CN223637961U - A heat dissipation mechanism for computer memory modules - Google Patents
A heat dissipation mechanism for computer memory modulesInfo
- Publication number
- CN223637961U CN223637961U CN202520029173.XU CN202520029173U CN223637961U CN 223637961 U CN223637961 U CN 223637961U CN 202520029173 U CN202520029173 U CN 202520029173U CN 223637961 U CN223637961 U CN 223637961U
- Authority
- CN
- China
- Prior art keywords
- plate
- heat dissipation
- slot
- heat
- mounting base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请涉及计算机散热技术领域，公开了一种计算机用内存条散热机构。本申请中，包括安装底板，安装底板的表面开设有若干个内存条插槽，安装底板的表面开设有插槽一，插槽一设置在内存条插槽的一侧，安装底板的表面开设有插槽二，插槽二设置在内存条插槽的另一侧，插槽一的内部插接有插接板一，插接板一的上端设置有散热板一，插槽二的内部插接有插接板二，插接板二的上端设置有散热板二，散热板一及散热板二的一侧设置有若干个散热鳍片，插槽二的内部安装有复位弹簧，复位弹簧的一侧设置有与插接板二相对应的抵接板，安装底板的一侧安装有散热风扇，通过以上设计，使得散热板二可以便于拆卸，进而方便对内存条进行拆装，提高便捷性。
This application relates to the field of computer heat dissipation technology and discloses a heat dissipation mechanism for computer memory modules. The mechanism includes a mounting base plate with several memory module slots on its surface. Slot 1 is located on one side of the memory module slots, and Slot 2 is located on the other side. A connector plate 1 is inserted into Slot 1, with a heat sink 1 mounted on its upper end. Similarly, a connector plate 2 is inserted into Slot 2, with a heat sink 2 mounted on its upper end. Several heat dissipation fins are provided on one side of both heat sinks. A return spring is installed inside Slot 2, with a corresponding abutment plate on one side of the return spring. A cooling fan is installed on one side of the mounting base plate. This design allows for easy removal of the heat sink 2, facilitating the installation and removal of the memory modules and improving convenience.
Description
Technical Field
The application belongs to the technical field of computer heat dissipation, and particularly relates to a memory bank heat dissipation mechanism for a computer.
Background
The heat can be generated in the using process of the memory strip of the computer, if the heat cannot be well dissipated, the working of the computer can be influenced, and the heat dissipation aspect is achieved, so that the player's final goal is reached. And the appearance is good, the memory is an embarrassing existence. After all, the heat dissipation of the memory can be available, and in terms of the general strip with the largest installed amount, no heat dissipation device is usually arranged. Memory has been updated rapidly in recent years, and the age of DDR5 has been reached. The memory capacity is not only implemented by the G technology, but also the frequency is greatly improved as far as the memory is concerned.
The memory bank heat dissipation mechanism for the computer in the bulletin No. CN219302971U comprises a shell, wherein a first slot hole is formed in one side of the shell, a first screw is arranged on the inner surface of the first slot hole, a second slot hole is formed in one side of the shell, a second screw is arranged on the inner surface of the second slot hole, a heat dissipation fin is fixedly connected to one side of the shell, a heat dissipation fan is fixedly arranged on one side of the shell, a first heat conduction silica gel sheet is fixedly connected to one side of the shell, a notch is formed in one side of the shell, and a heat dissipation block is arranged on the inner surface of the notch. The heat dissipation mechanism has the advantages that all the heat dissipation mechanisms are made of aluminum alloy materials, good heat dissipation performance is achieved, the heat conduction silica gel sheet is arranged between the heat dissipation blocks and the memory strips, so that heat emitted by the memory strips can be better transferred out, and the heat dissipation mechanism can dissipate heat of one to four memory strips.
However, the memory strip in the application is inserted between the radiating blocks, and because the memory strip is abutted with the radiating blocks, when the memory strip needs to be replaced, the radiating blocks are removed, so that the efficiency of removing and replacing is reduced.
Disclosure of utility model
The application aims to solve the problems that the memory strip is inserted between the radiating blocks in the application, and the radiating blocks are removed when the memory strip needs to be replaced because the memory strip is abutted against the radiating blocks, so that the efficiency of removing and replacing is reduced, and provides the memory strip radiating mechanism for the computer.
The technical scheme includes that the memory strip heat dissipation mechanism for the computer comprises a mounting bottom plate, wherein a plurality of memory strip slots are formed in the surface of the mounting bottom plate, a first slot is formed in the surface of the mounting bottom plate, the first slot is arranged on one side of the memory strip slots, a second slot is formed in the surface of the mounting bottom plate, the second slot is arranged on the other side of the memory strip slots, a first plug board is inserted into the first slot, a first heat dissipation plate is arranged at the upper end of the first plug board, a second plug board is inserted into the second slot, a second heat dissipation plate is arranged at the upper end of the second plug board, a plurality of heat dissipation fins are arranged on one side of the first heat dissipation plate and one side of the second heat dissipation plate, a reset spring is arranged in the second slot, an abutting plate corresponding to the second plug board is arranged on one side of the second plug board, and a heat dissipation fan corresponding to the first heat dissipation plate and the second heat dissipation plate is arranged on one side of the mounting bottom plate.
Through adopting above-mentioned technical scheme, through above design for heating panel two can convenient to detach, and then conveniently dismouting to the memory strip improves the convenience.
In a preferred embodiment, a limiting chute corresponding to the abutting plate is formed in the mounting bottom plate, and the lower end of the abutting plate is slidably connected to the inside of the limiting chute.
Through adopting above-mentioned technical scheme, through the lower extreme slip of butt board in the inside of spacing spout, the removal of butt board is spacing, makes its operation more steady, improves the stability of device.
In a preferred embodiment, a chute corresponding to the abutting plate is formed in one side of the mounting bottom plate, a fixing bolt is connected to the chute in a sliding manner, a connecting plate is arranged on one side of the fixing bolt, and one end of the connecting plate is connected with the abutting plate.
Through adopting above-mentioned technical scheme, make the connecting plate drive the butt board through fixing bolt and compress reset spring for can remove the butt to the second board of inserting, make things convenient for dismantling of heating panel two, improve the convenience.
In a preferred embodiment, fixing screw holes are formed in two ends of the inside of the sliding groove, and pushing blocks corresponding to the fixing screw holes are connected with the inner threads of the fixing bolts.
Through adopting above-mentioned technical scheme, through the inside of pushing block rotation advance corresponding fixed screw, and then fix the butt plate, avoid rocking when the installation, stability when improving the installation.
In a preferred embodiment, a heat conducting silicon wafer is adhered to one side surface of the first heat dissipation plate and one side surface of the second heat dissipation plate.
Through adopting above-mentioned technical scheme, heat conduction silicon chip can give heating panel one and heating panel two with the heat that the memory strip produced fast, reduces the accumulation of heat in the inside of memory strip to effectively reduce the temperature of memory strip, simultaneously, also can play the cushioning effect, alleviate the mutual collision and the friction between memory strip and heating panel one and the heating panel two, protect memory strip, prolong its life.
In a preferred embodiment, a limiting slot is formed in a surface of one side of the second plug board, a limiting plug block corresponding to the limiting slot is arranged on one side of the abutting board, and the limiting plug block is inserted into the limiting slot.
Through adopting above-mentioned technical scheme, under the promotion of butt board for spacing inserted block pegging graft in the inside of spacing slot, and then carry out spacing fixed to the second inserted plate, improve the stability of the second inserted plate grafting in the second inside of slot.
In a preferred embodiment, the first heat dissipation plate and the second heat dissipation plate are made of aluminum alloy.
Through adopting above-mentioned technical scheme, it has higher thermal conductivity, after the chip on the memory strip produced heat, it can be effectively comes the heat conduction, makes the inside evenly distributed of heat at heating panel one and heating panel two, reduces the heat and in the circumstances of local pile up, effectually gives off the heat, improves radiating efficiency.
In summary, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
According to the application, when the memory bank needs to be replaced, the connecting plate drives the abutting plate to compress the reset spring through the fixing bolt, so that the abutting of the second abutting plate can be relieved, the second radiating plate is convenient to dismantle, the memory bank can be further dismantled and replaced, and when the memory bank is replaced, the abutting plate pushes the second abutting plate under the action of the elasticity of the reset spring to fix the second radiating plate, and the stability is improved.
Drawings
FIG. 1 is a schematic diagram of a front structure of a heat dissipating device according to the present application;
FIG. 2 is a schematic diagram of a front structure of a heat dissipating plate device according to the present application;
FIG. 3 is a schematic view of the internal structure of the spring device of the present application;
FIG. 4 is a schematic plan view of a pusher device according to the present application;
fig. 5 is a schematic plan view of a limiting device according to the present application.
The mark in the figure is 1, a mounting bottom plate; 2, a heat radiation fin, 3, a first heat radiation plate, 4, a second heat radiation plate, 5, a heat radiation fan, 6, a heat conduction silicon wafer, 7, a first plugboard, 8, a first slot, 9, a memory strip slot, 10, a second slot, 11, an abutting board, 12, a pushing block, 13, a fixing bolt, 14, a sliding slot, 15, a second plugboard, 16, a connecting plate, 17, a limiting sliding slot, 18, a reset spring, 19, a fixing screw hole, 20, a limiting slot, 21 and a limiting plug.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described in the following in conjunction with the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-5, a memory bank heat dissipation mechanism for a computer includes a mounting base plate 1, a plurality of memory bank slots 9 are formed on the surface of the mounting base plate 1, a first slot 8 is formed on the surface of the mounting base plate 1, the first slot 8 is arranged on one side of the memory bank slots 9, a second slot 10 is formed on the surface of the mounting base plate 1, the second slot 10 is arranged on the other side of the memory bank slots 9, a first plug board 7 is inserted into the first slot 8, a first heat dissipation plate 3 is arranged at the upper end of the first plug board 7, a second plug board 15 is inserted into the second slot 10, a second heat dissipation plate 4 is arranged at the upper end of the second plug board 15, a plurality of heat dissipation fins 2 are arranged on one side of the first heat dissipation plate 3 and the second heat dissipation plate 4, a reset spring 18 is arranged in the interior of the second slot 10, a heat dissipation fan 5 corresponding to the second plug board 15 is arranged on one side of the mounting base plate 1, and the second heat dissipation fan 5 corresponding to the first heat dissipation plate 3 and the second heat dissipation plate 4 is arranged on one side of the mounting base plate 1.
Referring to fig. 3, a limit chute 17 corresponding to the abutting plate 11 is provided in the mounting base plate 1, the lower end of the abutting plate 11 is slidably connected in the limit chute 17, and the movement of the abutting plate 11 is limited by sliding the lower end of the abutting plate 11 in the limit chute 17, so that the movement of the abutting plate 11 is more stable, and the stability of the device is improved.
Referring to fig. 3, a chute 14 corresponding to the abutting plate 11 is provided on one side of the mounting base plate 1, a fixing bolt 13 is slidably connected in the chute 14, a connecting plate 16 is provided on one side of the fixing bolt 13, one end of the connecting plate 16 is connected with the abutting plate 11, the connecting plate 16 drives the abutting plate 11 to compress a return spring 18 through the fixing bolt 13, so that the abutting of the second plugging plate 15 can be relieved, the second cooling plate 4 can be removed conveniently, and convenience is improved.
Referring to fig. 1 to 4, fixing screw holes 19 are formed at both ends of the inside of the chute 14, push blocks 12 corresponding to the fixing screw holes 19 are connected with internal threads of the fixing bolts 13, and the push blocks 12 are rotated into the corresponding fixing screw holes 19, so that the abutting plate 11 is fixed, shaking during installation is avoided, and stability during installation is improved.
Referring to fig. 2, a heat conducting silicon wafer 6 is adhered to one side surface of the first heat dissipation plate 3 and the second heat dissipation plate 4, the heat conducting silicon wafer 6 can rapidly transfer heat generated by the memory bank to the first heat dissipation plate 3 and the second heat dissipation plate 4, and accumulation of the heat in the memory bank is reduced, so that the temperature of the memory bank is effectively reduced, meanwhile, a buffering effect can be achieved, mutual collision and friction between the memory bank and the first heat dissipation plate 3 and the second heat dissipation plate 4 are reduced, the memory bank is protected, and the service life of the memory bank is prolonged.
Referring to fig. 5, a limiting slot 20 is formed on a surface of one side of the second plug board 15, a limiting insert 21 corresponding to the limiting slot 20 is disposed on one side of the abutting board 11, the limiting insert 21 is inserted into the limiting slot 20, and under the pushing of the abutting board 11, the limiting insert 21 is inserted into the limiting slot 20, so that the second plug board 15 is limited and fixed, and the stability of the second plug board 15 inserted into the second slot 10 is improved.
Referring to fig. 1-5, the first and second heat dissipation plates 3 and 4 are made of aluminum alloy, which has high heat conductivity, and after the chips on the memory bank generate heat, the chips can effectively conduct the heat, so that the heat is uniformly distributed in the first and second heat dissipation plates 3 and 4, the situation that the heat is locally accumulated is reduced, the heat is effectively dissipated, and the heat dissipation efficiency is improved.
The application relates to a memory bar heat dissipation mechanism for a computer, which comprises the following implementation principles:
When the memory bank needs to be replaced, the push block 12 is rotated to enable the memory bank to be moved out of the fixing screw hole 19, fixing of the fixing bolt 13 is released, then the connecting plate 16 drives the abutting plate 11 to compress the reset spring 18 through the fixing bolt 13, abutting of the second plug plate 15 can be released, detachment of the second heat dissipation plate 4 is facilitated, the push block 12 is rotated into the corresponding fixing screw hole 19, the fixing bolt 13 is fixed, the memory bank is convenient to detach and replace, when the memory bank is replaced, fixing of the fixing bolt 13 is released, under the action of elasticity of the reset spring 18, the abutting plate 11 pushes the second plug plate 15, the limiting plug block 21 is inserted into the limiting slot 20, the second heat dissipation plate 4 is fixed, the push block 12 is rotated into the corresponding fixing screw hole 19, the fixing bolt 13 is fixed, replacement of the memory bank is completed, and stability and convenience are improved.
The foregoing embodiments are merely for illustrating the technical solution of the present application, but not for limiting the same, and although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that modifications may be made to the technical solution described in the foregoing embodiments or equivalents may be substituted for parts of the technical features thereof, and that such modifications or substitutions do not depart from the spirit and scope of the technical solution of the embodiments of the present application in essence.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520029173.XU CN223637961U (en) | 2025-01-07 | 2025-01-07 | A heat dissipation mechanism for computer memory modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202520029173.XU CN223637961U (en) | 2025-01-07 | 2025-01-07 | A heat dissipation mechanism for computer memory modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223637961U true CN223637961U (en) | 2025-12-05 |
Family
ID=97863948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202520029173.XU Active CN223637961U (en) | 2025-01-07 | 2025-01-07 | A heat dissipation mechanism for computer memory modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223637961U (en) |
-
2025
- 2025-01-07 CN CN202520029173.XU patent/CN223637961U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN219574768U (en) | Memory bank module water-cooling heat abstractor and server water-cooling heat dissipation system | |
| US20110056670A1 (en) | Heat sink | |
| CN113985989A (en) | Heat dissipation equipment | |
| CN223637961U (en) | A heat dissipation mechanism for computer memory modules | |
| CN216719055U (en) | Hard disk heat dissipation device and hard disk assembly | |
| CN100345289C (en) | heat pipe radiator | |
| CN218630726U (en) | Memory bank heat radiation structure | |
| CN216210886U (en) | Vacuum cavity temperature equalizing plate heat dissipation device for computer chip | |
| CN219536721U (en) | Locking structure for electronic module with heat conduction cooling structure | |
| CN210864552U (en) | CPU chip and display card integrated heat dissipation module | |
| CN216491219U (en) | A high-efficiency heat dissipation HDI circuit board | |
| CN218825455U (en) | A kind of CPU radiator, computer | |
| CN2755781Y (en) | Integrated heat sink | |
| CN1681113A (en) | heat pipe radiator | |
| CN217426052U (en) | A kind of computer hard disk installation structure | |
| CN216249128U (en) | A low-consumption and energy-saving computer CPU radiator | |
| CN223651163U (en) | A high-speed solid-state drive with a sliding structure for heat dissipation | |
| CN220528433U (en) | Power board heat radiation structure | |
| CN216958007U (en) | A PCB board that can efficiently dissipate heat | |
| CN220933456U (en) | Double heat dissipation device for computer | |
| CN215987212U (en) | Computer mainboard radiator of swift installation | |
| CN216486346U (en) | A radiator with a protective device | |
| CN219891627U (en) | Computer CPU radiator | |
| CN223582688U (en) | Network additional memory | |
| CN222105700U (en) | A compact micro-integrated optical path carrier substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |