CN223611898U - A heat dissipation structure and a ruggedized sealed computer including the same. - Google Patents
A heat dissipation structure and a ruggedized sealed computer including the same.Info
- Publication number
- CN223611898U CN223611898U CN202423036223.1U CN202423036223U CN223611898U CN 223611898 U CN223611898 U CN 223611898U CN 202423036223 U CN202423036223 U CN 202423036223U CN 223611898 U CN223611898 U CN 223611898U
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- heat
- heat dissipation
- structure body
- cover plate
- heat radiation
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Abstract
The utility model discloses a heat radiation structure which comprises a heat radiation structure body (1) and a heat radiation fan (3) arranged at the tail part of the heat radiation structure body (1), wherein an inlet of the heat radiation structure body (1) is provided with an air inlet grid (11), the air inlet grid (11) is opposite to the heat radiation fan (3), a reticular channel is arranged in the heat radiation structure body (1), and the upper end face and the lower end face of the heat radiation structure body (1) are respectively inwards recessed to form mounting positions. By adopting the heat radiation structure, reliable heat radiation of the reinforced chassis can be realized.
Description
Technical Field
The utility model relates to the field of chassis, in particular to a heat dissipation structure and a reinforced sealing computer comprising the same.
Background
The reinforcement of the computer means that the security, stability and anti-attack capability of the computer system are improved through a series of hardware and software means, and the computer system is ensured to still stably operate under severe environment or potential security threat. Ruggedized computers find application in many high security requirements scenarios, such as military, financial, government agencies, industrial control systems, and the like.
With the high-speed development of domestic chips and integrated circuit technologies, the functional integration and the overall power consumption of the reinforced computer are gradually improved. At present, with the increase of the use demands, the reinforced computer needs to arrange more circuit components in a limited space, so in order to ensure the operation reliability of the computer, a higher requirement is also put on the heat dissipation of the reinforced computer.
The existing chassis mainly dissipates heat through a cooling fan, vent holes are formed in the side face, the top, the bottom and the front panel and the rear panel of the chassis, and air circulation can be prevented by reasonably designing the positions of the vent holes. Even many modern chassis designs have large area mesh structures to enhance air flow. Therefore, the reinforced computer requires the case to be reinforced and sealed, which seriously affects the heat dissipation effect of the reinforced case.
Disclosure of utility model
In order to overcome the defect that the heat dissipation effect of the case is influenced by the reinforcement and sealing requirements of the reinforced case in the prior art, the utility model provides a heat dissipation structure and a reinforced sealing computer comprising the heat dissipation structure.
In order to achieve the above purpose, the present utility model provides a heat dissipation structure, which comprises a heat dissipation structure body and a heat dissipation fan arranged at the tail of the heat dissipation structure body, wherein an inlet of the heat dissipation structure body is provided with an air inlet grid, the air inlet grid is arranged opposite to the heat dissipation fan, and a net-shaped channel is arranged in the heat dissipation structure body;
The upper end face and the lower end face of the heat dissipation structure body are respectively recessed inwards to form mounting positions.
Preferably, the heat dissipation fans are arranged in a plurality, and the heat dissipation fans are uniformly distributed at the tail part of the heat dissipation structure body.
The invention also provides a reinforced sealing computer which comprises the heat radiation structure, a circuit board, an upper cover plate and a lower cover plate, wherein the circuit board is detachably connected with the heat radiation structure through the mounting position, and the upper cover plate and the lower cover plate are respectively and hermetically connected with the upper end face and the lower end face of the heat radiation structure.
Preferably, the installation position of the heat dissipation structure body is provided with a heat conduction copper pipe, and two ends of the heat conduction copper pipe extend into the reticular channel.
Preferably, the mounting position of the heat dissipation structure body is provided with a heat conduction copper column, one end of the heat conduction copper column stretches into the reticular channel, and the other end of the heat conduction copper column is in contact with the circuit board.
Preferably, the surfaces of the heat dissipation fan facing the upper cover plate and the lower cover plate are provided with mounting surfaces, and the upper cover plate and the lower cover plate are detachably connected with the heat dissipation structure through the mounting surfaces.
Preferably, the side wall of the installation position is formed by enclosing the heat dissipation structure body and the heat dissipation fan, and the connection part between the adjacent side walls is subjected to sealing treatment.
Preferably, a sealing ring is arranged at the joint of the heat dissipation structure and the upper cover plate.
Preferably, a sealing ring is arranged at the joint of the heat dissipation structure and the lower cover plate.
According to the technical scheme, the cooling air circulation channel is formed in the radiating structure body, under the action of the radiating fan, cold air enters from the inlet, passes through the whole radiating structure body and is discharged from the radiating fan, so that the radiating effect of the whole radiating structure body is realized.
Be provided with the netted passageway in the heat radiation structure body for in this heat radiation structure body can be detained longer time for this cooling air can carry out abundant heat dissipation with the up end and the lower terminal surface of heat radiation structure body.
Through set up the grid that admits air in the entrance at the heat radiation structure body for the air that gets into the net passageway in the heat radiation structure body can all be by preliminary filtration, avoids impurity in the air to block up net passageway, thereby improves heat radiation structure's result of use and life.
The upper end face and the lower end face of the heat dissipation structure body are provided with inwards concave mounting positions, the circuit board can be mounted in the mounting positions, heat emitted by the circuit board during operation can be discharged into the mounting positions, heat exchange is carried out through the heat dissipation structure body and cooling air in the heat dissipation structure body in a heat transfer mode, and therefore the heat is taken away by the cooling air, and the cooling effect on the circuit board is achieved.
Therefore, through setting up this heat radiation structure, can realize the purpose to the circuit board of heat radiation structure body top and below jointly radiating, radiating efficiency is high, through setting up netted passageway and heat dissipation fan matched with mode moreover for this heat radiation structure has more excellent radiating effect, can realize the rapid cooling, the heat dissipation effect to the circuit board.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating structure;
Fig. 2 is a schematic structural view of a reinforced sealed computer.
Description of the reference numerals
Detailed Description
In the present utility model, unless otherwise indicated, terms such as "away from, upper, lower, lateral, and both ends" are used generally to refer to the orientation of the term in the normal state of use, or to the colloquial name understood by those skilled in the art, and should not be taken as limiting the term.
Referring to a heat dissipation structure shown in fig. 1, the heat dissipation structure comprises a heat dissipation structure body 1 and a heat dissipation fan 3 arranged at the tail of the heat dissipation structure body 1, wherein an inlet of the heat dissipation structure body 1 is provided with an air inlet grid 11, the air inlet grid 11 is opposite to the heat dissipation fan 3, and a reticular channel is arranged in the heat dissipation structure body 1;
the upper end face and the lower end face of the heat radiation structure body 1 are respectively recessed inwards to form mounting positions.
Through the implementation of the technical scheme, a channel for cooling air circulation is formed in the heat dissipation structure body 1, and under the action of the heat dissipation fan 3, cold air enters from the inlet and is discharged from the heat dissipation fan 3 after passing through the whole heat dissipation structure body 1, so that the heat dissipation effect of the whole heat dissipation structure body 1 is realized.
The heat radiation structure body 1 is internally provided with the netlike channel, so that air can stay in the heat radiation structure body 1 for a longer time, and the cooling air can sufficiently dissipate heat with the upper end face and the lower end face of the heat radiation structure body 1.
Through set up the grid 11 of admitting air in the entrance of heat radiation structure body 1 for the air that gets into the interior network channel of heat radiation structure body 1 can all be by preliminary filtration, avoids impurity in the air to block up the network channel, thereby improves heat radiation structure's result of use and life.
The upper end face and the lower end face of the heat dissipation structure body 1 are provided with inwards concave mounting positions, the circuit board 4 can be mounted in the mounting positions, heat emitted by the circuit board 4 during operation can be discharged into the mounting positions, heat exchange is carried out through the heat dissipation structure body 1 and cooling air in the heat dissipation structure body 1 in a heat transfer mode, and therefore the cooling air takes away the heat, and the cooling effect on the circuit board 4 is achieved.
Therefore, through setting up this heat radiation structure, can realize the purpose to the circuit board 4 of heat radiation structure body 1 top and below jointly radiating, radiating efficiency is high, through setting up netted passageway and 3 matched with modes of radiator fan moreover for this heat radiation structure has more excellent radiating effect, can realize the rapid cooling, the radiating effect to circuit board 4.
In this embodiment, preferably, a plurality of heat dissipation fans 3 are provided, and the plurality of heat dissipation fans 3 are uniformly distributed at the tail of the heat dissipation structure body 1.
In order to better improve the heat dissipation effect, more fans can be arranged for the heat dissipation structure so as to increase the ventilation quantity of the heat dissipation structure in unit time. Preferably, the purpose of improving the heat dissipation efficiency of the heat dissipation structure can also be achieved by a method of improving the rotation speed of the heat dissipation fan 3.
In addition, because the diameter of the cooling fan 3 cannot be set too large due to the influence of the size of the cooling structure, the acting area of the cooling fan 3 is limited, and the tail of the cooling structure body 1 is covered by a plurality of fans, so that the effective area of the tail of the cooling structure body 1 is effectively utilized, the cooling fan 3 is arranged as much as possible, the effective coverage of the cross section of the net-shaped channel in the cooling structure body 1 is realized, the cooling effect of the cooling structure can be improved, the cooling structure can uniformly cool the circuit board 4, and the local temperature rise of the circuit board 4 is avoided.
Referring to fig. 2, the reinforced sealed computer includes a heat dissipating structure, a circuit board 4, an upper cover plate 5 and a lower cover plate 6, wherein the circuit board 4 is detachably connected to the heat dissipating structure through a mounting position, and the upper cover plate 5 and the lower cover plate 6 are respectively and hermetically connected to an upper end face and a lower end face of the heat dissipating structure.
The circuit board 4 is fixedly connected with the heat dissipation mechanism through the mounting position, so that heat generated by the operation of the circuit board 4 is conducted to the heat dissipation structure and then is discharged through a cooling air channel in the heat dissipation structure.
The upper cover plate 5 and the lower cover plate 6 are respectively used for sealing the installation positions above and below the heat dissipation mechanism, and the circuit board 4 can be sealed in the concave space of the installation position after sealing, so that on one hand, a good waterproof sealing effect can be achieved, on the other hand, the computer can be effectively supported through the installation positions, and the strength of a reinforced sealing computer is improved.
In this embodiment, preferably, a heat conduction copper pipe 12 is provided at the installation position of the heat dissipation structure body 1, and both ends of the heat conduction copper pipe 12 extend into the mesh-shaped channel.
The heat conducting copper pipe 12 is arranged below the circuit board 4 and is in contact with a heating element on the circuit board 4, heat generated on the circuit board 4 can be quickly conducted into the heat radiating structure through the heat conducting copper pipe 12, and cooling air flowing in the heat radiating structure is discharged in a heat exchange mode.
When encountering situations such as vibration, the circuit board 4 can not only obtain a relatively stable position relation with the heat dissipation structure in a mounting and fixing mode, but also play a supporting role on the circuit board 4 to a certain extent by the heat conduction copper pipe 12, so that the influence of the fluctuation such as vibration on the stability of the circuit board 4 is avoided.
In this embodiment, preferably, the upper end face and the lower end face of the heat dissipation structure body 1 are respectively provided with a heat conduction copper pillar 13, one end of the heat conduction copper pillar 13 extends into the mesh-shaped channel, and the other end is in contact with the circuit board 4.
The heat conducting copper column 13 is arranged below the circuit board 4 and is in contact with a heating element on the circuit board 4, heat generated on the circuit board 4 can be quickly conducted into the heat radiating structure through the heat conducting copper tube 12, and cooling air flowing in the heat radiating structure is discharged in a heat exchange mode.
The heat conduction copper column 13 is used for heating elements with smaller surface area and less heating, the heat conduction copper tube 12 can be suitable for heating elements with larger surface area and larger heating value, and heat generated on the circuit board 4 can be quickly transferred into a heat dissipation structure through the cooperation of the heat conduction copper tube 12 and the heat conduction copper column 13, so that efficient heat dissipation of the circuit board 4 is realized.
In this embodiment, it is preferable that the surfaces of the heat radiation fan 3 facing the upper cover plate 5 and the lower cover plate 6 are provided with mounting surfaces, by which the upper cover plate 5 and the lower cover plate 6 are detachably connected to the heat radiation structure.
The upper cover plate 5 and the lower cover plate 6 are detachably connected with the heat dissipation structure through the mounting surface, so that the heat dissipation fan 3 is also sealed in the reinforced sealed computer, and the working reliability of the heat dissipation fan 3 is improved.
Moreover, by the support of the installation surface of the heat radiation fan 3, the upper cover plate 5 and the lower cover plate 6 have better strength, so that the thickness of the upper cover plate 5 and the lower cover plate 6 can be reduced, the cost is saved, and the portability of the reinforced and sealed computer is improved.
In this embodiment, preferably, the side walls of the installation site are enclosed by the heat dissipation structure body 1 and the heat dissipation fan 3, and the connection between the adjacent side walls is subjected to sealing treatment.
In order to realize reliable sealing of the circuit board 4, the connection gaps between the side walls of the installation positions are sealed, and the cover plate and the installation positions are sealed, so that the circuit board 4 is in a completely sealed state, and the waterproof performance of the reinforced sealed computer is greatly improved.
In this embodiment, preferably, a sealing ring is provided at the junction of the heat dissipating structure and the upper cover plate 5.
In this embodiment, preferably, a sealing ring is provided at the junction of the heat dissipating structure and the lower cover plate 6.
The preferred embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present utility model within the scope of the technical concept of the present utility model, and all the simple modifications belong to the protection scope of the present utility model.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the utility model can be made without departing from the spirit of the utility model, which should also be considered as disclosed herein.
Claims (9)
1. The heat radiation structure is characterized by comprising a heat radiation structure body (1) and a heat radiation fan (3) arranged at the tail part of the heat radiation structure body (1), wherein an inlet of the heat radiation structure body (1) is provided with an air inlet grid (11), the air inlet grid (11) is arranged opposite to the heat radiation fan (3), and a netlike channel is arranged in the heat radiation structure body (1);
The upper end face and the lower end face of the heat radiation structure body (1) are respectively recessed inwards to form mounting positions.
2. The heat dissipation structure according to claim 1, wherein a plurality of heat dissipation fans (3) are provided, and the plurality of heat dissipation fans (3) are uniformly distributed at the tail of the heat dissipation structure body (1).
3. A reinforced sealed computer, characterized in that the reinforced sealed computer comprises the heat dissipation structure, a circuit board (4), an upper cover plate (5) and a lower cover plate (6) according to any one of claims 1-2, wherein the circuit board (4) is detachably connected with the heat dissipation structure through the mounting position, and the upper cover plate (5) and the lower cover plate (6) are respectively in sealing connection with the upper end face and the lower end face of the heat dissipation structure.
4. A reinforced sealed computer according to claim 3, wherein the mounting position of the heat dissipation structure body (1) is provided with a heat conduction copper pipe (12), and two ends of the heat conduction copper pipe (12) extend into the reticular channel.
5. A reinforced sealed computer according to claim 3, wherein a heat conducting copper column (13) is arranged on the mounting position of the heat radiating structure body (1), one end of the heat conducting copper column (13) extends into the reticular channel, and the other end is in contact with the circuit board (4).
6. A reinforced sealed computer according to claim 3, wherein the surfaces of the heat radiation fan (3) facing the upper cover plate (5) and the lower cover plate (6) are provided with mounting surfaces, and the upper cover plate (5) and the lower cover plate (6) are detachably connected with the heat radiation structure through the mounting surfaces.
7. A reinforced sealed computer according to claim 3, wherein the side walls of the mounting locations are enclosed by the heat dissipation structure body (1) and the heat dissipation fan (3), and the connection between the adjacent side walls is sealed.
8. The reinforced sealed computer of claim 6, wherein a sealing ring is provided at the junction of the heat dissipating structure and the upper cover plate (5).
9. The reinforced sealed computer of claim 6, wherein a sealing ring is provided at the junction of the heat dissipating structure and the lower cover plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423036223.1U CN223611898U (en) | 2024-12-06 | 2024-12-06 | A heat dissipation structure and a ruggedized sealed computer including the same. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202423036223.1U CN223611898U (en) | 2024-12-06 | 2024-12-06 | A heat dissipation structure and a ruggedized sealed computer including the same. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN223611898U true CN223611898U (en) | 2025-11-28 |
Family
ID=97784658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202423036223.1U Active CN223611898U (en) | 2024-12-06 | 2024-12-06 | A heat dissipation structure and a ruggedized sealed computer including the same. |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN223611898U (en) |
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2024
- 2024-12-06 CN CN202423036223.1U patent/CN223611898U/en active Active
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