CN223651163U - A high-speed solid-state drive with a sliding structure for heat dissipation - Google Patents

Abstract

This utility model relates to the field of solid-state drives (SSDs), specifically a high-speed SSD with a sliding heat dissipation structure. The SSD includes a motherboard and a heatsink. In use, the protective film of the thermally conductive silicone pad is typically removed and then applied between the heat-generating components on the motherboard and the heatsink. Appropriate pressure is applied to ensure a tight seal, allowing the heatsink to be mounted on the outside of the motherboard. When the SSD is running, the thermally conductive silicone pad creates a good thermal conductivity path between the heat-generating components on the motherboard and the heatsink, helping to quickly transfer the heat generated by the heat-generating components to the heatsink. The heatsink's fins, through their large surface area and the sliding, deployable plate, come into contact with the air, utilizing airflow to dissipate heat and achieve a cooling effect. This results in good heat dissipation performance, reducing the operating temperature of the SSD and improving its stability and performance. Its heat dissipation efficiency mainly depends on the surface area and the airflow speed.

Description

High-speed solid state disk with sliding structure for heat dissipation

Technical Field

The utility model relates to the field of solid state disks, in particular to a high-speed solid state disk with a sliding structure for heat dissipation.

Background

With the continuous development of computer hardware, the capacity and the reading speed of the solid state disk are continuously enhanced, the power and the heating value of the hard disk are also continuously increased, when the heat is accumulated to a certain extent in the solid state disk but is not controlled, the accuracy and the service life of data storage can be affected by continuous high temperature, the data of the solid state disk are seriously lost or even damaged, and the heat dissipation requirement of the existing external fan cannot be met by the heat dissipation mode of the external fan.

Disclosure of utility model

Aiming at the defects of the background technology, the utility model provides a high-speed solid state disk with a sliding structure for heat dissipation.

The utility model adopts the following technical scheme:

The utility model provides a radiating high-speed solid state hard disk of sliding construction, its characterized in that, this solid state hard disk includes mainboard and radiator, two the radiator is located respectively two upper and lower surfaces of mainboard, and be equipped with heat conduction silica gel piece between radiator and the mainboard, the radiator passes through heat conduction silica gel piece with the components and parts butt that generates heat on the mainboard, the radiator includes:

The radiating fin is abutted with the heating element on the main board through the heat conduction silica gel sheet, and a plurality of radiating fins are arranged on the surface of the radiating fin, which is opposite to the main board;

The movable plates are arranged, the two movable plates are respectively arranged at two ends of the radiating fin and stretch, the movable plates are positioned on the surface of the radiating fin, which is opposite to the main board, and the radiating fins on the radiating fin are positioned between the two movable plates;

The radiating fins, the radiating fins and the movable plates are all made of metal, and after the movable plates at two ends of the radiator extend outwards to the limit positions, the two movable plates are suspended above two ends of the main board.

As a further improvement, the radiating fin and the movable plate are all made of metal aluminum.

As a further improvement, the two sides of the surface of the radiating fin, which is opposite to the main board, are respectively provided with a first support plate, the two ends of the first support plates are respectively provided with a sliding groove, the two sides of the movable plate are respectively provided with a second support plate, the sides of the second support plates, which are opposite to the movable plate, are respectively provided with a sliding block, and when the movable plate is arranged at the two ends of the radiating fin to stretch out and draw back, the sliding blocks are positioned in the sliding grooves to slide.

As a further improvement, the cross section of the sliding block is rectangular or square.

As a further improvement, the radiating fin on the radiating fin and the first support plate are integrally formed.

As a further improvement, a plurality of radiating fins are arranged on the surface of the movable plate, which faces away from the radiating fins.

As a further improvement, the movable plate, the radiating fins on the movable plate and the second support plate are integrally formed.

As can be seen from the above description of the structure of the present utility model, compared with the prior art, the present utility model has the advantages that when in use, the heat sink can be mounted outside the main board by only tearing off the protective film of the heat conducting silica gel sheet and then adhering the protective film between the heat generating component of the main board and the heat sink, and tightly combining the protective film with proper pressure. When the solid state disk operates, the heat conduction silica gel sheet can form a good heat conduction path between the heating element of the main board and the radiator, so that heat generated by the heating element of the main board is helped to be quickly conducted onto the radiator, the radiating fin of the radiator contacts with air through the surface of the large-area radiating fin and the movable plate which is expanded in a sliding manner, the heat is taken away by utilizing air flow, the radiating effect is realized, the radiating performance is good, the working temperature of the solid state disk is reduced, the stability and the performance of the solid state disk are improved, and the radiating efficiency mainly depends on the size of the surface area and the speed of the air flow.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic exploded view of the present utility model.

Fig. 3 is an exploded view of a radiator.

Fig. 4 is a schematic perspective view of the movable plate after extending to the limit position.

Fig. 5 is a schematic elevational view of the present utility model.

Detailed Description

Specific embodiments of the present utility model will be described below with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, a high-speed solid state disk with a sliding structure for heat dissipation includes a main board 1 and a radiator 2, wherein the two radiators 2 are respectively disposed on the upper and lower surfaces of the main board 1, a heat-conducting silica gel sheet 3 is disposed between the radiator 2 and the main board 1, and the radiator 2 is abutted to heat-generating components on the main board 1 through the heat-conducting silica gel sheet 3, wherein the heat-generating components include components such as flash memory particles 11, a main control firmware 12, and an external hard disk. When in use, the protective film of the heat-conducting silica gel sheet 3 is usually only required to be torn off and then stuck between the heating element of the main board 1 and the radiator 2, and the heat-conducting silica gel sheet is tightly combined by proper pressure. The heat conduction silica gel piece 3 can fill the gap between the contact surfaces well, extrude the air to the contact surfaces, can realize the full contact of the contact surfaces, and enable the heat conduction silica gel piece 3 to form a good heat conduction path between the heating components of the main board 1 and the radiator 2, thereby helping to conduct the heat generated by the heating components of the main board 1 to the radiator 2 rapidly, reducing the working temperature of the solid state disk and improving the stability and performance of the solid state disk. Meanwhile, the heat-conducting silica gel sheet 3 has good insulating property, can prevent electrical short circuit and ensures safe operation of the solid state disk. In addition, the softness and high compressibility of the heat conduction silica gel sheet 3 enable the heat conduction silica gel sheet to have a certain damping effect, and can play a certain role in protecting the solid state disk. The solid state disk in the utility model adopts PCIe 4.0 interface standard, PCIe 4.0 is a fourth generation version of PCI-Express (PCIe) bus, which is a high-speed serial computer expansion bus standard, has the characteristics of high-speed serial, point-to-point dual-channel, high-bandwidth transmission and the like ‌, the reading speed is up to 7000MB/s, the flash memory particles 11 are TLC particles, the voltage state of the TLC particles is less, and the reading and the transmission of data are easier and faster.

As shown in fig. 2 and 3, the radiator 2 includes a heat dissipation plate 21 and a movable plate 25, the heat dissipation plate 21 is abutted with a heating element on the main board 1 through the heat conduction silica gel sheet 3, and a plurality of heat dissipation fins 24 are arranged on the surface of the heat dissipation plate 21 facing away from the main board 1, and the working principle of the heat dissipation fins 24 is to dissipate heat into air by increasing the surface area and convection. When heat is transferred from the heat-generating components of the motherboard 1 to the heat sink 21, the heat sink 21 contacts with air through the surface of the large-area heat-dissipating fins 24, and the heat is taken away by air flow, so that a heat dissipation effect is achieved, and the heat dissipation efficiency mainly depends on the size of the surface area and the speed ‌ of the air flow. In addition, two ends of the radiating fin 21 are respectively provided with a movable plate 25, the movable plates 25 are positioned on the surface of the radiating fin 21, which is opposite to the main board 1, and the radiating fins 24 on the radiating fin 21 are positioned between the two movable plates 25, wherein the radiating fin 21, the radiating fins 24 and the movable plates 25 are all made of metal aluminum, and the metal aluminum has good heat conductivity, light weight and easy processing, and can effectively improve the radiating efficiency.

It should be noted that, as shown in fig. 3 to 5, two movable plates 25 are respectively disposed at two ends of the heat sink 21 and stretch out and draw back, two sides of the surface of the heat sink 21 facing away from the main board 1 are respectively provided with a first support plate 22, two ends of the first support plate 22 are respectively provided with a sliding groove 23, two sides of the movable plate 25 are respectively provided with a second support plate 26, the side of the second support plate 26 facing away from the movable plate 25 is provided with a sliding block 27, and when the movable plate 25 is disposed at two ends of the heat sink 21 and stretch out and draw back, the sliding block 27 is located in the sliding groove 23. When the solid state disk is installed on a computer, the two movable plates 25 are retracted on the radiating fins 21 in a sliding manner, so that the movable plates 25 are prevented from influencing the installation of the solid state disk, and after the installation is completed, the movable plates 25 can be extended outwards according to actual conditions, so that the radiating area is further enlarged, and the radiating effect is improved. When the solid state disk is idle and stored, the movable plate 25 can also be outwards extended to the limit position, and extend out from the two ends of the radiator 2, and is suspended above the two ends of the main board 1, at this time, the movable plates 25 on the two radiators 2 can effectively cover and protect the interfaces at the two ends of the main board 1, so that the risk of damage to the interfaces of the solid state disk is reduced. Meanwhile, the size of the sliding groove 23 can be adjusted, the matching relation between the sliding groove 23 and the sliding block 27 is changed, so that when the sliding block 27 is slid, a certain pushing and pulling force is applied to the movable plate 25 and the sliding block 27 to realize the sliding of the sliding block 27 in the sliding groove 23, the expansion and contraction of the movable plate 25 are completed, and the random sliding of the movable plate 25 in the use process is avoided, so that the heat dissipation effect and the protection effect on the solid state disk interface are influenced. The cross section of the sliding block 27 is rectangular or square, so that the movable plate 25 is prevented from rotating around the sliding block 27 in the telescoping process, and the use of the movable plate 25 is prevented from being influenced.

Further, as shown in fig. 3, the heat sink 21, the heat sink fins 24 on the heat sink 21 and the first support plate 22 are integrally formed by adopting a stamping forming technology, that is, a metal plate is put into a die and formed by a stamping machine, and no welding is performed, so that the production speed is high and the production process is good. In addition, the surface of the movable plate 25 facing away from the heat sink 21 is provided with a plurality of heat dissipation fins 24, and the movable plate 25, the heat dissipation fins 24 on the movable plate 25 and the second support plate 26 are also integrally formed by adopting a stamping forming technology.

In summary, when the heat-conducting silicon sheet 3 is used, the heat radiator 2 is usually mounted on the outside of the main board 1 by tearing off the protective film of the heat-conducting silicon sheet 3 and then adhering the protective film between the heat-generating components of the main board 1 and the heat radiator 2 and tightly combining the protective film with proper pressure. When the solid state disk operates, the heat conducting silica gel sheet 3 can form a good heat conducting path between the heating element of the main board 1 and the radiator 2, so that heat generated by the heating element of the main board 1 is helped to be quickly conducted onto the radiator 2, the radiating fin 21 of the radiator 2 is contacted with air through the surface of the large-area radiating fin 24 and the sliding and unfolding movable plate 25, the heat is taken away by utilizing the air flow, the radiating effect is realized, the radiating performance is good, the working temperature of the solid state disk is reduced, the stability and the performance of the solid state disk are improved, and the radiating efficiency mainly depends on the size of the surface area and the speed of the air flow.

The foregoing is merely illustrative of specific embodiments of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the present utility model by using the design concept shall fall within the scope of the present utility model.

Claims (7)

1. A high-speed solid-state drive with a sliding structure for heat dissipation, characterized in that the solid-state drive includes a motherboard and a heat sink, two heat sinks are respectively disposed on the upper and lower surfaces of the motherboard, and a thermally conductive silicone pad is provided between the heat sink and the motherboard, the heat sink abutting against heat-generating components on the motherboard through the thermally conductive silicone pad, the heat sink comprising: A heat sink is provided, which abuts against the heat-generating components on the motherboard via the thermally conductive silicone pad, and the surface of the heat sink facing away from the motherboard is provided with a plurality of heat dissipation fins. The device includes two movable plates, which are respectively located at both ends of the heat sink and extend and retract. The movable plates are located on the surface of the heat sink facing away from the motherboard, and the heat dissipation fins on the heat sink are located between the two movable plates. The heat sink, heat dissipation fins, and movable plates are all made of metal. When the movable plates at both ends of the heat sink extend outward to their limit positions, the two movable plates are suspended above both ends of the motherboard. 2. The high-speed solid-state drive with sliding structure heat dissipation as described in claim 1, characterized in that: the heat sink, heat dissipation fins and movable plate are all made of aluminum. 3. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 1, characterized in that: a first support plate is provided on both sides of the surface of the heat sink facing away from the motherboard, and a sliding groove is provided at both ends of the first support plate; a second support plate is provided on both sides of the movable plate, and a slider is provided on the side of the second support plate facing away from the movable plate; when the movable plate extends and retracts at both ends of the heat sink, the slider slides within the sliding groove. 4. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 3, wherein the cross-section of the slider is rectangular or square. 5. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 4, characterized in that: the heat sink, the heat dissipation fins on the heat sink, and the first support plate are integrally formed. 6. A high-speed solid-state drive with a sliding structure for heat dissipation as described in claim 1, characterized in that: the surface of the movable plate facing away from the heat sink is provided with a plurality of heat dissipation fins. 7. A high-speed solid-state drive with sliding structure for heat dissipation as described in claim 6, characterized in that: the movable plate, the heat dissipation fins on the movable plate, and the second support plate are integrally formed.