CN223735078U - A die-cutting apparatus for processing and cutting circuit board substrates. - Google Patents

Abstract

This utility model relates to the field of circuit board processing technology, specifically a die-cutting device for processing and cutting circuit board substrates. It includes: a base plate, a support plate fixedly mounted on the base plate, a cylinder fixedly mounted on the support plate, the cylinder's output end passing through the upper end of the support plate and fixedly connected to an upper die holder, and a die-cutting blade fixedly mounted at the bottom end of the upper die holder; a processing groove is provided on a lower die holder, which is mounted on a mounting base via connecting components and auxiliary components. The mounting base is fixedly mounted on the base plate, and its sidewall is engaged with the support plate; by moving the mounting plate along the mounting groove until the slider engages with the limiting plate, the moving plate inserts into the slot to fix the mounting plate, facilitating the rotation of the lower die holder. The die-cut circuit board substrates in the lower die holder are then poured into a collection box for centralized collection. The operation is simple, providing convenience for operators in collecting circuit board substrates, thereby improving the processing efficiency of circuit board substrate cutting boards.

Description

Die cutting device for processing and cutting circuit board substrate

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a die cutting device for processing and cutting a circuit board substrate.

Background

The Chinese patent document with the prior bulletin number of CN220922692U discloses a punching die for processing a flexible circuit board, which comprises a base and a mounting seat, wherein a supporting plate is fixedly connected to one side of the top of the base. The circuit board cutting machine has the advantages that when the circuit board is cut, the telescopic air cylinder is started to push the upper die holder to descend, the upper die holder enables the cutter to descend to cut the circuit board in the processing groove, the upper die holder can enable the upper die holder to stably cut the circuit board in a lifting manner through the limiting frame fixedly connected with the top, the operation is convenient and time-saving, the control rod is pulled by the rotating rod through the handle, the positioning block is contracted to the inside of the sliding groove, the lower die holder is pulled to one side of the mounting seat, the circuit board is placed in the processing groove and then pushed to the lower die holder, the spring can push the positioning block to be inserted in the positioning groove, the lower die holder can be pulled out, the circuit board in the processing groove can be placed or taken out conveniently by a worker, and the worker and the cutter can be prevented from being too close to influence on the safety of the worker.

However, in the above scheme and the prior art, after die cutting processing of the circuit board substrate, the lower die holder is pulled out from the mounting seat to manually pick up and collect the circuit board substrate, so that the operation is inconvenient, the time consumption is long, and the processing efficiency of the subsequent circuit board substrate cutting board is affected.

Disclosure of utility model

The utility model aims to provide a die cutting device for processing and cutting a circuit board substrate, so as to solve the problems in the background art.

In order to achieve the above purpose, the utility model provides a die cutting device for processing and cutting a circuit board substrate, comprising:

The bottom plate is fixedly provided with a supporting plate, the supporting plate is fixedly provided with a cylinder, the output end of the cylinder penetrates through the upper end of the supporting plate and is fixedly connected with the upper die seat, the bottom end of the upper die seat is fixedly provided with a die cutter, a groove is formed in the bottom plate, and a collecting box is inserted into the groove;

The die comprises a die holder, wherein a processing groove is formed in the die holder, the die holder is arranged on a mounting seat through a connecting component and an auxiliary component, the mounting seat is fixedly arranged on a bottom plate, and the side wall of the mounting seat is clamped with a supporting plate.

Preferably, the mounting groove in the connecting assembly is formed in the mounting seat, sliding grooves are symmetrically formed in two side walls of the mounting groove, limiting plates are fixedly arranged at the end parts of the sliding grooves, the lower die holder is rotatably arranged on the mounting plate, and the mounting plate is movably clamped with the mounting groove.

Preferably, the two side walls of the mounting plate are symmetrically and fixedly provided with sliding blocks, the sliding blocks are movably clamped in the sliding grooves, and the sliding blocks are clamped with the limiting plates.

Preferably, the mounting plate is provided with a straight groove, the bottom end of the lower die holder is fixedly provided with a connecting plate, the connecting plate is movably arranged in the straight groove, two ends of the connecting plate are symmetrically and fixedly provided with convex plates, and the convex plates are movably clamped with the sliding grooves.

Preferably, the trapezoid groove in the auxiliary assembly is formed in the side wall of the mounting seat, the trapezoid block is movably clamped in the trapezoid groove, the movable plate is fixedly arranged on the side wall of the trapezoid block, and the movable plate is clamped with the mounting plate.

Preferably, the movable plate is provided with a clamping groove, the rotary plate is rotatably arranged on the side wall of the mounting seat, the rotary plate is in clamping connection with the clamping groove, the slot is arranged on the side wall of the mounting plate, and the movable plate is in plugging connection with the slot.

Compared with the prior art, the utility model has the beneficial effects that:

Through removing the mounting panel along the mounting groove, until the slider makes the fixed mounting panel's in the slot position of pegging graft with limiting plate joint back for the movable plate, the die cutting processing good circuit board base plate in the die holder is once only poured into the collecting box and is accomplished concentrated the collection, easy and simple to handle, it is convenient to collect circuit board base plate for operating personnel, and then improves circuit board base cutting board machining efficiency.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is an enlarged view of a portion of FIG. 1 in accordance with the present utility model;

FIG. 3 is a schematic view of a mounting base according to the present utility model;

FIG. 4 is a schematic view of a mounting plate according to the present utility model;

fig. 5 is a schematic diagram of a moving plate structure according to the present utility model.

In the figure, a bottom plate 1, a supporting plate 2, an air cylinder 3, an upper die seat 4, a die cutter 5, a groove 6, a collecting box 7, a lower die seat 8, a processing groove 9, a mounting seat 10, a mounting groove 11, a sliding groove 12, a limiting plate 13, a mounting plate 14, a sliding block 15, a straight groove 16, a connecting plate 17, a convex plate 18, a trapezoid groove 19, a trapezoid block 20, a moving plate 21, a slot 22, a clamping groove 23 and a rotating plate 24 are arranged.

Detailed Description

In order to make the objects, technical solutions, and advantages of the present utility model more apparent, the embodiments of the present utility model will be further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some, but not all, embodiments of the present utility model, are intended to be illustrative only and not limiting of the embodiments of the present utility model, and that all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.

Referring to fig. 1-5, the present utility model provides two preferred embodiments:

The die cutting device for processing and cutting the circuit board substrate comprises a bottom plate 1, a supporting plate 2 is fixedly arranged on the bottom plate 1, an air cylinder 3 is fixedly arranged on the supporting plate 2, the output end of the air cylinder 3 penetrates through the upper end of the supporting plate 2 and is fixedly connected with an upper die holder 4, a die cutter 5 is fixedly arranged at the bottom end of the upper die holder 4, a groove 6 is formed in the bottom plate 1, a collecting box 7 is inserted and arranged in the groove 6, a lower die holder 8 is arranged on the lower die holder 8 and is provided with a processing groove 9, the lower die holder 8 is arranged on a mounting seat 10 through a connecting component and an auxiliary component, the mounting seat 10 is fixedly arranged on the bottom plate 1, the side walls of the mounting seat 10 are clamped with the supporting plate 2, a mounting groove 11 in the connecting component is formed in the mounting seat 10, sliding grooves 12 are symmetrically formed in the two side walls of the mounting groove 11, limiting plates 13 are fixedly arranged at the end parts of the sliding grooves 12, the lower die holder 8 are rotatably arranged on the mounting plate 14 and the mounting groove 11, sliding blocks 15 are symmetrically and fixedly arranged on the two side walls of the mounting plate 14, the sliding blocks 15 are movably clamped in the sliding grooves 12, the sliding blocks 15 are movably clamped and are arranged on the sliding grooves 13, the sliding blocks 13 are clamped with the limiting plates 13, the side walls 16 are symmetrically arranged on the mounting plate 14 and the two side walls are movably arranged in the sliding grooves, the sliding blocks 17 are fixedly arranged at the sliding blocks, the sliding blocks 17 are fixedly arranged at the end faces 17, the sliding blocks are fixedly arranged respectively, and the sliding blocks are fixedly arranged respectively, the sliding grooves 17 are fixedly arranged respectively, and are fixedly connected with the sliding grooves 18, and are fixedly arranged respectively.

When the circuit board substrate is used, the circuit board substrate is placed in the processing groove 9, the air cylinder 3 starts to push the upper die holder 4 to move downwards, the die cutter 5 is used for die cutting the circuit board substrate, handrails are fixedly arranged on the side walls of the lower die holder 8 and the mounting plate 14 and are convenient to control and move, the collecting box 7 is positioned and inserted in the groove 6 after the circuit board substrate is processed, the mounting plate 14 is moved along the mounting groove 11 until the position of the mounting plate 14 is fixed after the sliding block 15 is clamped with the limiting plate 13, the convex plate 18 slides out of the sliding groove 12 at the moment, the lower die holder 8 is convenient to unlock and rotate, the circuit board substrate processed in the processing groove 9 is poured into the collecting box 7, the lower die holder 8 is reset to place a new circuit board substrate in the processing groove 9, the mounting plate 14 is moved along the mounting groove 11 until the mounting plate 14 is clamped with the supporting plate 2 and then fixed, the convex plate 18 is clamped into the sliding groove 12, the operation is simple and convenient, the circuit board substrate after the processing can be poured into the collecting box 7 at one time and is finished and collected intensively, and the circuit board substrate cutting efficiency is improved for operators.

In the second embodiment, on the basis of the first embodiment, a trapezoid groove 19 in the auxiliary assembly is formed in the side wall of the mounting seat 10, a trapezoid block 20 is movably clamped in the trapezoid groove 19, a movable plate 21 is fixedly arranged on the side wall of the trapezoid block 20, the movable plate 21 is clamped with the mounting plate 14, a clamping groove 23 is formed in the movable plate 21, a rotating plate 24 is rotatably arranged on the side wall of the mounting seat 10, the rotating plate 24 is clamped with the clamping groove 23, a slot 22 is formed in the side wall of the mounting plate 14, and the movable plate 21 is spliced with the slot 22.

When the circuit board substrate is to be fetched, after the sliding block 15 is clamped with the limiting plate 13, the trapezoidal block 20 is moved along the trapezoidal groove 19 to enable the moving plate 21 to be inserted into the slot 22, then the rotating plate 24 is rotated to be clamped into the clamping groove 23, the position of the mounting plate 14 is further limited, and the die-cut circuit board substrate is conveniently poured out by rotating the lower die holder 8 in a stable operation.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A die-cutting apparatus for processing and cutting circuit board substrates, characterized in that it comprises: A base plate (1) is provided with a support plate (2) and a cylinder (3) is provided with a cylinder (3). The output end of the cylinder (3) passes through the upper end of the support plate (2) and is fixedly connected to the upper mold base (4). A die-cutting knife (5) is fixedly provided at the bottom end of the upper mold base (4). A groove (6) is opened on the base plate (1) and a collection box (7) is inserted into the groove (6). The lower mold base (8) is provided with a machining groove (9). The lower mold base (8) is set on the mounting base (10) through a connecting component and an auxiliary component. The mounting base (10) is fixedly set on the base plate (1). The side wall of the mounting base (10) is snapped with the support plate (2). 2. A die-cutting device for processing and cutting circuit board substrates according to claim 1, characterized in that: the mounting groove (11) in the connecting assembly is opened on the mounting base (10), the mounting groove (11) is symmetrically provided with sliding grooves (12) on both sides, the end of the sliding groove (12) is fixedly provided with a limiting plate (13), the lower die base (8) is rotatably arranged on the mounting plate (14), and the mounting plate (14) is movably engaged with the mounting groove (11). 3. A die-cutting device for processing and cutting circuit board substrates according to claim 2, characterized in that: sliders (15) are symmetrically fixed on both sides of the mounting plate (14), the sliders (15) are movably engaged in the slide groove (12), and the sliders (15) are engaged with the limiting plate (13). 4. A die-cutting device for processing and cutting circuit board substrates according to claim 3, characterized in that: a straight groove (16) is provided on the mounting plate (14), a connecting plate (17) is fixedly provided at the bottom end of the lower die base (8), the connecting plate (17) is movably arranged in the straight groove (16), and convex plates (18) are symmetrically fixed at both ends of the connecting plate (17), and the convex plates (18) are movably engaged with the sliding groove (12). 5. A die-cutting device for processing and cutting circuit board substrates according to claim 1, characterized in that: the trapezoidal groove (19) in the auxiliary component is opened on the side wall of the mounting base (10), a trapezoidal block (20) is movably engaged in the trapezoidal groove (19), a movable plate (21) is fixedly provided on the side wall of the trapezoidal block (20), and the movable plate (21) is engaged with the mounting plate (14). 6. A die-cutting device for processing and cutting circuit board substrates according to claim 5, characterized in that: a slot (23) is provided on the movable plate (21), the rotating plate (24) is rotatably disposed on the side wall of the mounting base (10), the rotating plate (24) is engaged with the slot (23), the slot (22) is provided on the side wall of the mounting plate (14), and the movable plate (21) is inserted into the slot (22).