CN223652421U - High-temperature-resistant circuit substrate - Google Patents
High-temperature-resistant circuit substrateInfo
- Publication number
- CN223652421U CN223652421U CN202423167722.4U CN202423167722U CN223652421U CN 223652421 U CN223652421 U CN 223652421U CN 202423167722 U CN202423167722 U CN 202423167722U CN 223652421 U CN223652421 U CN 223652421U
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- unit
- plate
- circuit board
- main body
- groove
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Abstract
The utility model discloses a high-temperature-resistant circuit substrate, which relates to the technical field of circuit substrates and comprises a main body unit, a blocking unit arranged on the side part of the main body unit and a cooling unit arranged on the top of the main body unit, wherein the blocking unit comprises a 匚 template arranged on the side part of the main body unit, a connecting groove arranged on the top of the 匚 template, a connecting seat arranged at the bottom of the 匚 template and a connecting piece arranged in the connecting groove. The utility model relates to a high-temperature-resistant circuit substrate, which avoids the conditions of touching circuit elements and communicating circuits caused by excessive force in the installation process through the arranged blocking unit and the cooling unit, and improves the installation applicability.
Description
Technical Field
The utility model relates to the technical field of circuit substrates, in particular to a high-temperature-resistant circuit substrate.
Background
The substrate is a basic material for manufacturing a PCB, typically, the substrate is a copper clad laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing hole processing, electroless copper plating, electrolytic copper plating, etching and the like on the substrate material-copper clad laminate. In the manufacture of the other type of multilayer printed board, an inner core thin copper-clad foil board is used as a substrate, and conductive pattern layers and prepregs are alternately laminated and bonded together at one time to form more than 3 layers of conductive pattern interlayer interconnection. It has the functions of conducting, insulating and supporting.
According to the high-temperature-resistant flexible circuit board disclosed in the publication No. CN215871979U, the high-temperature-resistant flexible circuit board comprises a substrate, a conductive layer arranged on the top of the substrate, an adhesive layer arranged on the top of the conductive layer, a high-temperature-resistant protective layer arranged on the top of the adhesive layer, and an insulating protective layer arranged on the top of the high-temperature-resistant protective layer, wherein a plurality of transverse grooves are formed in the upper surface of the adhesive layer in a downward sinking mode.
Although the flexibility of the adhesive layer is improved, the adverse effect of the adhesive layer on the flexibility of the flexible circuit board is reduced, but the substrate circuits in many circuit designs are installed in multiple layers, and the upper layers and the lower layers of the substrate are lack of partition, and in the installation process, the circuit elements and the communication circuits on the substrate are damaged by slight force, so that the high-temperature-resistant circuit substrate is provided.
Disclosure of utility model
The utility model mainly aims to provide a high-temperature-resistant circuit substrate, which solves the problems that a plurality of substrate circuits in circuit design can be installed in multiple layers, and the upper layer and the lower layer of the substrate are lack of partition, and circuit elements on the substrate and a communication circuit can be damaged by slightly applying force in the installation process through a separation unit and a cooling unit.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The high-temperature-resistant circuit substrate comprises a main body unit, a blocking unit arranged on the side part of the main body unit, and a cooling unit arranged on the top of the main body unit;
The blocking unit comprises a 匚 template arranged on the side part of the main body unit, a connecting groove formed in the top of the 匚 template, a connecting seat arranged at the bottom of the 匚 template, and a connecting piece arranged in the connecting groove;
The cooling unit comprises a first refrigerating sheet and a second refrigerating sheet which are arranged at the top of the main body unit, and a conducting sheet which is arranged at the top of the main body unit and is used for communicating the first refrigerating sheet with the second refrigerating sheet.
Preferably, the main body unit includes a copper foil conductive plate, a printed circuit board mounted on top of the copper foil conductive plate, and a base substrate mounted on bottom of the copper foil conductive plate.
Preferably, the main body unit further comprises a heat dissipation cavity formed at the bottom of the base substrate, and a heat dissipation area formed at the bottom of the copper foil conductive plate.
Preferably, the connecting piece includes set up at the storage tank of spread groove lateral part, set up at the removal through-hole of storage tank lateral wall, activity set up in the removal post in the through-hole, install the clamping plate that the post is located the inside one end of removal through-hole, install the tensile board at the removal post other end, and set up in connect the spring between spread groove and the clamping plate.
Preferably, one end of the connecting spring is fixedly connected with the side wall of the connecting groove, and the other end of the connecting spring is fixedly connected with the clamping plate.
Preferably, the connecting piece further comprises a clamping groove formed in the side wall of the connecting seat.
Preferably, the cooling unit further comprises an electronic component mounting point mounted on the top of the printed circuit board.
Compared with the prior art, the utility model has the following beneficial effects:
According to the utility model, when the circuit substrate is required to be installed in multiple layers, the stretching plate is pulled to enable the moving column to drive the clamping plate to butt against the spring to compress until the clamping plate is completely contained in the containing groove, at the moment, the connecting seat of the upper circuit substrate can be placed in the connecting groove of the lower circuit substrate, then the force applied to the stretching plate is removed, under the action of the elasticity of the spring, the clamping plate returns and is clamped with the clamping groove, so that stable connection between the upper layer and the lower layer of the circuit substrate is formed, the partition layer is formed, the situation that the circuit element and the communicating circuit are touched due to excessive force in the installation process is avoided, the installation applicability is improved, when the circuit substrate is required to work, the first refrigerating plate and the second refrigerating plate start to cool, the surface of the printed circuit substrate is radiated through the conducting plate, the heat dissipation cavity is formed by the matching of the base substrate, the heat dissipation cavity is formed, the heat dissipation effect is greatly improved, and the heat dissipation effect is good.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a left-hand structural schematic diagram of the present utility model;
FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 at A-A in accordance with the present utility model;
FIG. 4 is a schematic cross-sectional view of the structure of the utility model at B-B in FIG. 2;
Fig. 5 is a schematic diagram of a front view structure of the present utility model.
In the figure:
1. the printed circuit board comprises a main body unit, a printed circuit board, a copper foil conductive plate, a base substrate, a heat dissipation area and a heat dissipation area, wherein the main body unit comprises a printed circuit board (101);
2. The device comprises a blocking unit, a plate 201, 匚, a connecting groove 203, a connecting seat 204, a connecting piece 2041, a moving column 2042, a clamping plate 2043, a stretching plate 2044, a connecting spring 2045 and a clamping groove;
3. cooling unit 301, first refrigerating sheet 302, second refrigerating sheet 303, conducting sheet 304 and electronic component mounting point.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Example 1
As shown in fig. 1, 2, 4 and 5, a high temperature resistant circuit substrate comprises a main body unit 1, a blocking unit 2 arranged on the side part of the main body unit 1, and a cooling unit 3 arranged on the top of the main body unit 1;
As shown in fig. 1, the blocking unit 2 includes a 匚 board 201 mounted on the side of the main body unit 1, a connecting slot 202 formed on the top of the 匚 board 201, a connecting seat 203 mounted on the bottom of the 匚 board 201, and a connecting piece 204 disposed in the connecting slot 202, where the connecting seat 203 and the connecting slot 202 are cooperatively disposed, so that convenient installation between upper and lower circuit substrates can be realized;
As shown in fig. 4, the cooling unit 3 includes a first cooling fin 301 and a second cooling fin 302 mounted on the top of the main unit 1, and a conductive fin 303 mounted on the top of the main unit 1 for communication between the first cooling fin 301 and the second cooling fin 302, the conductive fin 303 being capable of radiating cool air generated between the first cooling fin 301 and the second cooling fin 302.
As shown in fig. 3, the main unit 1 includes a copper foil conductive plate 102, a printed circuit board 101 mounted on top of the copper foil conductive plate 102, and a base substrate 103 mounted on the bottom of the copper foil conductive plate 102, where the base substrate 103 cooperates with a cavity to form a heat dissipation cavity, so as to facilitate heat dissipation.
As shown in fig. 3, the main unit 1 further includes a heat dissipation cavity formed at the bottom of the base substrate 103, and a heat dissipation area 104 formed at the bottom of the copper foil conductive plate 102, where the heat dissipation area 104 is a heat dissipation groove formed by laser engraving, and the heat dissipation groove is used for heat dissipation, so that the heat dissipation effect is good and the heat dissipation efficiency is high.
As shown in fig. 4, the connecting piece 204 includes a receiving groove formed on a side portion of the connecting groove 202, a moving through hole formed on a side wall of the receiving groove, a moving post 2041 movably disposed in the moving through hole, a clamping plate 2042 mounted on one end of the moving post 2041 located in the moving through hole, a stretching plate 2043 mounted on the other end of the moving post 2041, and a connecting spring 2044 disposed between the connecting groove 202 and the clamping plate 2042, wherein the clamping plate 2042 can be driven by the moving post 2041 to move by pulling the stretching plate 2043.
As shown in fig. 4, one end of the connecting spring 2044 is fixedly connected with the side wall of the connecting groove 202, and the other end is fixedly connected with the clamping plate 2042, and the arrangement of the connecting spring 2044 facilitates the resetting movement of the clamping plate 2042.
As shown in fig. 2, the connecting piece 204 further includes a locking groove 2045 formed on a side wall of the connecting seat 203, and the locking groove 2045 is matched with the locking plate 2042, so that the matching connection between the connecting seat 203 and the connecting groove 202 is facilitated.
When the circuit substrate needs to be mounted in multiple layers, the stretching plate 2043 is pulled, so that the moving column 2041 drives the clamping plate 2042 to compress the abutting spring 2044 until the clamping plate 2042 is completely contained in the containing groove, at the moment, the connecting seat 203 of the upper circuit substrate can be placed in the connecting groove 202 of the lower circuit substrate, then the force applied to the stretching plate 2043 is removed, under the action of the elastic force of the spring 2044, the clamping plate 2042 returns and is clamped with the clamping groove 2045, stable connection between the upper layer and the lower layer of the circuit substrate is formed, a partition layer is formed, the condition that a circuit element is touched and a circuit is communicated due to excessive force in the mounting process is avoided, and the mounting applicability is improved.
Example 2
As shown in fig. 1, 2, 3, 4 and 5, a high temperature resistant circuit substrate comprises a main body unit 1, a blocking unit 2 arranged on the side part of the main body unit 1, and a cooling unit 3 arranged on the top of the main body unit 1;
As shown in fig. 1, the blocking unit 2 includes a 匚 board 201 mounted on the side of the main body unit 1, a connecting slot 202 formed on the top of the 匚 board 201, a connecting seat 203 mounted on the bottom of the 匚 board 201, and a connecting piece 204 disposed in the connecting slot 202, where the connecting seat 203 and the connecting slot 202 are cooperatively disposed, so that convenient installation between upper and lower circuit substrates can be realized;
As shown in fig. 4, the cooling unit 3 includes a first cooling fin 301 and a second cooling fin 302 mounted on the top of the main unit 1, and a conductive fin 303 mounted on the top of the main unit 1 for communication between the first cooling fin 301 and the second cooling fin 302, the conductive fin 303 being capable of radiating cool air generated between the first cooling fin 301 and the second cooling fin 302.
As shown in fig. 3, the main unit 1 includes a copper foil conductive plate 102, a printed circuit board 101 mounted on top of the copper foil conductive plate 102, and a base substrate 103 mounted on the bottom of the copper foil conductive plate 102, where the base substrate 103 cooperates with a cavity to form a heat dissipation cavity, so as to facilitate heat dissipation.
As shown in fig. 3, the main unit 1 further includes a heat dissipation cavity formed at the bottom of the base substrate 103, and a heat dissipation area 104 formed at the bottom of the copper foil conductive plate 102, where the heat dissipation area 104 is a heat dissipation groove formed by laser engraving, and the heat dissipation groove is used for heat dissipation, so that the heat dissipation effect is good and the heat dissipation efficiency is high.
As shown in fig. 4, the connecting piece 204 includes a receiving groove formed on a side portion of the connecting groove 202, a moving through hole formed on a side wall of the receiving groove, a moving post 2041 movably disposed in the moving through hole, a clamping plate 2042 mounted on one end of the moving post 2041 located in the moving through hole, a stretching plate 2043 mounted on the other end of the moving post 2041, and a connecting spring 2044 disposed between the connecting groove 202 and the clamping plate 2042, wherein the clamping plate 2042 can be driven by the moving post 2041 to move by pulling the stretching plate 2043.
As shown in fig. 4, one end of the connecting spring 2044 is fixedly connected with the side wall of the connecting groove 202, and the other end is fixedly connected with the clamping plate 2042, and the arrangement of the connecting spring 2044 facilitates the resetting movement of the clamping plate 2042.
As shown in fig. 2, the connecting piece 204 further includes a locking groove 2045 formed on a side wall of the connecting seat 203, and the locking groove 2045 is matched with the locking plate 2042, so that the matching connection between the connecting seat 203 and the connecting groove 202 is facilitated.
As shown in fig. 4 and 5, the cooling unit 3 further includes an electronic component mounting point 304 mounted on the top of the printed circuit board 101, and the electronic component mounting point 304 is provided for mounting external electronic components.
When the circuit substrate is required to work, the first refrigerating sheet 301 and the second refrigerating sheet 302 start to perform refrigeration work and radiate heat on the surface of the printed circuit board 101 through the conducting sheet 303, the base substrate 103 is matched with the cavity to form a heat radiation cavity, and the heat radiation area 104 is arranged in the cavity, so that the heat radiation effect can be greatly improved, and the heat radiation stability is good.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423167722.4U CN223652421U (en) | 2024-12-23 | 2024-12-23 | High-temperature-resistant circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423167722.4U CN223652421U (en) | 2024-12-23 | 2024-12-23 | High-temperature-resistant circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223652421U true CN223652421U (en) | 2025-12-09 |
Family
ID=97911855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202423167722.4U Active CN223652421U (en) | 2024-12-23 | 2024-12-23 | High-temperature-resistant circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223652421U (en) |
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2024
- 2024-12-23 CN CN202423167722.4U patent/CN223652421U/en active Active
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