CN223741028U - Semiconductor refrigeration module - Google Patents
Semiconductor refrigeration moduleInfo
- Publication number
- CN223741028U CN223741028U CN202520133246.XU CN202520133246U CN223741028U CN 223741028 U CN223741028 U CN 223741028U CN 202520133246 U CN202520133246 U CN 202520133246U CN 223741028 U CN223741028 U CN 223741028U
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- semiconductor refrigeration
- refrigeration module
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Abstract
本实用新型公开了一种半导体制冷模块，包括：外壳，其内设有两个风道，风道的两端分别设有进风口和排风口，两个风道之间设有隔板，隔板设有第一通孔；风机组件，包括两个叶轮以及设于两个叶轮之间的双头电机，两个叶轮分别设于两个风道内，双头电机用于驱动两个叶轮；制冷组件，包括设于第一通孔内的制冷片，制冷片的两侧均触接有散热器，两个散热器分别设于两个风道内。使用时，制冷片的一侧吸收热量，另一侧释放热量，双头电机能驱动两个叶轮转动，促进两个风道内空气的流动，使其中一个风道送出冷风，达到制冷的目的，另一个风道送出热风以进行散热；仅需要设置一个双头电机，结构简单，成本较低，有利于半导体制冷模块的推广使用。
This utility model discloses a semiconductor cooling module, comprising: a housing with two air ducts inside, each with an air inlet and an air outlet at its ends, and a partition with a first through hole between the two air ducts; a fan assembly including two impellers and a dual-head motor disposed between the two impellers, the two impellers being respectively disposed within the two air ducts, and the dual-head motor driving the two impellers; and a cooling assembly including a cooling plate disposed within the first through hole, with heat sinks contacting both sides of the cooling plate, and two heat sinks being respectively disposed within the two air ducts. In use, one side of the cooling plate absorbs heat, and the other side releases heat. The dual-head motor drives the two impellers to rotate, promoting airflow within the two air ducts, causing one air duct to deliver cold air for cooling, and the other air duct to deliver hot air for heat dissipation. Only one dual-head motor is required, resulting in a simple structure and low cost, which is beneficial for the widespread use of semiconductor cooling modules.
Description
Technical Field
The utility model relates to the technical field of refrigeration, in particular to a semiconductor refrigeration module.
Background
The semiconductor refrigeration module has the advantages of small volume, silence, no vibration and the like, and is very suitable for being applied to portable small refrigeration equipment. However, the existing semiconductor refrigeration module needs to be provided with fans on both the heat radiation side and the refrigeration side, which results in a relatively complex structure and relatively high cost of the semiconductor refrigeration module, which restricts the popularization and use of the semiconductor refrigeration module.
Disclosure of utility model
The present utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a semiconductor refrigeration module.
According to an embodiment of the utility model, a semiconductor refrigeration module includes:
The air conditioner comprises a shell, wherein two air channels are arranged in the shell, an air inlet and an air outlet are respectively arranged at two ends of each air channel, a partition plate is arranged between the two air channels, and the partition plate is provided with a first through hole;
the fan assembly comprises two impellers and a double-headed motor arranged between the two impellers, the two impellers are respectively arranged in the two air channels, and the double-headed motor is used for driving the two impellers;
The refrigerating assembly comprises a refrigerating sheet arranged in the first through hole, two sides of the refrigerating sheet are respectively contacted with a radiator, and the two radiators are respectively arranged in the two air channels.
The semiconductor refrigeration module at least has the following technical effects that when the semiconductor refrigeration module is used, one side of the refrigeration piece absorbs heat, the other side releases heat, the double-headed motor can drive the two impellers to rotate, the flow of air in the two air channels is promoted, one air channel is enabled to send cold air to achieve the purpose of refrigeration, the other air channel is enabled to send hot air to dissipate heat, and the semiconductor refrigeration module is simple in structure and low in cost, and is beneficial to popularization and use of the semiconductor refrigeration module.
According to some embodiments of the utility model, the separator comprises two insulation layers and a carcass layer disposed between the two insulation layers.
According to some embodiments of the utility model, the carcass layer is a plastic member.
According to some embodiments of the utility model, the thermal insulation layer is thermal insulation cotton.
According to some embodiments of the utility model, one of the heat insulation layers is provided with an avoidance hole, and the main body of the double-headed motor is arranged in the avoidance hole and connected with the framework layer.
According to some embodiments of the utility model, the partition board is transversely arranged, the two air channels are respectively arranged on the upper side and the lower side of the partition board, the two impellers are centrifugal impellers, and the axial direction of the double-headed motor and the axial direction of the two impellers are vertical.
According to some embodiments of the utility model, a heat insulation ring is arranged in the first through hole, the heat insulation ring is sleeved between the inner wall of the first through hole and the refrigerating sheet, and the heat insulation ring is arranged between the two radiators.
According to some embodiments of the utility model, the housing includes a bottom case and an upper cover provided on an upper side of the bottom case, the upper cover and the bottom case are detachably connected, and the partition is provided between the upper cover and the bottom case.
According to some embodiments of the utility model, the semiconductor refrigeration module further comprises an annular mounting flange, the mounting flange is sleeved on the outer side of the shell, the shell is provided with an annular convex edge, and the mounting flange is detachably connected with the convex edge.
According to some embodiments of the utility model, the convex edge is disposed on the bottom shell, and the horizontal projection of the upper cover is disposed on the inner side of the mounting flange.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
Fig. 1 is a schematic perspective view of a semiconductor refrigeration module according to an embodiment of the present utility model;
Fig. 2 is a schematic cross-sectional structure of a semiconductor refrigeration module according to an embodiment of the present utility model;
fig. 3 is an exploded view of a semiconductor refrigeration module according to an embodiment of the present utility model;
In the accompanying drawings:
101-upper cover, 102-bottom shell, 103-air inlet, 104-air outlet, 110-mounting flange, 111-convex edge, 120-partition board, 121-heat insulation layer, 122-framework layer, 200-double-headed motor, 210-impeller, 300-refrigerating sheet, 310-radiator and 320-heat insulation ring.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, only for convenience of description and simplification of the description, and are not intended to indicate that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Further, the meaning of a plurality is one or more, and the meaning of a plurality is two or more, and greater than, less than, exceeding, etc. is understood to exclude the present number, and the meaning of above, below, within, etc. is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
A semiconductor refrigeration module according to an embodiment of the present utility model is described below with reference to fig. 1 to 3.
The semiconductor refrigeration module comprises a shell, a fan assembly and a refrigeration assembly.
The shell is internally provided with two air channels, which are respectively called an upper channel and a lower channel, the upper channel is arranged on the upper side of the lower channel, the two ends of the air channels are respectively provided with an air inlet 103 and an air outlet 104, the two air channels are respectively provided with the air inlet 103 and the air outlet 104, the air inlet 103 of the upper channel is positioned at the left end of the air channel, the air outlet 104 of the upper channel is positioned at the right end of the air channel, the air inlet 103 of the lower channel is positioned at the left end of the air channel, the air outlet 104 of the lower channel is positioned at the right end of the air channel, a partition 120 is arranged between the two air channels, the partition 120 is the bottom wall of the upper channel, the partition 120 is the top wall of the lower channel, the partition 120 is provided with a first through hole, and the first through hole vertically penetrates the partition 120.
The fan assembly is used for promoting the flow of air in two air channels, the fan assembly comprises two impellers 210 and a double-headed motor 200 arranged between the two impellers 210, the double-headed motor 200 is provided with two output shafts for driving two independent loads, in general, the two output shafts of the double-headed motor 200 are mutually separated and coaxial, the double-headed motor 200 is a conventional component in the field and can be directly purchased, the specific structure of the double-headed motor 200 is not repeated herein, the two impellers 210 are respectively arranged in the two air channels, the two output shafts of the double-headed motor 200 are respectively connected with the two impellers 210, the double-headed motor 200 is used for driving the two impellers 210, the two impellers 210 are respectively called an upper wheel and a lower wheel, the upper wheel is arranged in the upper channel, and the lower wheel is arranged in the lower channel.
The refrigeration assembly comprises a refrigeration piece 300 arranged in a first through hole, the refrigeration piece 300 is transversely arranged, two sides of the refrigeration piece 300 are respectively contacted with a radiator 310, two radiators 310 are respectively abutted to the upper side and the lower side of the refrigeration piece 300, and the two radiators 310 are respectively arranged in two air channels.
When the refrigerator is used, one side of the refrigerating sheet 300 absorbs heat, the other side releases heat, the double-headed motor 200 can drive the two impellers 210 to rotate, the flow of air in the two air channels is promoted, one air channel is enabled to send cold air to achieve the purpose of refrigeration, the other air channel is enabled to send hot air to dissipate heat, only one double-headed motor is needed, the refrigerator is simple in structure and low in cost, popularization and use of a semiconductor refrigerating module are facilitated, in addition, the two radiators 310 are directly contacted with the refrigerating sheet 300, additional heat conducting components are not needed, assembly procedures are simplified, cost is saved, and heat transfer efficiency is improved to improve energy efficiency.
In some embodiments of the utility model, the separator 120 includes two insulating layers 121 and a carcass layer 122 disposed between the two insulating layers 121. The heat transfer between the two air channels can be blocked so as to improve the refrigerating effect, and the partition plate 120 is high in strength, not easy to damage and convenient to assemble and maintain.
In some embodiments of the present utility model, the carcass layer 122 is a plastic member. Thus, the cost is lower, and the production and the manufacture are easy.
In some embodiments of the utility model, the insulating layer 121 is insulating cotton. The heat-insulating cotton has low price, is easy to install and cut, and is suitable for being used as the heat-insulating layer 121.
In some embodiments of the present utility model, one of the insulating layers 121 is provided with a relief hole, and the main body of the double-headed motor 200 is disposed in the relief hole and connected to the carcass layer 122. The two heat insulation layers 121 are respectively referred to as an upper cotton layer and a lower cotton layer, the upper cotton layer and the lower cotton layer are respectively arranged on the upper side and the lower side of the framework layer 122, the avoidance holes are arranged on the lower cotton layer, referring to fig. 2, the main body of the double-headed motor 200 is arranged on the lower side of the framework layer 122, one output shaft of the double-headed motor 200 extends upwards and penetrates through the framework layer 122 and the upper cotton layer to be connected with an upper wheel, and the other output shaft of the double-headed motor 200 extends downwards and is connected with a lower wheel. The main body of the double-headed motor 200 is arranged on the framework layer 122, so that the structure is stable and is not easy to loosen and fall off.
In some embodiments of the present utility model, the partition 120 is disposed transversely, and two air channels are disposed on the upper side and the lower side of the partition 120, respectively, and the two impellers 210 are centrifugal impellers 210, and the axial direction of the double-headed motor 200 and the axial direction of the two impellers 210 are vertical. Referring to fig. 3, the upper channel extends from left to right, the air inlet 103 of the upper channel is arranged on the top wall of the shell and above the upper wheel, the radiator 310 in the upper channel is arranged on the right side of the upper wheel, the air outlet 104 of the upper channel is arranged on the right end of the upper channel, the lower channel extends from left to right, the air inlet 103 of the lower channel is arranged on the lower wall of the shell and below the lower wheel, the radiator 310 in the lower channel is arranged on the right side of the lower wheel, and the air outlet 104 of the lower channel is arranged on the right end of the lower channel.
In some embodiments of the present utility model, a heat insulation ring 320 is disposed in the first through hole, the heat insulation ring 320 is sleeved between the inner wall of the first through hole and the cooling fin 300, and the heat insulation ring 320 is disposed between the two heat sinks 310. The two heat insulation layers 121 have a certain thickness to achieve a better heat insulation effect, so that the overall thickness dimension of the partition board 120 is larger than the thickness dimension of the refrigerating sheet 300, therefore, in the embodiment, the upper cotton layer is sleeved outside the radiator 310 in the upper channel, the lower cotton layer is sleeved outside the radiator 310 in the lower channel, so that the radiator 310 can be compactly attached to the refrigerating sheet 300, in addition, in order to achieve a better heat dissipation effect, the front-back dimension and the transverse dimension of the radiator 310 are larger than those of the refrigerating sheet 300, the edge of the radiator 310 protrudes out of the edge of the refrigerating sheet 300, so that a cavity is reserved between the two radiators 310, which is not beneficial to blocking heat transfer between the two radiators 310, and the embodiment achieves the purpose of blocking heat transfer between the two radiators 310 by arranging the heat insulation ring 320.
In some embodiments of the present utility model, the housing includes a bottom case 102 and an upper cover 101 disposed on an upper side of the bottom case 102, the upper cover 101 and the bottom case 102 are detachably connected, and a partition 120 is disposed between the upper cover 101 and the bottom case 102. The upper cover 101 and the bottom shell 102 can be connected through bolts, so that the upper cover 101 and the bottom shell 102 are convenient to disassemble and assemble, and of course, the upper cover 101 and the bottom shell 102 can be detachably connected through clamping, threaded connection or a proper gas mode.
In some embodiments of the present utility model, the semiconductor refrigeration module further includes an annular mounting flange 110, and referring to fig. 1, the mounting flange 110 is sleeved on the outer side of the housing, the housing is provided with an annular flange 111, and the mounting flange 110 is detachably connected with the flange 111. When the semiconductor refrigeration module is used, the mounting flange 110 and the convex edge 111 can be connected through bolts, the mounting hole can be formed in the wall of the container needing refrigeration, the mounting flange 110 and the shell can be detached, the shell is placed into the mounting hole, the edge of the mounting hole is located between the mounting flange 110 and the convex edge 111, and then the mounting flange 110 is connected with the convex edge 111, so that the semiconductor refrigeration module is mounted on the container needing refrigeration.
In some embodiments of the present utility model, the flange 111 is disposed on the bottom case 102, and the horizontal projection of the upper cover 101 is disposed on the inner side of the mounting flange 110. In this way, the mounting flange 110 and the upper cover 101 are not mutually affected, and the upper cover 101 can be removed for checking and maintaining the fan assembly and the refrigeration assembly without removing the mounting flange 110.
While the preferred embodiment of the present utility model has been illustrated and described, the present utility model is not limited to the embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the present utility model, and these equivalent modifications and substitutions are intended to be included in the scope of the present utility model as defined in the appended claims.
Claims (10)
1. A semiconductor refrigeration module, comprising:
The air conditioner comprises a shell, wherein two air channels are arranged in the shell, an air inlet and an air outlet are respectively arranged at two ends of each air channel, a partition plate is arranged between the two air channels, and the partition plate is provided with a first through hole;
the fan assembly comprises two impellers and a double-headed motor arranged between the two impellers, the two impellers are respectively arranged in the two air channels, and the double-headed motor is used for driving the two impellers;
The refrigerating assembly comprises a refrigerating sheet arranged in the first through hole, two sides of the refrigerating sheet are respectively contacted with a radiator, and the two radiators are respectively arranged in the two air channels.
2. The semiconductor refrigeration module as set forth in claim 1, wherein the separator includes two heat insulating layers and a skeletal layer disposed between the two heat insulating layers.
3. The semiconductor refrigeration module as set forth in claim 2, wherein said skeletal layer is a plastic member.
4. The semiconductor refrigeration module as set forth in claim 2, wherein the heat insulating layer is heat insulating cotton.
5. The semiconductor refrigeration module as set forth in claim 2, wherein one of the heat insulating layers is provided with an escape hole, and the main body of the double-ended motor is provided in the escape hole and connected to the skeleton layer.
6. The semiconductor refrigeration module as set forth in claim 1, wherein said partition plate is disposed transversely, said two air channels are disposed on the upper and lower sides of said partition plate, respectively, said two impellers are centrifugal impellers, and the axial direction of said double-ended motor and the axial direction of said two impellers are vertical.
7. The semiconductor refrigeration module as set forth in claim 1, wherein a heat insulating ring is disposed in the first through hole, the heat insulating ring is sleeved between the inner wall of the first through hole and the cooling fin, and the heat insulating ring is disposed between the two heat sinks.
8. The semiconductor refrigeration module according to claim 1, wherein the housing includes a bottom case and an upper cover provided on an upper side of the bottom case, the upper cover and the bottom case are detachably connected, and the partition is provided between the upper cover and the bottom case.
9. The semiconductor refrigeration module as set forth in claim 8, further comprising an annular mounting flange, wherein the mounting flange is disposed around the outer side of the housing, and wherein the housing is provided with an annular flange, and wherein the mounting flange is detachably connected to the flange.
10. The semiconductor refrigeration module as set forth in claim 9, wherein said flange is provided on said bottom shell and a horizontal projection of said upper cover is provided on an inner side of said mounting flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520133246.XU CN223741028U (en) | 2025-01-20 | 2025-01-20 | Semiconductor refrigeration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520133246.XU CN223741028U (en) | 2025-01-20 | 2025-01-20 | Semiconductor refrigeration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223741028U true CN223741028U (en) | 2025-12-30 |
Family
ID=98170337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520133246.XU Active CN223741028U (en) | 2025-01-20 | 2025-01-20 | Semiconductor refrigeration module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223741028U (en) |
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2025
- 2025-01-20 CN CN202520133246.XU patent/CN223741028U/en active Active
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