CN223763490U - Silicon wafer automatic separation transfer equipment - Google Patents
Silicon wafer automatic separation transfer equipmentInfo
- Publication number
- CN223763490U CN223763490U CN202423100684.0U CN202423100684U CN223763490U CN 223763490 U CN223763490 U CN 223763490U CN 202423100684 U CN202423100684 U CN 202423100684U CN 223763490 U CN223763490 U CN 223763490U
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- silicon wafer
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- separation
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Abstract
The utility model discloses automatic silicon wafer separation and transfer equipment, which separates cut silicon wafers from a jacking by using a silicon wafer separation assembly, screens and loads the single silicon wafers into a second silicon wafer basket by using a silicon wafer feeding assembly, transfers the second silicon wafer basket loaded with the silicon wafers to the next processing procedure by using the basket feeding assembly, and completes the processes of cleaning, separation, screening, loading and transferring of the silicon wafers by using automatic processing in the whole process of the production process of the silicon wafers, thereby having high automation degree, saving manpower resources and greatly improving the production efficiency of the silicon wafers.
Description
Technical Field
The utility model relates to the technical field of silicon wafer production, in particular to automatic silicon wafer separation and transportation equipment.
Background
With the development of semiconductor technology, the demand of silicon wafers is increasing day by day, among the current silicon wafer production methods, what generally adopted is the mode of cutting silicon rod to acquire the silicon wafer, need to adhere silicon rod and top support together and place in the middle of the silicon wafer basket of flowers, then cut the silicon rod, after cutting is accomplished, need to separate silicon wafer and top support to carry out the processing earlier of next step to the silicon wafer that the cutting obtained, therefore processing step is more, and the silicon wafer production is usually all loaded with silicon wafer basket of flowers, consequently need carry out handling of high strength, if adopt manual handling, need consume very big manpower.
Disclosure of utility model
In order to overcome the defects, the utility model aims to provide the automatic silicon wafer separating and transferring equipment, which separates cut silicon wafers from a jacking by using a silicon wafer separating assembly, screens and loads the independent silicon wafers into a second silicon wafer basket by using a silicon wafer feeding assembly, transfers the second silicon wafer basket loaded with the silicon wafers to a next processing procedure by using a basket feeding assembly, and completes the processes of cleaning, separating, screening, loading and transferring the silicon wafers by using automatic processing in the whole process in the production process of the silicon wafers, thereby having high automation degree, saving human resources and greatly improving the production efficiency of the silicon wafers.
In order to achieve the purpose, the technical scheme adopted by the utility model is that the automatic silicon wafer separating and transferring equipment comprises:
The silicon wafer separation assembly comprises a spraying tank, a degumming tank and a cleaning tank which are arranged side by side along the second direction;
The silicon wafer feeding assembly and the silicon wafer separating assembly are arranged side by side along a first direction, the silicon wafer feeding assembly comprises a silicon wafer conveying device and a silicon wafer feeding device, the silicon wafer conveying device and the silicon wafer feeding device are arranged side by side along the first direction, the silicon wafer conveying device is arranged at one end, close to the silicon wafer separating assembly, of the silicon wafer feeding device, the silicon wafer conveying device comprises a first conveying belt extending along the first direction, the silicon wafer feeding device comprises a screening piece, and the screening piece is connected with the first conveying belt;
The flower basket feeding assembly is connected with the silicon wafer feeding assembly and comprises a first guide beam, a second guide beam and a third guide beam, the first guide beam extends along a first direction, the second guide beam extends along a second direction, the second guide beam is arranged on the first guide beam, the third guide beam extends along a third direction, and the third guide beam is arranged on the second guide beam.
According to the technical scheme, the silicon wafer separating assembly cleans the silicon wafer basket by using the spraying pond, so that dust generated by cutting of the silicon wafer is removed, the degumming pond is used for separating the silicon wafer from the jacking, the cleaning pond is used for cleaning the silicon wafer after the photoresist stripping, the silicon wafer feeding assembly conveys the silicon wafer of the scattered part to the silicon wafer commodity device by using the first conveying belt and rejects the defective silicon wafer by using the screening part, the basket feeding assembly enables the second silicon wafer basket loaded with the silicon wafer to move along the length direction of the first guide beam by using the first guide beam, the second guide Liang Bianyu moves along the length direction of the second guide beam, and the third guide beam is used for lifting and putting down the second silicon wafer basket to finish the transfer treatment of the second silicon wafer basket.
In some embodiments, the silicon wafer automatic separation and transfer device further comprises a flower basket driving assembly, the flower basket driving assembly is arranged on the silicon wafer separation assembly and the upper side of the silicon wafer feeding assembly, the flower basket driving assembly comprises a first cross beam, a second cross beam and a vertical beam, the first cross beam extends along a first direction, the second cross beam extends along a second direction, the vertical beam extends along a third direction, the second cross beam is arranged on the first cross beam, and the vertical beam is connected with the second cross beam.
In the technical scheme, the basket driving assembly is used for driving a first silicon wafer basket loaded with a jacking, the first cross beam is used for guiding the movement of the first silicon wafer basket along a first direction, the second cross beam is used for guiding the movement of the first silicon wafer basket along a second direction, and the third cross beam is used for guiding the movement of the second silicon wafer basket along a third direction.
In some embodiments, the basket driving assembly further comprises a first driving device, a second driving device and a third driving device, the second driving device is fixedly connected with the third driving device, the second cross beam is arranged on the first cross beam through the first driving device, and the vertical beam is arranged on the second cross beam through the second driving device and the third driving device.
In the technical scheme, the first driving device is used for driving the second cross beam to move along the length direction of the first cross beam, the second driving device is used for driving the vertical beam to move along the length direction of the second cross beam, and the third driving device is used for driving the vertical beam to move along the third direction.
In some embodiments, the first driving device comprises a first driving rule extending along the length direction of the first beam and a first driving gear clamped with the first driving rule, the second driving device comprises a second driving rule extending along the length direction of the second beam and a second driving gear clamped with the second driving rule, the third driving device comprises a third driving rule extending along the length direction of the vertical beam and a second driving gear clamped with the third driving rule, the first driving rule is fixed on the first beam, the second driving rule is fixed on the second beam, and the third driving rule is fixed on the vertical beam.
In the technical scheme, the first driving rule and the first driving gear move through the first driving gear, so that the first driving gear moves along the length direction of the first driving rule, the second driving rule and the second driving gear move through the second driving gear, so that the second driving gear moves along the length direction of the second driving rule, and the third driving rule and the third driving gear move through the third driving gear, so that the third driving rule moves along the length direction of the third driving rule.
In some embodiments, the silicon wafer transport device further comprises a feed bin, and the first conveyor belt is disposed within the feed bin.
According to the technical scheme, the feeding box is used for loading and taking out the first silicon wafer flower basket of the jacking, so that the silicon wafer is placed on the first conveying belt, and the silicon wafer is conveyed to the silicon wafer feeding device by using the first conveying belt.
In some embodiments, the silicon wafer loading device further comprises a basket lifting assembly, wherein the basket lifting assembly is arranged on the lower side of the basket loading assembly, and the basket lifting assembly is arranged on one end, far away from the first conveying belt, of the screening piece.
In the technical scheme, the basket lifting assembly is used for lifting the second silicon wafer basket, so that the silicon wafers with qualified quality after detection are loaded into the second silicon wafer basket in cooperation with the screening piece.
In some embodiments, the basket loading assembly further comprises a fourth driving device, a fifth driving device and a sixth driving device, the second guide beam is arranged on the first guide beam through the fourth driving device, and the third guide beam is arranged on the second guide beam through the fifth driving device and the sixth driving device.
In this technical scheme, the fourth drive arrangement is used for driving that second guiding beam to follow the length direction motion of first guiding beam, and the fifth drive arrangement is used for driving the third guiding beam to follow the length direction motion of second guiding beam, and the sixth drive arrangement is used for driving the third guiding beam to follow its length direction motion.
In some embodiments, the fourth driving device comprises a guide rod and a driving wheel, the guide rod and the driving wheel extend along the first direction, the driving wheel is provided with a groove body extending along the circumference direction of the driving wheel, the guide rod is clamped with the driving wheel, the fifth driving device comprises a fifth driving rule extending along the length direction of the second beam body and a fifth driving gear clamped with the fifth driving rule, the sixth driving device comprises a driving track, and one end of the driving track is fixed on the fifth driving device.
In the technical scheme, the guide rod is used for guiding the movement of the driving wheel, the driving wheel drives the second guide beam to move, the fifth driving device is used for driving the third guide beam to move along the length direction of the second guide beam, and the sixth driving device is used for driving the third guide beam to move along the third direction.
In some embodiments, the silicon wafer automatic separation and transfer device further comprises a jacking and carrying assembly, wherein the jacking and carrying assembly is arranged on one side, away from the silicon wafer feeding assembly, of the silicon wafer separation assembly, and the jacking and carrying assembly comprises a plurality of tracks extending along a first direction.
In the technical scheme, after the silicon wafer is separated from the jacking, the jacking is carried by using the jacking carrying assembly.
In some embodiments, the silicon wafer automatic separation and transport apparatus further comprises a silicon wafer impact assembly disposed between the jacking handling assembly and the silicon wafer separation assembly, the silicon wafer impact assembly comprising an upper end and an impact end with an open side.
In the technical scheme, when the silicon wafer and the jacking are not sufficiently separated, the silicon wafer impact assembly is used for impacting the first silicon wafer basket for loading the silicon wafer and the jacking so as to separate the silicon wafer from the jacking.
The silicon wafer separating assembly has the advantages that the silicon wafer separating assembly is used for separating the cut silicon wafer from the jacking, the silicon wafer feeding assembly is used for screening and loading the single silicon wafer into the second silicon wafer basket, the basket feeding assembly is used for transferring the second silicon wafer basket loaded with the silicon wafer to the next processing procedure, and in the production process of the silicon wafer, the whole process uses automatic treatment to complete the cleaning, separating, screening, loading and transferring of the silicon wafer, so that the automation degree is high, manpower resources are saved, and the production efficiency of the silicon wafer is greatly improved.
Drawings
FIG. 1 is a schematic view of an embodiment of an automatic silicon wafer separation and transportation device;
FIG. 2 is a schematic top view of an apparatus for automatically separating and transporting silicon wafers according to an embodiment of the present utility model;
FIG. 3 is a schematic top view of a silicon wafer separation assembly of an automatic silicon wafer separation and transport apparatus according to one embodiment of the present utility model;
FIG. 4 is a schematic diagram of a silicon wafer loading assembly of an automatic silicon wafer separation and transportation device according to an embodiment of the present utility model;
FIG. 5 is a schematic top view of a silicon wafer loading device of an automatic silicon wafer separating and transporting apparatus according to an embodiment of the present utility model;
FIG. 6 is a schematic diagram of a basket loading assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present utility model;
FIG. 7 is a schematic diagram showing connection relations of basket feeding components of an automatic silicon wafer separation and transportation device according to an embodiment of the present utility model;
FIG. 8 is a schematic view of a basket driving assembly of an automatic silicon wafer separating and transferring device according to an embodiment of the present utility model;
FIG. 9 is a schematic diagram showing the connection relationship of basket driving components of an automatic silicon wafer separation and transportation device according to an embodiment of the present utility model;
FIG. 10 is a schematic view of a silicon wafer impact assembly of an automatic silicon wafer separation and transport apparatus according to an embodiment of the present utility model;
In the figure, 1, a silicon chip separation assembly, 11, a spray tank, 12, a degumming tank, 13 and a cleaning tank;
2. The device comprises a silicon wafer feeding assembly, a silicon wafer conveying device, a first conveying belt, a 212, a feeding box, a 22, a silicon wafer feeding device, a 221, a screening piece, a 2211, an arched conveying device, a 2212, a second conveying belt, a 2213, an ejection device, a 2214, a detection sensor, a 2215, an ejection section, a 222 and a basket lifting assembly, wherein the silicon wafer feeding assembly is arranged on the silicon wafer conveying device;
3. A basket feeding assembly; 31, a first guide beam, 32, a second guide beam, 33, a third guide beam, 341, a guide rod, 342, a driving wheel, 351, a fifth driving rule, 352, a fifth driving gear, 361, and a driving track;
4. Basket driving assembly 41, first beam 42, second beam 43, vertical beam 441, first driving rule 442, first driving gear 451, second driving rule 461, third driving rule 462, second driving gear;
5. The jacking and carrying assembly is 51, a track;
6. The silicon wafer impact assembly comprises an impact end, a 62, a collecting end, a 63 and a supporting frame;
x, a first direction, y, a second direction, and z, a third direction.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.
Referring to fig. 1 to 6, the present utility model provides an automatic silicon wafer separating and transferring device, comprising:
The silicon wafer separation assembly 1 comprises a spraying tank 11, a degumming tank 12 and a cleaning tank 13 which are arranged side by side along a second direction y, wherein a spraying pipe is arranged in the spraying tank 11, a heating plate is arranged in the degumming tank 12 and used for heating liquid in the degumming tank 12, and the degumming efficiency is improved;
The silicon wafer feeding assembly and the silicon wafer separating assembly are arranged side by side along a first direction x, the silicon wafer feeding assembly 2 comprises a silicon wafer conveying device 21 and a silicon wafer feeding device 22, the silicon wafer conveying device 21 and the silicon wafer feeding device 22 are arranged side by side along the first direction x, the silicon wafer conveying device 21 is arranged at one end of the silicon wafer feeding device 22, which is close to the silicon wafer separating assembly 1, the silicon wafer conveying device 21 comprises a first conveying belt 211 extending along the first direction x, the silicon wafer feeding device 22 comprises a screening piece 221, the screening piece 221 comprises an arch conveying device 2211 extending along the first direction x, a second conveying belt 2212, an ejection device 2213, a detection sensor 2214 and an ejection section 2215, the upper end of the arch conveying assembly is connected with the second conveying belt 2212, the ejection section 2215 is arranged between the two second conveying belts 2212, the ejection section 2215 and the second conveying belt 2212 are arranged side by side along the first direction x, the ejection device 2213 is arranged at the lower side of the ejection section 2215, the detection sensor 2214 is connected with the first conveying belt 2211, and the ejection device 2213 is connected with the first conveying belt 211;
the flower basket feeding assembly 3, the flower basket feeding assembly 3 is connected with the silicon wafer feeding assembly, the flower basket feeding assembly 3 comprises a first guide beam 31, a second guide beam 32 and a third guide beam 33, the first guide beam 31 extends along a first direction x, the second guide beam 32 extends along a second direction y, the second guide beam 32 is arranged on the first guide beam 31, the third guide beam 33 extends along a third direction z, and the third guide beam 33 is arranged on the second guide beam 32.
The silicon wafer separating assembly 1 cleans the silicon wafer basket by using the spraying pond 11 so as to remove dust generated by cutting the silicon wafer, separates the silicon wafer from the jacking by using the degumming pond 12, cleans the wafer after the photoresist removal by using the cleaning pond 13, removes defective silicon wafers by using the screening piece 221 by transporting the scattered silicon wafers to a silicon wafer commodity device by using the first conveying belt 211, and enables the second silicon wafer basket loaded with the silicon wafers to move along the length direction of the first guiding beam 31 by using the basket feeding assembly 3, the second guiding beam 32 is convenient for the second silicon wafer basket to move along the length direction of the second guiding beam 32, and the third guiding beam 33 is used for lifting and dropping the second silicon wafer basket to finish the transferring treatment of the second silicon wafer basket.
Continuing to refer to fig. 8, in some embodiments, the automatic silicon wafer separating and transferring device further includes a basket driving assembly 4, where the basket driving assembly 4 is disposed on the silicon wafer separating assembly 1 and the silicon wafer feeding assembly, the basket driving assembly 4 includes a first beam 41, a second beam 42 and a vertical beam 43, the first beam 41 extends along a first direction x, the second beam 42 extends along a second direction y, the vertical beam 43 extends along a third direction z, the second beam 42 is disposed on the first beam 41, and the vertical beam 43 is connected with the second beam 42.
The basket driving assembly 4 is used for driving a first silicon wafer basket of the loading jacking, the first cross beam 41 is used for guiding the movement of the first silicon wafer basket along the first direction x, the second cross beam 42 is used for guiding the movement of the first silicon wafer basket along the second direction y, and the third cross beam is used for guiding the movement of the second silicon wafer basket along the third direction z.
In some embodiments, the basket driving assembly 4 further includes a first driving device, a second driving device and a third driving device, the second driving device is fixedly connected with the third driving device, the second cross beam 42 is disposed on the first cross beam 41 through the first driving device, and the vertical beam 43 is disposed on the second cross beam 42 through the second driving device and the third driving device.
The first driving device is used for driving the second cross beam 42 to move along the length direction of the first cross beam 41, the second driving device is used for driving the vertical beam 43 to move along the length direction of the second cross beam 42, and the third driving device is used for driving the vertical beam 43 to move along the third direction z.
With continued reference to fig. 9, in some embodiments, the first driving device includes a first driving rule 441 extending along a length direction of the first beam 41 and a first driving gear 442 engaged with the first driving rule 441, the second driving device includes a second driving rule 451 extending along a length direction of the second beam 42 and a second driving gear 462 engaged with the second driving rule 451, the third driving device includes a track, a third driving rule 461 extending along a length direction of the vertical beam 43, and a second driving gear 462 engaged with the third driving rule 461, the first driving rule 441 is fixed on the first beam 41, the second driving rule 451 is fixed on the second beam 42, the third driving rule 461 is fixed on the vertical beam 43, one end of the track is fixed on the third driving device, and the other end of the track is disposed at a lower end of the vertical beam 43.
The first driving rule 441 and the first driving gear 442 move by the movement of the first driving gear 442, thereby moving the first driving gear 442 in the length direction of the first driving rule 441, the second driving rule 451 and the second driving gear 462 move by the movement of the second driving gear 462, thereby moving the second driving gear 462 in the length direction of the second driving rule, and the third driving rule 461 and the third driving gear move by the movement of the third driving gear, thereby moving the third driving rule 461 in the length direction thereof.
With continued reference to fig. 4 and fig. 5, in some embodiments, the silicon wafer transporting device 21 further includes a loading box 212, the first conveying belt 211 is disposed in the loading box 212, and the loading box 212 is used for loading the first silicon wafer basket from which the top is lifted, so that the silicon wafer is placed on the first conveying belt 211, and the silicon wafer is transported to the silicon wafer loading device 22 by using the first conveying belt 211.
In some embodiments, the silicon wafer loading device 22 further includes a basket lifting assembly 222, the basket lifting assembly 222 is disposed on the lower side of the basket loading assembly 3, the basket lifting assembly 222 is disposed on one end of the screening member 221 away from the first conveying belt 211, and the basket lifting assembly 222 is used for lifting the second silicon wafer basket, so that the screening member 221 is matched to load the silicon wafer with qualified quality after detection into the second silicon wafer basket.
In some embodiments, the basket loading assembly 3 further includes a fourth driving device, a fifth driving device, and a sixth driving device, the second guide beam 32 is disposed on the first guide beam 31 through the fourth driving device, and the third guide beam 33 is disposed on the second guide beam 32 through the fifth driving device and the sixth driving device.
The fourth driving means is for driving that second guide beam 32 to move in the length direction of the first guide beam 31, the fifth driving means is for driving the third guide beam 33 to move in the length direction of the second guide beam 32, and the sixth driving means is for driving the third guide beam 33 to move in the length direction thereof.
With continued reference to fig. 7, in some embodiments, the fourth driving device includes a guide rod 341 extending along the first direction x and a driving wheel 342, a groove body extending along the circumferential direction of the driving wheel 342 is provided on the driving wheel 342, the guide rod 341 is clamped with the driving wheel 342, the fifth driving device includes a fifth driving rule 351 extending along the length direction of the second beam body and a fifth driving gear 352 clamped with the fifth driving rule 351, the sixth driving device includes a driving track 361, and one end of the driving track 361 is fixed on the fifth driving device.
The guide bar 341 is used for guiding the movement of the driving wheel 342, the driving wheel 342 drives the second guide beam 32 to move, the fifth driving device is used for driving the third guide beam 33 to move along the length direction of the second guide beam 32, and the sixth driving device is used for driving the third guide beam 33 to move along the third direction z.
With continued reference to fig. 1 and fig. 2, in some embodiments, the automatic silicon wafer separating and transferring apparatus further includes a jacking and carrying assembly 5, where the jacking and carrying assembly 5 is disposed on a side of the silicon wafer separating assembly 1 away from the silicon wafer loading assembly, and the jacking and carrying assembly 5 includes a plurality of rails 51 extending along a first direction x, and the cart may move along the rails 51, and after the silicon wafer is separated from the jacking and carrying the jacking by using the jacking and carrying assembly 5.
With continued reference to fig. 1 and 10, in some embodiments, the automatic silicon wafer separation and transportation device further includes a silicon wafer impact assembly 6, where the silicon wafer impact assembly 6 is disposed between the jacking handling assembly 5 and the silicon wafer separation assembly 1, the silicon wafer impact assembly 6 includes an upper end and an impact end 61 with an open side, when the silicon wafer is insufficiently separated from the jacking, the silicon wafer impact assembly 6 is used to impact a first silicon wafer basket for loading the silicon wafer and jacking, to separate the silicon wafer from the jacking, and the silicon wafer impact assembly 6 further includes a collecting end 62 and a supporting frame 63, the collecting end 62 is disposed below the impact end 61, and the collecting end 62 is conducted with the collecting end 62, where the collecting end 62 is disposed in the supporting frame 63.
In summary, the utility model provides an automatic silicon wafer separating and transferring device, which separates a cut silicon wafer from a jacking by using a silicon wafer separating assembly, screens and loads an individual silicon wafer into a second silicon wafer basket by using a silicon wafer feeding assembly, transfers the second silicon wafer basket loaded with the silicon wafer into a next processing procedure by using a basket feeding assembly, and uses automatic processing in the whole process of the production process of the silicon wafer to finish the processes of cleaning, separating, screening, loading and transferring the silicon wafer, thereby having high automation degree, saving human resources and greatly improving the production efficiency of the silicon wafer.
The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the content of the present utility model and to implement the same, but are not intended to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. The utility model provides a silicon chip autosegregation transshipment equipment which characterized in that includes:
The silicon wafer separation assembly comprises a spraying tank, a degumming tank and a cleaning tank which are arranged side by side along the second direction;
The silicon wafer feeding assembly and the silicon wafer separating assembly are arranged side by side along a first direction, the silicon wafer feeding assembly comprises a silicon wafer conveying device and a silicon wafer feeding device, the silicon wafer conveying device and the silicon wafer feeding device are arranged side by side along the first direction, the silicon wafer conveying device is arranged at one end, close to the silicon wafer separating assembly, of the silicon wafer feeding device, the silicon wafer conveying device comprises a first conveying belt extending along the first direction, the silicon wafer feeding device comprises a screening piece, and the screening piece is connected with the first conveying belt;
The flower basket feeding assembly is connected with the silicon wafer feeding assembly and comprises a first guide beam, a second guide beam and a third guide beam, the first guide beam extends along a first direction, the second guide beam extends along a second direction, the second guide beam is arranged on the first guide beam, the third guide beam extends along a third direction, and the third guide beam is arranged on the second guide beam.
2. The silicon wafer automatic separation and transportation device according to claim 1, further comprising a flower basket driving assembly, wherein the flower basket driving assembly is arranged on the upper side of the silicon wafer separation assembly and the upper side of the silicon wafer feeding assembly, the flower basket driving assembly comprises a first cross beam, a second cross beam and a vertical beam, the first cross beam extends along a first direction, the second cross beam extends along a second direction, the vertical beam extends along a third direction, the second cross beam is arranged on the first cross beam, and the vertical beam is connected with the second cross beam.
3. The automated silicon wafer separation and transport equipment according to claim 2, wherein the basket driving assembly further comprises a first driving device, a second driving device and a third driving device, the second driving device is fixedly connected with the third driving device, the second cross beam is arranged on the first cross beam through the first driving device, and the vertical beam is arranged on the second cross beam through the second driving device and the third driving device.
4. The automated silicon wafer separation and transportation device according to claim 3, wherein the first driving device comprises a first driving rule extending along the length direction of the first cross beam and a first driving gear clamped with the first driving rule, the second driving device comprises a second driving rule extending along the length direction of the second cross beam and a second driving gear clamped with the second driving rule, the third driving device comprises a third driving rule extending along the length direction of the vertical beam and a second driving gear clamped with the third driving rule, the first driving rule is fixed on the first cross beam, the second driving rule is fixed on the second cross beam, and the third driving rule is fixed on the vertical beam.
5. The automated silicon wafer separation and transport apparatus of claim 1, wherein the silicon wafer transport device further comprises a feed bin, the first conveyor belt being disposed within the feed bin.
6. The silicon wafer automatic separation and transportation device according to claim 1, wherein the silicon wafer feeding device further comprises a flower basket lifting assembly, the flower basket lifting assembly is arranged on the lower side of the flower basket feeding assembly, and the flower basket lifting assembly is arranged on one end, far away from the first conveying belt, of the screening piece.
7. The automated silicon wafer separation and transport equipment according to claim 1, wherein the basket of flowers material loading assembly further comprises a fourth drive device, a fifth drive device and a sixth drive device, the second guide beam is disposed on the first guide beam through the fourth drive device, and the third guide beam is disposed on the second guide beam through the fifth drive device and the sixth drive device.
8. The automated silicon wafer separation and transportation device according to claim 7, wherein the fourth driving means comprises a guide rod and a driving wheel which extend along a first direction, the driving wheel is provided with a groove body which extends along a circumferential direction of the driving wheel, the guide rod is in clamping connection with the driving wheel, the fifth driving means comprises a fifth driving rule which extends along a length direction of the second beam body and a fifth driving gear which is in clamping connection with the fifth driving rule, the sixth driving means comprises a driving track, and one end of the driving track is fixed on the fifth driving means.
9. The automated silicon wafer separation and transport apparatus of claim 1, further comprising a jacking handling assembly disposed on a side of the silicon wafer separation assembly away from the silicon wafer loading assembly, the jacking handling assembly comprising a plurality of rails extending along a first direction.
10. The automated silicon wafer separation and transport apparatus of claim 9, further comprising a silicon wafer impact assembly disposed between the jacking handling assembly and the silicon wafer separation assembly, the silicon wafer impact assembly including an upper end and an impact end with an open side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423100684.0U CN223763490U (en) | 2024-12-16 | 2024-12-16 | Silicon wafer automatic separation transfer equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202423100684.0U CN223763490U (en) | 2024-12-16 | 2024-12-16 | Silicon wafer automatic separation transfer equipment |
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| CN223763490U true CN223763490U (en) | 2026-01-06 |
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| CN202423100684.0U Active CN223763490U (en) | 2024-12-16 | 2024-12-16 | Silicon wafer automatic separation transfer equipment |
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