CN223582688U

CN223582688U - Network additional memory

Info

Publication number: CN223582688U
Application number: CN202422706844.XU
Authority: CN
Inventors: 伍炳伟; 周科
Original assignee: Shenzhen Lvlian Technology Co Ltd
Current assignee: Shenzhen Lvlian Technology Co Ltd
Priority date: 2024-11-06
Filing date: 2024-11-06
Publication date: 2025-11-21
Anticipated expiration: 2034-11-06

Abstract

The utility model relates to the technical field of network additional memories, in particular to a network additional memory. The network additional memory comprises a shell, a hard disk inner frame, a circuit board, a fan and a heat radiation component, wherein the hard disk inner frame is arranged in the shell, the hard disk inner frame is used for installing a hard disk of the network additional memory, the heat radiation component comprises a heat radiation substrate, a heat conduction pipe and heat radiation fins, and the circuit board is provided with a heat source component. The heat dissipating substrate is arranged close to or attached to the heat source component and is connected with the heat dissipating fins through the heat conducting pipe. The utility model has better heat dissipation effect on heat source components.

Description

Network additional memory

Technical Field

The utility model relates to the technical field of network additional memories, in particular to a network additional memory.

Background

The network attached storage (Network Attached Storage, NAS) is a device connected to a network and having a data storage function, and is also called "network storage". The special data storage server takes data as a center, thoroughly separates the storage equipment from the server, and centrally manages the data, thereby releasing bandwidth and improving performance. The network additional memory can automatically backup and synchronize the photos and files on the terminal equipment, so that the data security is ensured. The user can conveniently access the files stored on the network attached storage through the network.

The network additional memory circuit board is provided with heat source components such as a CPU, and the heat source components can generate a large amount of heat in the use process, and at present, the heat dissipation effect is poor due to simple blowing or exhausting heat dissipation through a fan.

Disclosure of utility model

The embodiment of the utility model provides a network additional memory, which is used for solving the problem that the network additional memory in the prior art simply dissipates heat only through fans, radiating fins and the like, and has poor heat dissipation effect.

The utility model discloses a network additional memory, which comprises a shell, and a hard disk inner frame, a circuit board, a fan and a heat radiation component which are arranged in the shell, wherein the hard disk inner frame is used for installing a hard disk of the network additional memory;

The heat dissipating substrate is arranged close to or attached to the heat source component and is connected with the heat dissipating fins through the heat conducting pipe.

Optionally, the circuit board is mounted below the hard disk inner frame.

Optionally, a first mounting column extending towards the circuit board is mounted at the bottom of the hard disk inner frame, and the heat dissipation substrate is mounted on the first mounting column.

Optionally, the heat dissipation substrate comprises a main body part and side wing connecting parts arranged on two sides of the main body part, wherein the thickness of the main body part is larger than that of the side wing connecting parts, and the side wing connecting parts are arranged on the first mounting columns.

Optionally, a mounting groove is formed on a side of the main body facing the circuit board, and one end of the heat conducting tube is mounted in the mounting groove.

Optionally, a lead-out notch is formed on one side of the heat dissipation substrate facing the heat dissipation fins, and the heat conduction pipe is led out of the lead-out notch and connected with the heat dissipation fins.

Optionally, a stud is connected to a side of the heat dissipation substrate facing the circuit board, and the connection stud is screwed on the circuit board through a screw.

Optionally, a second mounting post extending towards the circuit board is mounted at the bottom of the hard disk inner frame, and the circuit board is mounted on the second mounting post.

Optionally, the bottom of the hard disk inner frame extends out of the extension part towards the rear end of the shell, a first opening is formed in the extension part, and the heat conduction pipe penetrates through the first opening from the bottom of the hard disk inner frame and is connected with the heat dissipation fins.

Optionally, the heat dissipation substrate is a copper plate or an aluminum plate, the heat dissipation fins are made of copper or aluminum, and the heat conduction pipe is a solid copper pipe.

Compared with the prior art, the network additional memory has the beneficial effects that the fan is arranged at the rear end of the shell, the radiating assembly is arranged at the same time, the radiating substrate is arranged close to or attached to the heat source component, the radiating fins are arranged between the fan and the rear end of the hard disk inner frame, the hard disk inner frame existing in the network additional memory is fully considered, under the condition that space utilization is guaranteed, the radiating fins are connected with the radiating substrate through the heat conducting pipe, heat generated by the heat source component can be directly and quickly conducted to the radiating substrate, and is conducted through the radiating substrate, the heat conducting pipe and the radiating fins in sequence, and finally the heat is blown out of the shell by the fan, so that the radiating effect on the heat source component is better.

Drawings

The technical scheme of the utility model will be further described in detail below with reference to the accompanying drawings and examples, wherein:

FIG. 1 is a schematic diagram of network attached storage according to an embodiment of the present utility model;

FIG. 2 is a cross-sectional view of network attached storage according to an embodiment of the present utility model;

FIG. 3 is an internal diagram of network attached storage according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a hard disk inner frame, a heat dissipation assembly, a circuit board and a fan according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of a heat dissipating assembly, a circuit board, and a fan according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a circuit board according to an embodiment of the utility model;

FIG. 7 is a schematic diagram of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a heat dissipating substrate according to an embodiment of the present utility model;

fig. 9 is another schematic diagram of a heat dissipating substrate according to an embodiment of the utility model.

The reference numerals in the drawings are as follows:

1. The device comprises a shell, a hard disk inner frame, 21, a first mounting column, 22, a second mounting column, 23, an extension part, 231, a first opening, 3, a circuit board, 31, a heat source component, 4, a fan, 5, a heat dissipation assembly, 51, a heat dissipation substrate, 511, a main body part, 511a, a mounting groove, 511b, a lead-out notch, 512, a side wing connecting part, 513, a connecting stud, 52, a heat conduction pipe, 53, a heat dissipation fin, 6 and a hard disk.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.

The embodiment of the utility model provides a network additional memory, which comprises a shell 1, a hard disk inner frame 2, a circuit board 3, a fan 4 and a heat dissipation assembly 5, wherein the hard disk inner frame 2, the circuit board 3, the fan 4 and the heat dissipation assembly 5 are arranged in the shell 1, the hard disk inner frame 2 is used for installing a hard disk 6 of the network additional memory, the heat dissipation assembly 5 comprises a heat dissipation substrate 51, a heat conduction pipe 52 and heat dissipation fins 53, and the heat source components 31 are arranged on the circuit board 3. The fan 4 is mounted at the rear end of the housing 1 and electrically connected with the circuit board 3, the heat dissipation fins 53 are mounted between the fan 4 and the rear end of the hard disk inner frame 2, and the heat dissipation substrate 51 is disposed close to or attached to the heat source component 31 and connected with the heat dissipation fins 53 through the heat conduction pipe 52.

The network additional memory is provided with the fan 4 at the rear end of the shell 1, and the heat radiating component 5 is arranged at the same time, wherein the heat radiating substrate 51 is arranged close to or attached to the heat source component 31, the heat radiating fins 53 are arranged between the fan 4 and the rear end of the hard disk inner frame 2, the hard disk inner frame 2 existing in the network additional memory is fully considered, under the condition that space utilization is ensured, the heat radiating fins 53 are connected with the heat radiating substrate 51 through the heat conducting pipe 52, heat generated by the heat source component 31 can be directly and quickly conducted to the heat radiating substrate 51, and is conducted through the heat radiating substrate 51, the heat conducting pipe 52 and the heat radiating fins 53 in sequence, and finally, the heat radiating effect of the heat source component 31 is better when the heat radiating substrate is blown out of the shell 1 by the fan 4.

Specifically, by installing the fan 4 at the rear end of the housing 1 and establishing an effective heat conduction path between the heat dissipation substrate 51, the heat conduction pipe 52 and the heat dissipation fins 53, heat generated by the heat source component 31 can be quickly conducted to the heat dissipation substrate 51, then dissipated through the heat conduction pipe 52 and the heat dissipation fins 53, and finally discharged out of the housing 1 by the fan 4, the layout of the heat dissipation assembly 5 is optimized by combining with the existence of the hard disk inner frame 2 in the network accessory memory while ensuring the effective utilization of the inner space of the NAS, and the heat dissipation efficiency is improved by the more direct and quick heat conduction path, thereby being beneficial to protecting the inner elements of the network accessory memory and prolonging the service life of equipment.

The hard disk inner frame 2 is used for inserting the hard disk 6 in the network accessory memory, and the hard disk inner frame 2 can be provided with a plurality of hard disk 6 inserting positions, and the plurality of hard disks 6 are respectively inserted in the hard disk 6 inserting positions. The circuit board 3 controls the normal operation of the network additional memory, on which various necessary components, circuits, interfaces, etc. are provided, and the heat source component 31 may be a component that is easily heated, such as a CPU, etc. provided on the circuit board 3. For the specific arrangement of the heat-dissipating substrate 51, the heat-dissipating substrate 51 is arranged close to the heat-source component 31, that is, there is a certain gap between the heat-dissipating substrate 51 and the heat-source component 31 without bonding contact therebetween. The heat dissipation substrate 51 is attached to the heat source component 31, that is, the heat dissipation substrate 51 is attached to the heat source component 31 without a gap therebetween. The heat radiation substrate 51 is close to or attached to the heat source component 31, so that the distance between the heat radiation substrate 51 and the heat source component 31 is small, and heat generated by the heat source component 31 can be timely, quickly and accurately conducted to the heat radiation substrate 51, and the heat radiation speed and the heat radiation effect are improved.

The heat dissipation substrate 51 is a copper plate or an aluminum plate, the heat dissipation fins 53 are made of copper or aluminum, and the copper plate or the aluminum plate has good heat conduction performance. The heat pipe 52 is a solid copper pipe. The heat pipe 52 employs a solid copper pipe that provides a more direct and rapid heat conduction path than a hollow copper pipe.

Specifically, the circuit board 3 is mounted below the hard disk inner frame 2. By mounting the circuit board 3 below the hard disk inner frame 2, the space inside the NAS device can be more effectively utilized, making the NAS device more compact. The circuit board 3 may be located below the hard disk inner frame 2, or may be mounted at the bottom of the hard disk inner frame 2, or may be mounted on the housing 1, and located below the hard disk inner frame 2.

A first mounting post 21 extending toward the circuit board 3 is mounted on the bottom of the hard disk inner frame 2, and a heat dissipation substrate 51 is mounted on the first mounting post 21. The first mounting post 21 provides a fixed mounting point for facilitating the mounting of the heat dissipating substrate 51, so that the mounting of the heat dissipating substrate 51 is more stable. This design can reduce displacement of the heat dissipation substrate 51 caused by vibration or other factors during operation, and improve overall stability. The first mounting post 21 may also make the heat dissipation substrate 51 be in a suspended state on one side of the hard disk inner frame 2, so as to avoid that the heat of the heat dissipation substrate 51 is conducted to the hard disk inner frame 2 instead, resulting in high temperature of the hard disk 6. Specifically, the first mounting post 21 is a bolt, one end of which may be mounted on the bottom of the hard disk inner frame 2 by a screw.

As shown in fig. 7 to 9, the heat dissipating substrate 51 includes a main body portion 511 and wing connection portions 512 provided at both sides of the main body portion 511, the thickness of the main body portion 511 is greater than that of the wing connection portions 512, and the wing connection portions 512 are mounted on the first mounting posts 21. The body 511 is thicker, which provides greater heat capacity and higher heat conduction efficiency, and heat can be more quickly conducted from the heat source component 31 to the body 511 of the heat dissipation substrate 51, which can significantly improve heat dissipation efficiency. The heat dissipation substrate 51 is fixed to the first mounting post 21 by the thin side wing connection portion 512, so that connection and installation with the first mounting post 21 are facilitated, for example, the side wing connection portion 512 is installed on the first mounting post 21 by a screw.

As shown in fig. 7 to 9, a mounting groove 511a is formed in a side of the main body 511 facing the circuit board 3, and one end of the heat conduction pipe 52 is mounted in the mounting groove 511 a. The mounting groove 511a is formed in the side, facing the circuit board 3, of the main body 511, one end of the heat conducting tube 52 is mounted in the mounting groove 511a, and the heat conducting tube 52 can be directly contacted with the main body 511 of the heat radiating substrate 51 and faces the heat source component 31, so that heat is absorbed by the heat conducting tube 52 more favorably, and rapid and efficient heat conduction is achieved. Heat can be quickly conducted from the heat source component 31 to the heat-dissipating substrate 51, and then quickly dispersed by the heat-conducting pipe 52, thereby improving the overall heat-dissipating efficiency. The mounting groove 511a can facilitate the mounting limitation of the heat transfer pipe 52, and improve the mounting firmness of the heat transfer pipe 52. The heat conductive pipe 52 may be press-fitted into the mounting groove 511 a.

As shown in fig. 7 to 9, the heat dissipating substrate 51 has an extraction notch 511b formed on a side facing the heat dissipating fins 53, and the heat pipe 52 is led out of the extraction notch 511b and connected to the heat dissipating fins 53. The heat dissipation substrate 51 is provided with the extraction notch 511b on one side facing the heat dissipation fins 53, so that the heat conduction pipe 52 can be conveniently extracted from the heat dissipation substrate 51, and can be directly and smoothly connected to the heat dissipation fins 53 after extraction.

Further, as shown in fig. 9, the heat dissipation substrate 51 is connected to the stud 513 on the side facing the circuit board 3, and the connection stud 513 is screwed to the circuit board 3 by a screw. The connecting studs 513 can be used as feet to support the heat dissipation substrate, so that gaps exist between the circuit board 3 and the heat dissipation substrate 51, the heat dissipation substrate 51 is prevented from being directly pressed on the heat source component 31 or being pressed on the heat source component 31, the heat source component 31 is prevented from being damaged, meanwhile, the heat dissipation substrate 51, the circuit board 3 and the hard disk inner frame 2 are mutually connected through screws in the circuit board 3, the whole is formed, and the connection installation stability of the heat dissipation substrate 51 and the circuit board 3 is improved.

On the other hand, as shown in fig. 4 and 5, the bottom of the hard disk inner frame 2 is mounted with a second mounting post 22 extending toward the circuit board 3, and the circuit board 3 is mounted on the second mounting post 22. The second mounting posts 22 provide mounting positions for the circuit board 3, and ensure convenient and firm mounting of the circuit board 3. The second mounting post 22 can also keep the circuit board 3 away from the hard disk inner frame 2 for a certain distance, so that heat concentration caused by mutual heat transfer between the heat of the hard disk 6 and the heat of the circuit board 3 is avoided, and the temperature is increased. And, the second mounting post 22 can make a space between the circuit board 3 and the bottom of the hard disk inner frame 2, so that the heat dissipation substrate 51 is convenient to mount.

The bottom of the hard disk inner frame 2 extends out of the extension part 23 towards the rear end of the shell 1, a first opening 231 is formed in the extension part 23, and the heat conducting tube 52 penetrates through the first opening 231 from the bottom of the hard disk inner frame 2 and is connected with the heat radiating fins 53. The first opening 231 is formed to facilitate the heat pipe 52 to be led out from the rear end of the hard disk inner frame 2 and connected with the heat dissipation fins 53.

It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, and all such modifications and substitutions are intended to fall within the scope of the appended claims.

Claims

1. A network attached storage device (NASDD), characterized in that it includes a housing, and a hard disk drive frame, a circuit board, a fan, and a heat dissipation assembly disposed within the housing; the hard disk drive frame is used to mount the hard disk of the NSDD; the heat dissipation assembly includes a heat dissipation substrate, heat pipes, and heat dissipation fins, and the circuit board is provided with heat source components;

The fan is mounted at the rear end of the housing and electrically connected to the circuit board. The heat sink fins are mounted between the fan and the rear end of the hard drive inner frame. The heat sink substrate is disposed close to or attached to the heat source components and is connected to the heat sink fins through the heat pipe.

2. The network-attached storage device according to claim 1, wherein the circuit board is mounted below the hard disk drive enclosure.

3. The network-attached storage device according to claim 2, wherein a first mounting post extending toward the circuit board is mounted at the bottom of the hard disk inner frame, and the heat dissipation substrate is mounted on the first mounting post.

4. The network-attached memory according to claim 3, wherein the heat dissipation substrate includes a main body and side wing connecting portions disposed on both sides of the main body; the thickness of the main body is greater than the thickness of the side wing connecting portions; and the side wing connecting portions are mounted on the first mounting post.

5. The network-attached memory according to claim 4, wherein the main body has a mounting groove on the side facing the circuit board, and one end of the heat pipe is installed in the mounting groove.

6. The network-attached memory according to claim 5, wherein the heat dissipation substrate has an outlet notch on the side facing the heat dissipation fins, and the heat pipe is led out from the outlet notch and connected to the heat dissipation fins.

7. The network-attached memory according to claim 3, wherein a stud is connected to the side of the heat dissipation substrate facing the circuit board, and the stud is screwed onto the circuit board by screws.

8. The network-attached storage device according to claim 2, wherein a second mounting post extending toward the circuit board is mounted at the bottom of the hard disk inner frame, and the circuit board is mounted on the second mounting post.

9. The network-attached storage according to claim 2, wherein the bottom of the hard disk inner frame extends toward the rear end of the housing, the extension has a first opening, and the heat pipe passes through the first opening from the bottom of the hard disk inner frame and connects to the heat dissipation fins.

10. The network-attached memory according to claim 1, wherein the heat dissipation substrate is a copper plate or an aluminum plate, the heat dissipation fins are made of copper or aluminum, and the heat pipe is a solid copper pipe.