Heat radiation structure of heavy-current battery
Technical Field
The utility model relates to the technical field of batteries, in particular to a heat dissipation structure of a high-current battery.
Background
With the increasing popularity of energy storage markets, energy storage battery products are developing to large capacity, the capacity is increased, the battery charge and discharge flows are increased, and the problem of battery heat dissipation is highlighted. Currently, battery products in the market are limited by the heat dissipation capability of the BMS, the battery current is mostly below 150A, the battery charge and discharge power is small, a user side often needs to purchase a plurality of groups of batteries and connect the batteries together to increase the total charge and discharge battery and power, and the user cost is increased.
Some batteries in the market do not conduct heat dissipation design aiming at BMS, charge and discharge Chi Xiao, and some batteries conduct heat dissipation by adopting a liquid cooling scheme in order to achieve high-current charge and discharge, so that heat dissipation performance is improved, but cost is high, and structure is complex.
Disclosure of utility model
In order to solve the problems, the utility model adopts the following technical scheme that the high-current battery heat dissipation structure comprises a chassis, a BMS plate, a fixed bracket, a radiator and a cover plate;
The top of the case is provided with a placing groove, the BMS plate is arranged in the placing groove, the fixing support is arranged in the placing groove, the radiator is arranged on the fixing support, and the radiator is abutted with the BMS plate;
The cover plate is arranged on the case, and the cover plate movably covers the placing groove.
Further, the BMS board is fixed in the placement groove by bolts.
Further, a gap is formed in the BMS board, and the MOSFET module on the BMS board is located in the gap.
Further, the heat conducting pad is arranged in the notch, one side of the heat conducting pad is abutted with the MOSFET module, and the other side of the heat conducting pad is abutted with the radiator.
Further, a plurality of first screw holes are formed in the fixing support, a second screw hole is formed in the radiator, each first screw hole is movably communicated with one second screw hole, a plurality of screws are detachably arranged on the fixing support, and each screw penetrates through one second screw hole and then is in threaded connection with one first screw hole.
Further, a fin structure is provided at a side of the heat sink away from the BMS plate, the fin structure facing the cap plate.
Further, the radiator is made of aluminum profiles.
Further, the cover plate is fixed on the chassis through screws.
Further, a shutter is arranged on the cover plate and used for realizing circulation heat exchange between the air outside the case and the radiator.
Further, the heat conducting pad is a silica gel pad.
The high-current battery heat dissipation structure has the beneficial effects that the high-current battery heat dissipation structure is used, the case, the BMS plate, the fixing support, the radiator and the cover plate are integrally matched and installed, the structure is simple, the cost is low, heat generated by the battery in high-current charging and discharging operation can be effectively conducted into the air, the operation temperature of the whole battery is reduced, the reliability of the battery is improved, and the service life of the battery is prolonged. Meanwhile, the number of the plurality of groups of batteries needed to be purchased by a user is reduced, the parallel operation is performed, the current is increased, and the use cost is saved.
Drawings
The utility model is further illustrated by the accompanying drawings, which are not to be construed as limiting the utility model in any way.
Fig. 1 is a schematic diagram illustrating a direction of a heat dissipation structure of a high-current battery according to an embodiment;
fig. 2 is a schematic explosion diagram of a direction of a heat dissipation structure of a high-current battery according to an embodiment.
Detailed Description
The technical solution of the present utility model will be further described below with reference to the accompanying drawings of the embodiments of the present utility model, and the present utility model is not limited to the following specific embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
As shown in fig. 1 to 2, the high-current battery heat dissipation structure comprises a case 100, a BMS board 200, a fixing support 300, a radiator 400 and a cover plate 500, wherein a placement groove 110 is formed in the top of the case 100, the BMS board 200 is arranged in the placement groove 110, the fixing support 300 is arranged in the placement groove 110, the radiator 400 is arranged on the fixing support 300 and is in contact with the BMS board 200, the cover plate 500 is arranged on the case 100, and the cover plate 500 movably covers the placement groove 110.
Specifically, the BMS board 200 is fixed in the placement groove 110 by bolts. The BMS board 200 is provided with a notch 210, and the MOSFET module 220 on the BMS board 200 is located at the notch 210. Further, the high-current battery heat dissipation structure further includes a heat conduction pad 600, wherein the heat conduction pad 600 is disposed in the notch 210, and one side of the heat conduction pad 600 is abutted to the MOSFET module 220, and the other side is abutted to the heat sink 400.
In one embodiment, the fixing bracket 300 is provided with a plurality of first screw holes, the heat sink 400 is provided with a second screw hole, each first screw hole is movably communicated with one second screw hole, and the fixing bracket 300 is detachably provided with a plurality of screws, each screw passes through one second screw hole and then is screwed with one first screw hole. The side of the heat sink 400 remote from the BMS plate 200 is provided with a fin structure facing the cap plate 500. The heat sink 400 is made of aluminum profile. The cover 500 is fixed to the cabinet 100 by screws 510. It should be noted that, the cover plate 500 is provided with a louver 520, and the louver 520 is used to exchange heat between the air outside the chassis 100 and the radiator 400. The thermal pad 600 is a silica gel pad.
When mounted, firstly, the BMS board 200 is fixed in the placement groove 110 of the case 100 by bolts, and the fixing brackets 300 are mounted on four inner sidewalls of the placement groove 110 and located at the outer sides of the entire BMS board 200. At this time, the notch 210 opened in the BMS board 200 is upwardly facing, and the MOSFET module 220 is placed in the region of the notch 210 due to a large heat generation amount during operation, and then the heat conduction pad 600 is padded, and the heat sink 400 is fixed to the fixing bracket 300. That is, by placing the heat conductive pad 600 to fill the gap between the heat sink 400 and the notch 210 on the BMS board 200, that is, other areas on the BMS board 200 are directly abutted against the heat sink 400 except for the region of the notch 210, which is required by using the heat conductive pad 600. That is, when the battery is operated with a large current, the heat generated by the MOSFET module 220 is conducted to the heat sink 400, and since the heat sink 400 is made of an aluminum profile and is provided with a fin structure, the surface area of the heat sink 400 is significantly increased, which is advantageous for radiating the heat into the air by natural convection and radiation. Further, since the fin structure of the heat sink 400 faces upward, i.e., toward the cover plate 500, the flow diffusion of the hot gas is more facilitated. It should be noted that, by arranging the louver 520 on the cover plate 500, on one hand, the circulation heat exchange between the outside of the chassis 100 and the radiator 400 can be realized, thereby diffusing the hot air of the radiator 400 to the outside of the chassis 100, and on the other hand, dust impurities in the air are not easy to directly drop onto the radiator 400, thereby influencing the heat dissipation performance of the radiator 400, and the long-time heat dissipation performance of the heat dissipation structure is effectively ensured.
In summary, the above-described embodiments are not intended to be limiting embodiments of the present utility model, and modifications and equivalent variations, which are within the spirit and scope of the present utility model, will be within the technical scope of the present utility model.