CN223758451U - Embedded heat pipe heat dissipation structure on circuit board - Google Patents

Abstract

This utility model discloses an embedded heat pipe heat dissipation structure for a circuit board, comprising: a board body with a cavity in the middle; a water-cooling assembly disposed in the cavity and filled with a heat dissipation medium that is circulated within the cavity to reduce the heat of the board body; and a heat dissipation assembly disposed at the bottom of the board body and rotatable at the bottom of the board body to dissipate the heat of the board body.

Description

Heat dissipation structure of circuit board embedded heat pipe

Technical Field

The utility model relates to the technical field of circuit boards, in particular to an embedded heat pipe radiating structure of a circuit board.

Background

The names of the circuit boards are ceramic circuit boards, aluminum oxide ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper plates, impedance boards, PCBs, ultrathin circuit boards, printed (copper etching technology) circuit boards and the like.

The existing heat dissipation mode of the circuit board generally dissipates heat through the combination of the heat dissipation teeth and the heat dissipation fans, and the heat dissipation mode has better effect when used on a small circuit board, but the larger circuit board can dissipate heat only by using a plurality of fans, so that the cost is increased.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present utility model is to provide a heat dissipation structure of a circuit board embedded heat pipe, comprising:

The middle part of the plate body is provided with a cavity;

The water cooling component is arranged in the cavity, and is filled with a heat dissipation medium which can circulate in the cavity so as to be suitable for reducing the heat of the plate body;

The heat dissipation assembly is arranged at the bottom of the plate body and can rotate at the bottom of the plate body so as to be suitable for dissipating heat of the plate body.

Preferably, the water cooling assembly includes:

the pipeline is laid in the cavity;

And the miniature water pump is communicated with the water outlet and the water inlet of the pipeline.

Preferably, the heat dissipation medium flows through the pipe.

Preferably, graphite sheets are filled in the cavity, and the height of the graphite sheets is flush with the height of the pipeline.

Preferably, the top and the bottom of the graphite sheet and the bottom of the pipeline are coated with the first heat-conducting double faced adhesive tape.

Preferably, the heat dissipation assembly includes:

the heat dissipation teeth are arranged at the bottom of the plate body;

the heat dissipation fan is arranged at the bottom of the heat dissipation teeth.

Preferably, a second heat-conducting double faced adhesive tape is coated between the heat dissipation teeth and the plate body.

Preferably, the heat dissipation medium is deionized purified water or ethylene glycol.

Preferably, a filter screen can be arranged at the bottom of the heat dissipation fan.

The scheme of the utility model at least comprises the following beneficial effects:

When the plate body works, heat is emitted, a heat dissipation medium in the water cooling component circulates in the cavity, the heat emitted by the plate body is reduced through the circulating heat dissipation medium, the bottom of the plate body is also provided with the heat dissipation component, and when the heat dissipation component rotates, cold air can be blown to the plate body or the heat of the plate body can be emitted;

The heat of the board body can be efficiently reduced through the cooperation of the water cooling component and the heat radiating component, the water cooling is embedded in the board body, the external space of the circuit board is not required to be additionally occupied, the miniaturization and the compactness of the structure are realized, the installation and the layout of the circuit board in a limited space are facilitated, and the overall integration level and the aesthetic degree of the electronic equipment are improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a heat dissipation structure of an embedded heat pipe of a circuit board according to an embodiment of the present utility model;

fig. 2 is an enlarged view of a portion a of fig. 1;

FIG. 3 is a schematic view of the sectional B-B structure of FIG. 1;

Fig. 4 is an enlarged view of a portion C of fig. 3;

FIG. 5 is a schematic view of a water cooling module according to an embodiment of the present utility model.

Reference numerals illustrate:

1. the plate body, 2, the water-cooling assembly, 3, the heat dissipating assembly;

201. The device comprises a pipeline, a 202, a miniature water pump, 203, graphite sheets, 204 and a first heat-conducting double faced adhesive tape;

301. heat dissipation tooth, 302, heat dissipation fan, 303, second heat conduction double faced adhesive tape.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present utility model and should not be construed as limiting the utility model, and all other embodiments, based on the embodiments of the present utility model, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following describes a circuit board embedded heat pipe heat dissipation structure according to an embodiment of the present utility model in detail with reference to the accompanying drawings.

Referring to fig. 1-5, in the embodiment, the cooling device comprises a plate body 1, a water cooling component 2, a heat dissipation component 3, a heat dissipation component 2, a heat dissipation component 3 and a heat dissipation component 3, wherein the middle part of the plate body 1 is provided with a cavity, the water cooling component 2 is arranged in the cavity, the water cooling component 2 is filled with a heat dissipation medium, the heat dissipation medium can circulate in the cavity so as to be suitable for reducing the heat of the plate body 1, the heat dissipation component 3 is arranged at the bottom of the plate body 1, the heat dissipation component 3 can rotate at the bottom of the plate body 1 so as to be suitable for radiating the heat of the plate body 1, when the plate body 1 works, the heat dissipation medium in the water cooling component 2 circulates in the cavity, the heat radiated by the plate body 1 is reduced through the circulating heat dissipation medium, and the bottom of the plate body 1 is also provided with the heat dissipation component 3, and when the heat dissipation component 3 rotates, the plate body 1 can blow cold air or radiate the heat;

The heat of the board body 1 can be efficiently reduced through the cooperation of the water cooling component 2 and the heat radiating component 3, the water cooling is embedded in the board body 1, the external space of the circuit board is not required to be additionally occupied, the miniaturization and the compactness of the structure are realized, the installation and the layout of the circuit board in a limited space are facilitated, and the overall integration level and the aesthetic degree of the electronic equipment are improved.

In the embodiment, the water cooling assembly 2 comprises a pipeline 201, wherein the pipeline 201 is paved in a cavity, a micro water pump 202 is communicated with a water outlet and a water inlet of the pipeline 201, a heat dissipation medium flows in the pipeline 201, the water pump drives the heat dissipation medium to circulate in the pipeline 201, so that the temperature of the plate body 1 can be effectively reduced, the pipeline 201 is covered in the cavity, the heat dissipation area is greatly increased, heat can be quickly conducted and taken away through the heat dissipation medium, the heat dissipation efficiency is improved, the heat dissipation medium in the pipeline 201 can continuously and stably transfer the heat, the problem of uneven heat dissipation caused by the change of the rotation speed of a fan is avoided, and the stable operation of the circuit board is ensured.

In the embodiment, the cavity is filled with the graphite sheets 203, the height of the graphite sheets 203 is level with the height of the pipeline 201, and the graphite sheets 203 can effectively and uniformly disperse heat and transfer the heat to the pipeline 201, so that the temperature of the plate body 1 is reduced rapidly.

In this embodiment, the top, bottom and bottom of the graphite sheet 203 and the bottom and bottom of the pipeline 201 are coated with the first heat-conducting double-sided tape 204, and the first heat-conducting double-sided tape 204 can fill the gaps between the top, bottom and cavity of the graphite sheet 203 and the gaps between the bottom and cavity of the pipeline 201, and effectively conduct heat from the plate body 1 to the pipeline 201, so as to improve heat dissipation efficiency, and can also transfer heat to the heat dissipation component 3 at the bottom of the plate body 1, so that the heat dissipation component 3 and the water cooling component 2 can dissipate heat for the plate body 1 at the same time.

In this embodiment, the heat dissipation assembly 3 includes heat dissipation teeth 301, wherein the heat dissipation teeth 301 are disposed at the bottom of the plate body 1, heat dissipation fans 302, wherein the heat dissipation fans 302 are disposed at the bottom of the heat dissipation teeth 301, and heat at the bottom of the plate body 1 is conducted to the heat dissipation teeth 301 and then dissipated through the heat dissipation fans 302, so that the water cooling assembly 2 is assisted to jointly dissipate heat of the plate body 1, and therefore the plate body 1 cannot be disabled due to overheating during working.

In the embodiment, a second heat-conducting double-sided adhesive tape 303 is coated between the heat-radiating teeth 301 and the plate body 1, and the plate body 1 effectively conducts heat from the plate body 1 to the heat-radiating teeth 301 through the second heat-conducting double-sided adhesive tape 303, so that the heat-radiating efficiency of the plate body 1 is improved.

In the embodiment, the heat dissipation medium is made of deionized purified water or glycol, and the purified water is a good heat dissipation medium with high specific heat capacity and can effectively absorb and conduct heat. Meanwhile, pure water is relatively low in price and environment-friendly and pollution-free, ethylene glycol is a common cooling liquid component, has excellent heat conduction performance and freezing resistance, can operate in extremely cold environment, and has anti-corrosion and antibacterial properties.

In this embodiment, a filter screen may be disposed at the bottom of the heat dissipation fan 302, so that the filter screen may prevent impurities such as dust from adhering to the heat dissipation fan 302, thereby ensuring that the heat dissipation fan 302 can work stably.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (9)

1. A circuit board embedded heat pipe heat dissipation structure, characterized in that it includes: A plate body, wherein a cavity is provided in the middle of the plate body; A water-cooling assembly is disposed within the cavity and is filled with a heat dissipation medium that is circulated within the cavity to reduce the heat of the plate. A heat dissipation component is disposed at the bottom of the plate and is rotatable at the bottom of the plate to dissipate the heat of the plate. 2. The circuit board embedded heat pipe heat dissipation structure according to claim 1, wherein the water cooling component comprises: A pipe, which is laid within the cavity; A miniature water pump, wherein the miniature water pump is connected to the outlet and inlet of the pipeline. 3. The circuit board embedded heat pipe heat dissipation structure according to claim 1, wherein the heat dissipation medium flows within the pipe. 4. The circuit board embedded heat pipe heat dissipation structure according to claim 1, characterized in that the cavity is filled with graphite sheets, and the height of the graphite sheets is flush with the height of the pipe. 5. The circuit board embedded heat pipe heat dissipation structure according to claim 3, wherein the top and bottom of the graphite sheet and the bottom and bottom of the pipe are all coated with a first thermally conductive double-sided adhesive. 6. The circuit board embedded heat pipe heat dissipation structure according to claim 1, wherein the heat dissipation component comprises: Heat dissipation teeth are provided at the bottom of the plate. A cooling fan is located at the bottom of the cooling fins. 7. The circuit board embedded heat pipe heat dissipation structure according to claim 1, characterized in that a second thermally conductive double-sided adhesive is coated between the heat dissipation teeth and the board body. 8. The circuit board embedded heat pipe heat dissipation structure according to claim 1, wherein the heat dissipation medium is made of deionized pure water or ethylene glycol. 9. The circuit board embedded heat pipe heat dissipation structure according to claim 1, wherein a filter screen may be provided at the bottom of the heat dissipation fan.