CN223611901U

CN223611901U - A heat dissipation structure for a high-power CPU in a cantilever all-in-one computer

Info

Publication number: CN223611901U
Application number: CN202423297073.XU
Authority: CN
Inventors: 赵明; 蒋京阳
Original assignee: Shanghai Yiyao Electronics Co ltd
Current assignee: Shanghai Yiyao Electronics Co ltd
Priority date: 2024-12-30
Filing date: 2024-12-30
Publication date: 2025-11-28
Anticipated expiration: 2034-12-30

Abstract

This utility model discloses a heat dissipation structure for a high-power CPU in a cantilever all-in-one computer. It relates to a heat dissipation structure comprising a chassis, a rear mount, buttons, a cover plate, a motherboard, an interface board, copper pipes, and a heat sink. The copper pipes are fixed to the heat sink with thermally conductive adhesive. The heat sink is fixed to the rear mount with M3 screws. The chassis is fixed to the rear mount with M6 hex socket screws. The interface board is fixed to the rear mount with M3 screws. The motherboard is fixed to the interface board with M3 screws. USB ports or buttons are installed in holes on both sides of the rear mount. The rear mount is fixed to the screen with M4 screws. The cover plate covers the rear mount. This utility model solves the problem of CPU heat dissipation to the casing under IP65 protection level.

Description

Radiating structure of high-power CPU of cantilever integrated machine

Technical Field

The utility model relates to a heat radiation structure, in particular to a heat radiation structure of a high-power CPU of a cantilever integrated machine.

Background

The CPU of U series is named as low power consumption model, but the power of the CPU is more than 60W after the frequency is operated because the frequency exceeds 4GHZ from 11 generations, and the heat dissipation becomes a difficult problem.

Disclosure of utility model

Aiming at the defects existing in the prior art, the utility model aims to provide a radiating structure of a high-power CPU of a cantilever integrated machine, which solves the problem that the CPU radiates heat to a shell under the protection level of IP 65.

The heat dissipation structure of the cantilever integrated machine high-power CPU comprises a box seat, a rear hanging piece, a button, a cover plate, a main board, an interface board, copper pipes and a heat dissipation shell, wherein the copper pipes are fixed on the heat dissipation shell through heat conduction glue, the heat dissipation shell is fixed on the rear hanging piece through M3 screws, the box seat is fixed on the rear hanging piece through M6 socket head cap screws, the interface board is fixed on the rear hanging piece through M3 screws, the main board is fixed on the interface board through M3 screws, USB or buttons are arranged in holes on the left side and the right side of the rear hanging piece, the rear hanging piece is fixed on a screen body through M4 screws, and the cover plate covers the rear hanging piece.

Preferably, two copper tubes are arranged, and copper blocks are fixed on the copper tubes towards the CPU.

Preferably, a sealing ring is arranged between the heat dissipation shell and the rear hanging piece.

Preferably, a sealing ring is arranged between the rear hanging piece and the screen body.

Preferably, a sealing ring is arranged between the cover plate and the rear hanging piece.

The utility model has the beneficial effects that:

The utility model is composed of a rear hanging piece, a cover plate, an interface plate, a heat dissipation shell, copper bars, a main board, a cantilever box seat, fixing screws and the like, wherein a sealing ring is arranged between the heat dissipation shell and the rear hanging piece, a sealing ring is arranged between the rear hanging piece and a cantilever screen, and a sealing ring is also arranged between the cover plate and the rear hanging piece, so that the requirement of protection grade IP65 is met. Under the protection level of the same IP65, the utility model dissipates heat outwards for the CPU, and solves the problem that the heat caused by inwards dissipating heat of the CPU in the original scheme affects the screen.

Drawings

The utility model is described in detail below with reference to the drawings and the detailed description;

FIG. 1 is a front view of the present utility model;

fig. 2 is a cross-sectional view taken along A-A of fig. 1.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

Referring to fig. 1-2, the embodiment adopts the following technical scheme that the heat dissipation structure of the high-power CPU of the cantilever integrated machine comprises a box base 1, a rear hanging piece 2, a button 3, a cover plate 4, a main board 5, an interface board 6, a copper pipe 7 and a heat dissipation shell 9, wherein the copper pipe 7 is fixed on the heat dissipation shell 9 through heat conduction glue, the heat dissipation shell 9 is fixed on the rear hanging piece 2 through an M3 screw, the box base 1 is fixed on the rear hanging piece 2 through an inner hexagon screw of an M6, the interface board 6 is fixed on the rear hanging piece 2 through an M3 screw, the main board 5 is fixed on the interface board 6 through an M3 screw, USB or buttons 3 are arranged in holes on the left side and the right side of the rear hanging piece 2, and the rear hanging piece 2 is fixed on a screen body through an M4 screw 8. The cover plate 4 is covered on the rear hanging piece 2.

It is noted that two copper tubes 7 are provided, and copper blocks are fixed on the copper tubes 7 towards the direction of the CPU.

It should be noted that a sealing ring is disposed between the heat dissipation shell 9 and the rear hanging member 2.

It is noted that a sealing ring is arranged between the rear hanging member 2 and the screen body (cantilever screen).

In addition, a sealing ring is arranged between the cover plate 4 and the rear hanging piece 2.

The CPU heat dissipation structure of the specific embodiment is assembled by fixing 2 copper pipes 7 on a heat dissipation shell 9 through heat conducting glue, fixing copper blocks on the copper pipes 7 towards the CPU, installing the heat dissipation shell 9 with the copper pipes 7 on a rear hanging piece 2 through 4M 3 screws, fixing an interface board 6 on the rear hanging piece 2 through 4M 3 screws, fixing a box seat 1 on the rear hanging piece through 4M 6 socket head cap screws, fixing a main board 5 on the interface board 6 through 4M 3 screws, installing USB or buttons 3 on the left side 22 and the right side 22 of the rear hanging piece, fixing the rear hanging piece with six M4 screws 8 on a screen body after installing the above parts, and finally covering a cover board 4.

According to the embodiment, under the protection level of the same IP65, the CPU is used for radiating outwards, and the influence of heat caused by inwards radiating of the CPU on a screen in the original scheme is solved.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A heat dissipation structure for a high-power CPU of a cantilever all-in-one machine, characterized in that it includes a base (1), a rear mount (2), a button (3), a cover plate (4), a motherboard (5), an interface board (6), a copper pipe (7), and a heat sink (9). The copper pipe (7) is fixed to the heat sink (9) with thermally conductive adhesive. The heat sink (9) is fixed to the rear mount (2) with M3 screws. The base (1) is fixed to the rear mount (2) with M6 hexagonal screws. The interface board (6) is fixed to the rear mount (2) with M3 screws. The motherboard (5) is fixed to the interface board (6) with M3 screws. USB or button (3) is installed in the holes on the left and right sides of the rear mount (2). The rear mount (2) is fixed to the screen with M4 screws (8). The cover plate (4) covers the rear mount (2).

2. The heat dissipation structure of a high-power CPU in a cantilever integrated machine according to claim 1, characterized in that two copper pipes (7) are provided, and a copper block is fixed on the copper pipes (7) facing the CPU.

3. The heat dissipation structure of a high-power CPU for a cantilever integrated machine according to claim 1, characterized in that a sealing ring is provided between the heat dissipation shell (9) and the rear bracket (2).

4. The heat dissipation structure of a high-power CPU for a cantilever integrated machine according to claim 1, characterized in that a sealing ring is provided between the rear mount (2) and the screen body.

5. The heat dissipation structure of a high-power CPU for a cantilever integrated machine according to claim 1, characterized in that a sealing ring is provided between the cover plate (4) and the rear hanger (2).