CN223613529U - Power adapter back chip heat dissipation structure - Google Patents
Power adapter back chip heat dissipation structureInfo
- Publication number
- CN223613529U CN223613529U CN202422894639.0U CN202422894639U CN223613529U CN 223613529 U CN223613529 U CN 223613529U CN 202422894639 U CN202422894639 U CN 202422894639U CN 223613529 U CN223613529 U CN 223613529U
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- heat dissipation
- heat
- heat transfer
- power adapter
- aluminum
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Abstract
The utility model relates to the technical field of heat dissipation of power adapters, in particular to a heat dissipation structure of a back chip of a power adapter, which comprises an aluminum shell, an aluminum substrate and a control board, wherein the aluminum shell is provided with a placement cavity, the aluminum substrate is arranged on the placement cavity, the bottom surface of the placement cavity is provided with a heat transfer surface, one surface of the aluminum substrate is attached to the heat transfer surface, a heat transfer area is arranged on the aluminum substrate, a heating chip is arranged on the control board, one surface of the heating chip is attached to the heat transfer area, and the aluminum substrate transfers heat of the heating chip towards the aluminum shell through the heat transfer area. According to the utility model, a high-efficiency and stable heat dissipation system is constructed through the precise matching among the aluminum shell, the aluminum substrate and the control board. The system not only remarkably improves the heat radiation performance of the power adapter and prolongs the service life of the power adapter, but also reduces the fault risk caused by overheat, and provides safer and more reliable electricity utilization experience for users.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of power adapters, in particular to a heat dissipation structure of a back chip of a power adapter.
Background
The power adapter, also called external power supply, is a small portable electronic device and power supply voltage conversion device for electronic appliances. The device is widely applied to small electronic equipment such as mobile phones, liquid crystal display screens, computer notebooks and the like, and is also commonly used in equipment such as security cameras, television set top boxes, wireless routers, lamp bars, massage instruments and the like. The basic working principle of the power adapter is to convert alternating current input into direct current output, and the power adapter is generally composed of components such as a shell, a transformer, an inductor, a capacitor, a control IC, a PCB and the like.
The heat dissipation structure of the power adapter is an important part of the internal design, particularly in a switching power supply working under high voltage and high current conditions, the work load is heavy, the power adapter is usually a totally-enclosed structure, and the shell is not provided with heat dissipation holes, so the heat dissipation design is particularly important. Existing heat dissipation structures typically have a built-in or externally mounted fan to dissipate heat from the power adapter. However, the existing fan heat dissipation mode affects rapid heat dissipation due to the problem of low heat transfer efficiency. New improvements to existing heat dissipating structures are therefore needed.
Disclosure of utility model
In order to solve the problems, the utility model constructs a high-efficiency and stable heat dissipation system through the precise matching among the aluminum shell, the aluminum substrate and the control board. The system not only remarkably improves the heat radiation performance of the power adapter and prolongs the service life of the power adapter, but also reduces the fault risk caused by overheating, and provides a safer and more reliable power consumption experience power adapter back chip heat radiation structure for users.
The technical scheme includes that the back chip heat dissipation structure of the power adapter comprises an aluminum shell, an aluminum substrate and a control board, wherein the aluminum shell is provided with a placement cavity, the aluminum substrate is arranged on the placement cavity, a heat transfer surface is arranged on the bottom surface of the placement cavity, one surface of the aluminum substrate is attached to the heat transfer surface, a heat transfer area is arranged on the aluminum substrate, a heating chip is arranged on the control board, one surface of the heating chip is attached to the heat transfer area, and the aluminum substrate transfers heat of the heating chip towards the aluminum shell through the heat transfer area.
The aluminum shell is provided with a heat dissipation part on one surface facing away from the heat transfer surface, the heat dissipation part is provided with a fan installation area and heat dissipation fins, and the heat dissipation fins are located on the periphery of the fan installation area.
The heat dissipation fins are arranged in a plurality, the heat dissipation fins are arranged on the fan installation area in a surrounding mode, fixed installation columns are arranged on the heat dissipation fins, and fixing holes are formed in the fixed installation columns.
According to the scheme, the aluminum shell is provided with the outer edge of the attaching part, and the outer edge of the attaching part is provided with the sealing groove for accommodating the sealing ring to seal the attaching cavity.
The improvement of the scheme is that the outer edge of the joint is provided with a plurality of connecting columns, and the connecting columns are provided with connecting holes.
The improvement of the scheme is that a plurality of mounting positioning pins are arranged on the outer edge of the binding.
The aluminum shell is integrally formed by casting aluminum alloy or pure aluminum.
The aluminum shell is characterized in that a first interface groove and a second interface groove are formed in two sides of the aluminum shell, and one ends of the first interface groove and the second interface groove are communicated to the placement cavity.
According to the technical scheme, the aluminum substrate is provided with the copper-clad layer, the copper-clad layer is formed on the heat transfer surface through spraying, the surface of the copper-clad layer is a flat surface and is used for being attached to the aluminum substrate, the heat transfer surface is provided with the mounting holes, and the aluminum substrate is provided with the through holes so as to penetrate through the screws to fix the aluminum substrate on the heat transfer surface.
The heat transfer surface is provided with a fixed pressing hole, a pressing block is arranged on the fixed pressing hole, a pressing groove is formed in the aluminum substrate, and the pressing block is arranged on the pressing groove so as to press and attach the aluminum substrate on the heat transfer surface.
The aluminum substrate is provided with an insulating layer, and the heat transfer area is exposed on the insulating layer.
The heating chip is provided with a heat-conducting metal sheet, and one surface of the heat-conducting metal sheet is attached to the heat transfer area.
The utility model has the beneficial effects that:
Compared with the existing power adapter chip for heat dissipation, the aluminum shell is adopted as the main structure, so that the excellent heat conductivity and the lightweight characteristic of the aluminum material are fully utilized. The arrangement cavity arranged in the aluminum shell not only provides stable support for the internal components, but also constructs a high-efficiency heat conduction path through the heat transfer surface arranged on the bottom surface of the aluminum shell. This design makes the heat can be fast from the internal component transfer to aluminum hull surface, and then gives off to external environment fast through modes such as natural convection or fin, has effectively reduced power adapter's operating temperature. Secondly, the aluminum substrate is used as a key heat conduction medium, and a heat conduction area with a carefully designed surface is closely attached to the heating chip. The fitting design greatly reduces the thermal resistance, so that the heat generated by the heating chip can be transferred to the aluminum substrate almost without loss. The aluminum substrate uniformly distributes and guides the heat to the heat transfer surface of the aluminum shell, so that the efficient and orderly transfer of the heat is realized, and the occurrence of local overheating phenomenon is avoided. In addition, the layout of the heating chip on the control board corresponds to the heat transfer area of the aluminum substrate accurately, so that the heat dissipation efficiency is further improved. The design not only optimizes the heat conduction path, but also ensures reasonable utilization of the internal space of the power adapter, and improves the compactness and integration of the whole structure. According to the utility model, a high-efficiency and stable heat dissipation system is constructed through the precise matching among the aluminum shell, the aluminum substrate and the control board. The system not only remarkably improves the heat radiation performance of the power adapter and prolongs the service life of the power adapter, but also reduces the fault risk caused by overheat, and provides safer and more reliable electricity utilization experience for users.
Drawings
FIG. 1 is a schematic perspective view of a heat dissipation structure for a back chip of a power adapter according to the present utility model;
FIG. 2 is a schematic perspective view of the back side chip heat dissipation structure of the power adapter of FIG. 1 from another perspective;
FIG. 3 is an exploded view of the back side chip heat dissipating structure of the power adapter of FIG. 1;
fig. 4 is a schematic diagram of a portion of the heat dissipation structure of the back side chip of the power adapter of fig. 1.
The reference numerals indicate that the aluminum case 1, the installation cavity 11, the heat transfer surface 12, the pressing block 121, the heat radiating part 13, the fan installation area 131, the heat radiating fins 132, the fixed installation column 133, the fixed hole 134, the attaching outer edge 14, the sealing groove 141, the connecting column 142, the connecting hole 143, the installation positioning pin 144, the first interface groove 15, the second interface groove 16, the aluminum substrate 2, the heat transfer area 21, the heat conducting metal sheet 311, the control board 3, and the heat generating chip 31.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As shown in fig. 1 to 4, an embodiment of the utility model relates to a heat dissipation structure for a back chip of a power adapter, which comprises an aluminum shell 1, an aluminum substrate 2 and a control board 3, wherein the aluminum shell 1 is provided with a placement cavity 11, the aluminum substrate 2 is arranged on the placement cavity 11, the bottom surface of the placement cavity 11 is provided with a heat transfer surface 12, one surface of the aluminum substrate 2 is attached to the heat transfer surface 12, a heat transfer area 21 is arranged on the aluminum substrate 2, a heating chip 31 is arranged on the control board 3, one surface of the heating chip 31 is attached to the heat transfer area 21, and the aluminum substrate 2 transfers heat of the heating chip 31 towards the aluminum shell 1 through the heat transfer area 21. In this embodiment, the aluminum case 1 is used as a main structure, thereby making full use of excellent heat conductivity and lightweight characteristics of aluminum. The arrangement cavity 11 provided inside the aluminum housing 1 not only provides a stable support for the internal components, but also constructs an efficient heat conduction path through the heat transfer surface 12 provided at the bottom surface thereof. This design makes the heat can be fast from the internal component transfer to aluminum hull 1 surface, and then gives off to external environment fast through modes such as natural convection or fin, has effectively reduced power adapter's operating temperature. Next, the aluminum substrate 2 serves as a key heat transfer medium, and the surface of the aluminum substrate is closely attached to the heat generating chip 31 by the carefully designed heat transfer area 21. This conforming design greatly reduces the thermal resistance so that the heat generated by the heat generating chip 31 can be transferred to the aluminum substrate 2 with little loss. The aluminum substrate 2 distributes and guides the heat to the heat transfer surface 12 of the aluminum shell 1 uniformly, so that the heat is transferred efficiently and orderly, and the local overheating phenomenon is avoided. In addition, the layout of the heating chip 31 on the control board 3 corresponds to the heat transfer area 21 of the aluminum substrate 2 precisely, so that the heat dissipation efficiency is further improved. The design not only optimizes the heat conduction path, but also ensures reasonable utilization of the internal space of the power adapter, and improves the compactness and integration of the whole structure. In the embodiment, a high-efficiency and stable heat dissipation system is constructed through the precise matching among the aluminum shell 1, the aluminum substrate 2 and the control board 3. The system not only remarkably improves the heat radiation performance of the power adapter and prolongs the service life of the power adapter, but also reduces the fault risk caused by overheat, and provides safer and more reliable electricity utilization experience for users.
The aluminum shell 1 is provided with a heat dissipation part 13 on the surface facing away from the heat transfer surface 12, the heat dissipation part 13 is provided with a fan installation area 131 and heat dissipation fins 132, and the heat dissipation fins 132 are positioned on the periphery of the fan installation area 131. Specifically, a plurality of heat dissipation fins 132 are provided, a plurality of heat dissipation fins 132 are enclosed on the fan mounting area 131, a fixed mounting post 133 is provided on the heat dissipation fins 132, and a fixing hole 134 is provided on the fixed mounting post 133. In this embodiment, by skillfully providing the fan mounting region 131 and the heat dissipation fins 132 on the heat dissipation portion 13, efficient heat conduction and dissipation are achieved. Specifically, the plurality of heat dissipation fins 132 are disposed around the fan mounting area 131, so as to form a wide heat dissipation area, thereby greatly improving heat dissipation efficiency. The fixing and mounting posts 133 and the fixing holes 134 provided on the heat dissipation fins 132 not only ensure the stable installation of the heat dissipation fins 132, but also facilitate the subsequent maintenance and replacement. The structural design not only improves the working stability of the power adapter, but also prolongs the service life of the power adapter.
The outer periphery of the aluminum shell 1, which is positioned in the placement cavity 11, is provided with a fitting outer edge 14, and the fitting outer edge 14 is provided with a sealing groove 141 for accommodating a sealing ring to seal the placement cavity 11. Specifically, the attaching outer edge 14 is provided with a plurality of connecting posts 142, and the connecting posts 142 are provided with connecting holes 143. The outer conformable rim 14 is provided with a plurality of mounting locator pins 144. In this embodiment, through laminating sealing groove 141 that sets up on the outer edge 14, can accurately hold the sealing washer to the realization is to the effective seal of settling chamber 11, has promoted the sealing performance of structure by a wide margin, has effectively prevented impurity invasion such as outside dust, moisture, has ensured the steady operation of electronic component such as inside chip. In addition, the plurality of connecting columns 142 and the connecting holes 143 which are designed on the attaching outer edge 14 not only strengthen the connecting strength of the structure, but also facilitate the stable assembly with other parts of the power adapter, and improve the reliability and the stability of the whole structure. Meanwhile, the plurality of mounting positioning pins 144 further ensure the accurate positioning of the aluminum shell 1 in the heat radiation structure, and avoid the problems of poor heat radiation or structural damage and the like caused by position deviation.
The aluminum shell 1 is integrally formed by casting aluminum alloy or pure aluminum. Specifically, a first interface groove 15 and a second interface groove 16 are arranged on two sides of the aluminum shell 1, and one ends of the first interface groove 15 and the second interface groove 16 are communicated with the placement cavity 11. In this embodiment, the design of the aluminum shell 1 fully utilizes the excellent heat conducting property of aluminum alloy or pure aluminum, and can effectively conduct the heat generated by the chip to the surface of the aluminum shell 1, so as to realize the rapid heat dissipation by natural convection or forced air cooling. In addition, the first interface groove 15 and the second interface groove 16 that the aluminum hull 1 both sides set up not only provide convenience for power adapter's interface connection, and the one end in these two interface grooves all communicates to settling chamber 11 moreover, has further optimized the heat dissipation route for the heat can be conducted to the aluminum hull 1 outside more smoothly from the chip. The design not only improves the heat radiation efficiency of the power adapter and ensures the stable operation of the chip, but also greatly prolongs the service life of the product. Meanwhile, the aluminum shell 1 is firm and durable in structure due to the casting integrated forming process, can bear larger external force and impact, and provides powerful guarantee for the overall performance of the power adapter.
The heat transfer surface 12 is provided with a copper-clad layer by spraying, the surface of the copper-clad layer is a flat surface for attaching the aluminum substrate 2, the heat transfer surface 12 is provided with mounting holes, and the aluminum substrate 2 is provided with through holes for fixing the aluminum substrate 2 on the heat transfer surface 12 through screws. Specifically, the heat transfer surface 12 is provided with a fixed pressing hole, a pressing block 121 is arranged on the fixed pressing hole, a pressing groove is arranged on the aluminum substrate 2, and the pressing block 121 is arranged on the pressing groove so as to press and attach the aluminum substrate 2 on the heat transfer surface 12. In this embodiment, the copper-clad layer not only enhances the heat conductivity, but also ensures close adhesion with the aluminum substrate 2 through its flat surface, thereby reducing the thermal resistance and optimizing the heat transfer path. In addition, by providing mounting holes and through holes and fixing the aluminum substrate 2 to the heat transfer surface 12 using screws, a stable mechanical connection is achieved. The fixing mode ensures the stability of the heat dissipation structure, is favorable for keeping good contact between the aluminum substrate 2 and the heat transfer surface 12, and further improves the heat dissipation effect. More specifically, the aluminum substrate 2 is pressed against the heat transfer surface 12 by the design of the fixing press hole and the press block 121, effectively preventing the loosening problem due to vibration or temperature variation. The press block 121 is matched with the pressing groove on the aluminum substrate 2 to form additional fixing force, so that the reliability and durability of the heat dissipation structure are further enhanced.
An insulating layer is provided on the aluminum substrate 2, and the heat transfer area 21 is exposed on the insulating layer. In this embodiment, the aluminum substrate 2 has good heat conducting property, and can rapidly conduct out the heat generated by the chip, so that the internal temperature of the power adapter is effectively reduced. Through setting up the insulating layer, can ensure electrical safety, avoid the emergence of problems such as electric current leakage or short circuit, further improved the reliability of product. Next, the heat transfer area 21 is exposed on the insulating layer, so that the heat dissipation performance of the aluminum substrate 2 can be maximally utilized. This design allows for a more direct and rapid transfer of heat to the external environment, thereby improving heat dissipation efficiency.
The heat generating chip 31 is provided with a heat conductive metal sheet 311, and one surface of the heat conductive metal sheet 311 is attached to the heat transfer area 21. In this embodiment, the heat conducting metal sheet 311 is used as a high-efficiency heat conducting medium, and one surface of the heat conducting metal sheet is closely attached to the heat conducting area 21 of the chip, so that heat generated during the operation of the chip can be rapidly absorbed and dispersed. The design greatly improves the heat transfer efficiency, and effectively reduces the temperature rise of the chip, thereby ensuring the stability and reliability of the chip. In addition, the use of the thermally conductive metal sheet 311 also enhances the overall heat dissipation performance of the power adapter. The heat conductive metal sheet 311 can further release heat to the outside through heat exchange with the surrounding environment, thereby avoiding accumulation of heat inside the power adapter. This not only prolongs the service life of the power adapter, but also improves its work efficiency and safety.
The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422894639.0U CN223613529U (en) | 2024-11-27 | 2024-11-27 | Power adapter back chip heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422894639.0U CN223613529U (en) | 2024-11-27 | 2024-11-27 | Power adapter back chip heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223613529U true CN223613529U (en) | 2025-11-28 |
Family
ID=97786475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422894639.0U Active CN223613529U (en) | 2024-11-27 | 2024-11-27 | Power adapter back chip heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223613529U (en) |
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2024
- 2024-11-27 CN CN202422894639.0U patent/CN223613529U/en active Active
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