inside of a product, and simultaneously cooperate with external cooling to ensure that the whole heat dissipation is more uniform and efficient, thereby improving the cooling speed of the product, directly enabling cooling water to act on a mold to cool the mold during cooling, improving the heat exchange efficiency without an intermediate medium, further improving the cooling efficiency, and referring to figures 1-7, the bottle cap mold cooling structure comprises a groove seat 100;

please refer to fig. 1, 2, 3 again, In fig. 5 and 6, a movable plate 110 is slidably connected to the left and right sides of the inner cavity wall of the slot 100, the movable plate 110 is used for installing a die sleeve 111 and a hollow die column 112, the top of the movable plate 110 extends to the outer side of the slot 100, the die sleeve 111 is fixedly connected to the upper side of the left side wall of the right movable plate 110, the die sleeve 111 is used for matching with the hollow die column 112, the hollow die column 112 is fixedly connected to the upper side of the right side wall of the left movable plate 110, the hollow die column 112 is used for matching with the die sleeve 111 for injection molding, a through hole 113 is formed in the upper side of the left side wall of the left movable plate 110, the through hole 113 is used for ventilation, the through hole 113 is communicated with the hollow die column 112, the upper side of the left side wall of the left movable plate 110 is fixedly connected with a hollow mounting plate 114 through bolts, the hollow mounting plate 114 is used for mounting a barrel 115 and a heat dissipation fan 120, the middle of the right side wall of the hollow mounting plate 114 is fixedly connected with the barrel 115, the cylinder 115 is used for installing the heat conducting rods 116, the right side wall of the cylinder 115 extends to the inner cavity of the hollow die column 112, the cylinder 115 is communicated with the hollow mounting plate 114 and the hollow die column 112, the heat conducting rods 116 are fixedly connected to the inner cavity of the hollow die column 112 and are arranged on the periphery of the outer side wall of the cylinder 115, the heat conducting rods 116 are used for installing the semiconductor refrigerating sheets 117 and the heat radiating sheets 118, the number of the heat conducting rods 116 is four, the four heat conducting rods 116 are uniformly distributed in a group from left to right, one end of each heat conducting rod 116 is fixedly connected with the semiconductor refrigerating sheet 117, the semiconductor refrigerating sheet 117 is used for cooling and radiating the hollow die column 112 by using refrigeration, the semiconductor refrigerating sheet 117 is an existing detectable technology, so heat conducting silica gel pads are not arranged between the refrigerating surface of the semiconductor refrigerating sheet 117 and the inner cavity wall of the hollow die column 112, the heat-conducting silica gel pad is used for enabling the semiconductor refrigerating sheet 117 to be more attached to the inner wall of the hollow mold column 112, improving the heat-conducting effect by utilizing good heat conductivity, the other end of the heat-conducting rod 116 extends to the inner cavity of the cylinder 115 and is fixedly connected with the heat-radiating sheet 118, the heat-radiating sheet 118 is used for cooling and radiating the heating surface of the semiconductor refrigerating sheet 117 through the heat-conducting rod 116, the heat-radiating surface is cooled, the temperature of the heating surface is reduced, the temperature difference between the refrigerating surface and the heating surface is larger, the larger temperature difference is beneficial to improving the refrigerating efficiency, and the refrigerating surface can be fast and the refrigerating surface is fast, The heat-conducting device is characterized in that the temperature is effectively reduced, a heat-radiating fan 120 is fixedly connected to the inner cavity wall of the hollow mounting plate 114, the heat-radiating fan 120 is used for radiating heat of a heat-radiating fin 118, a wind-guiding cover 121 is fixedly connected to the middle of the left side wall of the hollow mounting plate 114, the wind-guiding cover 121 is used for guiding the extracted hot air to avoid being sucked back at once, the wind-guiding cover 121 is communicated with the hollow mounting plate 114, a limiting plate 130 is fixedly connected to the left side of the outer side wall of the hollow die column 112, the limiting plate 130 is used for limiting a die sleeve 111 during processing so as to rapidly perform subsequent injection molding operation, a circular ring 131 is fixedly connected to the right side wall of the limiting plate 130 and the outer side of the hollow die column 112, the circular ring 131 is used for being matched with a silicon rubber sealing ring to promote the sealing performance of the joint, a silicon rubber sealing ring is arranged on the inner side wall of the circular ring 131, a semiconductor refrigerating fin 117 and the heat-radiating fan 120 are started through an external controller when the heat-conducting device is used, the semiconductor refrigerating fin 117 is matched with a heat-conducting surface to cool the hollow die column 112 through a heat-conducting silica gel pad, when the heat-conducting surface of the semiconductor refrigerating fin 117 is used, the heat-conducting rod 116 transfers heat to the heat-conducting fin 116, the heat is transferred to the heat-conducting fin 120, the heat is pumped into the heat-conducting fin 120, the heat-conducting fin 120 is used for conducting the heat-conducting fin 112, the heat is discharged from the heat-conducting fin 112, the heat-conducting fin body and the heat-conducting fin 112 is discharged from the air through the air and the air channel 112 to the heat-conducting fin 112, and finally the heat-conducting fin 120 is discharged to the heat-conducting fin and introduced into the heat-conducting fin body through the heat-conducting fin and the heat-conducting fin cover and the heat-conducting fin 120;

In summary, the cooling can be performed on the inside of the product, and the cooling outside is matched to ensure that the whole heat dissipation is more uniform and efficient, so that the cooling speed of the product is improved.

Referring to fig. 1, 2, 4, 5 and 7 again, the inside of the die sleeve 111 is provided with a cooling cavity 140, the cooling cavity 140 is used for facilitating the cooling water to fully contact with the die sleeve 111, the left side and the right side of the inner cavity wall of the cooling cavity 140 are fixedly connected with annular pipes 141, the left side and the right side of the annular pipes 141 are respectively connected with the existing industrial circulating cooling water system through water outlet hoses and water inlet hoses, so as to realize the circulation of cooling water, the industrial circulating cooling water system is referred to as the existing technology, so that the holes 142 are formed on the right side wall of the left side annular pipe 141 and the left side wall of the right side annular pipe 141, the holes 142 are used for uniformly distributing and circulating the cooling water in the cooling cavity 140, the holes 142 are uniformly distributed in a ring shape, the right side annular pipe 141 is communicated with the water inlet hoses, the left side annular pipe 141 is communicated with the water outlet hoses, the inner cavity wall of the cooling cavity 140 is fixedly connected with a flow blocking plate 150, the flow blocking plates 150 are used for matching the flow through holes 151 so that cooling water can stay in the cooling cavity 140 for a long enough time, so that heat is absorbed for a sufficient time, the flow blocking plates 150 are uniformly distributed from left to right in sequence, the flow blocking plates 150 are positioned between the inner side walls of the annular pipes 141 on the left side and the right side, the outer side walls of the flow blocking plates 150 are provided with flow holes 151, the flow holes 151 are used for facilitating the circulation of the cooling water, the flow holes 151 are uniformly distributed in a ring shape, the left side wall and the right side wall of the tank base 100 are fixedly connected with electric telescopic rods 160, the electric telescopic rods 160 are used for driving the movable plates 110 to move, the output ends of the two electric telescopic rods 160 extend to the inner cavity of the tank base 100 and are respectively fixedly connected with the outer side walls of the movable plates 110 on the left side and the right side, when in use, the cooling water is conveyed into the cooling cavity 140 through the right side holes 142 by matching with the water inlet hoses 141 on the right side, the left annular pipe 141 is matched with a water outlet pipe to pump out cooling water through the left hole 142, and the two sides are matched with each other to enable the cooling water to uniformly circulate in the cooling cavity 140, so that the cooling water absorbs heat of the die sleeve 111 to cool products, and when the cooling water circulates and cools, the flow rate of the cooling water is slowed down by the flow blocking plate 150 matched with the flow through hole 151, so that the cooling water stays in the cooling cavity 140 for a long enough time and absorbs heat for a long enough time;

In summary, the cooling water can directly act on the die to cool the die in cooling, and the heat exchange efficiency is improved without an intermediate medium, so that the cooling efficiency is further improved.

When in specific use, a person skilled in the art starts the electric telescopic rods 160 at two sides through the external controller, the electric telescopic rods 160 at two sides respectively drive the movable plates 110 at two sides to move oppositely at the same time, so that the hollow mold column 112 is inserted into the mold sleeve 111, the positioning is accurately performed under the action of the limiting plate 130, raw materials are added between the mold sleeve 111 and the hollow mold column 112 through the injection molding pipe on the mold sleeve 111, after the addition is completed, the plug is plugged into the injection molding pipe for sealing, the ring 131 is matched with the silicone rubber sealing ring to avoid leakage of raw materials at the joint when in injection molding, the semiconductor refrigeration sheet 117 and the heat dissipation fan 120 are started through the external controller when in cooling, the semiconductor refrigeration sheet 117 is matched with the heat conduction silicone pad to cool the hollow mold column 112, and the heating surface of the semiconductor refrigeration sheet 117 transfers heat to the heat conduction rod 116 when in cooling, the heat conducting rod 116 transfers heat to the radiating fin 118, the radiating fan 120 pumps air into the hollow mold column 112 from the through hole 113 to radiate heat of the heat conducting rod 116 and the semiconductor refrigerating sheet 117, under the action of the radiating fan 120, the air flows to the tail end of the hollow mold column 112 and then enters the cylinder 115 to circulate, so that the heat on the radiating fin 118 is taken away, finally, the air is discharged through the air guide cover 121, the interior of a product is cooled by cooling the hollow mold column 112, meanwhile, the annular pipe 141 on the right side is matched with a water inlet hose to convey cooling water into the cooling cavity 140 through the right hole 142, the annular pipe 141 on the left side is matched with a water outlet hose to pump the cooling water out through the left hole 142, the two sides are matched with each other to ensure that the cooling water uniformly circulates in the cooling cavity 140, the heat of the cooling water absorbing mold sleeve 111 is used for cooling the exterior of the product, and when the cooling water circulates for cooling, the flow blocking plate 150 is matched with the flow through hole 151 to slow down the circulation speed of the cooling water, so that the cooling water stays in the cooling cavity 140 for a long enough time and absorbs heat for a long enough time, and the product is cooled down quickly.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims (6)

1. The utility model provides a bottle lid mould cooling structure, its characterized in that includes groove seat (100), the inner chamber wall left and right sides sliding connection of groove seat (100) has fly leaf (110), the top of fly leaf (110) extends to the outside of groove seat (100), the right side the left side lateral wall upside of fly leaf (110) is fixedly connected with die sleeve (111), the left side the right side lateral wall upside of fly leaf (110) is fixedly connected with hollow die post (112), the left side open on the left side lateral wall upside of fly leaf (110) has through-hole (113), through-hole (113) with hollow die post (112) are linked together, the left side lateral wall upside of fly leaf (110) is through bolt fixedly connected with hollow mounting plate (114), the right side lateral wall middle part fixedly connected with barrel (115), the right side lateral wall of barrel (115) extends to the inner chamber of hollow die post (112), and barrel (115) all with hollow die (114) and hollow die post (116) are connected with each other, one end of four heat conduction rods (116) are evenly distributed in proper order, one week is connected with hollow die post (116) and one end (116), a heat conduction silica gel pad is arranged between the refrigerating surface of the semiconductor refrigerating sheet (117) and the inner cavity wall of the hollow mold column (112), and the other end of the heat conduction rod (116) extends to the inner cavity of the cylinder body (115) and is fixedly connected with a radiating fin (118).

2. The cooling structure of a bottle cap mold according to claim 1, wherein the inner cavity wall of the hollow mounting plate (114) is fixedly connected with a heat dissipation fan (120), the middle of the left side wall of the hollow mounting plate (114) is fixedly connected with a wind scooper (121), and the wind scooper (121) is communicated with the hollow mounting plate (114).

3. The cooling structure of a bottle cap mold according to claim 1, wherein a limiting plate (130) is fixedly connected to the left side of the outer side wall of the hollow mold column (112), a circular ring (131) is fixedly connected to the right side wall of the limiting plate (130) and located on the outer side of the hollow mold column (112), and a silicon rubber sealing ring is arranged on the inner side wall of the circular ring (131).

4. The cooling structure of the bottle cap mold according to claim 1, wherein a cooling cavity (140) is formed in the mold sleeve (111), annular pipes (141) are fixedly connected to the left side and the right side of the inner cavity wall of the cooling cavity (140), holes (142) are formed in the right side wall of the annular pipe (141) and the left side wall of the annular pipe (141), the holes (142) are uniformly distributed in a ring shape, a water inlet hose is communicated with the annular pipe (141) on the right side, and a water outlet hose is communicated with the annular pipe (141) on the left side.

5. The cooling structure of a bottle cap mold according to claim 4, wherein a flow blocking plate (150) is fixedly connected to the inner cavity wall of the cooling cavity (140), the flow blocking plates (150) are uniformly distributed in sequence from left to right, the flow blocking plates (150) are positioned between the inner side walls of the annular pipes (141) at the left side and the right side, a flow hole (151) is formed in the outer side wall of the flow blocking plate (150), and the flow holes (151) are uniformly distributed in an annular shape.

6. The cooling structure of a bottle cap mold according to claim 1, wherein the left and right side walls of the groove seat (100) are fixedly connected with electric telescopic rods (160), and the output ends of the two electric telescopic rods (160) extend to the inner cavity of the groove seat (100) and are fixedly connected with the outer side walls of the movable plates (110) at the left and right sides respectively.