CN223681407U - A lane controller with a heat dissipation device - Google Patents

Abstract

This application discloses a lane controller with a heat dissipation device, comprising a housing, a circuit board, and a heat sink. The housing has a recess, and the heat sink is mounted in the recess. The heat sink consists of a substrate and heat sink fins. The substrate is placed on the circuit board, and the heat sink fins include fins and multiple vertically symmetrically arranged fins whose length gradually increases from the end furthest from the substrate to the end closest to the substrate. By incorporating a heat sink, heat dissipation efficiency can be effectively improved, ensuring rapid heat conduction between the substrate and the circuit board. Furthermore, the design of the heat sink fins facilitates airflow to remove heat, enabling the lane controller to operate stably and efficiently for extended periods, avoiding functional failures or performance degradation caused by overheating.

Description

Lane controller with heat abstractor

Technical Field

The utility model relates to the field of intelligent transportation, in particular to a lane controller with a heat dissipation device.

Background

With the rapid development of intelligent traffic systems, lane controllers are increasingly used. However, the lane controller generates a large amount of heat during the working process, if the heat cannot be effectively dissipated, the working life of the controller can be shortened, and electrical faults can be caused to influence the normal operation of the system. The traditional heat dissipation mode is mostly dependent on natural convection of air, and the heat dissipation efficiency is limited, and especially when the controller is used in a high-density and high-temperature environment, natural cooling is difficult to meet the heat dissipation requirement.

Disclosure of utility model

The utility model aims to solve at least one of the technical problems in the prior art, and therefore, the utility model provides a lane controller with a heat dissipating device, which comprises a shell and a circuit board, wherein the circuit board is arranged in the shell, the lane controller also comprises a radiator, the shell is provided with a groove, the radiator is arranged in the groove, the radiator comprises a base plate and a radiating fin, the base plate is arranged on the circuit board, the radiating fin is arranged on the base plate, the radiating fin is provided with a fin rod and a plurality of fins, the fins are vertically and symmetrically arranged on two sides of the fin rod, and the length of each fin gradually increases from one end far away from the base plate to one end close to the base plate.

According to one embodiment of the present utility model, the fin includes a top end piece, a middle piece, and a bottom end piece, the top end piece, the middle piece, and the bottom end piece being disposed from top to bottom.

According to one embodiment of the utility model, the top and bottom end pieces are disposed vertically on the fin.

According to one embodiment of the utility model, the middle piece forms an upward included angle of 5-45 degrees with the fin rod in the horizontal direction.

According to one embodiment of the utility model, the number of intermediate sheets is four.

According to one embodiment of the utility model, the groove structure comprises a top surface, an inclined surface and a bottom surface, wherein the top surface is arranged on the surface of the shell, the upper edge of the inclined surface is connected with the top surface, the lower edge of the inclined surface is connected with the bottom surface, and the inclined surface and the bottom surface form an included angle of 45 degrees.

According to one embodiment of the utility model, the heat sink is arranged at a height not exceeding the top surface.

According to one embodiment of the utility model, the radiating fins are arranged in a matrix, and each radiating fin arrangement gap is 3-6mm.

According to one embodiment of the present utility model, the heat sink is made of aluminum alloy.

According to one embodiment of the utility model, the heat sink-to-board gap is filled with a thermally conductive silicone.

Compared with the prior art, the embodiment of the utility model has the following beneficial effects:

According to the application, the radiator with the design that the fin length is gradually increased is arranged in the shell, so that the radiating efficiency is effectively improved. The fin rods of the radiating fins and the fin designs with a plurality of vertically symmetrical arrangement and gradually increased lengths are beneficial to more effectively taking away heat when air flows between the fins, so that the controller keeps lower temperature when running for a long time, the problem of functional failure or performance reduction caused by overheating is avoided, and the lane controller can run stably and efficiently.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic illustration of the present utility model;

FIG. 2 is a schematic diagram of a heat sink;

FIG. 3 is a schematic view of a heat sink;

Fig. 4 is a schematic diagram of the heat dissipating device and the groove.

Reference numerals 1, housing, 11, groove, 111, top surface, 112, inclined surface, 113, bottom surface, 2, circuit board, 3, radiator, 31, base plate, 32, radiating fin, 321, fin rod, 322, fin, 322-A, top end piece, 322-B, middle piece, 322-C, bottom end piece.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Referring to fig. 1, the application provides a lane controller with high-efficiency heat dissipation performance, which specifically comprises a housing 1 and a circuit board 2, wherein a groove 11 is arranged on the housing 1, a radiator 3 is arranged in the groove 11, and the specific structure is as follows:

The shell 1 adopts a cuboid structure, is flattened in overall design, and meets the compact installation requirement of the lane controller in various scenes. The shell 1 is made of high-strength metal (such as aluminum alloy) or composite material and has stronger heat resistance and mechanical strength, the side surface of the shell 1 is provided with a mounting structure such as a threaded hole or a sliding rail type fixing device, so that the lane controller can be conveniently mounted on a narrow space or a specific bracket, the side surface of the shell 1 is provided with an opening corresponding to the interface position of the circuit board 2, so that an external connection cable can be conveniently connected with other equipment, and the top of the shell 1 is provided with a groove 11 fixedly connected with the radiator 3, so that stable support and functional space are provided for the radiator. The shell 1 is compact in design and firm in structure, not only saves the occupied space of equipment, but also ensures the sufficient protection of an internal circuit, and improves the contact efficiency of the heat radiating device and the ambient air.

The circuit board 2 is arranged in the shell 1 and is electrically connected with other parts of the controller for processing related signals and data of lane control, the circuit board 2 is arranged in the shell 1 through screws or buckles, the position of the circuit board is fixed and is in close contact with the substrate 31 of the radiator 3, and the interface part of the circuit board 2 is connected with external equipment through an opening on the side surface of the shell 1, so that convenience in signal input and output is ensured.

The recess 11 is located above the housing 1 to provide a separate space for the installation of the heat sink 3. The radiator 3 is embedded into the groove 11 and fixed, and is connected with the shell 1 through screws or buckles, so that the stability of the whole structure is maintained. The design of the grooves 11 optimizes the layout of the radiator 3 while maintaining the overall compactness of the housing 1, so that the radiator can efficiently contact external air flow, and the radiating efficiency is improved.

The radiator 3 is arranged in the groove 11 and comprises a base plate 31 and radiating fins 32, the base plate 31 is made of metal with high heat conductivity (such as copper or aluminum alloy) and is in direct contact with the circuit board 2, heat is guaranteed to be quickly transferred to the radiating fins 32 through filling heat-conducting silicone grease, the length of each fin 322 is gradually increased, the radiating effect caused by air flow is enhanced, the base plate 31 of the radiator 3 is tightly contacted with the radiating surface of the circuit board 2 through the heat-conducting silicone grease, the radiating fins 32 are fixed with the base plate 31, the top of each radiating fin 32 is flush with the groove 11, and the protruding of the shell 1 is prevented from affecting the whole installation performance. The heat radiator 3 can quickly reduce the temperature of the circuit board 2 and prevent heat accumulation by the direct conduction of the substrate 31 and the efficient convection heat radiation design of the heat radiating fins 32, and the heat radiation performance is improved by the integral embedded design of the heat radiator 3 and the shell 1.

Referring to fig. 2, the heat sink 3 includes a substrate 31 and a heat dissipation plate 32, wherein the substrate 31 is in a rectangular flat plate structure and is made of a high thermal conductivity material (such as copper or aluminum alloy) and is used for directly contacting a heat source part of the circuit board 2 to transfer heat to the heat dissipation plate 32, the surface is subjected to smooth treatment and filled with heat conduction silicone grease to improve tightness and heat conduction efficiency of contacting with the heat source of the circuit board 2, the size of the substrate 31 corresponds to a heat dissipation area of the circuit board 2 to ensure full coverage of heat transfer, the bottom surface 113 of the substrate 31 is tightly contacted with the heat dissipation part of the circuit board 2 through the heat conduction silicone grease to form an efficient heat conduction path, and the top of the substrate 31 is connected with the heat dissipation plate 32 in a welding or mechanical fixing manner to provide a stable support for the heat dissipation plate 32. The high thermal conductivity of the substrate 31 allows for rapid heat collection and transfer, providing a sufficient heat source for the heat sink 32 to avoid heat build up on the circuit board 2 causing component damage.

Referring to fig. 3, the heat sink 32 is in a long strip shape, and has a cross section in a tree structure, and is composed of fins 321 and fins 322. The heat dissipation fins 32 are made of the same material as the base plate 31 (such as aluminum alloy) and have excellent heat conduction performance, the fin rods 321 are perpendicular to the base plate 31 and are arranged to serve as supporting structures of the fins 322, the fins 322 are symmetrically arranged on two sides of the fin rods 321 in a layered arrangement from top to bottom, each group of fins 322 are laterally symmetrical, the lengths of the layers are gradually increased, and each group of fins 322 are uniformly arranged to form an efficient convection heat dissipation network. The bottom ends of the fins 321 are fixedly connected with the base plate 31, so that no gap exists in a heat transfer path between the fins 321 and the base plate 31. The design of the tree structure increases the air flow contact area, optimizes the heat exchange efficiency of the radiating fins 32 and the surrounding air, gradually increases the length of the fins 322 from top to bottom, so that the heat in different areas can be dispersed in sequence, the phenomenon that the heat is concentrated at a certain place is effectively avoided, and the symmetrically arranged fins 322 form uniform air flow channels, and are beneficial to rapidly discharging the heat by utilizing natural convection and the flow of the outside air.

In some embodiments, referring to FIG. 3, fin 322 is comprised of top end sheet 322-A, middle sheet 322-B, and bottom end sheet 322-C. The three fins 322 are sequentially arranged from top to bottom in sequence, and the shape, size and angle of the fins are optimized to enhance the heat dissipation efficiency, and specifically, the top end piece 322-A is smaller in volume and is arranged at the top of the fin rod 321, is horizontally arranged, has limited contact area with air flow and is mainly used for guiding initial air flow, and the middle piece 322-B is positioned between the top end piece 322-A and the bottom end piece 322-C and is a heat dissipation middle layer. The number of the top end piece 322-A and the bottom end piece 322-C is larger than that of the bottom end piece 322-C, and each piece forms an upward included angle (5-45 degrees) with the fin 321 in the horizontal direction. The inclined angle of the middle plate 322-B not only enhances the contact area with the air flow, but also optimizes the flow path of the air flow so that heat is more easily taken away, and the bottom plate 322-C is arranged at the bottommost layer of the heat sink 32 and is perpendicular to the fins 321, and has a length and an area which are larger than those of the top plate 322-A and the middle plate 322-B, so that the maximum heat dissipation surface area is provided for processing the maximum heat. The sequentially increasing lengths and layered design of the top and middle sheets 322-a, 322-B, and 322-C not only avoids concentrated accumulation of heat, but also creates a stable airflow circulation around the heat sink 3, improving the efficiency of natural convection.

In some embodiments, referring to fig. 4, the groove 11 is provided with a top surface 111, an inclined surface 112 and a bottom surface 113, wherein the top surface 111 is an inlet of the groove 11 and is located on the surface of the casing 1 and is in direct contact with the outside, and the specific structure is that the top surface 111 is of a planar design and is in a rectangular or square structure as a whole. The inclined plane 112 is a connection transition surface of the groove 11, the upper edge of the inclined plane 112 is connected with the top surface 111, the lower edge of the inclined plane 112 is connected with the bottom surface 113, and the inclined plane 112 and the bottom surface 113 are of an inclined design, so that an included angle of 45 degrees is formed, and a natural diversion structure is formed. The sloped design of the ramp 112 helps to direct airflow into the interior of the recess 11 and through the heat sink 3 while increasing the depth of the recess 11 to accommodate the complex structure of the heat sink 3. The bottom surface 113 is the bottom layer of the groove 11, and the bottom surface 113 is flat and is located on the installation reference surface of the heat sink 3. The top surface 111, the inclined surface 112 and the bottom surface 113 of the groove 11 are tightly connected to form a complete space, a good environment is provided for installation and airflow circulation of the radiator 3, the top surface 111 serves as an opening area of the groove 11, installation and maintenance operation of the radiator 3 are facilitated, the radiator 3 is embedded into the shell 1 through the groove 11, the external space is saved, and the radiator is particularly suitable for application scenes with limited installation space.

In some embodiments, referring to fig. 2, the fins 32 are arranged on the substrate 31 in a matrix, forming a regular grid structure, with each row and each column being uniformly distributed, with a gap of 3-6mm. The specific values of the gaps are set according to heat dissipation requirements, material characteristics and optimization of the air flow channels, so that smooth air flow is ensured, the total surface area of the radiating fins 32 is maximized, no direct contact exists between the adjacent radiating fins 32, stable air flow channels are formed in the gaps, heat dissipation is achieved effectively, the gaps between the radiating fins 32 are clear and visible due to the design of matrix arrangement, a user can clean dust or sundries regularly, and long-term heat dissipation effect is maintained.

According to the utility model, through the optimized structures of the shell 1, the radiator 3 and the groove 11, the heat radiation performance of the lane controller is effectively improved. The shell 1 is made of high-strength materials, is compact in design and convenient to install in a narrow space, provides reliable protection for the circuit board 2, the radiator 3 is firmly installed in the groove 11, the airflow flow path is optimized, the radiator 3 comprises a substrate 31 and tree-shaped radiating fins 32, the temperature of equipment is quickly reduced through heat conduction and convection, the radiating area is increased through matrix arrangement and layered design of the radiating fins 32, the natural convection effect is enhanced, heat accumulation is avoided, and the service life of the equipment is prolonged. The utility model has simple and attractive integral structure and easy maintenance, and meets the requirement of high-performance heat dissipation.

The foregoing embodiments are merely illustrative of the technical solutions of the present utility model, and not restrictive, and although the present utility model has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that modifications may still be made to the technical solutions described in the foregoing embodiments or equivalent substitutions of some technical features thereof, and that such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. The utility model provides a contain heat abstractor's lane controller, includes shell and circuit board, the circuit board sets up inside the shell, its characterized in that still includes the radiator, the shell is equipped with the recess, the radiator is installed in the recess, the radiator includes base plate and fin, the base plate sets up on the circuit board, the fin sets up on the base plate, the fin is equipped with fin pole and a plurality of fin, a plurality of the vertical symmetrical arrangement of fin is in fin pole both sides, every the length of fin is from keeping away from the one end of base plate to the one end that is close to the base plate increases gradually.

2. The lane controller according to claim 1, the fin comprising a top end piece, a middle piece, and a bottom end piece, the top end piece, the middle piece, and the bottom end piece being disposed from top to bottom.

3. The lane controller according to claim 2, wherein the top end piece and the bottom end piece are vertically disposed on the fin.

4. The lane controller according to claim 3, wherein the middle piece forms an angle of 5 ° to 45 ° upward with the fin in a horizontal direction.

5. The lane controller according to claim 2, wherein the number of intermediate pieces is four.

6. The lane controller of claim 1, the groove structure comprising a top surface, a bevel surface and a bottom surface, the top surface disposed on the housing surface, the bevel upper edge connected to the top surface, the bevel lower edge connected to the bottom surface, the bevel surface angled at 45 ° from the bottom surface.

7. The lane controller of claim 6, the heat sink being disposed at a height not exceeding the top surface.

8. The lane controller according to claim 1, wherein the heat sinks are arranged in a matrix, and each of the heat sink arrangement gaps is 3-6mm.

9. The lane controller according to claim 1, wherein the heat sink is made of aluminum alloy.

10. The lane controller of claim 1, the heat sink-to-circuit board gap being filled with thermally conductive silicone.